This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Discover what is an FPGA and how field-programmable gate arrays empower engineers to create custom digital hardware. This guide combines a beginner-friendly definition with architectural insights, process technology, and design methodologies.
The purpose of this article is to provide a comprehensive, in-depth guide to PCB soldermask, exploring the key concepts, principles, and practical applications that will help you excel in PCB design and manufacturing.
The diversification of primary industries refers to the aim to have producers (primary industries) also perform processing (secondary industries) and distribution and sales (tertiary industries) in order to diversify their management
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Discover what is an FPGA and how field-programmable gate arrays empower engineers to create custom digital hardware. This guide combines a beginner-friendly definition with architectural insights, process technology, and design methodologies.
The purpose of this article is to provide a comprehensive, in-depth guide to PCB soldermask, exploring the key concepts, principles, and practical applications that will help you excel in PCB design and manufacturing.
The diversification of primary industries refers to the aim to have producers (primary industries) also perform processing (secondary industries) and distribution and sales (tertiary industries) in order to diversify their management
Semiconductors have become an integral part of our modern lives that relies heavily on electronics, serving as the foundation for a wide range of such devices, from smartphones and computers to medical equipment, automotive applications, and renewable energy systems.
New fabs will focus on making cutting-edge chips, not those based on older, established technology. So how should your company solve for potential limited supplies?
ASIC design is the specialized practice of developing chips tailored to perform specific tasks with maximum efficiency, precision, and reliability—combining architectural insight, hardware expertise, and careful trade-offs to meet exact functional and system-level requirements.
This article aims to provide a comprehensive guide to RTL design, including the fundamentals, operations, and advanced concepts while addressing the challenges and nuances that make this design approach valuable.
Discover what tented vias are in PCB design and how to use them effectively – covering their definition, benefits, drawbacks, and best practices from design through manufacturing!
TechBlick's presentation reviews printed electronics' industrial applications, dispelling the notion that it's solely a technology of the future. The talk showcases various commercial success stories incl. photovoltaics, displays, sensors, HMIs, 3D electronics, MLCCs, PCBs, semicon packaging, etc
A novel stretchable film has been developed for soft & stretchable circuit / electronic solutions, outperforming existing films like TPU. Here you can learn about case studies showcasing its potential in pliable PCBs, stretchable hybrid PCBs, and truly stretchable electronics.
In this article+talk, electrical 3D printing's technical aspects are covered, covering resin printing, circuit formation, part mounting, materials, and methods. Learn about low-temperature soldering, embedded components, and the impact on rapid prototyping and unique device manufacturing.
Originally, the vast majority of GIS offered 2D displays, but with the advancement of technology, many systems now feature 3D displays capable of visualizing geospatial information more clearly for different purposes.
Castellated holes are extensively used in the printed circuit board (PCB) design process. This article is a detailed overview of castellated holes, covering their history, application, benefits, design attributes, challenges, and significance in modern electronic design.