This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Leaking fluids can wreak havoc if not detected at an early stage. This article showcases ultra-thin and flexible leak-detection solutions that can stick to any surface and immediately alert users in case of a leakage.
The IoT has been a game-changer for large-scale agricultural food growth. Through precision farming—which uses connectivity, sensors, machines, drones and data analytics—farmers can create the ideal crop growing conditions and achieve the best yield-to-input ratio.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Leaking fluids can wreak havoc if not detected at an early stage. This article showcases ultra-thin and flexible leak-detection solutions that can stick to any surface and immediately alert users in case of a leakage.
The IoT has been a game-changer for large-scale agricultural food growth. Through precision farming—which uses connectivity, sensors, machines, drones and data analytics—farmers can create the ideal crop growing conditions and achieve the best yield-to-input ratio.
Thin film deposition is a process used to create thin film coatings on different materials. Thin films can consist of metal, semiconductors, and dielectrics, providing them with different properties. These properties translate to benefits such as electrical insulation, optical transmission, and corrosion resistance, that can be used to improve substrate performance. This article explores the processes of thin film deposition, along with its types, parameters, benefits, drawbacks, and applications.
As a result of the development of various machines and robots, we have become able to effortlessly handle jobs that humans could not perform with muscle strength and motor skills. Moreover, owing to advances in sensors, AI, and other information processing technologies, we have also become able to use perceptual abilities that exceed the five human senses.
Researchers at ETH Zurich, Empa and EPFL are developing a 3D-printed insole with integrated sensors that allows the pressure of the sole to be measured in the shoe and thus during any activity. This helps athletes or patients to determine performance and therapy progress.
The Composite Engineering Challenge, organized by the Mitsubishi Chemicals Group and Wevolver, invited innovators, entrepreneurs, startups, and scaleups to submit projects that make use of fiber-reinforced composites.
Article #5 of Innovations in Electric and Autonomous Vehicles Series: EV batteries and chargers evolve, and as traditional auto sales dropped, EV sales continued to rise over the past years. What will this mean for investors and consumers? Where is the tech taking us and what stands in the way?
ABI Research forecasts that TinyML unit volumes will explode from 15 million units in 2020 to 2.5 billion units in 2030. Find out about this machine-learning technique now.
Filled vias are via holes that are completely filled and closed with conductive or non-conductive material or copper plating. The filled via is one of the many realizations of PCB via covering, specified by industry standards. This article covers the definition, benefits, processes, applications, and challenges of filled vias.
Railways are more energy-efficient than other modes of passenger transportation, with CO₂ emissions per ton-kilometer roughly one-seventh those of passenger cars. The difference is more pronounced over long distances, and high-speed railway networks contribute substantially to energy savings in transport infrastructure.
A cold solder joint is a defect caused by improper melting of solder to bond PCB electronic components. This defect can impact the functionality of a PCB assembly, and so must be carefully avoided.
Robotic assembly lines have revolutionized production processes, enabling manufacturers to achieve high levels of efficiency, productivity, and quality.
Article #3 of Innovations in Electric and Autonomous Vehicles Series: 3GPP intends to use 5G in vehicle-to-everything (V2X) applications with significant advantages over current dedicated short-range communication or other cellular-V2X proposals.