This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Flexible membrane keyboards are used in a variety of electronics, medical devices, automotive, and more due to their thin, lightweight design. This project demonstrates printing one using Voltera’s NOVA system.
Real-time Clock (RTC) modules are the specialized components designed to maintain accurate timing even in medical devices such as neurostimulators, pacemakers, insulin pumps, and other essential devices.
Power Management ICs are the silent architects of energy efficiency. Discover how these specialized integrated circuits optimize power delivery in everything from smartphones to electric vehicles!
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Flexible membrane keyboards are used in a variety of electronics, medical devices, automotive, and more due to their thin, lightweight design. This project demonstrates printing one using Voltera’s NOVA system.
Real-time Clock (RTC) modules are the specialized components designed to maintain accurate timing even in medical devices such as neurostimulators, pacemakers, insulin pumps, and other essential devices.
Power Management ICs are the silent architects of energy efficiency. Discover how these specialized integrated circuits optimize power delivery in everything from smartphones to electric vehicles!
Henkel Adhesive Technologies holds leading market positions worldwide in the industrial and consumer business. As a global leader in the adhesives, sealants, and functional coatings markets, Henkel has developed a large material portfolio of LOCTITE® conductive inks ...
Flexible Multilayer Electronics combine flexibility with advanced functionality, enabling applications in wearables, biosensors, defense, and consumer electronics. This article explores how technologies like Voltera’s NOVA platform are making their development more accessible.
Cornell scientists have developed a novel technique to transform symmetrical semiconductor particles into intricately twisted, spiral structures – or “chiral” materials – producing films with extraordinary light-bending properties.
Surface Mount Technology (SMT) revolutionized electronics manufacturing by enabling smaller, faster, and more efficient circuit designs. This guide delves into the core principles of SMT, explores its cutting-edge advancements, and addresses the challenges in implementing this technology.
This article explains, how is a microprocessor different from an integrated circuit, exploring their key differences, architectures, technological advancements, and potential applications.
Scientists at ITMO University have developed multiple-use sensor substrates coated with gold nanoparticles for use in gauging the precise ratio of chlorogenic acid in natural and manufactured raw material.
The integration of Git for hardware platform AllSpice addresses communication silos between firmware, software, and hardware teams, enhancing synergy and efficiency within tech enterprises.
The rapid evolution of ADAS boosts demand for real-time processing and complex power management, requiring high-performance processors and advanced solutions like the 80V LM5137F-Q1 and 6V, 30A TPS62883-Q1 buck converters to ensure optimal operation and meet top safety standards like ASIL D.
A comprehensive technical analysis comparing High Bandwidth Memory 2 (HBM2) and GDDR6 memory architectures, examining architectural differences, performance metrics, and system integration considerations. Essential reading for system architects working with high-performance computing systems.