This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
The future of hardware engineering is being redefined by automation, Git-powered version control, and CI/CD integration. With tools like AllSpice enabling real-time collaboration, development cycles are becoming faster, smarter, and more seamless—pushing the limits of innovation like never before.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
The future of hardware engineering is being redefined by automation, Git-powered version control, and CI/CD integration. With tools like AllSpice enabling real-time collaboration, development cycles are becoming faster, smarter, and more seamless—pushing the limits of innovation like never before.
Researchers at the Technical University of Munich (TUM) have invented an entirely new field of microscopy, nuclear spin microscopy. The team can visualize magnetic signals of nuclear magnetic resonance with a microscope.
Metamaterials are artificial substances that allow wave phenomena such as light and other electromagnetic waves and sound (sound waves) to be controlled as desired by behaving in ways not found in substances in the natural world. "Meta" is a Greek word that means "transcending."
Using an approach called DNA origami, scientists at Caltech have developed a technique that could lead to cheaper, reusable biomarker sensors for quickly detecting proteins in bodily fluids, eliminating the need to send samples out to lab centers for testing.
Miniaturization in modern wearables and portable devices is shaped by consumer demands for compact, lightweight, and efficient electronics; Real-Time Clock (RTC) modules are essential for their precise timekeeping, low power consumption, and ease of integration into small designs.
As the demand for smarter, faster, and more efficient electronic devices grows, the development of advanced circuits is becoming central to the evolution of next-generation technologies.
Flexible membrane keyboards are used in a variety of electronics, medical devices, automotive, and more due to their thin, lightweight design. This project demonstrates printing one using Voltera’s NOVA system.
Real-time Clock (RTC) modules are the specialized components designed to maintain accurate timing even in medical devices such as neurostimulators, pacemakers, insulin pumps, and other essential devices.
Power Management ICs are the silent architects of energy efficiency. Discover how these specialized integrated circuits optimize power delivery in everything from smartphones to electric vehicles!
Henkel Adhesive Technologies holds leading market positions worldwide in the industrial and consumer business. As a global leader in the adhesives, sealants, and functional coatings markets, Henkel has developed a large material portfolio of LOCTITE® conductive inks ...