This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Researchers at ITMO University rolled out their far-field wireless technology for low-power devices such as Internet of Things (IoT) and smart home sensors detecting motion, temperature, humidity, and other parameters.
Innovative semiconductor solutions are essential for addressing ADAS sensor integration challenges, including power management, communication reliability, and safety enhancements, enabling smarter and safer automotive systems.
Nanoinks and nanopastes are composed of nanoparticles suspended in a solution or paste. These materials can be printed or applied to surfaces with extreme precision, making them ideal for electronic manufacturing.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Researchers at ITMO University rolled out their far-field wireless technology for low-power devices such as Internet of Things (IoT) and smart home sensors detecting motion, temperature, humidity, and other parameters.
Innovative semiconductor solutions are essential for addressing ADAS sensor integration challenges, including power management, communication reliability, and safety enhancements, enabling smarter and safer automotive systems.
Nanoinks and nanopastes are composed of nanoparticles suspended in a solution or paste. These materials can be printed or applied to surfaces with extreme precision, making them ideal for electronic manufacturing.
The future of hardware engineering is being redefined by automation, Git-powered version control, and CI/CD integration. With tools like AllSpice enabling real-time collaboration, development cycles are becoming faster, smarter, and more seamless—pushing the limits of innovation like never before.
Researchers at the Technical University of Munich (TUM) have invented an entirely new field of microscopy, nuclear spin microscopy. The team can visualize magnetic signals of nuclear magnetic resonance with a microscope.
Metamaterials are artificial substances that allow wave phenomena such as light and other electromagnetic waves and sound (sound waves) to be controlled as desired by behaving in ways not found in substances in the natural world. "Meta" is a Greek word that means "transcending."
Using an approach called DNA origami, scientists at Caltech have developed a technique that could lead to cheaper, reusable biomarker sensors for quickly detecting proteins in bodily fluids, eliminating the need to send samples out to lab centers for testing.
Miniaturization in modern wearables and portable devices is shaped by consumer demands for compact, lightweight, and efficient electronics; Real-Time Clock (RTC) modules are essential for their precise timekeeping, low power consumption, and ease of integration into small designs.
As the demand for smarter, faster, and more efficient electronic devices grows, the development of advanced circuits is becoming central to the evolution of next-generation technologies.