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Gain the technical insights to make your robotics systems more reliable, maintainable, and future-ready.

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Wafer dicing separates individual integrated circuits or chips from a semiconductor wafer without damaging their delicate structures and circuits. This process is crucial for the production of electronic devices and components used in various industries, and the demand for it has increased with the development of high-performance and smaller electronic devices. Different dicing techniques, such as blade dicing, laser dicing, and plasma dicing, have been developed, and new innovations continue to emerge to address the challenges of complex semiconductor devices.

The Ultimate Guide to Wafer Dicing: Techniques, Challenges, and Innovations

ORGANIZATIONS. SHAPING THE INDUSTRY.

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The Next Byte

Entertainment

The Next Byte Podcast is hosted by two young engineers - Daniel and Farbod - who select the most interesting tech/engineering cont...

165 Posts

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Creaform

3D Engineering Services

Founded in 2002 in Lévis (Québec, Canada), Creaform is a world-class leader...

160 Posts

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UltiMaker

Manufacturing

Since 2011, Ultimaker has built an open and easy-to-use solution of 3D prin...

105 Posts

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Protolabs

Manufacturing

Manufacturing. Accelerated.

101 Posts

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MacroFab

EMS manufacturing

A better way to build electronics through a redefined experience, innovativ...

79 Posts

TAGGED WITH 3d printing

Nylon parts are used widely, but when standard nylon is not tough enough, glass filled nylon is a good candidate. This polyamide engineering plastic offers higher strength, stiffness and heat resistance by adding powdered glass to nylon resin or compounding nylon with glass fibres.

The Advantages and Disadvantages of Glass-Filled Nylon

MJF 3D printing is a polymer powder-bed fusion process engineered for high throughput and mechanical consistency. Unlike legacy methods, it delivers functional, end-use parts with near-isotropic properties, making it a highly viable alternative to injection molding for low-to-mid volume production.

Multi Jet Fusion (MJF) 3D Printing Technology Overview

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Wafer dicing separates individual integrated circuits or chips from a semiconductor wafer without damaging their delicate structures and circuits. This process is crucial for the production of electronic devices and components used in various industries, and the demand for it has increased with the development of high-performance and smaller electronic devices. Different dicing techniques, such as blade dicing, laser dicing, and plasma dicing, have been developed, and new innovations continue to emerge to address the challenges of complex semiconductor devices.

The Ultimate Guide to Wafer Dicing: Techniques, Challenges, and Innovations

Article #3 of Transforming Industrial Manufacturing with Industry 4.0 Series: Manufacturing has an adoption rate of 85% for IoT, the highest among businesses. Driving the move toward smart factories, some challenges must be overcome to reap the benefits of this disruptive shift.

Building Smart Factories with Industrial IoT

You have been tasked with buying a 3D scanner. The only problem is figuring out where to start your search. You know what 3D scanning is but don’t know enough about it to make an informed choice.

What Is the Best 3D Scanner?

The world of precision technology is constantly evolving, and one of the innovations that have gained significant attention in recent years is the development of micro-fabricated metal nozzle plates. These tiny, intricate components are revolutionizing industries across the board, with various applications in fields like Inkjet Printing, Medical, and Flow Control. In this article, we'll explore the key features of these nozzle plates, their applications, and how they empower important industry applications.

Harnessing the potential of micro precision: how Electroformed micro nozzle plates empower applications across industries

Article #2 of Transforming Industrial Manufacturing with Industry 4.0 Series: The rapid evolution of the manufacturing industry through Industry 4.0 has expanded and evolved the roles of systems, processes, and design engineers in bringing new industrial engineering to life.

The Impact of Industry 4.0 on Industrial Engineering Branches