This article delves into the fundamentals of EMI gaskets, types, and their critical role in protecting electronic devices and ensuring optimal performance in various engineering applications.

EMI Gaskets: The Unsung Heroes of Electromagnetic Interference Shielding

Mike Simmons, Matthew Kleyn, Joseph Vlach, Liz Josephson; Intellivation LLCThe demand for high-performance devices with enhanced functionalities continues to grow. Materials, such as graphene and MoS2, exhibit unique electrical and mechanical properties making them ideal for flexible electronic applications. To meet the rising demand and requirements for flexible 2D microelectronics devices manufactured using Roll to Roll technology, we use innovative manufacturing techniques including vacuum coatings in combination with laser technology. Laser patterning of sputtered coatings provides the ability to achieve high-volume production with precision, functionality and efficiency for a wide range of flexible applications.Sputter deposition is a widely used technique for depositing thin films onto substrates. For flexible 2D microelectronics, sputtered coatings serve as the foundation for building functional devices. Sputtering involves bombarding a target material with ions to eject atoms or molecules, which then deposit onto a substrate to form a thin film. This process allows for precise control over the thickness and composition of the deposited film, making it a preferred method for creating uniform and reproducible coatings. &nbsp;Sputtered layers were deposited using Intellivation’s R2R Lab system. Sputtering provides an excellent method for depositing coatings uniformly over large areas, while laser patterning can create discrete devices, circuits, and other types of discontinuous features required for manufacturing. &nbsp;Using these two techniques in combination provides unique capabilities, particular during product development. &nbsp; Photolithography requires multiple steps and is time consuming, it also requires geometric commitment of features at early stage of design. &nbsp;Laser patterning offers a direct and efficient way to create and define patterns on sputtered coatings including changes in geometry while providing consistent feature size and edge quality.Laser patterning uses a laser beam to selectively remove or modify specific areas of deposited films enabling the generation of intricate patterns with submicron-level precision. &nbsp;Control and precision of the laser is critical and the non-contact nature of laser patterning reduces the risk of contamination and damage to the underlying substrate, ideal for delicate 2D materials. &nbsp;This technique provides the ability to develop and then validate a design and process in small volumes and then easily transfer to large area roll-to-roll production without changes to the laser processing equipment.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEyMTYwNzI0ODg3LVNjcmVlbnNob3QgMjAyNC0wNC0wMyAxNTQwMzkuanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712209387228-Boston-2024-email.jpg" style="width: 100%px;" class="fr-fic fr-dib">Join us and Intellivation at TechBlick's Future of Electronics RESHAPED conference and exhibition in Boston | June 2024 https://www.techblick.com/electronicsreshapedusaDeposition of the conductive material onto the substrate was done with Intellivation’s R2R thin film vacuum deposition Lab coater , it is then laser patterned or the laser is used to isolate regions to crystallize them for interfacing with subsequent layers. Once the substrate, layer stacks and laser variables are optimized, the next phase is to scale these devices to large area R2R processing. <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEyMTYxMDkyODYyLVNjcmVlbnNob3QgMjAyNC0wNC0wMyAxNTQzMzAuanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib">The combination of laser patterning and sputtered coatings has unlocked new possibilities in the high-volume production of flexible 2D microelectronics. This innovative approach addresses the demand for devices with enhanced performance, precision, and scalability. A roll-to-roll approach offers several significant advantages in terms of efficiency, cost and adaptability.&nbsp;<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712209445705-660d896c5506c37659840c4f.jpg" style="width: 768px;" class="fr-fic fr-dib">Intellivation will be exhibiting at TechBlick's Future of Electronics RESHAPED conference and exhibition in Boston | June 2024 https://www.techblick.com/electronicsreshapedusa

R2R Sputtering + Direct Laser Patterning is a great way to create large-area circuits on flexible circuits, even with materials such as graphene or MoS2.  The technology R2R produces high-quality uniform films on large substrates whilst the laser forms precision circuit patterns without photolith.

Flexible Microelectronic Devices produced with Sputtered Coatings and Laser Patterning

This comprehensive series delves into the fundamentals of PCB design, including design workflow, signal integrity, manufacturing, testing and debugging, advanced design techniques, and the latest software and tools available for PCB design.

PCB Design: A Comprehensive Guide to Printed Circuit Board Design - Part 2

PCB Design: A Comprehensive Guide to Printed Circuit Board Design - Part 1

Dive into the future of Edge AI with an in-depth look at the top 5 AI Single Board Computers shaping tomorrow's tech. 

Exploring the Frontier of Edge AI: Top 5 Single Board Computers (SBCs)

This article provides a detailed understanding of microprocessor vs integrated circuit, their basics, key differences, future trends, challenges, and how they synergize to form the backbone of our digital systems.

Microprocessor vs Integrated Circuit: Unveiling the Core of Modern Technology

Close-up of a Rigid-Flex PCB featuring a microchip and miniature electronic components

Understanding the need for Rigid Flex PCB technology, capturing its manufacturing process and applications, and the innovations it has brought in modern electronics design and industrial manufacturing. 

Rigid Flex PCB: Revolutionizing Modern Electronics Design

G-code is a programming language understood by CNC machines and 3D printers

What you need to know about G-code, the programming language essential to translating a digital 3D design into a physical object.

Your Guide to 3D Printing G-Code

This article provides an in-depth exploration of the evolution, fundamental concepts, diverse types, operating principles, and practical applications of ASICs.

What is an ASIC: A Comprehensive Guide to Understanding Application-Specific Integrated Circuits

Discover the differences between titanium vs aluminum and choose the perfect material for your next project. Lightweight or strong? Find out now!

Titanium vs Aluminum

<h2 id="isPasted">The Use of Targets: A Significant Limitation</h2>Creaform has been advocating 3D scanning as an innovative solution for corrosion assessment for more than ten years. Throughout those years, however, we have seen a recurring demand for eliminating positioning targets during data acquisition. Indeed, more than a third of our users have identified the use of targets as a significant limitation of 3D scanning.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1708692185631-Blog-NDT_graphics-01.webp" style="width: 100%px;" class="fr-fic fr-dib">Chart showing the main limitations of 3D scanning according to users (35%: positioning targets, 31%: software limitations, 23%: cable, and 12%: large components).<h2 id="isPasted">Solution: New HandySCAN 3D|MAX Series</h2>3D scanning technology, which still features unmatched precision due to its unique auto-positioning and tracking, is not yet ready to completely eliminate targets. However, Creaform has recently introduced a significant innovation to address this issue. The <a href="https://www.creaform3d.com/en/handyscan-3d-max-series-for-large-objects" target="_blank">HandySCAN 3D|MAX Series</a>, a 3D scanner designed specifically for large parts, was added to the product portfolio. This new scanner has a much wider field of view, allowing users to significantly reduce the number of targets used during the scanning process. In some cases, the targets can even be spaced as far as 30 cm apart.Furthermore, to enhance the scanning experience and preparation, we have developed a new positioning accessory called the 360 Magnetic Target. These new positioning targets can be positioned and removed more quickly than traditional markers. In addition, their geometry makes them more easily detectable by the sensor, regardless of the angle or position the user is holding the scanner.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1708692209084-Prior_Scanning_Setup_Inside_Rail_Car.webp" style="width: 100%px;" class="fr-fic fr-dib">NDT technician scanning a cylindrical section inside a rail car, surrounded by a multitude of positioning targets.On the one hand, the NDT industry is mostly made of large parts and bulky structures, which are challenging to inspect due to the high number of positioning targets they may require. On the other hand, NDT service companies demand as few positioning targets as possible. For this reason, we engineered the new magnetic marker so that users can install and uninstall them very quickly—and in limited numbers.So, what does this improved ease of use represent in terms of productivity gains?<h2>Productivity Gain: 75% Less Inspection Time</h2>To get a better idea of the impact of this improvement, we made an experiment. We scanned a Ford Transit minivan of similar dimensions to a rail car (34 m2 vs 32 m2) with the new HandySCAN 3D|MAX Series. We documented the time required to set up and scan these two vehicles. The inspection carried out with the MAX Series took 75% less time to complete than the one performed with the HandySCAN 700.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1708692229854-2024-02-07-15_09_05-Window.webp" style="width: 100%px;" class="fr-fic fr-dib">Positioned halfway between conventional and long-range scanners, the MAX Series has been designed and optimized for measuring large parts and is the only <a href="https://www.creaform3d.com/en/ndt-solutions/ndt-pipeline-inspection-oil-and-gas-industry" target="_blank" id="isPasted">solution offered in the NDT market</a> with sub-millimeter precision.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1708692237137-handyscan-max-ndt-solutions-refinery-Pressure-Vessel-1-LR-1536x1024.webp" style="width: 100%px;" class="fr-fic fr-dib">NDT technician holding a HandySCAN MAX and inspecting the paint and corrosion of a pressure vessel with a few 360 Magnetic Targets positioned on the structure.<h2 id="isPasted">Faster Preparation and Enhanced Scanning Experience</h2>With the new MAX Series, NDT service companies have the opportunity to become more productive and gain in productivity. Moreover, they can now measure a series of structure dimensions and complex geometries that were simply impossible to assess before with such a high level of precision. This is the case for rail storage tanks, tank cars for transporting oil and gas, distillation columns, and pressure vessels, to name just a few.In short, the HandySCAN 3D|MAX Series, combined with VXintegrity, provides NDT services companies with the most precise solution for assessing large corroded areas, and the fastest experience, from setup preparation to part inspection.<h2>Watch the New Technology in Action</h2><iframe width="640" height="360" src="https://www.youtube.com/embed/gw9O6G5lWZU?&amp;wmode=opaque&amp;rel=0&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true"></iframe>

NDT technician holding a HandySCAN MAX and inspecting the paint and corrosion of a pressure vessel with a few 360 Magnetic Targets positioned on the structure.

The benefits associated with 3D scanning are unanimously acknowledged in the NDT industry. They involve the acquisition of data independent of the user’s expertise or experience, increased precision and repeatability, and significant productivity gains compared to more traditional techniques.

New 3D Scanner Revolutionizing Extensive Surface Damage Assessment

This detailed guide will cover the fundamentals of SMT vs SMD, and THT, exploring their working principle, advantages and disadvantages, comparative analysis, and choosing the right one for electronics assembly.

SMT VS SMD (VS THT): A Comprehensive Guide to Electronics Assembly Techniques

 A semiconductor chip designed via tapeout

Unveiling the Evolution, History, and Significance of the Tapeout Process in Semiconductor Manufacturing.

Tapeout in Semiconductor Manufacturing: An In-depth Exploration

Mock-ups are scaled or full-size models of a design that are used for various purposes, such as aesthetic design evaluation, fit-testing, product testing, demonstration, teaching, and promotion. In the Automotive industry, these physical models of car designs range from simple sketches to full-scale prototypes. Made of various materials, such as clay, foam, plastic, or metal, they are essential for validating the functionality, aesthetics, and performance of new car concepts before they go into production. They are important for custom-made cars and vehicle development for several reasons.<h3>The impact of 3D printing on Mock-ups and Full-scale Prototypes in the Automotive Industry</h3>Large format additive manufacturing (LFAM) is an innovative technology that enables the creation of large parts or structures by depositing layers of material, such as plastic, metal, or composite, using a print head controlled by slicing and automation software.As traditional methods of making mock-ups can be costly, time-consuming, and wasteful, LFAM systems are increasingly adopted in this specific application. Through the use of large-scale 3D printers, the production and supply chain of automotive mock-ups can benefit from several advantages, such as:<ul style="list-style-type: circle;"><li>Faster manufacturing;</li><li>Reduced material waste and cost;</li><li>Improved quality and accuracy;</li><li>Enhanced design freedom and innovation.</li></ul><h3>Read more on why 3D printed mock-ups are important for the Automotive industry and how Caracol and Titans of CNC collaborated on the front grille 3D printed mock-up and end-use custom part for a 1968 Chevrolet C10 custom build by Gas Monkey Garage, Dallas (Texas) <a href="https://www.caracol-am.com/resources/case-studies/how-large-3d-printed-mock-ups-can-accelerate-the-automotive-industry" target="_blank" rel="noopener noreferrer">at this link</a>.</h3>

Working on custom car projects Caracol has seen how large 3D printed mock-ups can help accelerate product development in the automotive industry, from concept design to fitting and production.

How large 3D printed mock-ups can accelerate the automotive industry

In this compelling podcast, host Raymond Yin, explores the rapidly advancing realm of smart home connectivity, offering valuable insights for tech enthusiasts, homeowners, and those intrigued by the potential of interconnected living environments.<h2 dir="ltr">The Essence of Interoperability in Smart Homes</h2>A central theme of the episode is the critical importance of interoperability in smart homes. Yin and LaPré delve into how devices from various manufacturers can seamlessly communicate and collaborate, creating an integrated and efficient home environment. This aspect of smart home technology is not just a convenience but a necessity in our increasingly interconnected world.<a href="https://www.wevolver.com/article/matter-the-future-of-smart-home-connectivity-and-its-impact-on-product-development" target="_blank" rel="noopener noreferrer">Read more about the Matter protocol here. </a><h3 dir="ltr">Benefits of a Unified Ecosystem</h3>The podcast highlights the numerous advantages of a unified smart home ecosystem. The duo discusses how such integration leads to heightened convenience, bolstered security, and improved energy efficiency. These benefits underscore the transformative impact of smart home technologies on our daily lives.The conversation also acknowledges the challenges and complexities inherent in the smart home technology sector. As the field evolves rapidly, staying abreast of these changes and addressing the emerging issues is essential for both developers and consumers.<h3 dir="ltr">Insights from an Industry Expert</h3>Bringing a wealth of knowledge to the table, Chris LaPré shares his expertise on the current landscape of smart home connectivity. He sheds light on recent advancements in wireless technologies and the significance of open standards in promoting interoperability and shaping the future of connected homes.<h3 dir="ltr">Visioning the Future of Connected Homes</h3>The episode provides a glimpse into the future of smart homes, emphasizing the role of interoperability in its evolution. This forward-looking perspective is particularly engaging for listeners keen to understand where smart home technology is headed.In conclusion, "The Tech Between Us" episode with Raymond Yin and Chris LaPré offers a comprehensive and insightful exploration of the present and future of smart home connectivity. It's a must-listen for anyone interested in the intersection of technology and everyday living, providing a clear view of the technological landscape that lies between us and our homes. The podcast also encourages its audience to subscribe and stay updated on future episodes, ensuring they remain at the forefront of technological advancements in the field.

In a recent episode of the podcast "The Tech Between Us," host Raymond Yin engages in a compelling discussion with Chris LaPré, the Chief Technology Officer at the Connectivity Standards Alliance. 

The Tech Between Us Podcast: Exploring the Matter Protocol for a Smarter Home

Sculpteo

Bits to Atoms

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digital fabrication

digital fabrication

Profiles