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Article #1 of our Industrial IoT Revolution Series: As the power requirements and operating frequencies of electronic components rise, new interconnecting technologies are required to cater to the ever-growing demand.
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Engineers at EPFL have developed a method for reading several qubits – the smallest unit of quantum data – at the same time. Their method paves the way to a new generation of even more powerful quantum computers.
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Wearable sensors plus computer vision could reduce the likelihood of degenerative joint disease.
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Mouser Electronics
Electronics
Mouser Electronics is a worldwide leading authorized distributor of semiconductors and electronic components.
219 Posts
TAGGED WITH flexible electronics
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
Explore how frequency shapes EMC behavior from RF emissions to ultra-low-frequency drift, with mitigation strategies for robust, compliant electronic system design.
This article provides a technical overview of the brushless vs brushed motor paradigm, equipping design engineers with the analytical framework necessary to make informed, application-specific decisions.
TAGGED WITH microchips
Ultra-efficient chip design enables extremely strong cryptography algorithms to run on energy-constrained edge devices.
Researchers at ETH Zurich have now developed chip technology that enables verification of the authenticity of sensor data, including images or videos.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
Latest Posts
Article #1 of our Industrial IoT Revolution Series: As the power requirements and operating frequencies of electronic components rise, new interconnecting technologies are required to cater to the ever-growing demand.
Engineers at EPFL have developed a method for reading several qubits – the smallest unit of quantum data – at the same time. Their method paves the way to a new generation of even more powerful quantum computers.
2 minutes read
Wearable sensors plus computer vision could reduce the likelihood of degenerative joint disease.
3 minutes read
People living with disabilities don't want special treatment; they want equal opportunity. The ability to act independently of, and at the same time connect with, others when moving, communicating, learning, working, and socializing.
3 minutes read
Energy harvesting will reduce the constant battery replacements in IoT sensors, benefitting maintenance engineers and future generations alike.
3 minutes read
The semiconductor manufacturing field employs a range of etching techniques to craft intricate patterns and structures on material surfaces, with dry etching and wet etching being primary methods.
Article #7 of our Circuit Protection Series: Designer engineers must incorporate circuit protection early enough in the process of vehicle electronics to avoid last-minute revisions that can delay compliance approvals and potentially compromise circuit performance.
Startram is a concept mass driver that can launch payloads into space without rocket propulsion, instead relying on magnetic levitation (maglev) technology.
Despite specific industries experiencing slowdowns caused by the Covid-19 pandemic, projections in the Bluetooth technology market are optimistic through the remainder of 2021 and beyond.
3 minutes read
Silicon wafers are thin slices of highly pure crystalline Silicon, used in the production of integrated circuits. This article delves into the fascinating world of silicon wafers, unraveling their production process, unique properties, and the wide range of applications that make them indispensable.
Puntozero redesigned the cold plate of the power electronics of Dynamis PRC’s electric race car for additive manufacturing. The result was a 25% lighter liquid-cooled heat sink and bioinspired flow guides that increased the heat transfer surface area by 300%.
5 minutes read
This article provides a comparison between NB-IoT and LTE-M protocols and explores how NB-IoT facilitates energy-efficient and latency-tolerant IoT solutions for hard-to-reach locations.
10 minutes read
The article covers the basics of TinyML, a technology that improves the privacy, energy efficiency, affordability and reliability of devices utilising artificial intelligence. Be a part of TinyML for good, an online event and showcase of ideas that aims at exploring the topic in more detail.
Article #6 of our Circuit Protection Series: The Factories of the Future Will Demand Advanced Circuit Protection Technology to Keep Everything Connected.
Article #5 of our Circuit Protection Series: Ports like RS-485 and Ethernet are a key part of any communication system but can be vulnerable to stress.
