This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Phosphors or QDs for color conversion in LCD and microLED ? Which will win? This is an evolving technology space to watch. Here, it is shown that phosphor technology is evolving, enabling not just red but also green narrowband color conversation with small particle sizes compatible with microLEDs
Molecular particle free inks can offer extreme formability and stretchability, allowing the design and production of 3D shaped and/or in-mold electronics parts with extreme curvatures and complex shapes.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Phosphors or QDs for color conversion in LCD and microLED ? Which will win? This is an evolving technology space to watch. Here, it is shown that phosphor technology is evolving, enabling not just red but also green narrowband color conversation with small particle sizes compatible with microLEDs
Molecular particle free inks can offer extreme formability and stretchability, allowing the design and production of 3D shaped and/or in-mold electronics parts with extreme curvatures and complex shapes.
As NASA prepares to send astronauts back to the Moon to live and explore, capabilities for space-based manufacturing of sensors, circuits, and other electronics will become increasingly critical. Recent microgravity flights have helped to advance cutting-edge methods for 3D printing of electronics
This article delves into the specifics of NPN and PNP transistors, their working principles, applications, comparisons, and factors to consider when choosing between them.
In this episode, we talk about how researchers are developing a sticker that can conduct ultrasound tests along with a machine learning powered robotic solution for choosing chemical proteins when developing new drugs and biofuels or recycling plastics.
The rigid, flex and rigid-flex PCBs are all types of printed circuit boards. The rigid PCB is the traditional board and the base from which the other two variations came about, in response to industry and market needs. Flex PCBs introduced versatility to PCB fabrication and rigid-flex combines both for increased performance. Learn more about these board types, their benefits, disadvantages, and applications in this article.
In this episode, we talk about how researchers are bringing affordable space technology to the masses via additive manufacturing along with a manufacturing approach that could serve as the keystone for wide scale use of affordable, semitransparent organic solar cells.
Digital imaging giant Teledyne DALSA is one of the most senior residents at High Tech Campus Eindhoven. Using state-of-the-art X-ray detectors for medical, dental and industrial applications their ambition is to be both world and innovation leader in their field.
It is incredible to see the progress that organic semiconductors (OSC) have made over the past 15-20 years. Ian Jenks explains in this short 5-min presentation how they are removing the long-existing barriers to adoption of OTFT technology.
Gallium-Indium-Tin is an interesting material for stretchable electronics. It can be formed into a non-toxic RoHS-compliant gel and applied to almost any substrate to form stretchable conductive metallizations and circuits.
Screen printing never ceases to advance and is entering into ultrafine line printing territory. FERNANDO ZICARELLI explains in this short 5-min talks important considerations to achieve fineline printing and further push the resolution down:
A team at Columbia University and the National University of Singapore finds a simple new way to describe the water-like movement of electrons in a novel type of semiconductor, which could pave the way for more efficient electronics.