This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
We first discuss emerging and existing applications for ultra fineline screen printing, outlining how evolution of screen printing can unlock various electronic applications. Next, it will review other printing technologies extending the linewidth resolution to sub-micron range
The ability to turn superconductivity off and on with a literal flip of a switch in so-called "magic-angle twisted graphene" has allowed engineers at Caltech to observe an unusual phenomenon that may shed new light on superconductivity in general.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
We first discuss emerging and existing applications for ultra fineline screen printing, outlining how evolution of screen printing can unlock various electronic applications. Next, it will review other printing technologies extending the linewidth resolution to sub-micron range
The ability to turn superconductivity off and on with a literal flip of a switch in so-called "magic-angle twisted graphene" has allowed engineers at Caltech to observe an unusual phenomenon that may shed new light on superconductivity in general.
Researchers at Texas A&M University and The University of Texas at Austin are working to change that, enabling continuous monitoring that can provide a more comprehensive look at blood pressure than the single snapshot that comes with the cuffs.
A motion sensor or passive infrared (PIR) sensor is an electronic device that detects the movement of an object, anywhere within its field of view, by measuring the infrared (IR) light emitted from, or reflected by, that object.
Introducing the Improving Lives with Digital Healthcare Series: Modern biomedical instruments enhanced by the latest digital technologies can make healthcare more accessible, personalized, and proactive.
This article delves into the core concepts of linear vs switching power supply, exploring their efficiency, noise levels, and other key factors, that help make the right choice for your projects!
The combination of n-type and p-type semiconductors forms PN junctions, which are essential for the operation of electronic devices. This article explains these vital components and how they pave the way for the electronic devices we rely on every day.
Bare boards are the skeletal framework of printed circuit boards (PCBs). They are without electrical components which should have made it a fully functional PCB. This article details the uses, benefits, and drawbacks of bare boards, including the types of bare board testing.
The merging of ECAD and MCAD allows virtual simulation of the manufacturing process and reduces validation gaps that can happen when design efforts happen independently.
A young team with a new technology are currently creating a revolution in the world of printed electronics. In their modern, brand-new lab at the High Tech Plaza, they will be developing a device that can deposit any material on any substrate at a very rapid pace.
Mitigating electronics manufacturing delays starts with understanding where manufacturing processes can go wrong. We’ve highlighted the four key reasons here, giving you a starting point if you struggle with on-time deliveries.