This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
In this episode, we talk about how a novel approach for wind turbine design could alleviate the supply chain bottleneck while maintaining or increasing energy output followed by the initiatives to reduce construction related emissions while focusing on increasing structural longevity.
Mitigating electronics manufacturing delays starts with understanding where manufacturing processes can go wrong. We’ve highlighted the four key reasons here, giving you a starting point if you struggle with on-time deliveries.
Design for Manufacturing (DFM) builds upon five tenets that should apply to the decision chain starting from project initiation. This critical step within the manufacturing development cycle merges design requirements with production methods to create the best end results.
An instrumentation amplifier is a precision differential amplifier designed to amplify small voltage differences. This guide explains the three-op-amp architecture, and how to choose between INA128, AD620, LT1167, and a standard difference amplifier for sensor front-ends.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
In this episode, we talk about how a novel approach for wind turbine design could alleviate the supply chain bottleneck while maintaining or increasing energy output followed by the initiatives to reduce construction related emissions while focusing on increasing structural longevity.
Mitigating electronics manufacturing delays starts with understanding where manufacturing processes can go wrong. We’ve highlighted the four key reasons here, giving you a starting point if you struggle with on-time deliveries.
Design for Manufacturing (DFM) builds upon five tenets that should apply to the decision chain starting from project initiation. This critical step within the manufacturing development cycle merges design requirements with production methods to create the best end results.
With today’s most advanced cloud manufacturing platforms, users can access the full capabilities needed to move seamlessly between prototyping, testing, and full-scale production
Rapid PCBA prototyping using electronics cloud manufacturing offers many advantages including problem identification, reduced error rate, lower costs, and shortened manufacturing timelines.
Article #1 of the Enabling IoT Series. "Intuitive sensing” applications enable humans to interact with smart devices in a more natural and seamless way.
A team of researchers in Korea has been working on functional acoustic energy transmission (AET) systems, and their latest paper details a major breakthrough: Prototypes capable of powering LEDs, sensors, and Bluetooth transmitters at range and through materials include metal, tissue, and water.
Local governments and policymakers are anxious about the U.S. grid’s ability to withstand ever-increasing demand. Consumers could hold the key to an untapped resource.
Battery cells come in rigid form factors that limit where and how they can be implemented in electric vehicles without forcing major design tradeoffs. Capacitech’s flexible energy storage products complements batteries, improves performance, enable features, and streamlines design.
Axelera has recently joined the AI Innovation Center at High Tech Campus Eindhoven. The company is designing chips for AI on the edge with the aim to revolutionise the field and make AI accessible to everyone. They picked up an impressive 10 million euros in their seed investment round.
Choosing Cellular or WiFi Article #1:Cellular and WiFi connectivity have their own distinct benefits for IoT. Learn about the strengths and weaknesses and application examples of each one.