This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
Wearable sensor patches offer many opportunities for healthcare and wellness applications. For comfort and reliability, they should be flexible, soft, conformable, or even stretchable. Printed and hybrid electronics enable the use of almost any substrate and packaging materials, making it essential.
Understanding the key differences between the two high-in-demand battery types. This article focuses on Energy density, lifespan, safety, and cost trade-offs for the technical selection of Li-Ion and LiFePO4 batteries.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
Explore how frequency shapes EMC behavior from RF emissions to ultra-low-frequency drift, with mitigation strategies for robust, compliant electronic system design.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
Wearable sensor patches offer many opportunities for healthcare and wellness applications. For comfort and reliability, they should be flexible, soft, conformable, or even stretchable. Printed and hybrid electronics enable the use of almost any substrate and packaging materials, making it essential.
This guide offers an in-depth overview of different types of electric circuits, exploring their foundational concepts, common circuit layouts, specialized circuits, the latest technological advances, and their applications in real-life scenarios.
Lan Yang and Jie Liao’s optical barcodes for multimode sensing have potential applications in biomedical diagnostics, environmental monitoring, chemical sensing and more
NVIDIA TAO and Edge Impulse integrate to streamline the development and deployment of edge AI models, empowering developers to quickly build and optimize AI applications for diverse hardware environments.
Researchers at MIT used a Voltera NOVA to successfully print field electron emitters with a high-concentration carbon nanotube ink. The research has exciting implications for small satellites.
Explore the transformative power of precision agriculture, highlighting innovations like Particle's M-Series and the future of sustainable farming. Dive into the evolution, technologies, and trends shaping tomorrow's agriculture.
Unlock the secrets to enhancing electronic system performance through strategic PCB stackup configurations, crucial for ensuring signal integrity and mechanical stability.
PCBs printed onto flexible substrates demonstrate huge potential across a range of industries. But what are the materials used to make these printed devices?
Using an ultrasensitive photonic crystal, TU/e researchers were able to detect single particles down to 50 nanometers in diameter. The new research has just been published in the journal Optica.
Robot Operating System (ROS) drivers were developed on Analog Devices products so that they can be readily used within a ROS ecosystem. This article will give an overview on how to use and integrate these drivers in their applications, products, and systems.
The miniaturization of electronics is widely attributed to advances in semiconductor technology as observed by Moore’s Law, but many overlook the design and manufacturing challenges involved in utilizing small device packages such as ball grid arrays.
A comprehensive exploration of open circuits, detailing their characteristics, detection methods, and the pivotal role they play in modern engineering systems.