Scientists at ITMO have come up with a new way to protect microelectronics devices from counterfeit. The new technology is based on gold and silicon nanoparticles with unique optical properties that make it possible to create unclonable functions with a record information density.
PCB Trace Width Calculator
Glossary of Semiconductors Terms
Scientists at ITMO have come up with a new way to protect microelectronics devices from counterfeit. The new technology is based on gold and silicon nanoparticles with unique optical properties that make it possible to create unclonable functions with a record information density.
Master HBM memory technology with our comprehensive engineering guide covering 3D stacking architecture, bandwidth calculations, and design optimization techniques. Discover implementation strategies for AI and HPC applications!
Polymer glass transition temperature (Tg) refers to the temperature at which an amorphous polymer transitions from a glassy, rigid state to a rubbery, flexible state. Understanding the polymer glass transition temperature is crucial for various industries, including engineering and manufacturing.
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
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Semiconductors
Nordic Semiconductor is a fabless semiconductor company specializing in wireless technology that powers the IoT.
181 Posts
Exploring the shift to additive digital printing in modern electronics fabrication.
This article explains the ESP8266 pinout, covering GPIO mapping, boot-strapping pins, safe-to-use pins, flash connections, ADC limits, deep-sleep functions, and NodeMCU and D1 mini pin labels.
Learn how a Hall Effect Current Sensor works, including principles, topologies, specifications, comparisons and engineering applications.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
Exploring the shift to additive digital printing in modern electronics fabrication.
A PCB design can be electrically correct, pass every design rule check and perform exactly as expected on an engineer's screen - and still cause significant problems when it reaches manufacturing.
A semiconductor is a material whose electrical conductivity falls between that of a conductor and an insulator and can be controlled by temperature, light, and impurities. This article covers semiconductor materials, doping, diodes, transistors, and integrated circuits.
Scientists at ITMO have come up with a new way to protect microelectronics devices from counterfeit. The new technology is based on gold and silicon nanoparticles with unique optical properties that make it possible to create unclonable functions with a record information density.
3 minutes read
Master HBM memory technology with our comprehensive engineering guide covering 3D stacking architecture, bandwidth calculations, and design optimization techniques. Discover implementation strategies for AI and HPC applications!
Polymer glass transition temperature (Tg) refers to the temperature at which an amorphous polymer transitions from a glassy, rigid state to a rubbery, flexible state. Understanding the polymer glass transition temperature is crucial for various industries, including engineering and manufacturing.
Hackaday Supercon is returning for an exciting weekend filled with technical talks, badge hacking, and hands-on workshops
The low-cost, scalable technology can seamlessly integrate high-speed gallium nitride transistors onto a standard silicon chip.
Researchers at ETH Zurich and Empa have developed a new image sensor made of perovskite. This semiconductor material enables better colour reproduction and fewer image artefacts with less light. Perovskite sensors are also particularly well suited for machine vision.
4 minutes read
Plasma Science and Fusion Center researchers created a superconducting circuit that could one day replace semiconductor components in quantum and high-performance computing systems.
Discover how Dry Phase Patterning (DPP) showcased a 99 percent reduction both in carbon footprint and electricity used compared to conventional wet etching.
This technical guide explores the various types, material properties, manufacturing processes, and key design considerations associated with blank PCB technology!
Ball Grid Array (BGA) is a high-density packaging technology using solder balls for connections. This guide covers BGA design principles, performance advantages, modern applications (2000+ pins in 45mm), and cutting-edge implementation techniques for engineers.
By performing deep learning at the speed of light, this chip could give edge devices new capabilities for real-time data analysis.
Michigan Engineers are leading hardware efforts to enable the AI required for full autonomy.
3 minutes read
Parylene coatings present unique challenges when it comes to rework and removal. They often outperform other conformal coatings. Parylene has better barrier properties, uniform coverage, and performance in thinner layers.
Embedded Multimedia Card (eMMC) is a non-volatile flash memory mainly used in mobile devices and embedded systems. It has a single package design featuring a NAND flash memory integrated with a memory controller.
8 minutes read
How xDS Turns Static Deep Learning Deployments into Resilient, Dynamic Systems
