Carbon fiber 3D printing represents a significant advancement in additive manufacturing technology, combining the strength and lightweight properties of carbon fiber with the design flexibility of 3D printing.
Carbon fiber 3D printing represents a significant advancement in additive manufacturing technology, combining the strength and lightweight properties of carbon fiber with the design flexibility of 3D printing.
Researchers at ETH Zurich and Empa have developed a new image sensor made of perovskite. This semiconductor material enables better colour reproduction and fewer image artefacts with less light. Perovskite sensors are also particularly well suited for machine vision.
This article explains the IPC-A-610 standard for electronic assemblies, including solder joints, inspection criteria, product classes, and quality requirements for reliable PCB manufacturing and high-performance electronics.
Discover how iAM Marketplace simplifies industrial additive manufacturing by unifying materials, validation services, and multi-brand technologies into one open ecosystem for efficient AM sourcing.
This article discusses what attendees can expect from TCT Asia 2026, including its conference format, focus areas, and the experts contributing to industry-specific discussions.
This article discusses the exhibitors, products, and industrial trends defining additive manufacturing across the Asia-Pacific region at TCT Asia 2026.
This article discusses how the Asia-Pacific region is advancing additive manufacturing and the role of TCT Asia as the leading 3D printing and additive manufacturing event in the Asia-Pacific.
Lightweighting materials play a crucial role in offering the potential for improved fuel efficiency, enhanced performance, and reduced emissions in the automotive industry. It is anticipated that the lighter and more efficient automotive materials and components will revolutionize the industry in the coming years.
Carbon fiber 3D printing represents a significant advancement in additive manufacturing technology, combining the strength and lightweight properties of carbon fiber with the design flexibility of 3D printing.
Researchers at ETH Zurich and Empa have developed a new image sensor made of perovskite. This semiconductor material enables better colour reproduction and fewer image artefacts with less light. Perovskite sensors are also particularly well suited for machine vision.
This technical guide explores the various types, material properties, manufacturing processes, and key design considerations associated with blank PCB technology!
TFLN offers a much smaller footprint and improved modulation efficiency, making it highly attractive for short-reach optical communication and future integrated photonics.
What is polypropylene and why is it the second most popular commodity plastic in the world? Here we look at the science behind PP and its top applications.
Parylene coatings present unique challenges when it comes to rework and removal. They often outperform other conformal coatings. Parylene has better barrier properties, uniform coverage, and performance in thinner layers.
Some materials, like metals, tend to expand when heated, while others, like water, show a more complex behavior, with expansion occurring at specific temperatures.
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Learn about other thermal coating properties, like thermal conductivity and glass transition temperature.
An international team of scientists was first to demonstrate that halide perovskites can serve as a base for nonlinear on-chip optical components. As an example, they can be used to build ultrafast optical chips and transistors, and, potentially, other integrated optical systems.
New materials like Cubic Ink 303 VP ESD and AzureFilms Prime HS deliver heat-deflection over 220 Degrees Celsius and matte finish quality - expanding plastics beyond prototyping into tooling and functional parts.
As augmented smart glasses technology edges closer to mainstream adoption, engineers face challenges around display performance. Namely, many seek to achieve higher resolution without driving up power consumption and device bulk.