Sustainability has been one of the key topics at Formnext for several years now. It is becoming increasingly important, especially when it comes to innovations in the field of plastic materials.
As augmented smart glasses technology edges closer to mainstream adoption, engineers face challenges around display performance. Namely, many seek to achieve higher resolution without driving up power consumption and device bulk.
In this episode, we explore how the simple act of popcorn popping inspired researchers at Carnegie Mellon University to revolutionize the synthesis of MXenes—a class of 2D materials known for their radiation shielding properties.
Today's carbon capture systems suffer a tradeoff between efficient capture and release, but a new approach developed at MIT can boost overall efficiency.
When benchmarked against outsourcing, the desktop machine repays its USD15 k capital outlay in 3 months. The industrial press crosses break even at 5 years.
A Japanese consortium reports that it has developed the first technology for additively processing a magnesium alloy. The highly reactive metal offers enormous potential for lightweight constructions and can be used in the aerospace industry, among other areas.
Thermal conductivity is a fundamental concept in heat transfer and is crucial in multiple industries and scientific disciplines. It refers to the ability of a material to conduct heat or the rate at which heat transfers through a substance.
Iron-rich hematite, commonly found in rocks and soil, turns out to have magnetic properties that make it a promising material for ultrafast next-generation computing.
Functional inks are the backbone of printed electronics, transforming ordinary substrates like plastic, paper, or textiles into smart, interactive devices.
This in-depth technical guide explains what is galvanic corrosion, covering the electrochemical mechanisms, influencing factors, consequences in electronics, and mitigation strategies in electronics, hardware, and industrial systems.
In this article, we'll explore the key benefits of multi-material 3D printing, some of the practical applications, and the best practices for achieving optimal results.
LGA uses flat pads for connections, while BGA relies on solder balls for permanent mounting. This guide compares their thermal performance, electrical traits, reliability, and assembly pros and cons to help you choose the best IC package for your needs.
This article explores the principles, methods, and real-world applications of the solderability test, offering insights into how it enhances quality assurance across modern electronics manufacturing processes!