Research and Development product leaders like you and me drive innovation. We turn ideas and problems into safe and manufacturable products by exploring new technologies, materials, and processes to meet technical needs and customer expectations.
Research and Development product leaders like you and me drive innovation. We turn ideas and problems into safe and manufacturable products by exploring new technologies, materials, and processes to meet technical needs and customer expectations.
In this episode, we explore how the simple act of popcorn popping inspired researchers at Carnegie Mellon University to revolutionize the synthesis of MXenes—a class of 2D materials known for their radiation shielding properties.
Today's carbon capture systems suffer a tradeoff between efficient capture and release, but a new approach developed at MIT can boost overall efficiency.
This article explains the IPC-A-610 standard for electronic assemblies, including solder joints, inspection criteria, product classes, and quality requirements for reliable PCB manufacturing and high-performance electronics.
Discover how iAM Marketplace simplifies industrial additive manufacturing by unifying materials, validation services, and multi-brand technologies into one open ecosystem for efficient AM sourcing.
This article discusses what attendees can expect from TCT Asia 2026, including its conference format, focus areas, and the experts contributing to industry-specific discussions.
This article discusses the exhibitors, products, and industrial trends defining additive manufacturing across the Asia-Pacific region at TCT Asia 2026.
This article discusses how the Asia-Pacific region is advancing additive manufacturing and the role of TCT Asia as the leading 3D printing and additive manufacturing event in the Asia-Pacific.
Lightweighting materials play a crucial role in offering the potential for improved fuel efficiency, enhanced performance, and reduced emissions in the automotive industry. It is anticipated that the lighter and more efficient automotive materials and components will revolutionize the industry in the coming years.
Research and Development product leaders like you and me drive innovation. We turn ideas and problems into safe and manufacturable products by exploring new technologies, materials, and processes to meet technical needs and customer expectations.
In this episode, we explore how the simple act of popcorn popping inspired researchers at Carnegie Mellon University to revolutionize the synthesis of MXenes—a class of 2D materials known for their radiation shielding properties.
Today's carbon capture systems suffer a tradeoff between efficient capture and release, but a new approach developed at MIT can boost overall efficiency.
When benchmarked against outsourcing, the desktop machine repays its USD15 k capital outlay in 3 months. The industrial press crosses break even at 5 years.
Thermal conductivity is a fundamental concept in heat transfer and is crucial in multiple industries and scientific disciplines. It refers to the ability of a material to conduct heat or the rate at which heat transfers through a substance.
Iron-rich hematite, commonly found in rocks and soil, turns out to have magnetic properties that make it a promising material for ultrafast next-generation computing.
Functional inks are the backbone of printed electronics, transforming ordinary substrates like plastic, paper, or textiles into smart, interactive devices.
What is Mylar film? Here we explore the properties, applications and processing of Mylar (BoPET) polyester film in electrical and electronic engineering.
This in-depth technical guide explains what is galvanic corrosion, covering the electrochemical mechanisms, influencing factors, consequences in electronics, and mitigation strategies in electronics, hardware, and industrial systems.
In this article, we'll explore the key benefits of multi-material 3D printing, some of the practical applications, and the best practices for achieving optimal results.
LGA uses flat pads for connections, while BGA relies on solder balls for permanent mounting. This guide compares their thermal performance, electrical traits, reliability, and assembly pros and cons to help you choose the best IC package for your needs.
This article explores the principles, methods, and real-world applications of the solderability test, offering insights into how it enhances quality assurance across modern electronics manufacturing processes!
3D printing has revolutionized manufacturing by enabling the creation of complex parts with a wide range of materials. While there are a wide range of different 3D printing materials, in this article, we will examine 3 of the more common materials and compare their strength and performance.
This article reviews threaded inserts for plastics, covering press-fit, heat-set, helical, and molded-in inserts. It highlights their applications, benefits, and suitable materials production technologies as well as explains how to order parts with threaded inserts.