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Wafer dicing separates individual integrated circuits or chips from a semiconductor wafer without damaging their delicate structures and circuits. This process is crucial for the production of electronic devices and components used in various industries, and the demand for it has increased with the development of high-performance and smaller electronic devices. Different dicing techniques, such as blade dicing, laser dicing, and plasma dicing, have been developed, and new innovations continue to emerge to address the challenges of complex semiconductor devices.
