This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
Article 2 of Bringing Intelligence to the Edge Series: Advancements in AI and embedded vision technologies are revolutionizing various industries, enabling real-time decision-making, enhancing security, and facilitating automation in various applications.
Article 1 of Bringing Intelligence to the Edge Series: With the introduction of AI, IoT devices can become more intelligent and less reliant on external systems— but not without trade-offs in performance and cost. Understanding how to make that decision is key.
Introducing the Bringing Intelligence to the Edge Series: Exploring how Artificial Intelligence is moving to embedded systems, transforming technology across various applications.
An instrumentation amplifier is a precision differential amplifier designed to amplify small voltage differences. This guide explains the three-op-amp architecture, and how to choose between INA128, AD620, LT1167, and a standard difference amplifier for sensor front-ends.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
Article 2 of Bringing Intelligence to the Edge Series: Advancements in AI and embedded vision technologies are revolutionizing various industries, enabling real-time decision-making, enhancing security, and facilitating automation in various applications.
Article 1 of Bringing Intelligence to the Edge Series: With the introduction of AI, IoT devices can become more intelligent and less reliant on external systems— but not without trade-offs in performance and cost. Understanding how to make that decision is key.
Introducing the Bringing Intelligence to the Edge Series: Exploring how Artificial Intelligence is moving to embedded systems, transforming technology across various applications.
As IoT technology evolves, automation will play a more important role by, for instance, automatically stopping the watering process once the soil has received a sufficient level of moisture. Furthermore, analysis of irrigation data transmitted to Cloud computing can help ensure that watering occurs at the optimal time (for example, overnight or at cooler times during the day) to minimize evaporation losses.
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
This comprehensive article dives deep into the world of robotics, exploring the history, types, engineering components, applications, and future trends of robots, offering readers an in-depth understanding of how these remarkable machines work and shape our lives.
In this episode, we talk about a combined effort between ETH Zurich & the Swiss Federal Lab for Material Science (EMPA) to create “smart” internal bandages for safely patching patients post stomach/intestinal surgery while providing insight to the medical staff about the status of the patch to prevent leakages which can be fatal.
The Inflation Reduction Act directs nearly $400 billion to clean energy incentives including $47 billion allocated for manufacturing. This article concentrates on the advantages offered to businesses.
This article provides a detailed guide to System in Package technology, its advantages and challenges, key components, design, and manufacturing process.
Products referred to as "beauty tech" that utilize AI, IoT, and other technologies are breathing new life into the cosmetics industry. First, let's look at the background that led to the birth of beauty tech.
Wafer backgrinding is a crucial step in semiconductor manufacturing, as it prepares the wafer for further processing and packaging. The procedure comprises the thinning of silicon wafers by scraping out material from the backside, which is crucial for enhancing the functionality and dependability of semiconductor devices. This article examines the wafer backgrinding procedure, its difficulties, and the significance of quality control in ensuring the production of high-quality semiconductor devices.
Healthcare is undergoing a transformative shift with the rise of stick-to-skin wearable monitoring devices. These data-collecting marvels, such as continuous glucose or cardiac monitoring devices, offer convenience & real-time insights.This article explores capabilities, applications & market trends
Introducing a brand new series featuring innovative projects related to edge computing and machine learning. The first article presents a predictive maintenance solution utilizing the Nordic Thingy:91, monitoring machine health through anomaly detection with a TinyML model.