This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
FR4, often called "fiberglass," quietly underpins our daily lives. Think about your electronics, from smartphones to car and appliance circuit boards. FR4 is the unsung hero behind the scenes, making them work smoothly and power our modern world.
Conversational AI enables machines to respond in a human-like manner. These intelligent systems are designed to understand intent and context, remember user preferences, and engage in meaningful conversations.
A growing desire for continuous data collection, real-time information, and connectivity has resulted in increased demand for electronic functionalities that are fully integrated in everyday objects. Consumer electronics, healthcare, wearable electronics, IoT, and smart packaging ...
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
FR4, often called "fiberglass," quietly underpins our daily lives. Think about your electronics, from smartphones to car and appliance circuit boards. FR4 is the unsung hero behind the scenes, making them work smoothly and power our modern world.
Conversational AI enables machines to respond in a human-like manner. These intelligent systems are designed to understand intent and context, remember user preferences, and engage in meaningful conversations.
A growing desire for continuous data collection, real-time information, and connectivity has resulted in increased demand for electronic functionalities that are fully integrated in everyday objects. Consumer electronics, healthcare, wearable electronics, IoT, and smart packaging ...
In this episode, we unveil the astounding achievement of a student team that created an electric vehicle (EV) capable of shattering the 0-62mph speed record, leaving even the most capable state of the art supercars trailing behind.
This article aims to provide a comprehensive comparison between contactors and relays, highlighting their key differences, applications, and factors to consider when choosing the right device for your needs.
In the dynamic landscape of retail stores, bars, clubs, and seasonal markets, the need for effective product visibility becomes even more evident. Illumination technologies are amongst the highly effective means for brand distinction and impactful visual communication.
How a hand-built electric race car from Swiss university students shattered the 0-62mph (0-100km/h) acceleration record in a mere 0.956 seconds, outpacing the giants of the automotive world.
PWB and PCB are two commonly inter-used terms in the industry of consumer electronics. The former means printed wiring board and the latter, short for printed circuit board. This article explores their similarities and subtle differences; their uses, types, and benefits to the electronics industry.
FPGAs are reconfigurable hardware used for parallel, high-speed processing, while microcontrollers are fixed-architecture chips designed for sequential, control-oriented tasks. FPGAs offer flexibility and performance MCUs provide low power, ease of use, and cost-efficiency.
Identify gaps in current assistive technologies and design innovative solutions that cater to the unique needs of individuals with disabilities. Win great prizes.
Smart lighting company Signify reports that replacing conventional street lighting with energy-efficient LEDs is an effective way to reduce energy consumption and associated emissions.
The fusion of 2D semiconductors and ferroelectric materials could lead to joint digital and analog information processing, with significant improvement in energy consumption, electronic device performance, and lead to novel functionalities.
Printed Circuit Boards (PCB) form the backbone of electronics, while Printed Circuit Board Assemblies (PCBA) complete the circuit with components – this article explores the differences, roles, and implications in hardware design and manufacturing of PCBA vs PCB.