This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This article provides a comprehensive analysis of Arduino vs Raspberry Pi, highlighting their essentials, key features, and recent developments, helping you make an informed decision for your next project.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
This article provides a comprehensive analysis of Arduino vs Raspberry Pi, highlighting their essentials, key features, and recent developments, helping you make an informed decision for your next project.
If you force anything through a length of pipe or cable, the amount of power at the supply end will inevitably diminish by the time it gets to the exit. Electrical cables are no different. When electric current travels through cables, its flow is always impeded by the cable's inherent DC resistance.
Perovskite-based (PSC) and organic photovoltaic (OPV) cells are promising solar technologies. Adhesives play a crucial role offering not only mechanical stability but also environmental protection. This article focuses on the various types of adhesives used in the encapsulation of OPV or PSC cells.
Researchers from EPFL have developed a next-generation miniaturized brain-machine interface capable of direct brain-to-text communication on tiny silicon chips.
To successfully create durable smart devices, you need to begin with the stresses they will face. Learn about the common issues smart city applications must overcome every day.
Explore key methods like Direct Ink Writing, screen printing, and jet dispensing, and learn how Voltera’s V-One and NOVA are transforming the solder paste application process for improved accuracy and efficiency.
Article 3 of Next-Generation Current Measurement Series: Magnetic current sensors streamline PCB design by accurately measuring current through magnetic fields to reduce complexity in modern electronics.
Distributed air gap cores, traditionally expensive, enhance efficiency and thermal management in high-power, high-frequency applications by reducing reluctance and fringing flux. Standardization efforts by brands like TDK are making these advanced solutions more accessible and cost-effective.
How to optimize the art of inkjet printing for functional and electronics printing? We will discover that there are multiple potential causes of satellites and explore some of the ways to minimize their formation and effect.