This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
MacroFab's FabIQ aims to disrupt this status quo by leveraging artificial intelligence and a vast database to provide instant, accurate pricing for printed circuit board (PCB) assemblies and panels.
Circuit Showdown pits three engineering students against each other in a high-pressure design competition. With just four hours to build projects from scratch, they must showcase creativity and technical skills to impress the judges and win $40,000 in prizes.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
MacroFab's FabIQ aims to disrupt this status quo by leveraging artificial intelligence and a vast database to provide instant, accurate pricing for printed circuit board (PCB) assemblies and panels.
Circuit Showdown pits three engineering students against each other in a high-pressure design competition. With just four hours to build projects from scratch, they must showcase creativity and technical skills to impress the judges and win $40,000 in prizes.
AllSpice is a Git-based collaboration platform that transforms hardware development by streamlining project workflows, enhancing design precision, and reducing time to market through established software engineering practices such as Agile and CI/CD.
A wearable ‘smart’ choker for speech recognition has the potential to redefine the field of silent speech interface (SSI), say researchers – thanks to embedded ultrasensitive textile strain sensor technology.
In this episode, we explore an innovative and sustainable wearable device designed by researchers at the Karlsruhe Institute of Technology to improve posture and we discuss why AI isn’t just a novelty in this product but a core feature that sets it apart from the rest!
Amphenol Sine Systems' ecomate® Rugged Metal (RM) Shielded Connectors overcome RFI/EMI and withstand harsh environments. Enhance the reliability of your projects with durable, versatile connectors perfect for industrial, off-road, solar, and more applications.
The fragmented nature of traditional hardware development tools calls for the adoption of a unified, technology-driven approach that integrates robust version control systems like Git alongside methodologies similar to agile and DevOps to streamline processes and enhance team collaboration.
The BMF parts were able to withstand the extreme temperature enabling Z-Axis to use standard electronic system manufacturing techniques using 3D printed connectors.
This article explores the basics, types, and key considerations surrounding decoupling capacitors in electronic systems, providing insights into mastering power integrity in modern designs.
A team of academic and enterprise researchers has developed a synthesis process to produce a “rust-resistant” coating with additional properties ideal for creating faster, more durable electronics.