This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Azoteq's IQS39x family combines capacitive sensing and haptic feedback in a single compact IC, enabling more responsive, intuitive, and reliable user interfaces for next-gen consumer, industrial, and wearable devices.
Polymer glass transition temperature (Tg) refers to the temperature at which an amorphous polymer transitions from a glassy, rigid state to a rubbery, flexible state. Understanding the polymer glass transition temperature is crucial for various industries, including engineering and manufacturing.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Azoteq's IQS39x family combines capacitive sensing and haptic feedback in a single compact IC, enabling more responsive, intuitive, and reliable user interfaces for next-gen consumer, industrial, and wearable devices.
Polymer glass transition temperature (Tg) refers to the temperature at which an amorphous polymer transitions from a glassy, rigid state to a rubbery, flexible state. Understanding the polymer glass transition temperature is crucial for various industries, including engineering and manufacturing.
Researchers at ETH Zurich and Empa have developed a new image sensor made of perovskite. This semiconductor material enables better colour reproduction and fewer image artefacts with less light. Perovskite sensors are also particularly well suited for machine vision.
Plasma Science and Fusion Center researchers created a superconducting circuit that could one day replace semiconductor components in quantum and high-performance computing systems.
Discover how Dry Phase Patterning (DPP) showcased a 99 percent reduction both in carbon footprint and electricity used compared to conventional wet etching.
Utility robots can't always count on GNSS, especially in dynamic, busy environments like cities or industrial settings. By combining data from multiple sensors, Fixposition shows how sensor fusion can help robots stay on track and work reliably in the real world.
This technical guide explores the various types, material properties, manufacturing processes, and key design considerations associated with blank PCB technology!
Ball Grid Array (BGA) is a high-density packaging technology using solder balls for connections. This guide covers BGA design principles, performance advantages, modern applications (2000+ pins in 45mm), and cutting-edge implementation techniques for engineers.
Parylene coatings present unique challenges when it comes to rework and removal. They often outperform other conformal coatings. Parylene has better barrier properties, uniform coverage, and performance in thinner layers.
Cornell researchers have developed a soft robotic device that gently grips and injects living plant leaves with sensors that help it detect and communicate with its environment. The robot can also inject genetic material that could be used for bioengineering plants in the future.