This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
With help from recent gifts, the Stanford Wearable Electronics Initiative eWEAR-X is supercharging its efforts to transform researchers inspiration into reality by augmenting the Ideation and Prototyping Lab and providing seed funding for members of the university community.
The Silicon Photomultiplier (SiPM) is transforming optical sensing and LiDAR technology by providing high photon detection efficiency, low noise, and fast response times, enabling greater accuracy and resolution in applications such as autonomous navigation, environmental mapping, and 3D imaging.
This article explains practical DC motor speed control techniques for both brushed and BLDC systems, covering design principles, control methods, and engineering considerations behind reliable motor speed control.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
Explore how frequency shapes EMC behavior from RF emissions to ultra-low-frequency drift, with mitigation strategies for robust, compliant electronic system design.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
With help from recent gifts, the Stanford Wearable Electronics Initiative eWEAR-X is supercharging its efforts to transform researchers inspiration into reality by augmenting the Ideation and Prototyping Lab and providing seed funding for members of the university community.
The Silicon Photomultiplier (SiPM) is transforming optical sensing and LiDAR technology by providing high photon detection efficiency, low noise, and fast response times, enabling greater accuracy and resolution in applications such as autonomous navigation, environmental mapping, and 3D imaging.
Explore how TDKs Direct Retinal Projection DRP technology offers a breakthrough, enabling compact, energy-efficient AR glasses designed for all-day wear.
Learn how to calculate impedance in AC circuits – from basic RLC components to complex transmission lines and PCB traces. This guide covers the theory, formulas, methods, and tools needed to determine impedance accurately and ensure proper impedance matching in their designs.
Ambiq’s ultra-low-power edge AI technology is pushing health monitoring by enabling always-on, intelligent wearable devices that track vital signs in real time without relying on cloud connectivity.
Is soldering paste the same as flux? This technical article clarifies the differences for electronics engineers, covering their functionalities and practical implementations in both manual soldering (repairs, prototyping) and automated soldering (SMT reflow assembly)
Conformal coatings are polymeric films on printed circuit boards (PCBs) that protect against hazards like moisture, pollution, chemicals, and temperature changes. This layer of material is vital for the longevity and reliability of electronic parts.
Healthcare is facing a critical workforce shortage, with AI emerging as a key tool to support clinicians by improving diagnostics, treatment planning, and efficiency without replacing human expertise.
This article is a detailed guide on Vcc vs Vdd power rail naming conventions in analog and digital circuits (CMOS vs bipolar), with practical tips for schematics, PCB layout, and IC selection!
Surface Mount Technology PCB assembly is a revolution in electronics design, enabling smaller and more reliable circuits. This guide explores the basics of SMT PCB assembly, how it works, and industry standards. This article is for electronics designers to help understand critical SMT design aspects.
Lightweight, conformable, and cost-effective, new forms of printed flexible electronics open up a world of possibilities in consumer electronics, healthcare, and beyond.
Surface preparation and board cleaning are hot topics in our industry, and an entire history of why this is a debate would be beyond the scope of this article. If you are looking for that type of deep dive, Aqueous has a great reference.