This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Focused laser-like light that covers a wide range of frequencies is highly desirable for many scientific studies and for many applications, for instance quality control of manufacturing semiconductor electronic chips.
This article explores the theory, operation, and real-world implementations to provide a comprehensive understanding of N-Channel MOSFET basics for professional engineers and advanced learners.
The applications of 3D printing span many industries, from aircraft fuel nozzles to dental aligners. Here we look at some of the most important uses of the technology.
The demand for predictive maintenance (PdM) solutions in the energy sector is rapidly evolving. The global PdM market is projected to grow 31% from 2024 to 2029
Conventional microcontrollers make digital control impractical in 50 W-1 kW power supplies due to cost and power demands. ROHMs LogiCoA™ overcomes this with a hybrid, event-driven design that adds calibration, logging, and software flexibility for efficient, scalable power electronics solutions.
Understand the theory behind resistors, explore real world applications, and learn how to select the right component for reliable designs. This article targets digital design and hardware engineers, and electronics engineering students looking for an authoritative resource on resistors.
A wafer is the thin substrate used to build integrated circuits in semiconductor manufacturing. This article compares 200mm and 300mm wafer sizes, covering die count, fabs, process nodes, costs, and applications in CPUs, GPUs, automotive, analog, IoT, and more.
What if your next critical manufacturing project was halted by an unexpected supply chain disruption? In modern manufacturing, that is a constant risk. Staying on track requires agile sourcing, real-time coordination, and partners who can adapt when plans shift.
A centralized 720 kW power system built with MEAN WELL's SHP-10K power supplies and engineered by Sager Electronics delivers high-efficiency, low-maintenance performance for a horticultural facility running 720 LED lights per room, simplifying control, scaling reliably, and minimizing heat.