This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
PCB etching is a chemical process that removes copper to form circuits. This guide covers fast etchants, FeCl₃ reactions, AI-driven optimization, aerospace standards, and sustainable methods for high-density PCBs in 5G and medical applications.
The EIT series encompasses a range of technologies, with each installment focusing on specific engineering challenges and how sensor integration, power optimization, and design-for-sustainability principles are reimagining sustainable electronics from the ground up.
An instrumentation amplifier is a precision differential amplifier designed to amplify small voltage differences. This guide explains the three-op-amp architecture, and how to choose between INA128, AD620, LT1167, and a standard difference amplifier for sensor front-ends.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
PCB etching is a chemical process that removes copper to form circuits. This guide covers fast etchants, FeCl₃ reactions, AI-driven optimization, aerospace standards, and sustainable methods for high-density PCBs in 5G and medical applications.
The EIT series encompasses a range of technologies, with each installment focusing on specific engineering challenges and how sensor integration, power optimization, and design-for-sustainability principles are reimagining sustainable electronics from the ground up.
Learn how to wire a potentiometer in various configurations (voltage divider, rheostat, sensor) with this in-depth guide. We cover various potentiometer types, provide step-by-step wiring instructions, offer circuit design tips, highlight common mistakes, and include real-world examples.
Scientists at ITMO have come up with a new way to protect microelectronics devices from counterfeit. The new technology is based on gold and silicon nanoparticles with unique optical properties that make it possible to create unclonable functions with a record information density.
Polymer glass transition temperature (Tg) refers to the temperature at which an amorphous polymer transitions from a glassy, rigid state to a rubbery, flexible state. Understanding the polymer glass transition temperature is crucial for various industries, including engineering and manufacturing.
aster KCL circuit analysis with our comprehensive engineering guide covering nodal analysis, modern simulation tools, and industry applications. Learn advanced techniques used by leading engineers. Start optimizing your circuit designs today.
Azoteq's IQS39x family combines capacitive sensing and haptic feedback in a single compact IC, enabling more responsive, intuitive, and reliable user interfaces for next-gen consumer, industrial, and wearable devices.
Researchers at ETH Zurich and Empa have developed a new image sensor made of perovskite. This semiconductor material enables better colour reproduction and fewer image artefacts with less light. Perovskite sensors are also particularly well suited for machine vision.
Plasma Science and Fusion Center researchers created a superconducting circuit that could one day replace semiconductor components in quantum and high-performance computing systems.