These miniature scaffolds for 3D circuits are designed to assemble themselves.
3 minutes read
Be the first to know.
Get our electronics weekly email digest.
Tagged with
electronics
Latest Posts
Quantum dot displays have replaced their dim and energy-intensive predecessors on high-end televisions, but they can also be deployed for futuristic wearable electronics and much more
Arduino on Their Open-Source Ecosystems And Collaborations Fuelling Innovations Around The World
IPC standards ensure quality, reliability, and consistency in PCB design, manufacturing, and assembly. This guide covers key standards like IPC-A-610, IPC-2221, and IPC-J-STD-001, their importance, best practices, compliance challenges, and certification benefits.
The system uses reconfigurable electromechanical building blocks to create structural electronics.
A countersink in PCB design is a conical recess that allows flat-head screws to sit flush with the board surface. This article explores countersinks vs. counterbores, when to use them, IPC standards, manufacturing considerations, and best practices to ensure reliable, cost-effective PCB designs.
PCBs are integral to the functionality of consumer electronics, providing the necessary infrastructure for complex circuitry in a compact form.
A step-by-step guide on designing and fabricating modern printed circuit boards (PCBs) for professional and academic applications.
New electronics printing technologies enable the production of miniature, high-performance 3D electronic devices, with nanomaterials being key to the process
OSAT (Outsourced Semiconductor Assembly and Test) firms package, assemble, and test chips for fabless companies and foundries. As chip complexity rises, they boost efficiency, lower costs, and speed market entry for AI, IoT, and HPC. This article reviews OSAT fundamentals, players, and trends.
Advanced PCBs use features like microvias and fine-line traces to achieve ultra-high wiring density that leads to miniaturization and improved device performance
Nanoinks and nanopastes are composed of nanoparticles suspended in a solution or paste. These materials can be printed or applied to surfaces with extreme precision, making them ideal for electronic manufacturing.
Researchers developed a scalable, low-cost device that can generate high-power terahertz waves on a chip, without bulky silicon lenses.
The future of hardware engineering is being redefined by automation, Git-powered version control, and CI/CD integration. With tools like AllSpice enabling real-time collaboration, development cycles are becoming faster, smarter, and more seamless—pushing the limits of innovation like never before.
As the demand for smarter, faster, and more efficient electronic devices grows, the development of advanced circuits is becoming central to the evolution of next-generation technologies.
