Thermal conductivity is a fundamental concept in heat transfer and is crucial in multiple industries and scientific disciplines. It refers to the ability of a material to conduct heat or the rate at which heat transfers through a substance.
Thermal conductivity is a fundamental concept in heat transfer and is crucial in multiple industries and scientific disciplines. It refers to the ability of a material to conduct heat or the rate at which heat transfers through a substance.
LGA uses flat pads for connections, while BGA relies on solder balls for permanent mounting. This guide compares their thermal performance, electrical traits, reliability, and assembly pros and cons to help you choose the best IC package for your needs.
Functional inks are the backbone of printed electronics, transforming ordinary substrates like plastic, paper, or textiles into smart, interactive devices.
Discover how iAM Marketplace simplifies industrial additive manufacturing by unifying materials, validation services, and multi-brand technologies into one open ecosystem for efficient AM sourcing.
This article discusses what attendees can expect from TCT Asia 2026, including its conference format, focus areas, and the experts contributing to industry-specific discussions.
This article discusses the exhibitors, products, and industrial trends defining additive manufacturing across the Asia-Pacific region at TCT Asia 2026.
This article discusses how the Asia-Pacific region is advancing additive manufacturing and the role of TCT Asia as the leading 3D printing and additive manufacturing event in the Asia-Pacific.
Lightweighting materials play a crucial role in offering the potential for improved fuel efficiency, enhanced performance, and reduced emissions in the automotive industry. It is anticipated that the lighter and more efficient automotive materials and components will revolutionize the industry in the coming years.
Thermal conductivity is a fundamental concept in heat transfer and is crucial in multiple industries and scientific disciplines. It refers to the ability of a material to conduct heat or the rate at which heat transfers through a substance.
LGA uses flat pads for connections, while BGA relies on solder balls for permanent mounting. This guide compares their thermal performance, electrical traits, reliability, and assembly pros and cons to help you choose the best IC package for your needs.
Functional inks are the backbone of printed electronics, transforming ordinary substrates like plastic, paper, or textiles into smart, interactive devices.
Iron-rich hematite, commonly found in rocks and soil, turns out to have magnetic properties that make it a promising material for ultrafast next-generation computing.
In this article, we'll explore the key benefits of multi-material 3D printing, some of the practical applications, and the best practices for achieving optimal results.
This article explores the principles, methods, and real-world applications of the solderability test, offering insights into how it enhances quality assurance across modern electronics manufacturing processes!
3D printing has revolutionized manufacturing by enabling the creation of complex parts with a wide range of materials. While there are a wide range of different 3D printing materials, in this article, we will examine 3 of the more common materials and compare their strength and performance.
This article reviews threaded inserts for plastics, covering press-fit, heat-set, helical, and molded-in inserts. It highlights their applications, benefits, and suitable materials production technologies as well as explains how to order parts with threaded inserts.
Smallbatch nickel, cobalt, and titanium powders demand years of R&D and testing - but they're opening new doors in turbines, pumps, and extreme environments.
Is soldering paste the same as flux? This technical article clarifies the differences for electronics engineers, covering their functionalities and practical implementations in both manual soldering (repairs, prototyping) and automated soldering (SMT reflow assembly)
Scientists at EPFL have developed a scalable method to produce porous graphene membranes that efficiently separate carbon dioxide. The breakthrough could significantly reduce the cost and footprint of carbon capture technology.
From crack-free molybdenum MoC0.4 to conductive, anodizable aluminum Aheadd CP1—and ultrafine, user-driven powder production with ultrasonic atomization
Conformal coatings are polymeric films on printed circuit boards (PCBs) that protect against hazards like moisture, pollution, chemicals, and temperature changes. This layer of material is vital for the longevity and reliability of electronic parts.