This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This article explores the principles, methods, and real-world applications of the solderability test, offering insights into how it enhances quality assurance across modern electronics manufacturing processes!
The Silicon Photomultiplier (SiPM) is transforming optical sensing and LiDAR technology by providing high photon detection efficiency, low noise, and fast response times, enabling greater accuracy and resolution in applications such as autonomous navigation, environmental mapping, and 3D imaging.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
This article explores the principles, methods, and real-world applications of the solderability test, offering insights into how it enhances quality assurance across modern electronics manufacturing processes!
The Silicon Photomultiplier (SiPM) is transforming optical sensing and LiDAR technology by providing high photon detection efficiency, low noise, and fast response times, enabling greater accuracy and resolution in applications such as autonomous navigation, environmental mapping, and 3D imaging.
Explore how TDKs Direct Retinal Projection DRP technology offers a breakthrough, enabling compact, energy-efficient AR glasses designed for all-day wear.
With help from recent gifts, the Stanford Wearable Electronics Initiative eWEAR-X is supercharging its efforts to transform researchers inspiration into reality by augmenting the Ideation and Prototyping Lab and providing seed funding for members of the university community.
Learn how to calculate impedance in AC circuits – from basic RLC components to complex transmission lines and PCB traces. This guide covers the theory, formulas, methods, and tools needed to determine impedance accurately and ensure proper impedance matching in their designs.
Surface Mount Technology PCB assembly is a revolution in electronics design, enabling smaller and more reliable circuits. This guide explores the basics of SMT PCB assembly, how it works, and industry standards. This article is for electronics designers to help understand critical SMT design aspects.
This article is a detailed guide on Vcc vs Vdd power rail naming conventions in analog and digital circuits (CMOS vs bipolar), with practical tips for schematics, PCB layout, and IC selection!
Is soldering paste the same as flux? This technical article clarifies the differences for electronics engineers, covering their functionalities and practical implementations in both manual soldering (repairs, prototyping) and automated soldering (SMT reflow assembly)
Has your electric motor failed? Ensuring that your motor is operational is critical to businesses. All electric motors have a predetermined life-span. Usually, this is around 30,000 to 40,000 hours. This is highly dependant on proper maintenance and care.
Conformal coatings are polymeric films on printed circuit boards (PCBs) that protect against hazards like moisture, pollution, chemicals, and temperature changes. This layer of material is vital for the longevity and reliability of electronic parts.
Lightweight, conformable, and cost-effective, new forms of printed flexible electronics open up a world of possibilities in consumer electronics, healthcare, and beyond.
Printed electronics are used in a wide range of devices, including flexible displays, thin-film transistors, sensors, and photovoltaic cells. In this article, we look at five aspects of printing equipment that can be improved by switching to laser sintering.