R2R Sputtering + Direct Laser Patterning is a great way to create large-area circuits on flexible circuits, even with materials such as graphene or MoS2. The technology R2R produces high-quality uniform films on large substrates whilst the laser forms precision circuit patterns without photolith.
This comprehensive series delves into the fundamentals of PCB design, including design workflow, signal integrity, manufacturing, testing and debugging, advanced design techniques, and the latest software and tools available for PCB design.
This comprehensive series delves into the fundamentals of PCB design, including design workflow, signal integrity, manufacturing, testing and debugging, advanced design techniques, and the latest software and tools available for PCB design.
This article provides a detailed understanding of microprocessor vs integrated circuit, their basics, key differences, future trends, challenges, and how they synergize to form the backbone of our digital systems.
Understanding the need for Rigid Flex PCB technology, capturing its manufacturing process and applications, and the innovations it has brought in modern electronics design and industrial manufacturing.
This article provides an in-depth exploration of the evolution, fundamental concepts, diverse types, operating principles, and practical applications of ASICs.
The benefits associated with 3D scanning are unanimously acknowledged in the NDT industry. They involve the acquisition of data independent of the user’s expertise or experience, increased precision and repeatability, and significant productivity gains compared to more traditional techniques.
This detailed guide will cover the fundamentals of SMT vs SMD, and THT, exploring their working principle, advantages and disadvantages, comparative analysis, and choosing the right one for electronics assembly.
Working on custom car projects Caracol has seen how large 3D printed mock-ups can help accelerate product development in the automotive industry, from concept design to fitting and production.
In a recent episode of the podcast "The Tech Between Us," host Raymond Yin engages in a compelling discussion with Chris LaPré, the Chief Technology Officer at the Connectivity Standards Alliance.
This article offers an in-depth view of PVD coating in semiconductors, their underlying technology, materials, and applications crucial in today's rapidly evolving technological landscape.