A comprehensive overview of fully depleted silicon on insulator technology, covering device physics, process nodes and practical design approaches to help digital and hardware engineers leverage FDSOI for low power, high performance, and RF/mm wave applications.
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ORGANIZATIONS. SHAPING THE INDUSTRY.
SHINING 3D
3D Scanning & 3D Inspection
SHINING 3D is the global 3d digitiziting technology solution provider, empo...
10 Posts
Latest Posts
Discover how Turkish forging manufacturer EGEMET Ege Metal optimized the inspection of large forged parts and molds using SCANOLOGY's SIMSCAN 42 handheld 3D scanner. The transition from manual measurement to digital inspection improved accuracy, efficiency, and production flexibility.
2 minutes read
This technical article explains how to solder wires effectively, covering tools, techniques, tinning, flux selection, solder joints, and modern automation trends for achieving reliable, high-performance electrical connections in engineering applications.
Discover how DDD Control accelerated electric jetski tool design using Scanology's NimbleTrack 3D scanner, achieving high precision, faster validation, and reduced production time.
4 minutes read
Thermoplastic elastomers can be found in flexible products from wearables to automotive seals. This guide compares TPE vs TPU in terms of properties and applications.
What is ABS filament? This article explores the properties and applications of this robust thermoplastic.
Discover how Dajcor Aluminum improved quality inspection with SCANOLOGY's TrackScan Sharp-E optical 3D system—achieving high accuracy on large aluminum extrusions while cutting inspection time and boosting efficiency.
3 minutes read
Here we explore how Multi Jet Fusion (MJF) 3D printing combines powder bed fusion and ink jetting to produce strong, isotropic parts with exceptional efficiency.
Master what is GDDR6 memory with our comprehensive engineering guide covering architecture, performance formulas, design techniques and applications. Learn how dual channel architecture and 16 Gb/s per pin data rates empower GPUs, FPGAs and AI accelerators.
This technical article explains, what is HBM, detailing its 3D-stacked architecture, the critical role of advanced packaging, and its application in modern GPUs, AI accelerators, and embedded systems.
Discover key differences in GDDR6 vs GDDR6X memory: compare bandwidth, power efficiency, signaling methods, and design trade-offs for advanced GPU architectures.
Scanology's dynamic tracking 3D scanning solution enabled TAJMAC-ZPS to efficiently inspect large-scale castings up to 5 meters. By ensuring complete coverage, faster data acquisition, and stable alignment, the workflow transformed traditional inspection, delivering higher accuracy and productivity
3 minutes read
Discover the FDM printer meaning in practical terms, exploring how fused deposition modeling works and why it remains one of the most widely used technologies today.
Understanding the differences between Single Pole Single Throw (SPST), Single Pole Double Throw (SPDT), and Double Pole Double Throw (DPDT) switches is essential for designing reliable hardware. This article explains the theory behind these switching configurations and practical implementations.
How long does a 3D printer take to print a typical plastic part? This article looks at the theory and practice behind 3D print time.
