This article offers an in-depth view of PVD coating in semiconductors, their underlying technology, materials, and applications crucial in today's rapidly evolving technological landscape.
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Understanding the Intricacies of Plasma Etching Systems, Mechanisms, Process types, Equipment and Applications of the Technology, its Impacts on the Environment, and Essential Safety Precautions for Safe and Productive Utilization of the Etching Technique.
Transistors — the tiny on-off switches inside microchips — have gotten smaller and smaller over the years, increasing computing power and enabling smaller devices. During that time, the copper wires that connect these switches have likewise shrunk.
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Two primary PCB assembly techniques have emerged as the electronics industry standards: Through-Hole Technology (THT) and Surface Mount Technology (SMT). This article delves into the intricacies of THT and SMT, providing a thorough comparison of their advantages, disadvantages, and applications.
A new study led by chemists at the University of Illinois Urbana-Champaign brings fresh insight into the development of semiconductor materials that can do things their traditional silicon counterparts cannot – harness the power of chirality, a non-superimposable mirror image.
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Developed by EPFL researchers, the first large-scale in-memory processor using 2D semiconductor materials could substantially cut the ICT sector’s energy footprint.
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A report explores the forces that demand a new method of design, one that is not solely reliant on the exponential scaling predicted by Moore’s law.
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With a groundbreaking open-source architecture, RISC-V is paving the way for a new era of computing technology. In this article, we’ll delve into RISC-V’s evolution, its underlying principles and technical aspects, as well as its limitations and future prospects.
A Printed Circuit Board (PCB) layout is the blueprint that guides the production of circuit boards which are the backbone of any electronic device. This article explores the core principles of PCB layout, component placement, trace routing, signal integrity, and more.
A deep dive into the world of transistors and their application in modern electronics.
Without the coders, engineers, entrepreneurs, and innovators of tomorrow emerging from the classrooms—and soon—it will become increasingly difficult to advance society and tackle diverse global challenges. As things stand now, a global technology talent shortage threatens to stifle progress across all tech sectors.
4 minutes read
Mastering PCB Reverse Engineering: Techniques, Tools, and Best Practices for Success in Electronics
This comprehensive guide will cover the basics of PCB materials, the different types of materials available, their properties, and choosing the right material for your application.
RISC-V, the groundbreaking open and customizable instruction set architecture (ISA), is transforming the world of microprocessors. Its exceptional flexibility empowers developers to craft processors precisely suited for their needs, setting it apart as the go-to choice for a diverse range of devices, from energy-efficient IoT gadgets to powerful servers.
Advanced packaging of semiconductor-based sensors - specially on flexible substrates- brings very specific interconnection requirements. These often are related to a very narrow pitch of the interconnections or the fragility of the sensor. Learn how inkjet printing solves the issues
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