This technical article explains, what is HBM, detailing its 3D-stacked architecture, the critical role of advanced packaging, and its application in modern GPUs, AI accelerators, and embedded systems.
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Latest Posts
This article answers the practical question: how does SPI work, detailing the theory behind the bus, the role of each signal, timing modes, architectures and topologies, and practical design considerations.
Mousebites are tiny perforated holes along the edges of a PCB that allow individual boards to be easily broken off from a larger panel after assembly.
5 minutes read
In 2025, PCB design is not just about connecting components— it is about managing high-speed signals, power efficiency, thermal performance, and manufacturability.
5 minutes read
The USB-C connector has revolutionized modern electronics, offering a compact, reversible design capable of delivering high-speed data, power, and versatility in a single package.
6 minutes read
This guide delves into X5R vs X7R multilayer ceramic capacitors (MLCCs), explaining the physics, design trade-offs, and how to choose the right dielectric for modern digital and analog circuits.
Understanding the differences between Single Pole Single Throw (SPST), Single Pole Double Throw (SPDT), and Double Pole Double Throw (DPDT) switches is essential for designing reliable hardware. This article explains the theory behind these switching configurations and practical implementations.
This article explores the theory, operation, and real-world implementations to provide a comprehensive understanding of N-Channel MOSFET basics for professional engineers and advanced learners.
Understand the theory behind resistors, explore real world applications, and learn how to select the right component for reliable designs. This article targets digital design and hardware engineers, and electronics engineering students looking for an authoritative resource on resistors.
In this guide, we'll show you how to source cheap PCBs, understand what drives their pricing, and maximize your budget.
A wafer is the thin substrate used to build integrated circuits in semiconductor manufacturing. This article compares 200mm and 300mm wafer sizes, covering die count, fabs, process nodes, costs, and applications in CPUs, GPUs, automotive, analog, IoT, and more.
A difference amplifier is an op-amp circuit that amplifies the voltage difference between two input signals while rejecting common-mode noise. This guide covers theory, CMRR, resistor matching, impedance, instrumentation amplifiers, circuit design tips, and real-world applications.
Are you looking to cut costs on PCB batch production without sacrificing quality? In this comprehensive guide, we'll walk you through proven strategies for PCB batch cost reduction, dive into PCB manufacturing cost analysis, and share tips for optimizing PCB production costs.
Capacitors in parallel are ubiquitous in digital and analog hardware. When used properly, they increase capacitance, reduce unwanted impedance and noise, and improve power integrity across a broad frequency range.
Trying to keep up with the ever-shrinking requirements of consumer electronics? Looking to cut every milligram of fuel-wasting weight in automotive and aerospace? The design options printed electronics offer go far beyond what can be achieved with the rigid PCBs of the past.
