Rewarding Engineering Brilliance: Meet the Winners of the Hamamatsu 2025 Innovation Awards
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ORGANIZATIONS. SHAPING THE INDUSTRY.
SHINING 3D
3D Scanning & 3D Inspection
SHINING 3D is the global 3d digitiziting technology solution provider, empo...
10 Posts
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Nexperia's MLPAK MOSFETs offer a balanced, scalable solution for modern power and signal designs, combining proven manufacturing, compact form factors, and application-driven performance across consumer, industrial, and embedded systems.
How InnoPIC's Photonic Raman Spectroscopy Platform Is Taking Aim at One of Medicine's Most Elusive Challenges.
Explore How Smart Cable Systems Are Powering the Next Generation of Robotics
Engineers face multiple design challenges and constraints in the development of wearable diabetes devices. Smaller, reliable, and robust components are helping usher in the next generation of diabetes care devices.
Register now for our next webinar discussing the future of surge protection in connected systems.
This guide explains the gauge system, provides conversion charts for various metals—including steel, aluminum, copper, and brass—and answers common questions about gauge limitations, corrosion resistance, and industry standards.
2 minutes read
This article explores the major trends shaping connector technology in 2025, including miniaturization, ruggedness, increased current density, advanced materials, digital transformation in design and selection, engineering challenges.
Reliable connections are critical in cutting-edge medical devices.
Explore how fiber length, shape, and distribution impact mechanical properties beyond just material choice
Discover How to Protect High-Power USB-C Designs from ESD and Surge Damage.
What is High Bandwidth Memory 3 (HBM3)? This comprehensive engineering guide covers architecture, applications, and performance, along with some advanced techniques used by leading AI companies and best implementation strategies!
This paper explores why JFETs continue to be the interface of choice for high-impedance sensor design where fidelity and low noise are paramount.
Master HBM memory technology with our comprehensive engineering guide covering 3D stacking architecture, bandwidth calculations, and design optimization techniques. Discover implementation strategies for AI and HPC applications!
Azoteq's IQS39x family combines capacitive sensing and haptic feedback in a single compact IC, enabling more responsive, intuitive, and reliable user interfaces for next-gen consumer, industrial, and wearable devices.
