Engineers face multiple design challenges and constraints in the development of wearable diabetes devices. Smaller, reliable, and robust components are helping usher in the next generation of diabetes care devices.
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This guide explains the gauge system, provides conversion charts for various metals—including steel, aluminum, copper, and brass—and answers common questions about gauge limitations, corrosion resistance, and industry standards.
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Register now for our next webinar discussing the future of surge protection in connected systems.
This article explores the major trends shaping connector technology in 2025, including miniaturization, ruggedness, increased current density, advanced materials, digital transformation in design and selection, engineering challenges.
Reliable connections are critical in cutting-edge medical devices.
Explore how fiber length, shape, and distribution impact mechanical properties beyond just material choice
Discover How to Protect High-Power USB-C Designs from ESD and Surge Damage.
What is High Bandwidth Memory 3 (HBM3)? This comprehensive engineering guide covers architecture, applications, and performance, along with some advanced techniques used by leading AI companies and best implementation strategies!
This paper explores why JFETs continue to be the interface of choice for high-impedance sensor design where fidelity and low noise are paramount.
Azoteq's IQS39x family combines capacitive sensing and haptic feedback in a single compact IC, enabling more responsive, intuitive, and reliable user interfaces for next-gen consumer, industrial, and wearable devices.
Master HBM memory technology with our comprehensive engineering guide covering 3D stacking architecture, bandwidth calculations, and design optimization techniques. Discover implementation strategies for AI and HPC applications!
Discover how Dry Phase Patterning (DPP) showcased a 99 percent reduction both in carbon footprint and electricity used compared to conventional wet etching.
Understanding the basics of electrical transformer design, types, strategies, trade-offs, and effective implementation practices.
Flat flexible cables and flexible printed circuit solutions enable high-density, high-speed connections across a wide range of modern electronic applications. While Molex delivers the interconnect technology, Sager supports engineers with design guidance, prototyping, and supply chain execution.
Learn why JFETs are often the preferred choice for low-noise sensor interfaces.
