<p dir="ltr" id="isPasted">The electronics industry has some incredibly complex manufacturing practices and supply chains. Electronic technology evolves at a rapid pace, and products often contain dozens of components sourced from all over the world. Take the Apple iPhone 15, for example. The pocket-size device has a frame made by Chinese company Foxconn, a display made by Korean tech giant Samsung, and communications chips from U.S. companies Qualcomm and Broadcom. That’s a lot of technology and a lot of logistics.</p><p dir="ltr">But a complex supply chain is just the tip of the iceberg. Electronics manufacturers are faced with many diverse challenges such as expanding into new markets, ensuring quality products while dealing with increasing part complexity, reacting to supply chain volatility and resiliency, and dealing with rising concerns over the carbon footprint of electronics throughout their life cycle. Safety issues and smaller forms add further challenges.</p><p dir="ltr">Current trends in electronics address some of these issues but exacerbate others. Developments in material science are resulting in advanced electronics materials that are lighter and more energy-efficient, helping reduce the carbon footprint of electronic products while heightening their performance. 2024 may even see a rise in the use of biodegradable electronics. Elsewhere, <a href="https://xometry.eu/en/additive-manufacturing-in-electronics/" target="_blank">electronics 3D printing</a> continues to show promise in terms of agile manufacturing that eases pressure on global supply chains by localising production, as well as specific applications like 3D printed flexible PCBs. Yet these new developments bring added technological complexity and create new challenges.</p><p dir="ltr">So where does integration of artificial intelligence (AI) come into play? AI is expected to be a major electronics industry trend in 2024 — in terms of production, supply chains, and features of products themselves. As the technology continues to evolve at a rapid pace, engineers and product designers have the opportunity to harness AI for faster and more effective ideation, rapid prototyping, and shorter time-to-market, while suppliers and OEMs can deploy AI for tasks like predictive maintenance and defect detection. AI can also be deployed in procurement processes for smart supply chain management, using big data to make better forecasting and buying decisions. Finally, consumers are beginning to demand improved AI features in products. For example, the next iPhone is expected to provide a revamp of the AI capabilities of its “Siri” digital assistant.</p><p dir="ltr">This article discusses how AI is accelerating advancements in electronics manufacturing for vendors, suppliers, distributors, and beyond. It focuses on two key areas: expedited product development and smart procurement for improved part sourcing.</p><h2 dir="ltr">Accelerating Product Design and Development</h2><p dir="ltr" id="isPasted">One of the most exciting potential uses of artificial intelligence in the electronics industry is the acceleration of product design and development. Engineers and product designers can use AI tools to expedite idea generation and iteration, visualize and develop those ideas, automatically generate Design for Manufacturability (DfM) feedback, initiate and oversee rapid prototyping, and ultimately reduce the time-to-market for cutting-edge products.</p><p dir="ltr">AI can be implemented at the earliest stages of product development. For example, during market research, companies can use AI tools like Appen and Speak to turn data into consumer insights, helping them identify market opportunities. Some of the biggest limitations on this kind of AI use is limited or noisy data, but the electronics industry — particularly consumer electronics — can potentially provide vast datasets due to the large number of end-users.&nbsp;</p><p dir="ltr">Even greater opportunities arise during the ideation stage. Generative AI tools, including large language model (LLM) chatbots like ChatGPT and text-to-image systems like Midjourney, can assist product designers with concepts and early designs. For example, users could submit a prompt such as “five new plug-and-play USB devices targeted at senior citizens” to an LLM chatbot. Ideas can then be developed organically or with further dialogue with the chatbot.</p><p dir="ltr">Text-to-image generation tools provide opportunities for ideation, particularly in areas of electronics where innovative or unusual design can be a major selling point. While a tool like Midjourney may be unlikely to stumble upon an iconic new design like the Sony Walkman or iPod scroll wheel, it could be prompted to ideate new designs for a product such as a pair of headphones. Generative AI tools are helpful for product designers, as they encourage outside-the-box thinking and challenge preconceptions that humans may have trouble overcoming without assistance.</p><p dir="ltr">Generative design tools within established CAD applications like Solidworks Autodesk Fusion 360 and Siemens NX are another way to automate part design and allow engineers to define specific parameters and manufacturing requirements that would not be possible with simple text-to-image generation. This use of AI allows for the solving of specific engineering challenges — reducing the mass of a digital camera body by a set percentage, for example.</p><p dir="ltr">Further along the product development cycle, machine learning is steadily being incorporated into design for manufacturability (DfM) analysis. DfM allows engineers to validate the manufacturability of designs before prototyping, and is typically based on manually written rules (machine envelopes, material behavior, etc.). However, AI is opening up opportunities for more efficient and automated DfM analysis. For instance, researchers have successfully used supervised machine learning during semiconductor fabrication to more accurately identify errors.</p><p dir="ltr"><span class="fr-img-caption fr-fic fr-dib" style="width: 769px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEwNzgzMDMwNjk1LXNodXR0ZXJzdG9ja18xMDU2ODAyNzYzLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Generative design tools can enable the design the efficient design of complex systems.&nbsp;</span></span></span></p><h2 dir="ltr">Smart Procurement for Supply Chain Management</h2><p dir="ltr" id="isPasted">One of the most promising applications of artificial intelligence in the electronics industry is smart procurement: using AI to automate and streamline procurement processes and tackle supply chain challenges using big data. As discussed in the introduction to this article, electronics supply chains can be complex and volatile — a fact made evident by the industry-damaging global chip shortage of 2020–2023 — and buyers need all the tools at their disposal to deal with such challenges.</p><p dir="ltr">As discussed in the Xometry white paper <a href="https://www.xometry.com/resources/ebooks/ultimate-guide-use-of-ai-for-supply-chain-optimization/" target="_blank">The Ultimate Guide to the Use of Artificial Intelligence for Supply Chain Optimization</a>, smart procurement can be defined as the use of “advanced analytics, visualization, robotic process automation (RPA), big data, and artificial intelligence” within the procurement department in order to improve performance. The scope of AI usage can include machine learning, natural language processing, and other systems.</p><p dir="ltr">So what can AI achieve in electronics procurement? Ultimately, nobody is proposing that all part sourcing be left to computers. Rather, AI can be used to perform specific tasks, analyzing massive datasets to reduce risk, streamlining processes, and providing clearer information that leads to faster and more cost-efficient procurement. Would AI have been able to predict the pandemic-related chip shortage? Perhaps not, but datasets can include a very broad range of data points to help identify both risks and revenue opportunities such as new markets and suppliers.</p><p dir="ltr">Specific examples of AI usage in procurement include the use of machine learning algorithms for processes like vendor matching — connecting supplier data to a vendor hierarchy — and cloud-powered <a href="https://xometry.uk/" target="_blank" rel="noopener noreferrer">instant quotations</a> based on technical drawings that significantly shorten the pricing process. While speeding up such tasks may not seem like a radical application of AI, it is precisely the kind of area of supply chain management that can benefit from additional computing power, leaving humans to focus on high-level decision making. But AI algorithms deployed in such a way can have radical results — helping detect anomalies that could be missed using traditional methods, potentially helping to detect instances of fraud, for example.</p><p dir="ltr">While electronics procurement departments may be hesitant to overhaul their systems in favor of AI-driven smart procurement, change is certainly on the horizon. According to a <a href="https://www2.deloitte.com/us/en/insights/topics/operations/chief-procurement-officer-cpo-survey.html" target="_blank">Deloitte survey</a> of chief procurement officers, high-performing officers are “18x more likely to have fully deployed AI/cognitive capabilities” in their workflow.</p><h2 dir="ltr">Conclusion</h2><p dir="ltr">Artificial intelligence is changing the electronics industry in many ways. As a consumer, expect to see greater advancements in AI-powered products like IoT devices, smart home components, and smartphone apps. However, some of the most impactful changes will be taking place behind the scenes in the form of AI-assisted product development and buying strategies, allowing for even faster emergence of new and exciting technologies.</p>

Artificial intelligence (AI) is providing an opportunity for the electronics industry to accelerate design and development and speed up part sourcing.

How AI is Accelerating Advancements in Electronics Manufacturing

<h2 id="isPasted">Simple Tips for Engineers: Beating Supply Chain Issues</h2><p>In a helpful video, Francisco Luna from MacroFab shares great tips for engineers and supply chain professionals. Here’s a quick overview of what he talks about:</p><h3>MacroFab Platform: Making Things Easier</h3><p>Francisco starts with the MacroFab platform. This 24/7 online tool makes engineering work smoother, especially when dealing with supply chain problems. This platform helps you plan better and avoid delays.</p><h3>Before Production: Preparing Your BOM</h3><p>Before starting production, it's crucial to get your Bill of Materials (BOM) right. Francisco suggests double-checking your BOM to prevent future issues. A good BOM means fewer headaches later.</p><h3>For Supply Chain Pros: Stay Prepared</h3><p>If you're managing supply chains, Francisco has advice for you too. He emphasizes the need for being proactive – always plan ahead and keep an eye on what's happening in the supply chain.</p><h3>Common Production Problems: How to Solve Them</h3><p>Francisco talks about the usual problems engineers face during production. He gives practical solutions to these issues making it easier to handle them if they come up.</p><h3>Throughout the Product Life: Key Advice</h3><p>Finally, he gives tips for every stage of making a product. From design to the final product, these tips help engineers stay on top of their game and manage supply chain issues effectively.</p><p>In short, Francisco's advice is a must-watch for engineers and supply chain pros. Following these tips can make your work smoother and help you tackle those tricky supply chain challenges.</p><p><br></p>

As Francisco Luna explains in this short video, the MacroFab technology platform provides superior visibility and flexibility to solve today's most common supply chain issues.  Find out how you can speed up prototyping with MacroFab's technological platform prototyping and mitigate project risk.


Design Tips for Engineers to Combat the Supply Chain Problem

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Autoblocks™ Cloud emerges as a transformative solution, reshaping the way we approach and manage machine operations. Explore the key facets that define AutoBlocks Cloud's impact on seamless connectivity, intelligent insights, and unparalleled control.

Empowering Automation: AutoBlocks Cloud Redefines Connectivity and Control

<p id="isPasted"><em>When applied early in the development cycle, simulation (CAE, FEA) technologies can rapidly accelerate the creation of high-performance, profitable products. But choosing and implementing the right simulation solution effectively can be challenging when you have limited resources.</em></p><p><em>If you are considering implementing simulation (CAE, FEA) for the first time, utilizing CAD embedded simulation tools but running into challenges with speed and accuracy, or want to take the next step and explore multi-physics analysis, the free virtual event&nbsp;</em><a href="https://wevlv.co/altair_simulate_2024" target="_blank" rel="noopener noreferrer"><em>Simulate at the Speed of Design</em></a><em>&nbsp;on May 16th, 2024</em> <em>may be for you.</em></p><p><a class="button-main-action" href="https://wevlv.co/altair_simulate_2024" rel="noopener noreferrer" target="_blank"><em>Read more about the event here.</em></a></p><hr><p>This article refers to the 2023 event. See the updated 2024 event <a href="https://events.altair.com/simulate-at-the-speed-of-design-2024/#:~:text=Following%20on%20from%20Altair's%20highly,their%20development%20process%2C%20developing%20more" target="_blank" rel="noopener noreferrer">here.</a></p><h2><strong>Introduction</strong></h2><p>The product design and manufacturing landscape has been significantly transformed in recent years with the development of advanced technologies such as artificial intelligence, robotics, and the Internet of Things (IoT). One of the most crucial developments in this context is the increased dependence on simulation tools, which have proven to be invaluable assets in reducing risk, cutting costs, and expediting product design processes in new manufacturing environments. This article looks at how simulation tools can revolutionize modern manufacturing using case studies and examples from Altair while also highlighting some of the key speakers from <a href="https://www.wevolver.com/article/simulate-at-the-speed-of-design-2023" rel="noopener noreferrer" target="_blank">Simulate at the Speed of Design</a> event on June 28, 2023.</p><h3><strong>Reducing Risks in Manufacturing</strong></h3><p>Simulation tools can act as a safety net for engineers by identifying product design and manufacturing risks at an early stage of the product development cycle. Picking up on these risks later on — for instance, after a physical prototype has experienced critical failure — has undesirable cost implications and leaves less time for other processes in the development cycle.</p><p><em>Structural and Multiphysics Analysis</em></p><p>In traditional product development, concepts are developed into designs, which are developed into prototypes that undergo a variety of performance tests. How does the product perform under strain? How does it respond to changes in temperature? What happens when it crashes or explodes? If the results of these tests are unsatisfactory, designs need to be altered — sometimes extensively and at great cost, such as when re-tooling is required for moldings.&nbsp;</p><p>With simulation-driven product development, product designers use computer-aided engineering (CAE) and finite element analysis (FEA) tools to virtually evaluate the design early in the development stage. Simulation can range from ultra-fast meshless structural analysis via <a href="https://www.altair.com/simsolid?_ga=2.156665468.618429221.1682446023-1795229757.1682446002" target="_blank">Altair SimSolid</a> — in which users can analyze CAD geometries directly, specifying loads, material properties, and boundary conditions without simplifying the geometry — to complex multiphysics analyses via <a href="https://www.altair.com/simlab/" target="_blank">Altair SimLab</a>, which simulates performance under a combination of variables such as thermal, electromagnetic, and fluid dynamics.</p><p>One user of SimLab is aeronautical tooling company <a href="https://altair.com/resource/driving-aerospace-competitiveness-inespasa-accelerates-design-of-aero-tooling-structures-using-altair-simsolid?lang=en" id="isPasted" target="_blank">INESPASA</a>, a regular collaborator of Boeing and Airbus that has deployed the software’s multiphysics capabilities to estimate the stiffness of aeronautical structural elements and calculate their deformation level. This has allowed engineers to quickly assess proposed solutions and determine the most suitable design.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 302px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjgzNzE2NjkyNTg3LWFsdGFpciAyLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 300px;" class="fr-fic fr-dib"><span class="fr-inner" spellcheck="false">INESPA are using simulation to estimate the stiffness of aeronautical structural elements and calculate their deformation level.</span></span></span></p><p><em>Manufacturing Feasibility</em></p><p>Simulation tools help engineers predict how a manufactured product will perform during use. However, it is equally important to know how a part will behave during its manufacture — and whether it can feasibly be manufactured at all.</p><p>Engineers can use process-specific simulation software to determine whether a design can be efficiently manufactured via injection molding, casting, forming, or 3D printing. These processes have numerous variables, such as liquid material flow, work envelope constraints, and thermal shrinkage, all of which affect manufacturing outcomes and must therefore be factored into the design.&nbsp;</p><p><a href="https://altair.com/resource/boosting-3d-printing-design-with-simulation?lang=en" id="isPasted" target="_blank">Ford Motor Company</a> has used the <a href="https://altair.com/inspire-print3d/" target="_blank">Altair Inspire Print3D</a> additive manufacturing simulation software when printing automotive brackets. Using process-specific simulation tools, Ford has been able to resolve issues such as detachment of support structures and poor surface finish while optimizing printing parameters for improved performance.</p><p><em>Optimal Resource Allocation</em></p><p>One of the most significant advantages of simulation tools is their ability to optimize resource allocation in manufacturing processes. Engineers can utilize these tools to determine the most efficient use of materials, energy, and labor, thus minimizing waste and reducing production costs.</p><p>This optimization can take place at both the design and manufacturing stages. For example, the topology optimization features of a tool like Altair OptiStruct can iterate lightweight, materially efficient designs, while the process simulation tools offered by Altair Inspire can identify efficient manufacturing workflows.</p><hr><p><em>Simulate at the Speed of Design Speaker:</em></p><p><strong>Manufacture High-Quality Metal Formed Parts First Time with Simulation</strong></p><p><a href="https://events.altair.com/simulate-at-the-speed-of-design-2023/#schedule" rel="noopener noreferrer" target="_blank">Jay Weiner - Founder, BiggerBoat Solutions - Canada</a></p><p>With decades of experience in tool and die design and manufacturing, Jay Weiner, founder and forming specialist at BiggerBoat Solutions Ltd. in Ontario, Canada, will share some insights on how using Altair solutions has helped him provide his customers with the most accurate and reliable results.&nbsp;</p><hr><h3><strong>Accelerating Product Design</strong></h3><p>Accelerated product design goes hand in hand with risk and cost reduction. Using simulation tools for rapid iteration and optimization, structural analysis, multiphysics analysis, and detailed process simulation allows engineers to identify feasible designs and discard unfeasible designs faster, giving more time for suitable designs to reach production readiness.</p><p><em>Rapid Iteration and Optimization</em></p><p>By allowing engineers to test multiple design iterations virtually, simulation tools enable fast identification of the most promising solutions and instant optimization for real-world conditions. This rapid iteration process significantly reduces the time it takes to move from concept to production, while also ensuring that the final product meets performance and quality standards.</p><p>When deployed early in the design process, an intuitive and user-friendly simulation tool like <a href="https://www.altair.com/inspire-applications?_ga=2.193905258.618429221.1682446023-1795229757.1682446002" target="_blank">Altair Inspire</a> enables rapid design exploration and product creation within an interactive design environment, ensuring structurally efficient and topologically optimized designs from the outset.&nbsp;</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 302px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjgzNzE2NDA1MDkwLXN0XzAwMDVfMDJfd2Vic2l0ZV9pbnNwaXJlX3doeWluc3BpcmUwMl80ODB4MjQwcHgtcG5nLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 300px;" class="fr-fic fr-dib"><span class="fr-inner" spellcheck="false"><em id="isPasted">Altair Inspire enables the use of PolyNURBS to create free-form smooth geometry, and study multiple assembly configurations.</em></span></span></span></p><p><br></p><p><em>Virtual Prototyping</em></p><p>Within the traditional approach to product design, developing a new product or refining an existing design involves the creation of physical prototypes, which can be both time-consuming and expensive. With simulation tools, engineers can create accurate virtual models that simulate the performance and characteristics of the actual product, allowing them to evaluate various design iterations and make adjustments before committing to physical production.</p><p>This virtual prototyping process not only reduces material and labor costs but also shortens the time to market, as virtual testing and validation takes a fraction of the time of the physical process. This provides a competitive advantage to manufacturers, as it allows a greater number of concepts to be explored simultaneously. While virtual prototyping does not totally eliminate the need for physical prototyping, it can help engineers narrow down a shortlist of designs and identify any major structural or performance issues.</p><p id="isPasted"><em>Enhanced Collaboration</em></p><p>Advanced simulation tools running on a standalone platform — rather than the basic tools offered within a CAD environment — foster a collaborative environment where engineers can share and analyze design data in real-time, regardless of their physical location. This seamless exchange of information facilitates faster decision making and enables teams to iterate designs quickly, ultimately accelerating the product development cycle. This is particularly useful in areas like Electronic System Design (ESD), where several PCB design engineers may need to work on a product design simultaneously.</p><hr><p><em style="background-color: transparent;"><strong>Simulate at the Speed of Design Speaker:&nbsp;</strong></em></p><p>Patient-Specific Implants: Power of Simulation and Design for Improved Patient Outcomes</p><p><a href="https://events.altair.com/simulate-at-the-speed-of-design-2023/#schedule" rel="noopener noreferrer" target="_blank">Marques Felipe - CEO, BioArchitects - Brazil</a></p><p>Marques Felipe discusses the use of simulation solutions for virtual environments to determine if patient-specific implants (PSIs) are reliable and safe for use.&nbsp;</p><hr><p><strong style='font-family: "PT Sans", serif; font-size: 22px; background-color: transparent; color: rgb(0, 0, 0);'>Conclusion</strong></p><p>Simulation tools have emerged as game-changers in the manufacturing sector, offering a wealth of benefits that contribute to safer, more cost-effective, and more efficient operations. By reducing risks, cutting costs, and speeding up product design, these tools empower engineers to thrive in an increasingly competitive landscape, driving innovation and growth in the industry.&nbsp;</p><p>As manufacturing environments continue to evolve, the adoption of simulation tools like Altair Inspire, Altair SimSolid, and Altair SimLab will undoubtedly play a crucial role in determining the success of companies and their ability to maintain a competitive edge.</p><h2><strong>Simulate at the Speed of Design</strong></h2><p>On June 28, 2023, Altair will host the <a href="https://events.altair.com/simulate-at-the-speed-of-design-2023/" target="_blank">Simulate at the Speed of Design</a> virtual global event, featuring presentations from companies using Altair simulation tools to reduce the risk and cost of late design and manufacturing changes.&nbsp;</p><p>The event, whose program will be translated live into nine languages, is targeted at the following groups:</p><ul><li>Engineers</li><li>Product design managers</li><li>Newcomers to simulation tools</li><li>Users of CAD-embedded simulation tools looking to transition to a dedicated solution</li><li>Users of simulation tools looking to introduce multiphysics analysis</li><li>CAE users of all experience levels</li></ul><p><a class="button-main-action" href="https://wevlv.co/altair_simulate_2024" rel="noopener noreferrer" target="_blank">Registration for the virtual event is open now.</a></p>

Simulation tools from Altair streamline the product development cycle by accelerating product design, performing structural and multiphysics analyses, and ensuring manufacturing feasibility. 

Revolutionizing Manufacturing: How Simulation Tools Reduce Risk & Costs, Accelerate Product Design

<h2>Accelerating product design with simulation&nbsp;</h2><p id="isPasted">When applied early in the development cycle,<a href="https://www.wevolver.com/profile/altair" rel="noopener noreferrer" target="_blank">&nbsp;simulation (CAE, FEA) technologies</a> can rapidly accelerate the creation of high-performance, profitable products. But choosing and implementing the right simulation solution effectively can be challenging when you have limited resources.</p><p>If you are considering implementing simulation (CAE, FEA) for the first time or utilize CAD embedded simulation tools but running into challenges with speed and accuracy or want to take the next step and explore multi-physics analysis, the free virtual event <strong>Simulate at the Speed of Design</strong> event on <strong style="background-color: transparent;">June 28, 2023,&nbsp;</strong>maybe for you.</p><p><span style="background-color: transparent;">Learn from your peers and Altair&rsquo;s experts how a mixture of software, support, and know-how can help you be more efficient and effective in developing new products.</span></p><h3 id="isPasted">Why should you attend?</h3><p id="isPasted">Learn how small and medium organisations, are deploying Altair simulation (CAE, FEA) solutions such as Altair&reg; Inspire&trade;, SimSolid&reg; and SimLab&reg; to reduce the risk and cost of late design manufacturing changes.</p><h3><strong>Topics covered in the event</strong></h3><ul><li>Presentations from small-medium business (SMB) customers of Altair and Altair Channel Partners, on their transition from CAD embedded simulation and how they successfully implemented CAE, FEA simulation in their product development workflow.</li><li>Generative design, Concept development, topology optimization or design for manufacture in Altair&reg; Inspire&trade;.</li><li>Rapid structural analysis in Altair SimSolid&reg; for parts or large assemblies.</li><li>Drop test, thermal, CFD, fatigue or combined multiphysics analysis in Altair&reg; SimLab&reg;</li><li>Manufacturing feasibility, Process simulation with Inspire Cast, Inspire Form, Inspire Mold, or Inspire Print3D.</li></ul><p>Sessions will feature live audio translation into English, French, German, Spanish, Italian, Portuguese, Japanese, Chinese, and Korean.&nbsp;</p><header id="isPasted"><h3>Who should attend?</h3></header><ul><li>Individuals working in the design department, including engineers, design managers, and heads of the design department</li><li>If you are using 3D CAD and considering adopting simulation tools (CAE, FEA) for the first time</li><li>Anyone experiencing difficulties with the speed and accuracy of CAD-embedded simulation (CAE, FEA) tools</li><li>CAE Engineers, analysts, and the head of the CAE department</li><li>If you are interested in exploring multi-physics analysis and looking to take the next step</li><li>Managers of related departments who rely on the CAE department or outsource simulation services</li></ul><h2>Register now:</h2><p><span class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable fr-active" contenteditable="false" draggable="true"><iframe src="https://c8056756.sibforms.com/serve/MUIEADq3_HCA2rWZ6TLgOBVpz2rFfM3A99dNaAFKmUeI7IqeN4er1dRCxRf0WscB4d47N6twI2wswvF6fM9QsF4ZraTQYV20Vc9yPSKpxq3bYwdQo7GzhEvbwRM5hzk77a2MbNtkW-WesJEcU8awRUxzXhfJbWVVhkz53YircAuuTx9vu4tHANFd3AwLwdb3G8Lfz-tMVTQo_dQE" frameborder="0" scrolling="auto" allowfullscreen="" style="display: block; margin-left: auto; margin-right: auto; max-width: 100%; width: 540px; height: 600px;" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"></iframe></span><br></p><h2 id="isPasted">Event highlights</h2><p>The Simulate at the Speed of Design Event has events crossing the AMER, EMEA and APAC timezones. <a href="https://events.altair.com/simulate-at-the-speed-of-design-2023/" rel="noopener noreferrer" target="_blank">Check the full agenda on the event homepage</a>.</p><h3>Keynotes and Firesides</h3><p>Highlights of the agenda include keynote addresses from Ravi Kunju - Chief Product and Strategy Officer at Altair as well as a fireside chat with Michael Larner &nbsp;from ABI Research about SMB&#39;s Challenges to Adopting Simulation-Driven Design. The Fireside is moderated by Ujwal Patnaik, the Director of Product Strategy and Pricing at Altair.&nbsp;</p><h3>Exploring Multiphysics - How Design Engineers can Simulate like a Pro?</h3><p>Through examples and best practices, these sessions will demonstrate how Altair SimLab based easy-to-use Multiphysics solutions can inject innovation into your development cycle.&nbsp;</p><p>Of note is the session, titled, <em>&nbsp;Expert Chat: Handling Multiphysics Workflows with CAD associativity in Altair SimLab. Guna Krishna, Senior VP of SimLab development at Altair, hosts the session</em> and Ujwal Patnaik, Director of Product Strategy and Pricing at Altair will moderate.&nbsp;</p><h2>More about Altair:</h2><p>Altair is a global technology company which provides software and cloud solutions in the areas of simulation, high-performance computing (HPC), and artificial intelligence (AI). Altair enables organizations in nearly every industry to compete more effectively in a connected world while creating a more sustainable future.&nbsp;</p><p id="isPasted">Read more about simulation tools from Altair to streamline the product development cycle by accelerating product design, performing structural and multiphysics analyses, and ensuring manufacturing feasibility&nbsp;<a href="https://www.wevolver.com/article/revolutionizing-manufacturing-how-simulation-tools-reduce-risk-costs-accelerate-product-design" rel="noopener noreferrer" target="_blank">here.</a></p>

Learn about how to reduce the risk and cost of late design, and manufacturing changes at the free Altair Virtual Global Event  on June 28, 2023.

EVENT: Simulate at the Speed of Design 2023

An engineer's guide to understanding the future of robotics manufacturing.

The 2023 Manufacturing Robotics Report: Manufacturing

<p><a class="button-main-action" href="https://www.hubs.com/get/supply-chain-resilience-report/" rel="noopener noreferrer" target="_blank">Download the full report here.</a></p><style type="text/css" id="isPasted">
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</style><h2>Why supply chain resilience matters</h2><p>Supply chain disruptions have wide reaching effects. When a supplier in the global production and trade network fails to deliver, it can have a cascading effect on production lines, potentially causing delays and shortages of products. As Hubs&rsquo; Supply Chain Resilience Report outlines, such disruptions are on the rise. Shortages in automotive components manufactured in Ukraine have led to Europe-wide production delays; a ransomware cyberattack on one of Toyota&rsquo;s suppliers led to the automotive company temporarily shutting down production in Japan; sanctions on Russian energy resources have led to an energy shortage and skyrocketing gas prices; and there are many more examples.&nbsp;</p><p>However, supply chains do not necessarily have to be so fragile. Manufacturers and businesses are increasingly realizing the benefits of transitioning away from lean, just-in-time manufacturing models in favor of robust, agile, and resilient supply chain models. A resilient supply chain is one that can not only weather disruptions, but can adapt and react quickly, resulting in faster recovery times. <span style="background-color: transparent;">To build resilience in the supply chain, it is necessary to consider all potential risks and reassess supply networks in the long-term. This multifaceted process requires taking a comprehensive view of the supply chain.</span></p><h2>Key findings</h2><ul><li>43.7% of respondents think increasing local sourcing will help strengthen supply chains in 2023.</li><li dir="ltr" id="isPasted"><p dir="ltr">76.6% of companies experienced externally caused disruptions to their supply chain in 2022, with material shortages being the biggest challenge.</p></li><li dir="ltr" id="isPasted"><p dir="ltr">45.3% of companies had their supply chains impacted by the war in Ukraine.</p></li><li dir="ltr" id="isPasted"><p dir="ltr">70.1% of companies took measures in 2022 to build up supply chain resilience.</p></li><li dir="ltr" id="isPasted"><p dir="ltr">49% of respondents expressed concern about the rising tensions between China and Taiwan.</p></li></ul><h2>The time for resilience is now</h2><p>Supply chain resilience has always been a sound strategy, but the need for it has grown in recent years due to the increasing frequency and severity of disruptions. Hubs&rsquo; Supply Chain Resilience Report breaks down the most significant types of supply chain disruptions and details some of the biggest disruptions of 2022, including the wide-reaching supply chain ramifications of the war in Ukraine.</p><p>In 2020 and 2021, the COVID-19 pandemic was the primary concern for supply chains. However, in 2022, geopolitical tensions and conflicts have become a greater focus of concern.<span style="background-color: transparent;">&nbsp;The escalating tensions between China and Taiwan pose a risk of destabilizing the region and disrupting Taiwan&#39;s semiconductor industry, the largest in the world. The ongoing conflict in Ukraine has resulted in numerous supply chain problems, including trade route blockades, economic sanctions, and raw material shortages. Other geopolitical issues, such as labor strikes and shortages, shipping congestion and costs, and trade wars have also contributed to supply chain challenges.</span></p><p><span style="background-color: transparent;">Natural disasters also pose a severe threat to supply chains. For instance, droughts in China and Europe in 2022 led to significant transport delays along vital water trade routes. As the frequency and severity of natural disasters increase, manufacturers will need to increasingly account for their risk. Hubs cites cybersecurity as a significant supply chain risk, particularly ransomware and data breaches. The COVID-19 pandemic also continues to be a concern due to labor shortages and continued lockdowns in China.&nbsp;</span></p><h2>How to build supply chain resilience</h2><p>There are several measures and tactics businesses can and are employing in order to shore up their supply chains and build supply chain resilience. According to a Hubs survey, 63% of companies have implemented supply chain resilience measures in the past year. This is significant, but still leaves many companies without adequate resilience strategies.</p><p><span style="background-color: transparent;">Decisions made for the purpose of short-term profitability, such as relying on a single supplier for certain parts, should be reassessed in the long-term. Over-reliance on a single country for certain supplies and resources can lead to supply chain vulnerabilities, as we&rsquo;ve seen in Europe in terms of reliance on Russian gas, and Taiwan, which produces&nbsp;</span><a href="https://www.voanews.com/a/race-for-semiconductors-influences-taiwan-conflict-/6696432.html#:~:text=Taiwan%20makes%2065%25%20of%20the,90%25%20of%20the%20advanced%20chips." rel="noopener noreferrer" target="_blank">over 60%</a><span style="background-color: transparent;"><a href="https://www.voanews.com/a/race-for-semiconductors-influences-taiwan-conflict-/6696432.html#:~:text=Taiwan%20makes%2065%25%20of%20the,90%25%20of%20the%20advanced%20chips." rel="noopener noreferrer" target="_blank">&nbsp;</a></span><span style="background-color: transparent;">of the world&rsquo;s semiconductors. Diversifying supply networks is thus one of the most important steps for resilience. Over half of businesses surveyed by Hubs reported that diversification was the best way to avoid supply chain disruptions in the future.</span></p><p>The report also investigates other supply chain resilience strategies, including automation, reserve inventories, agile internal processes, supply chain monitoring, and strengthening client-supplier relationships. By using these tactics in combination, organizations can establish a robust supply network with fewer vulnerabilities that is equipped to mitigate the impacts of any disruptions.&nbsp;</p><h2>Conclusion</h2><p>We are in a time where global supply chains and trade networks are becoming increasingly complex and supply chain disruptions are becoming more common and their effects more extreme. Integrating resilience into supply chains is the only way to ensure disruptions are mitigated and that organizations can succeed over the long-term. Additionally, resilience is key to establishing production stability and meeting consumer demands, particularly for essential goods. Ultimately, it will never be possible to completely avoid disruptions. What is possible is preparing for eventual disruptions and supply chain risks with autonomy, flexibility, and visibility. In a word: resilience.</p><p>Download the full 2023 Supply Chain Resilience Report for more insights on supply chain risks and resilience.</p><p><a class="button-main-action" href="https://www.hubs.com/get/supply-chain-resilience-report/" rel="noopener noreferrer" target="_blank">Download your free report here.</a></p><h2 id="isPasted"><em>About the sponsor: Hubs</em></h2><p><a href="https://www.wevolver.com/profile/hubs" rel="noopener noreferrer" target="_blank"><em>Hubs</em></a><em>, formerly 3D Hubs, is an online platform for custom part manufacturing, providing access to a global network of manufacturing services, including CNC machining, 3D printing, injection molding, and sheet metal fabrication.&nbsp;</em></p><p><em><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjcxMzc3NTE1NDIxLWV5SmlkV05yWlhRaU9pSjNaWFp2YkhabGNpMXdjbTlxWldOMExXbHRZV2RsY3lJc0ltdGxlU0k2SW1aeWIyRnNZUzh4TmpReE9Ua3hOalkxT1RBMUxXaDFZbk1nWW1GdWJtVnlJR0p2ZEhSdmJTNXFjR2NpTENKbFpHbDBjeUk2ZXlKeVpYTnBlbVVpT25zaWQybGtkR2dpT2prMU1Dd2labWwwSWpvaVkyOTJaWElpZlgxOS53ZWJwIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 300px;" class="fr-fic fr-dib"></em></p><p><br></p>

Manufacturing platform, Hubs, has published its Supply Chain Resilience Report 2023, featuring insights from 2022 and addressing recent supply chain disruptions, including the ongoing war in Ukraine, escalating tensions between China and Taiwan, and more.  Download the full report below. 


The 2023 Supply Chain Resilience Report

<h1 id="isPasted">FAB Insights: ENIG vs. ENEPIG</h1><p><strong>How to choose PCBA surface finishes</strong></p><p>Let&rsquo;s review ENIG vs. ENEPIG in a side-by-side comparison to identify the best option for your PCBA projects. This blog will discuss the differences, advantages, and limitations of each.</p><p>ENIG (electroless nickel immersion gold) and ENEPIG (electroless nickel electroless palladium immersion gold) represent two of the main surface finish options to consider for your PCBA project. Surface finishes can stop copper pads from oxidizing, providing excellent component solderability to guarantee the best electrical performance.</p><p>Working with a contract manufacturer (CM) such as MacroFab during your development process will help you identify the pros and cons of each method.</p><h2>What is ENIG?</h2><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1665578673589-1665578673589.png" alt="what is enig" class="fr-fic fr-dii"></p><p>ENIG has been a popular PCB surface finish for several decades due to its flat planar surface. This has been required for assembly due to the rise of tight pitch BGA devices and other small surface-mount form factors. The process can also handle many solder reflow cycles with an extra benefit of a long shelf-life time.</p><p>However, historical manufacturing challenges with some ENIG suppliers have caused nickel corrosion to form the &ldquo;Black Pad&rdquo; effect. This has been a leading weakness related to the ENIG surface finish, although a controllable one when proper measures are taken.</p><p>This &ldquo;Black Pad&rdquo; occurs when the nickel applied beneath the gold plating corrodes and resembles a black surface. This corrosion can lead to poor component solderability and a solder pad that loses connectivity to the component pad.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1665578673267-1665578673267.png" alt="enig surface finish" class="fr-fic fr-dii"></p><p>The ENIG surface finish can be challenging to produce for some PCB manufacturers. When examining the final product, the gold application step can cover the final surface area which can obscure issues that cause &ldquo;Black Pad&rdquo;. The leading root cause analysis of this defect is that it is likely contamination of the Nickel which migrates into Gold and turns it a black color.</p><p>Your CM can rule out such issues through proper inspection; if no spikes or dark bands occur near nickel boundaries, a black pad is unlikely to occur. Additionally, a well-controlled nickel bath can minimize or eliminate the defect. Finally, working with a CM like MacroFab with a <a href="https://macrofab.com/macrofab-guarantee/?utm_content=four-reasons-your-electronics-development-team" target="_blank">one-year workmanship guarantee</a> provides extra peace of mind.</p><h3>Advantages of ENIG</h3><p>An ENIG finish provides many advantages, including:</p><ul><li>Surface flatness for fine-pitch BGA devices and other small form factor components.</li><li>Excellent for in-circuit electrical test points and connectors with press-fit insertion posts.</li><li>Support for wire bonding and edge card connections.</li><li>Lower relative cost compared to ENEPIG finishes.</li></ul><h3>Limitations of ENIG</h3><ul><li>Potential for &ldquo;Black Pads&rdquo; if the nickel and gold processing are not well controlled</li><li>The PCB plating can be affected by the thickness of electroless nickel and gold</li><li>A relatively low wet factor</li></ul><h3>What is ENEPIG</h3><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1665578673663-1665578673663.png" alt="what is enepig" class="fr-fic fr-dii"></p><p>One simple solution to the black pad potential issue is to use a similar alternative surface finish: ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold). The ENEPIG finish solves this issue by depositing electroless palladium on top of the nickel layer. The palladium prevents any Nickel contamination from migrating to the gold. ENEPIG is suitable for PCBs using different packaging technologies soldered across the system board. ENEPIG can also satisfy a wide range of applications such as military, aerospace, and other high-performance devices within the medical industry that features high density and reliability.</p><p>While ENEPIG costs more than ENIG, it is still a cost-effective option that deposits thin layers of gold and palladium for additional durability and excellent solderability. Additionally, ENEPIG&rsquo;s low contact resistance prevents energy losses, overheating, and poor grounding.</p><h3>Advantages of ENEPIG</h3><ul><li>Palladium mitigates the &ldquo;Black Pad&rdquo; quality issue seen with some CMs in the ENIG process</li><li>Preferred for good solderability and many solder reflow cycles</li><li>Highly reliable for wire bonding capability</li><li>Satisfies the broad requirements of miniaturization, PCB thinness, and dense vias.</li></ul><h3>Limitations of ENEPIG</h3><ul><li>Relatively higher cost than ENIG may not be economically suitable for all applications</li><li>Reduced SMT Solder performance due to a thicker layer from palladium</li><li>Longer duration to wet</li></ul><h3>Conclusion</h3><p>ENIG and ENEPIG surface finishes offer excellent PCB planarity for systems that require tight pitch components. While &ldquo;Black Pad&rdquo; issues may have plagued ENIG suppliers in the past, MacroFab has solved this quality challenge and can offer either finish without concern for quality. ENEPIG offers a more robust palladium application, it can also provide a higher reliability process for more demanding environmental applications.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1665578673618-1665578673618.png" alt="rohs compliant" class="fr-fic fr-dii"></p><p>When considering which surface finish to use, the following technical questions should be answered by working with MacroFab. These questions will have a role in influencing the selection of your optimal PCB surface finish for your project:</p><ul><li>Is lead-free solder, or Reduction of Hazardous Substances (RoHS), a requirement of your PCB design?</li><li>What component form factor types and pin pitch will be used within the PCB?</li><li>Will the PCB have wire-bonded components or will they all be mounted using wave solder?</li><li>To what environmental issues (temperature, humidity, and handling) will the final product be exposed?</li></ul><p>While ENIG and ENEPIG are two of the more popular surface finish options, MacroFab also offers EHG and LF-HASL (lead-free Hot Air Solder Leveling) as PCB surface finish options. LF-HASL may be an alternative for those systems that do not have fine-pitch device pins.</p><h4>For more PCBA design tips, download &ldquo;Design Faster, Improve Quality: Tips for PCBA Development&rdquo;.</h4><p><a href="https://macrofab.com/documents/tips-for-pcba-development/?utm_content=four-reasons-your-electronics-development-team" target="_blank">Download Now</a></p>

A short primer on how to choose PCBA surface finishes 

FAB Insights: ENIG vs ENEPIG

<p>When it comes to PCBA manufacturing, take the time to consider all the challenges and risks you face. When you anticipate possible roadblocks ahead, you can establish milestones more efficiently and avoid backtracking with customers and stakeholders, an action that might harm your reputation.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1664459657904-1664459657904.png" alt="integrated pcba" class="fr-fic fr-dii"></p><p>As PCBA systems become more integrated with advances in technical standards, the design architecture naturally becomes more complex. Customers continue to demand advanced technical features for their solutions as functions get consolidated into smaller spaces.</p><p>There is, however, a way to control design complexity. A system&rsquo;s manufacturability depends on design decisions made early in the project&rsquo;s life cycle. Take a look at these top five PCBA design mistakes that can create unnecessary complexity in PCBAs, and how you can mitigate them.</p><h3>Not Designing for Manufacture</h3><p>In addition to all the functional and technical design requirements, a new design&rsquo;s ability to go into production must be a final stakeholder requirement. Therefore, it is crucial to plan for manufacturing early in the process. Your contract manufacturing (CM) partner can assist you in completing an overall design for manufacturing (DFM) plan to ensure success.</p><p>The DFM will form the plan for all design aspects needed for production. All Bill of Materials (BoM), alternate components, prototype planning, and manufacturing technologies get outlined within the DFM. It will include specific processes for new vendor partners if they have unique requirements related to their technology. Complete this plan early in the project to avoid costly complexities later.</p><h3>Product Enclosure Is Unmanufacturable</h3><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1664459657301-1664459657301.png" alt="Product Enclosure Is Unmanufacturable" class="fr-fic fr-dii"></p><p>A product&rsquo;s housing can be just as important to your project&#39;s success as the PCBA located within it. Make sure your enclosure has a proper seal or water, dust, and other debris may enter, causing reliability problems.</p><p>A co-simulation of both the electrical and mechanical design structures should be completed in tandem. This integrated ECAD/MCAD simulation will ensure that connectors, harnesses, and other three-dimensional interfaces mate correctly without mechanical interference.</p><p>The complete design gets vetted during the first prototype build as proof that the co-simulation was successful. The DFM should consider any iterative changes and re-testing for final validation before moving forward.</p><h3>Incorrect PCB Landing Patterns</h3><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1664459657144-1664459657144.png" alt="Incorrect PCB Landing Patterns" width="796" height="480" class="fr-fic fr-dii"></p><p>Incorrect landing patterns are common PCBA design mistakes</p><p>Every component has a manufacturer&rsquo;s recommended and documented PCB solder pad pattern shape. Pin size, pin pitch, and whether underfill material will be used beneath the component for rigidity all contribute to pad structure. As smaller geometry components proliferate, some landing patterns can get swapped, but follow the details of each pad to prevent SMT issues.</p><p>If incorrect PCB landing patterns get used, the potential for the component to have open pins due to incomplete solder application increases. Cold solder joints or solder bridging between pads can also result. There is a potential for incorrect SMT issues to surface during prototyping unless the pads get checked against the manufacturer&rsquo;s recommendations. DFM plans should include steps for checking for these issues prior to building.</p><h3>Decoupling Capacitors in the Wrong Position</h3><p>Decoupling capacitors primarily serve a few specific functions:</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1664459656784-1664459656784.png" alt="Decoupling capacitors wrong position" class="fr-fic fr-dii"></p><ul><li>AC couple a signal to remove the DC component using a series capacitor</li><li>Removing AC noise from a power supply signal that needs to be electrically quiet</li><li>Act as a low-pass or high-pass filter to a signal that could be wider in frequency than required</li></ul><p>But a decoupling capacitor&rsquo;s position relative to its companion component is crucial. Too far away, they have no effect. If they are too close, they may interfere with other components&rsquo; placement and mounting.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1664459658772-1664459658772.png" alt="decoupling capacitor’s position" class="fr-fic fr-dii"></p><p>If their signal needs to reach a companion component, consider placing decoupling capacitors on the opposite side of the PCB, using a via. For accurate placement, their position should be checked and validated during the design phase. This may not be the most important step, but it must be verified prior to the final PCB tape-out for fabrication.</p><h3>No Design Review</h3><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1664459659065-1664459659065.png" alt="no design review" class="fr-fic fr-dii"></p><p>An inspection of the completed design against the original requirements and its manufacturing feasibility should get conducted at the end of every project. Without this formal step, good intentions get lost and informal understandings have the potential for error. The DFM will outline the design review items against manufacturability. Design reviews can be compared to court trials where evidence is presented to prove that the design itself is not in violation of manufacturing standards. Design teams often serve as &lsquo;defense attorneys&rsquo; for their design when facing a review by other stakeholders who have an interest in its success.</p><h3>Conclusion</h3><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1664459658959-1664459658959.png" alt="pcb landing patterns" class="fr-fic fr-dii"></p><p>Although new advancements can increase the technology used with designs, unbounded complexity should be tempered. Managing the complexity of your solution is possible. It is important to establish a clear DFM at an early stage with your CM partner&rsquo;s involvement. Throughout the development stage, the design should be reviewed and tested against mechanical enclosures, PCB landing patterns, and passive component placements. It is possible for these items, as well as others, to cause unwanted problems in the future. Issues can be remedied in advance when intentionally incorporated into your DFM.</p><h4>Learn more about using integrated ECAD/MCAD to improve your design processes.</h4><p><a href="https://macrofab.com/documents/avoid-assembly-issues-using-integrated-ecad-mcad/?utm_content=four-reasons-your-electronics-development-team" target="_blank">Download Now</a></p>

Avoiding manufacturability problems begins by catching design issues 

A system's manufacturability depends on design decisions made early in the project's lifecycle.  

The Five Biggest Design Mistakes for PCB Assemblies

<h1 id="isPasted">A Practical Guide to Solder Flux</h1><p><br></p><p>The assembly manufacturing process, including solder flux, has a large impact on the success of final product quality. A robust surface mount assembly maintains high reliability over the life of the product, and the soldering process and type of flux used are key contributing factors to surface mount technology (SMT) assembly success. Let&rsquo;s review how to use flux during soldering and how to decide which technology and contract manufacturing (CM) partner to choose.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1663678539629-1663678539629.png" alt="chip on circuit board" class="fr-fic fr-dii"></p><p>Soldering is the primary technique used within electronics manufacturing to electrically attach components to a printed circuit board (PCB). Soldering involves melting metal conductive material across masked metal pads. This forms electrical connections between the PCB and components called solder joints.</p><p>The soldering process requires a special type of agent called flux. The physical properties of solder flux can vary significantly from type to type. Flux removes oxides that form as metal gets exposed to air; oxides prevent the formation of good solder joints between the two oxidized metals.</p><p>Flux acts as a chemical compound to clean away oxidation from the component metal pins and the PCB solder pads before soldering. Without this proper flux cleaning, the solder won&rsquo;t properly adhere to the component or the PCB, and a bad solder joint may result. Flux also prevents corrosion between the two metal surfaces joined together by solder application.</p><h2>What Does Solder Flux Do?</h2><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1663678539770-1663678539770.png" alt="flux for soldering" class="fr-fic fr-dii"></p><p>Flux is critical in the creation of solder joint formation. Inherent in the soldering process are metallic impurities from the solder and the PCB fabrication processes. Flux removes these impurities from the PCB soldering surface and acts as a cleaning agent to remove oxides from the exposed metal surfaces.</p><p>After cleaning, flux presents a clean surface for a high-integrity solder joint. But once completing the soldering process, the residue must get removed through a final cleaning step. This is dependent upon the type of flux used.</p><p>Flux is a mixture of an activating chemical and a base material. It is the activator that removes oxides from metal and promotes better solder wetting. Depending upon the final system use application, different types of flux types may lend to a more successful manufacturing outcome.</p><h3>Flux Application Methods</h3><p>Flux is often applied in one of these three methods. Each category has different chemical properties based upon component and board soldering requirements.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1663678539692-1663678539692.png" alt="flux application methods" class="fr-fic fr-dii"></p><ul><li><strong>Wave Soldering:</strong> Wave solder flux composition includes many solvents. Flux gets sprayed onto the PCB before the solder wave. The flux cleans the components and removes oxidation. Depending upon the prior manufacturing steps, the PCB may need pre-cleaning.</li><li><strong>Solder Reflow:</strong> Solder paste screened onto the PCB only targets the intended metal pads for connection to components. The paste holds the parts in place for a short duration until the oven heat causes the solder paste to reflow and adheres between the PCB and the component leads. Solder reflow cleans metal surfaces while the sticky flux prevents more oxidation. This type of paste flux contains additives to improve solder flow as it melts.</li><li><strong>Selective Solder:</strong> In this case, the flux targets specific areas of the PCB through a spray application or a precise drop jet process.</li></ul><h3>Cleaning Different Flux Types</h3><p>&nbsp;Fluxes can have corrosive properties; if residue remains, it can affect board performance months or years later. Don&rsquo;t forget to clean the solder flux off circuit boards.&nbsp;</p><p>There are three primary flux types that have different manufacturing processes and cleaning requirements:</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1663678539737-1663678539737.png" alt="water soluble" class="fr-fic fr-dii"></p><ul><li><strong>Rosin-Based:</strong> This flux gets cleaned off the finished PCB with specific chemical solvents that often involve fluorocarbons. Most countries have restrictions on how to use this type of flux and the disposal of its chemical byproducts. As such, this older flux type is often rejected for either of the more favorable options.</li><li><strong>Water-Soluble:</strong> There are several cleaning agents that are more environmentally friendly that can be used for water-soluble fluxes. These options include deionized water and simple detergents.</li><li><strong>No-clean:</strong> No-clean fluxes need little to no cleaning after application. Instead, cleaning is more to improve appearance than to prevent imperfections, as residue rarely leads to any contamination. But sensitive electronic and optical inspection equipment can experience some failures, and no-clean fluxes can interfere with testing and conformal coating. Thus, cleaning is still recommended.</li></ul><p>All three of these methods need tight process controls to make sure that the flux works as intended without compromising soldering joint integrity. If not properly controlled, heated solvents have the potential to outgas and form a void within a solder joint.</p><p>Another quality problem could involve molten solder splattered onto unintended areas of the board that should get masked from solder. You can read more about solder mask in our <a href="https://macrofab.com/blog/bga-pad-creation-smd-nsmd/?utm_content=four-reasons-your-electronics-development-team" target="_blank">article about SMD vs NSMD</a>.</p><p>Choosing the right solder flux will depend upon your application, customer use, and the complexity of the component layout. By working with your CM during the design process, they can help guide you in the best solder flux manufacturing processes for your solution. MacroFab offers only <a href="https://help.macrofab.com/knowledge/what-are-macrofabs-assembly-capabilities?utm_content=four-reasons-your-electronics-development-team" target="_blank">no-clean and water-soluble fluxes</a>.</p><h3>Conclusion</h3><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1663678539584-1663678539584.png" alt="selecting a cm" class="fr-fic fr-dii"></p><p>Selecting a CM that follows your guidance on soldering processes is important. Not only will environmental policies in the country of origin impact your decisions, but also your customers will have an impact. Strict requirements imposed by some customers on the solder application and cleaning methods of flux will dictate manufacturing compliance. In addition, economic regions such as the European Union have banned the use of lead within solder and flux for all new electronics solutions.</p><h4>Ready to Get Started?</h4><p>Build from anywhere, anytime, with MacroFab</p><p><a href="https://factory.macrofab.com/?utm_content=four-reasons-your-electronics-development-team" target="_blank">Create Your Account Today</a></p>

Solder flux has a large impact on final product quality.  This article reviews how to use flux during soldering and how to decide on the right technology options for your project. 

A Practical Guide to Solder Flux

<h1 id="isPasted">FAB Insights: PVT in PCBA Product Development</h1><p><br></p><p>The production validation test (PVT) stage is a key milestone to proving your new PCBA project design can successfully run at full production volumes. All your earlier planning for cost, quality assurance, quality control, and efficiencies of scale now position your project for success.</p><p>Your team&ndash;along with your CM partner&ndash;will use PVT stage planning to ensure the reality of increased production capabilities using your vetted manufacturing processes. This is the final step before full production.</p><p>This is the third in our series on PCBA development stages. You can find earlier articles about EVT and DVT on our website. Now, let&rsquo;s review what happens during the PVT planning stage, what can go wrong, and what comes next.</p><h2>PVT in the Design Cycle</h2><p>There are four project stages between design and full-scale manufacturing. These include:</p><ul><li>Electronics Validation Testing (EVT)</li><li>Design Validation Testing (DVT)</li><li>Production Validation Testing (PVT)</li><li>Ramp to Mass Production</li></ul><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1663096824573-1663096824573.png" alt="design validation test" class="fr-fic fr-dii"></p><p>PVT comes after the successful completion of the DVT stage. During the Design Validation Test (DVT) stage, the project design is vetted for proper operation to meet performance specifications needed by customers and/or the broad market.</p><p>Tests validate specifications and analyze performance distributions across known variances, which proves a single prototype design can function and perform as expected. Once this DVT is proven out, the PVT stage is used to establish manufacturability at higher volumes.</p><p>PVT is essentially a faster, condensed DVT stage, proving processes at speed and quantity before moving to mass production. This is a mock run of mass production, providing a chance to tweak processes and catch problems before production hits the ground running.</p><p>The mass production stage allows the manufacturer to produce large quantities based on forecasts with known quality levels and costs. But before reaching this point, any questions requiring design engineering input should be completely resolved. Additionally, before embarking on full production, the PVT stage must pass exit criteria proving the project for larger volumes, showing processes, costs, quality metrics, and volume can be achieved without issue.</p><h3>What can go wrong during PVT</h3><p>Before the PVT stage, small prototype quantities get assembled without true regard for cost, execution time, or logistical impacts. EVT and DVT stages have other primary goals, so this is understandable. But now those previously ignored key areas must get tested before moving forward.</p><p>Additionally, previously unknown validation issues can get uncovered during PVT. While it may feel like a setback to have problems crop up this far into your design cycle, the intent here is to fix problems before they become magnified during mass production.</p><p>Examples of what can go wrong during the PVT stage include:</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1663096824507-1663096824507.png" alt="pvt goes wrong" class="fr-fic fr-dii"></p><ul><li>Manufacturing costs per unit are higher than planned.</li><li>Component procurement lead times against real order fulfillment schedules take longer than anticipated.</li><li>Primary BOM components may have shortages or go obsolete which requires an alternate component list within manufacturing.</li><li>Slower or manual prototype assembly processes prove impractical for mass production during PVT.</li><li>Re-work and quality control issues that were not important during prototyping become amplified during PVT.</li><li>The prototype-build issues at a small-build CM get resolved, but those learnings were not carried forward to the higher volume PVT stage where they are again repeated for a second time.</li></ul><p>By leveraging your CM&rsquo;s expertise during your project&rsquo;s design and development stage, you can mitigate unexpected issues for a seamless PVT phase. By working with MacroFab, your costs and lead times are planned out before procurement so you will know what to expect as you reach this stage.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1663096824301-1663096824301.png" alt="macrofab platform inventory" class="fr-fic fr-dii"></p><p>Additionally, MacroFab&rsquo;s platform offers real-time visibility into the component lifecycle, providing you with a window into what is available now and what will be available next month, next quarter, and next year. A DFM (design for manufacturing) plan can pinpoint any red light issues standing in the way of project completion. Work with MacroFab to develop a design for manufacturing (DFM) plan customized for your project.</p><h3>What&rsquo;s Next</h3><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1663096824174-1663096824174.png" alt="dfm plan" class="fr-fic fr-dii"></p><p>Your bill of materials (BoM) will be built using primary and alternate components to prepare for potential component shortages and avoid long lead times. A DFM plan includes quality assurance and controls, manufacturing schedule planning, and process control measures that address PVT execution before testing occurs. By working with MacroFab&rsquo;s vendor network that produces both small-batch engineering prototypes and large-scale manufacturing, anything learned during one phase automatically transfers to the next phase. Partnering with MacroFab as your CM is ideally suited to move your projects through each project development stage into production.</p><h4>Let&rsquo;s Build It Together!</h4><p>Request a quote now.</p><p><a href="https://factory.macrofab.com/?utm_content=four-reasons-your-electronics-development-team" target="_blank">Create Your Account</a></p>

Leverage your CM's expertise during design & development to mitigate unexpected issues during the PVT stage

Your new PCBA project design needs to pass production validation testing (PVT) to prove it's ready for production. The planning you did for cost, quality assurance, quality control, and scalability now positions your project for success.

Fab Insights: PVT in PCBA Product Development

<p id="isPasted">Once a new development project completes the evaluation validation test (EVT) process, it is time to undertake the DVT (Design Validation Test) stage. Ideally, you will have a single mass production-worthy configuration test ready before beginning this step. But in practice, this isn&rsquo;t common.</p><p>The DVT process focuses on three main areas:</p><ul><li>Preparing tools and techniques to complete a dependable small-batch manufacturing run</li><li>Ensuring your small-build results meet cosmetic and environmental requirements using finalized mass production tools, components, and materials</li><li>Measuring performance across the unit&rsquo;s expected manufacturing life variance</li></ul><p>This is the second in our series on PCBA development stages. Other articles about the EVT and PVT stages are also available. Now, let&rsquo;s review what happens during the DVT planning stage, what can go wrong, and what comes next.</p><h2>DVT in the Design Cycle</h2><p>These are the main activities during the DVT stage:</p><ul><li>A first build execution with real manufacturing processes beyond prototype volumes</li><li>Product qualification, certification, and reliability testing</li><li>Measured electrical performance testing at the boundaries of manufacturing</li></ul><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYyMDM0Njk4NzYyLTE2NjIwMzQ2OTg3NjIucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="dvt cycle" class="fr-fic fr-dii"></p><p>The DVT cycle occurs after the EVT stage that validated your first prototype build&rsquo;s success and built confidence the design met functional parameters. At the DVT stage, the design is not yet ready for manufacturing runs until this stage proves its maturity. All the certifications, qualifications, and specification requirements get tested now. This ensures the product will be ready for customer use across the product lifecycle.</p><p>The DVT stage has a small build quota, typically 50-200 units. Burn-in qualification, drop tests from known heights, submersion in water, and intensive battery testing puts the product through rigorous certification testing.</p><p>The results from water and dust testing will determine your IP (Ingress Protection) code rating. This step is crucial for products requiring regulatory certifications from the FCC (Federal Communications Commission) or UL (Underwriters Laboratory).</p><p>Electrical testing during DVT is also required to verify the corner variance cases. Sometimes called &ldquo;skew testing,&rdquo; these experiments force manufacturing variances to their acceptable limits to verify product performance will meet specification requirements even at unusual extremes.</p><p>While testing conditions can often fall outside 3 or 4 sigma variances, the intention is to prove that specifications hold up at boundary conditions. If issues crop up at this step, make design or manufacturing process changes now. It is far less costly and time-consuming to make changes during DVT than to identify problems during the natural process drift that happens while manufacturing at large volumes.</p><h3>What Can go Wrong During DVT</h3><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYyMDM0Njk4Njg0LTE2NjIwMzQ2OTg2ODQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="dvt risks" class="fr-fic fr-dii"></p><p>Without proper planning, the DVT stage has the potential for challenges. However, a design manufacturing plan (DFM) can mitigate and minimize these risks. Working with a contract manufacturing (CM) partner that has access to the supply chain provides expertise and helps you avoid unwanted issues.</p><p>Some of the risks during the DVT stage include:</p><ul><li>The tools and techniques for a dependable small-batch manufacturing run are not yet ready for DVT</li><li>Small batches cannot be built using mass production tools, components, and materials</li><li>Required components and other manufacturing materials are not available for timely builds</li><li>The product certification or qualification testing fails</li><li>Yields turn out to be unacceptably low</li><li>The product fails electrical performance corner-case testing</li></ul><h3>What&rsquo;s Next</h3><p>The DVT results must be successful before the production of the final design can take place in suitably large volumes for sale. Your contract manufacturing partner (CM) can help you develop a design for the manufacturing plan that outlines success for this step of development. Minimize DVT risks by leveraging a thorough planning cycle.</p><p>During DVT, testing feedback may require final design iterations and changes to manufacturing processes. Working with a contract manufacturing partner that makes changes easy and communicates them through the manufacturing supply chain can be painless.</p><p>At the end of DVT, you should be confident that any design or process issues causing unacceptable yields or quality aspects have been corrected. When DVT is completed, the project can successfully move to the final project phase, which is production validation testing (PVT). For further information on production validation testing, please read the blog on the next stage of the development process, PVT.</p><h4>Read About the EVT Stage</h4><p><a href="https://macrofab.com/blog/evt-pcba-product-development/?utm_content=four-reasons-your-electronics-development-team" target="_blank">Read the Blog Post</a></p>

Your design validation test (DVT) builds confidence in your design's functional parameters

At the DVT stage, your design is not yet ready for manufacturing.  All certifications, qualifications, and specification requirements get tested now. 

Fab Insights: DVT in PCBA Product Development

<h1 id="isPasted">Fab Insights: EVT in PCBA Product Development</h1><p>The engineering validation test (EVT) stage determines whether your PCBA design meets your customer&rsquo;s functional product requirements. This validation testing occurs after your project&rsquo;s concept phase and after a product requirements document (PRD) has been completed.</p><p>EVT is the first of three key validation stages. There are two additional testing phases before the project gets released to manufacturing, gated by successful EVT completion:</p><p>Design Validation Testing (DVT) &ndash; This stage tests whether the full characterization of the product meets specifications across all manufacturing variances.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYxMzQ2OTU3NTUzLTE2NjEzNDY5NTc1NTIucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="design validation testing" class="fr-fic fr-dii"></p><p>Production Validation Testing (PVT) &ndash; This stage works through the challenges of preparing for and transferring the project to manufacturing.</p><p>This is the first in our series on PCBA development stages. &nbsp;Look for our articles on<a href="https://macrofab.com/blog/dvt-pcba-product-development/" target="_blank">&nbsp;DVT</a> and PVT for a fuller design cycle picture. Now, let&rsquo;s review what happens during the EVT stage, its importance, what challenges exist, and how to overcome them.</p><h2>EVT in the Design Cycle</h2><p>The EVT stage implements the design in its fit, form, and function. This proves your electronics product can function as intended. The first batch of prototypes is assembled and tested for basic functionality. The typical prototype quantities can range from a few to fifty.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYxMzQ2OTU2MTE0LTE2NjEzNDY5NTYxMTQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="design iterations" class="fr-fic fr-dii"></p><p>This project phase may require design iterations if the functional operation does not meet specifications due to design shortcomings. In the case of required changes, the design must get updated for a new batch of prototypes. This can lead to an EVT2 stage.</p><p>If the EVT stage is successful, it is often used to better inform stakeholders of your production intent. This is often considered the most important milestone in the project as the customer acceptance process can only begin once they have the first project articles.</p><h3>What Can go Wrong During EVT</h3><p>The first prototype build demonstrates the ability to manufacture the first production batch. This first assembly preparation pinpoints weak points within the process. Preparation will pay off at this stage if the proper steps are in place to mitigate risks.</p><p>During EVT, the bill of materials (BOM) gets procured for the first time. Assembly also happens for the first time. The PCBA is finally manufactured. All these processes have the potential for unexpected issues. Here are some potential areas of risk if the proper preparation is not considered:</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYxMzQ2OTU1NjgzLTE2NjEzNDY5NTU2ODMucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="evt components" class="fr-fic fr-dii"></p><ul><li>One or more components within the BOM may not be available for procurement.</li><li>Although a component is available, the BOM package type may not match the footprint on the layout.</li><li>A PCBA layout connection issue may prevent proper electrical operation.</li><li>The solder screen for the PCBA assembly may have pad openings that are too large, too small, or may have erroneous features.</li><li>The final yield outcome turns out unacceptably low</li><li>Special custom surface-mount technology (SMT) instructions may not be completely communicated to the assembly floor for execution.</li></ul><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYxMzQ2OTU1NTQyLTE2NjEzNDY5NTU1NDIucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="evt planning" class="fr-fic fr-dii"></p><p>Mitigate challenges by making decisions early and working with a contract manufacturer (CM) such as MacroFab during project development. MacroFab works with a network of manufacturing partners that specialize in both small prototype build and large-scale manufacturing. The quoting process prepares for long-term success by identifying all project needs during the EVT stage. MacroFab&rsquo;s digital platform addresses risks that are inherent in the EVT processes and beyond.</p><p><strong id="isPasted">Recommended reading:&nbsp;</strong><span style="background-color: transparent;"><a href="https://www.wevolver.com/article/cooling-techniques-for-rugged-pcba-designs" rel="noopener noreferrer" target="_blank">Cooling Techniques for Rugged PCBA Designs</a></span></p><h3>What&rsquo;s Next</h3><p>The challenges to completing the project don&rsquo;t end with the EVT. Once the EVT stage meets requirements through additional design iterations, the project moves to the DVT stage. The DVT stage proves the design can hold up across variances. This is also the point where the performance is examined to understand where operational boundaries exist for the product.</p><p>By working with MacroFab as your CM partner, you can also tackle the next set of activities during DVT. You can learn more about DVT in the next article titled &ldquo;Fab Insights: DVT in PCBA Product Development.&rdquo;</p><h4>Build from anywhere, anytime, with MacroFab.</h4><p><a href="https://factory.macrofab.com/signup/?utm_campaign=&utm_content=&utm_id=&utm_medium=&utm_source=&utm_term=" target="_blank">Order Online</a></p>

The EVT stage determines whether your PCBA design will meet functional product requirements. 

The EVT Stage implements the design in its form, fit, and function to better inform stakeholders of your production intent.  Don't rush this important milestone. 

Fab Insights: EVT in PCBA Product Development

<p id="isPasted">During electronics production, product owners and electronics engineers often butt heads. The reason? Both roles are customer-oriented and want to solve end-user needs. But it&rsquo;s not always obvious where the management responsibilities for each role end.</p><p>The resulting lack of clarity can cause a lot of friction during a challenging electronics product development cycle. In this post, we&rsquo;ll dive into the relationship between product owners and electronics engineers to explain where things can go wrong and offer solutions to help get your team back on track.</p><h2>Overlapping Lanes</h2><p>Product owners and engineers can and often do encroach on the other&rsquo;s responsibilities. But in general, product owners set the product vision while the engineering manager decides how to make it come to life. Product owners are also responsible for creating the product roadmap, which outlines product iterations as the product matures. The product vision and roadmap get passed along to the engineering team.</p><p>Engineers determine the best way to design, test, and produce the product at scale. They take leadership over essential production stages, such as the engineering validation test (EVT) and design validation test (DVT) stages.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYwNzU2ODI0OTI2LTE2NjA3NTY4MjQ5MjYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="ownership after hand-off" class="fr-fic fr-dii"></p><p>Problems occur when a product owner tries to take ownership after the hand-off has been made, or when an engineering manager insists their input should override the product owner when setting the product roadmap. Everything works better when everyone stays in their own lane.</p><p>It&rsquo;s natural for disagreements to happen. In fact, some disagreement is good and can lead to better results. But too much indicates distrust between colleagues, a misalignment of vision, and a misunderstanding of the leadership progression.</p><p>If this is happening in your organization, get everyone in a room and align on who owns what lane. Establish your product owner as the leading voice on build progression. And reassure engineering that product owners will leave&nbsp;<a href="https://macrofab.com/blog/evt-pcba-product-development/" target="_blank">EVT</a>,&nbsp;<a href="https://macrofab.com/blog/dvt-pcba-product-development/" target="_blank">DVT</a>, and eventually production validation testing (PVT) to them.</p><p>The lack of trust problem is harder to solve. But by keeping roles and responsibilities clear, you&rsquo;re building a better foundation for that trust to grow. Empower your team with collaborative opportunities fueled by direct communication, and give it time.</p><h3>Communication Miscues</h3><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYwNzU2ODI0NzU2LTE2NjA3NTY4MjQ3NTYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="communication miscues" class="fr-fic fr-dii"></p><p>Communication miscues between engineers and product owners can lead to less-than-stellar ongoing communication. But these important team members must remain aligned. Without good communication, your EEs will remain in the dark about user requirements, essential features, and long-term plans connected to new products. And without a clear target, engineers have no chance to design effectively.</p><p>Simultaneously, product owners need regular insight into engineering progress. They need to know if their product vision is underwhelming or overly ambitious. Engineers should share when they hit roadblocks in the various validation stages and immediately communicate back to product owners when ideas aren&rsquo;t feasible from an engineering perspective or won&rsquo;t comply with industry standards.</p><p>Open and honest communication is crucial to a successful design. Product and engineering decision-makers need to work in sync. While how this happens can vary from company to company, the important takeaway here is to keep communication channels open so no one is left in the dark.</p><h3>Different Definitions of Success</h3><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYwNzU2ODI0ODM3LTE2NjA3NTY4MjQ4MzcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="different definitions of success" class="fr-fic fr-dii"></p><p>Product owners and engineers are accountable for different metrics. The drive to achieve these metrics is a major source of friction between product owners and engineering.</p><p>For example, imagine a product owner who prioritizes financial outcomes and user engagement above all else. This person might get frustrated working with an engineering team that emphasizes quality over quantity. Production throughput may be slower, design cycles may take longer, etc. As a result, the product owner struggles to reach specific benchmarks relying on minimum volumes or fails to consistently engage end-users.</p><p>The takeaway here is that product owners and engineers should share what success means to them. This also provides helpful context for leaders who want to understand what drives their colleagues&rsquo; decisions. Going one step further, product owners and engineers need to articulate what they are jointly accountable for within the broader organization. This can be the glue that brings everyone together when the product development cycle reaches the mass production stage. While this strategy may not remove all conflict, it will improve clarity by helping each side understand what is driving the others&rsquo; decisions.</p><h3>Bringing Everything Together Under One Roof</h3><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYwNzU2ODI0Nzk4LTE2NjA3NTY4MjQ3OTgucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="bringing everything together" class="fr-fic fr-dii"></p><p>Alleviating problems between product owners and engineers is easier with an all-encompassing electronics production solution. The right platform makes it easy to digitize product development workflows, documents, and resources. It also simplifies communication across lanes and streamlines data-sharing so that everyone can make informed decisions and stay on the same page.</p><p>A cloud-based manufacturing platform like MacroFab is designed for this exact purpose. We bring every step of electronics production under one roof by giving both product owners and engineers the tools they need for success while enabling collaboration.</p><h3>Conclusion</h3><p>Follow the tips in this post to improve communication and performance within your team and enable your organization to get higher-quality products to your customers faster. When conflict happens during the product development lifecycle, remember that product owners are in charge of determining the &ldquo;what&rdquo; and the &ldquo;why&rdquo; while engineers take care of the &ldquo;how&rdquo; and the &ldquo;who.&rdquo; Then take care of the &ldquo;when&rdquo; together through joint decision-making as a collaborative team.</p><h4>Schedule a demo today to learn more about our comprehensive electronics manufacturing platform.</h4><p><a href="https://macrofab.com/rfq/" target="_blank">Contact the MacroFab Team</a></p>

Engineers and Product Owners need to work in sync. 

Open and honest communication is crucial to a successful design.  Product and engineering decision-makers need to work in sync. 

Electronics Production: Common Conflicts Between Engineers and Product Owners

<h2><br></h2><h2 id="isPasted">Engineering Designs for Reduced Costs</h2><p>The competitive landscape for electronics systems dictates that new engineering designs must be differentiated in performance from other similar systems in the market. However, as technology and manufacturing capabilities continue to advance unabated, even a unique static design will eventually face cost pressures. The best designs must consider all the available opportunities to reduce costs at the onset. In order to reduce the total PCB system costs, several key design decisions need to be considered in advance of the first build. These items address the areas that can be controlled by the design team.</p><h3>Surface Mount vs. Plated Through-Hole</h3><hr><p>Surface mount technology (SMT) for PCB assembly is generally the lowest cost and minimum hassle process for manufacturing new engineering designs. Where possible, reduce or remove all plated through-hole (PTH) components as they require more costly manual assembly work. Some ruggedized external connectors may only be offered in through-hole options. Consider surface mount connectors with additional fasteners if needed.</p><p><a href="https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_6.png?utm_source=thomasnet&utm_medium=paid-banner&utm_term=electronics%20sourcing&utm_content=the-electronics-cloud-manufacturer&utm_campaign=mf-thomasnet-promo&gclid=CjwKCAjw7cGUBhA9EiwArBAvoqpIqIP22K1um5EdSw-4KCQnPtMaFXrHFCUKO8cmeUrGu20XMhy9kxoCZFYQAvD_BwE" target="_blank"><img width="700" height="335" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjU4NTEyMDc5NDU3LTE2NTg1MTIwNzk0NTcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" srcset="https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_6-700x335.png 700w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_6-150x72.png 150w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_6-250x120.png 250w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_6-768x368.png 768w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_6-600x287.png 600w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_6-120x57.png 120w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_6.png 1024w" sizes="(max-width: 700px) 100vw, 700px" class="fr-fic fr-dii"></a></p><p>PTH components are generally stronger and more rugged than SMT components. This makes them ideal for connectors. In the cases where PTH components are mandatory, discuss &lsquo;Paste in Hole&rsquo; (PIH) technology with your CM. This is the process of screening solder paste into and around plated through-holes on a PCB. Then, the leads of the through-hole components are placed into these prepared through-holes. The PCBs are run through only a single reflow soldering process, thus terminating both through-hole and SMT components at one time. PIH makes it easier, faster and cheaper to process double-sided boards.</p><p>PIH requires two prerequisites of the design. First, the insulator material of the component must be capable of withstanding lead or lead-free reflow temperatures. Check the datasheet of the components in question to verify this information. Second, the vertical and horizontal clearance around the leads must be large enough to allow an adequate volume of printed solder paste. This space is required to allow an unobstructed transfer of molten paste from the PCB surface into the plated through holes.</p><p><a href="https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_5.png?utm_source=thomasnet&utm_medium=paid-banner&utm_term=electronics%20sourcing&utm_content=the-electronics-cloud-manufacturer&utm_campaign=mf-thomasnet-promo&gclid=CjwKCAjw7cGUBhA9EiwArBAvoqpIqIP22K1um5EdSw-4KCQnPtMaFXrHFCUKO8cmeUrGu20XMhy9kxoCZFYQAvD_BwE" target="_blank"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjU4NTEyMDgwMDAxLTE2NTg1MTIwODAwMDEucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" class="fr-fic fr-dii"></a></p><p>For relatively low component count designs, use a single-sided PCB SMT when possible. While this may apply only to a limited number of systems, it can dramatically reduce the assembly complexity. The simpler the assembly process, the better and lower the costs. Re-work of assembly due to unnecessary complexity and component damage delays throughput and increases costs.</p><h3>Layout</h3><hr><p>The size of the PCB will directly impact its cost as this will dictate the number of systems per panel. The layout should be minimized as much as possible in size while also considering the minimum number of signal and ground layers within the PCB. Although a circuit block may be re-used from a previous design, its use within a different system may require a new layout due to its complementary functions.</p><p><a href="https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_1.png?utm_source=thomasnet&utm_medium=paid-banner&utm_term=electronics%20sourcing&utm_content=the-electronics-cloud-manufacturer&utm_campaign=mf-thomasnet-promo&gclid=CjwKCAjw7cGUBhA9EiwArBAvoqpIqIP22K1um5EdSw-4KCQnPtMaFXrHFCUKO8cmeUrGu20XMhy9kxoCZFYQAvD_BwE" target="_blank"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjU4NTEyMDc5NTE1LTE2NTg1MTIwNzk1MTQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" class="fr-fic fr-dii"></a></p><p>Blind vias, ones that are buried within the PCB, are often used to minimize the spatial impact on the top and bottom planes. However, work with your CM to understand the fabrication capabilities of blind vias and their impact on cost. Your CM can also help you understand the maximum array size for PCB count per panel. This will maximize the number of boards built at one time.</p><h3>Scrutinize Each BOM Component</h3><hr><p>Each component within a bill of materials (BOM) should provide unique value to the system. To test for this case, consider if the system would operate improperly, poorly, or even fail entirely if a component was missing. For most of the components, this would obviously be true. However, redundant parallel bypass capacitors, for example, may often sneak into a design at every active component supply pin.</p><p><a href="https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_2.png?utm_source=thomasnet&utm_medium=paid-banner&utm_term=electronics%20sourcing&utm_content=the-electronics-cloud-manufacturer&utm_campaign=mf-thomasnet-promo&gclid=CjwKCAjw7cGUBhA9EiwArBAvoqpIqIP22K1um5EdSw-4KCQnPtMaFXrHFCUKO8cmeUrGu20XMhy9kxoCZFYQAvD_BwE" target="_blank"><img width="700" height="496" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjU4NTEyMDgwMDQ0LTE2NTg1MTIwODAwNDQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" srcset="https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_2-700x496.png 700w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_2-150x106.png 150w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_2-250x177.png 250w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_2-768x544.png 768w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_2-600x425.png 600w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_2-120x85.png 120w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_2.png 1024w" sizes="(max-width: 700px) 100vw, 700px" class="fr-fic fr-dii"></a></p><p>Sometimes, a designer may simply re-use a legacy design block since &lsquo;it has always been done this way.&#39; However, unless the manufacturer&rsquo;s datasheet calls out for extreme bypassing at every supply pin, there may be some opportunity for bypass capacitor relief. Also, vet all pull-up and pull-down resistors on signal I/O to determine if indeed these are needed within the design. If the active component already provides an internal pull-up or pull-down, then this external resistor may be redundant.</p><h3>Component Performance Drives Cost</h3><hr><p>Component manufacturers segment and market their products just like any other industry. For cost reasons, it is important to review all the advertised features of a component. Only purchase those performance features that are needed. Draw the line at &lsquo;better than required&rsquo; features that only add cost with no added value to the system:</p><ul><li>Tolerance &ndash; Passive component vendors segment their products by offering several tolerance ranges of capacitors, resistors, inductors, and others such as 1%, 5%, 10%, and 20%. This helps them sell the full capacity of their factory for the highest price a customer is willing to pay for the tolerance accuracy achieved by their manufacturing. Again, to test the relevance of system tolerance, consider if your system would operate improperly, poorly or even fail entirely if a component was out of tolerance. If not, consider widening the tolerance for a lower-priced passive component.</li><li>Power requirements and size &ndash; Passive components are rated on their maximum power consumption, such as &frac14; watt resistors. Evaluate the maximum required power requirement for each passive component and only include required criteria on the BOM. This also typically drives to minimum-sized components.</li><li>Active circuit performance &ndash; The best systems may require the highest performing active components. When clock rate, switching speed, signal-to-noise ratio, or high gain drive the differentiation, then the highest performance semiconductors have no substitute. However, for those areas of the application where that is not the case, ensure that the system is not &lsquo;over designed&rsquo; using higher performance integrated circuits than needed as this will only drive additional cost. Review legacy circuit blocks that may be re-used for simplicity, but result in higher performance than required by the system.</li><li>Memory Size &ndash; Although memory is nearly always offered in sizes of 2n bits, empty unused memory offers no additional value. Condense firmware or computational memory as much as possible and only use the minimum memory size that the system requires.</li><li>Temperature grade &ndash; Component vendors often differentiate their products across several temperature grades to segment their market. Consumer (0-70C), Industrial (-25&ndash;85C) and Automotive (-40-105C) garner successively higher pricing depending upon the range. Ensure that the temperature grade of the components within your BOM meets, and does not exceed, your system application requirements. Reduce the temperature grade for components when warranted.</li><li>Vendor selection &ndash; There may be equivalent or pin-compatible competitive offerings that are lower cost. Consider all applicable component vendors.</li></ul><p>For any custom component within the system, determine if this can be sourced through multiple vendors with competitive quotes. A sole-sourced custom component from a single supplier will come at a premium cost. If at all possible, engage two or more suppliers with interchangeable parts that each wins some portion of your production volume.</p><h3>Volume and Procurement</h3><hr><p>Consider working closely with the logistics planner for the system, either internally or with your turn-key CM, to procure components in larger quantities. Once your system is stable in production with a mature run-rate, larger volume purchases may make sense to reduce the component pricing over the longer term. As a general rule of thumb, component pricing typically continues to be inversely proportional to volume until quantities exceed &gt;100,000-250,000. At some point beyond this volume, the pricing establishes a floor and additional volume no longer drives appreciably lower component costs.</p><p><a href="https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_4.png?utm_source=thomasnet&utm_medium=paid-banner&utm_term=electronics%20sourcing&utm_content=the-electronics-cloud-manufacturer&utm_campaign=mf-thomasnet-promo&gclid=CjwKCAjw7cGUBhA9EiwArBAvoqpIqIP22K1um5EdSw-4KCQnPtMaFXrHFCUKO8cmeUrGu20XMhy9kxoCZFYQAvD_BwE" target="_blank"><img width="700" height="525" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjU4NTEyMDc5OTE4LTE2NTg1MTIwNzk5MTgucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" srcset="https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_4-700x525.png 700w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_4-150x113.png 150w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_4-250x188.png 250w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_4.png 768w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_4-600x450.png 600w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/Engineering-Designs-for-Reduced-Costs_4-120x90.png 120w" sizes="(max-width: 700px) 100vw, 700px" class="fr-fic fr-dii"></a></p><p>Review component costs across as many distributors as possible to get the best pricing. Alternately, a turn-key CM has access to a broad choice of distributors and can aggregate their orders for better economies of scale. In some cases of large volume, buying particular high-value components directly from the component manufacturer may be an option to bypass a distributor mark-up. A component vendor will let you know what volume or dollar value will qualify to be a direct OEM account. Consolidate the variety of components by using the same values of R or C across the BOM where possible. This will drive higher volumes of fewer discrete values.</p><p>As many engineering designs go through several iterations of test and debugging before they are ready for final production, it is possible that there are embedded test mode circuits within the first system design that are no longer valuable in production. Unless a test points or debug circuit is needed to observe a behavior during or after production, consider removing test modes or non-essential functions for system production versions. This may include replacing zero ohm resistor test points with a new trace or solder. Additionally, the final PCB layout design should be reduced in size to remove any circuit debug area.</p><h3>Packaging</h3><hr><p>A design team may be indifferent to the component packaging, other than pricing. However, it may create excess complexity for the assembly within manufacturing. Work with your CM to understand how the component packaging form can reduce costs due to the ease of use on their pick-and-place machinery. A non-standard packaging may require more handling or push the CM to use a less efficient or costlier older piece of equipment.</p><p><a href="https://mxcdn.macrofab.com/wp-content/uploads/2019/07/feeder.jpg?utm_source=thomasnet&utm_medium=paid-banner&utm_term=electronics%20sourcing&utm_content=the-electronics-cloud-manufacturer&utm_campaign=mf-thomasnet-promo&gclid=CjwKCAjw7cGUBhA9EiwArBAvoqpIqIP22K1um5EdSw-4KCQnPtMaFXrHFCUKO8cmeUrGu20XMhy9kxoCZFYQAvD_BwE" target="_blank"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjU4NTEyMDc5MjkzLTE2NTg1MTIwNzkyOTMucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" class="fr-fic fr-dii"></a></p><p>Although tape and reel are often the most common packaging, some older vintage analog components may still only be offered in a tube format. Larger and more sophisticated semiconductors may also only be offered in trays. Understand the impact on your manufacturing facility of these design and ordering tradeoffs.</p><p><a href="https://mxcdn.macrofab.com/wp-content/uploads/2019/07/tray.jpg?utm_source=thomasnet&utm_medium=paid-banner&utm_term=electronics%20sourcing&utm_content=the-electronics-cloud-manufacturer&utm_campaign=mf-thomasnet-promo&gclid=CjwKCAjw7cGUBhA9EiwArBAvoqpIqIP22K1um5EdSw-4KCQnPtMaFXrHFCUKO8cmeUrGu20XMhy9kxoCZFYQAvD_BwE" target="_blank"><img width="700" height="703" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjU4NTEyMDgwMDc5LTE2NTg1MTIwODAwNzkucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" srcset="https://mxcdn.macrofab.com/wp-content/uploads/2019/07/tray-700x703.jpg 700w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/tray-150x150.jpg 150w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/tray-250x251.jpg 250w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/tray-768x772.jpg 768w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/tray-600x603.jpg 600w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/tray-120x121.jpg 120w, https://mxcdn.macrofab.com/wp-content/uploads/2019/07/tray.jpg 1024w" sizes="(max-width: 700px) 100vw, 700px" class="fr-fic fr-dii"></a></p><h3>Conclusion</h3><hr><p>Before handing over new engineering designs to a CM for production, consider all avenues for cost reduction during the design phase. While PCB layout is typically the first to be considered for lower costs, there are also many options to review for the BOM and its procurement. There may be some tradeoffs for cost vs. performance. These are the proper discussions to have with the design team to ensure that the system is not over-designed, but optimized for what the market will support. This will allow maximum flexibility for efficiencies during the course of manufacturing. For more information, view&nbsp;<a href="https://macrofab.com/blog/designs-for-reduced-costs-supply-chain/?utm_source=thomasnet&utm_medium=paid-banner&utm_term=electronics%20sourcing&utm_content=the-electronics-cloud-manufacturer&utm_campaign=mf-thomasnet-promo&gclid=CjwKCAjw7cGUBhA9EiwArBAvoqpIqIP22K1um5EdSw-4KCQnPtMaFXrHFCUKO8cmeUrGu20XMhy9kxoCZFYQAvD_BwE" target="_blank">Designs for Reduced Costs &ndash; Supply Chain</a>. &nbsp;</p>

Consider the minimum number of signal and ground layers in your PCBA 

The best designs must consider all available opportunities to reduce costs at the outset.  We give some common sense guidelines that can make a difference in your bottom line. 

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