This blog looks into the Electroforming technology, its technical advantages, why it is the optimal choice for the electronics industry, and its potential to transform the future of the electronics industry.
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ORGANIZATIONS. SHAPING THE INDUSTRY.
Murata Electronics
Electrical and Electronics Manufacturing
Murata is a global solution provider and the market leader in the design, m...
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Have you considered how modern communication systems, like GSM networks, satellite communications, and broadcasting, manage multiple signals with precision? RF diplexers and duplexers make seamless signal sharing and optimal performance possible. Let’s explore the technology in this article.
The first project is developing light-based chips to bridge the gap between photonics and electronics. The second project plans to make blood cells using blood stem cells. The two projects are the first ERC Synergy grants for TU/e.
3 minutes read
Large language models (LLMs) are increasingly automating tasks like translation, text classification and customer service. But tapping into an LLM’s power typically requires users to send their requests to a centralized server — a process that’s expensive, energy-intensive and often slow.
4 minutes read
Plasma cleaning is a high-tech surface treatment that uses ionized gas to remove microscopic contaminants, enhancing adhesion and durability in materials. This article explains plasma cleaning’s role across industries, its eco-friendly benefits, and emerging trends in sustainable manufacturing.
From AI-powered manufacturing to sustainable mobility solutions, Electronica 2024 revealed how electronics are paving the way to a carbon-neutral world. This year’s record-breaking event featured game-changing technologies and fostered collaboration across the global industry.
Thin film deposition applies material layers at the atomic/molecular level, vital for advancing electronics, energy, and aerospace. Key methods like CVD, PVD, and ALD enhance material properties, driving innovations in semiconductors, solar cells, and precision tech.
This article presents a comprehensive technical analysis of CPLD vs FPGA, focusing on their architectural distinctions, performance metrics, design flows, and implementation methodologies.
This article will discuss the different post-processing methods and their impact on dimensional accuracy, helping you navigate potential challenges and ensuring your designs achieve the precision and quality they require.
5 minutes read
Kapsula is an innovative solution designed to provide extreme protection for electronic devices in harsh environments. Utilizing advanced materials like polyphenylene sulfide reinforced with carbon fiber (PPS CF), Kapsula offers unparalleled durability against physical impacts, high temperatures
3 minutes read
AllSpice is a platform that empowers teams with advanced version control, seamless collaboration, and enhanced traceability, bringing robust oversight to complex design workflows and hardware development processes.
Choosing between solder-mask-defined and non-solder-mask-defined pads is an imperative when constructing footprints for BGA-style components.
4 minutes read
A comprehensive technical analysis of PCB prepreg and core materials, examining their distinct material properties, manufacturing implications, and selection criteria for multilayer PCB design.
This technical guide examines aluminum PCB architecture, manufacturing processes, thermal characteristics, and implementation methodologies for optimal thermal performance in high-power electronic systems.
This is the definitive technical comparison between Junction Field-Effect Transistors and metal-oxide Semiconductor Field-Effect Transistors. This in-depth analysis covers operational physics, performance metrics, and practical implementation guidelines for electronic design engineers.
