Discover how wireless technologies like 5G, LoRa, Wi-Fi, and Zigbee are transforming industrial automation by enabling flexible, scalable, and cost-efficient connectivity.
Discover how 5G RedCap enables cost-efficient, low-power connectivity for industrial gateways and rugged IoT, bridging the gap between LTE and full 5G performance.
Whether designing a window in an airliner or a cable conduit for an engine, manufacturers devote a lot of effort to reinforcing openings for structural integrity. But the reinforcement is rarely perfect and often creates structural weaknesses elsewhere.
Regarding the terahertz waves used in Beyond 5G/6G, the Federal Communications Commission, which manages communication radio waves in the US, has opened up a wide band from 95GHz to 3THz for research and experimental use. However, it is presumed that space development and other special applications are being considered as with the 94-GHz-milliwave frequency.
Cellular Vehicle-to-Everything (C-V2X) technology is transforming the transportation industry by enabling advanced communication between vehicles, infrastructure, and other road users. This breakthrough technology has the potential to improve road safety, reduce traffic congestion, and support the development of autonomous vehicles.
A new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips.
Thanks to a novel combination of cryogenic transmission electron tomography and deep learning, EPFL researchers have provided a first look at the nanostructure of platinum catalyst layers, revealing how they could be optimized for fuel cell efficiency.
Semiconductors have become an integral part of our modern lives that relies heavily on electronics, serving as the foundation for a wide range of such devices, from smartphones and computers to medical equipment, automotive applications, and renewable energy systems.
Reactive Ion Etching (RIE) is a powerful and versatile technique that has been widely adopted in various industries including semiconductor manufacturing, microelectromechanical systems (MEMS), and nanotechnology.
EPFL researchers have come up with a new approach to electronics that involves engineering metastructures at the sub-wavelength scale. It could launch the next generation of ultra-fast devices for exchanging massive amounts of data, with applications in 6G communications and beyond.
A quick electric pulse completely flips the material’s electronic properties, opening a route to ultrafast, brain-inspired, superconducting electronics.