Developed by EPFL researchers, the first large-scale in-memory processor using 2D semiconductor materials could substantially cut the ICT sector’s energy footprint.
Developed by EPFL researchers, the first large-scale in-memory processor using 2D semiconductor materials could substantially cut the ICT sector’s energy footprint.
Taking inspiration from the word-predicting large language models, a U-M team is kickstarting an atom-predicting model with 200,000 node hours on Argonne’s Polaris.
MIT CSAIL researchers combine AI and electron microscopy to expedite detailed brain network mapping, aiming to enhance connectomics research and clinical pathology.
The future of data, Edge Data Center, is equivalent to a mini data centre. Its proximity to enterprises eliminates latency and other limitations, giving access to real-time data. In this article, we will delve into its core concepts, advancements, operational challenges, and real-time applications.
The 2G and 3G switch-off is reshaping IoT connectivity worldwide, making migration to 4G, 5G, LTE-M, or NB-IoT essential to avoid outages and ensure future-ready devices.
NR+ is the first non-cellular 5G standard enabling massive IoT with low latency, long range, and operator-free private networks — powered by Nordic and Wirepas for scalable, resilient deployments.
Article #2 of Mastering RF Engineering: RF signal chains are key to wireless systems. Learn how components like amplifiers, filters, and mixers help plan RF designs, balance performance needs, and decide between custom-built or pre-made modules.
In the future, drones will take off automatically and head to an emergency scene immediately after the emergency call, transmitting initial aerial images to the emergency services control centre – even before the relevant personnel arrive.
Whether designing a window in an airliner or a cable conduit for an engine, manufacturers devote a lot of effort to reinforcing openings for structural integrity. But the reinforcement is rarely perfect and often creates structural weaknesses elsewhere.
Developed by EPFL researchers, the first large-scale in-memory processor using 2D semiconductor materials could substantially cut the ICT sector’s energy footprint.
Taking inspiration from the word-predicting large language models, a U-M team is kickstarting an atom-predicting model with 200,000 node hours on Argonne’s Polaris.
MIT CSAIL researchers combine AI and electron microscopy to expedite detailed brain network mapping, aiming to enhance connectomics research and clinical pathology.
Regarding the terahertz waves used in Beyond 5G/6G, the Federal Communications Commission, which manages communication radio waves in the US, has opened up a wide band from 95GHz to 3THz for research and experimental use. However, it is presumed that space development and other special applications are being considered as with the 94-GHz-milliwave frequency.
A new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips.
Cellular Vehicle-to-Everything (C-V2X) technology is transforming the transportation industry by enabling advanced communication between vehicles, infrastructure, and other road users. This breakthrough technology has the potential to improve road safety, reduce traffic congestion, and support the development of autonomous vehicles.
Thanks to a novel combination of cryogenic transmission electron tomography and deep learning, EPFL researchers have provided a first look at the nanostructure of platinum catalyst layers, revealing how they could be optimized for fuel cell efficiency.
Semiconductors have become an integral part of our modern lives that relies heavily on electronics, serving as the foundation for a wide range of such devices, from smartphones and computers to medical equipment, automotive applications, and renewable energy systems.
Reactive Ion Etching (RIE) is a powerful and versatile technique that has been widely adopted in various industries including semiconductor manufacturing, microelectromechanical systems (MEMS), and nanotechnology.