Printed Circuit Board Vertical Interconnect Access (PCB VIAs) are small plated holes that create electrical connections between different circuit board layers. This article delves into the various types, functions, and best practices of PCB VIAs to help you optimize your PCB design.
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Wafer thinning is a part of the semiconductor manufacturing process. It is essentially grinding off the backside of the wafers to control their thickness and is useful for the production of ultra-thin wafers. These flattened wafers are used to effect stacked and high-density packaging in compact or microelectronic devices. This article discusses the meaning of wafer thinning, along with its various techniques and significance.
At the DVT stage, your design is not yet ready for manufacturing. All certifications, qualifications, and specification requirements get tested now.
3 minutes read
PCB layers are the copper layers within a printed circuit board, laminated between or onto layers of conductive material. These layers are stacked to enhance the functionality of electronic devices. This article explores the concept of PCB layering, the various types of layers, and their benefits.
In this article, we look at how Super Low power Wi-Fi and Bluetooth LE enable smart locks to be more agile and reliable by demonstrating these features with a case study from Renesas.
Canadian researchers have discovered that they can stick hydrogel plasters to the skin very effectively using ultrasound. Outi Supponen has now explained the underlying mechanism: imploding bubbles that form within the adhesive located between the plaster and the skin anchor the one on the other.
2 minutes read
Open and honest communication is crucial to a successful design. Product and engineering decision-makers need to work in sync.
4 minutes read
As NASA prepares to send astronauts back to the Moon to live and explore, capabilities for space-based manufacturing of sensors, circuits, and other electronics will become increasingly critical. Recent microgravity flights have helped to advance cutting-edge methods for 3D printing of electronics
4 minutes read
This article delves into the specifics of NPN and PNP transistors, their working principles, applications, comparisons, and factors to consider when choosing between them.
The rigid, flex and rigid-flex PCBs are all types of printed circuit boards. The rigid PCB is the traditional board and the base from which the other two variations came about, in response to industry and market needs. Flex PCBs introduced versatility to PCB fabrication and rigid-flex combines both for increased performance. Learn more about these board types, their benefits, disadvantages, and applications in this article.
A student article explaining how quasioptical framework is advantageous for developing radiative wireless power transfer systems with high efficiency.
A team at Columbia University and the National University of Singapore finds a simple new way to describe the water-like movement of electrons in a novel type of semiconductor, which could pave the way for more efficient electronics.
Quick turn PCBs are designed, fabricated, and assembled swiftly, ensuring tight schedules and deadlines are met, even for high-volume orders. This article investigates the quick turn PCB process, highlighting its benefits, stages, and how it guarantees quality within a short turnaround time.
The best designs must consider all available opportunities to reduce costs at the outset. We give some common sense guidelines that can make a difference in your bottom line.
7 minutes read
Researchers at Texas A&M University and The University of Texas at Austin are working to change that, enabling continuous monitoring that can provide a more comprehensive look at blood pressure than the single snapshot that comes with the cuffs.
