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ORGANIZATIONS.

SHAPING THE INDUSTRY.

Sculpteo

3D printing services

We believe in the potential of 3D printing; we believe this technology can be accessible to everyone and every business.

42 Posts

Veco B.V.

Manufacturing

world leader in micro precision.

23 Posts

polySpectra

Additive Manufacturing

We help innovative engineers 3D print end-use components they can trust usi...

12 Posts

FACTUREE – The Online Manufacturer

Manufacturing | Procurement

The digital all-in-one solution for effortless procurement of custom parts

12 Posts

SINTRATEC

Machinery Manufacturing

Print your mind

12 Posts

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Latest Posts

Lonypack began to explore 3D printing in early 2022. Their goal was to develop new component designs that would optimize its production process. Doing so would allow the Spanish company to achieve these improvements in its state-of-the-art plant in the most economical, customizable way possible.

Lonypack: Optimizing food packaging with 3D printing

A unique new approach of printing functional materials with unparallel precision and repeatability. Technology called Ultra-Precise Deposition (UPD) is a nanodispensing method capable to print high density and high viscous materials with the resolution down to 1 µm in feature size and with high ratio of width to height after single pass. For this method material extrusion is controlled by a pressure, which means it is not supported with high electric field. Thanks to this there are no limitation if the substrate is conductive or dielectric.

Ultra-Precise Deposition for the Fabrication of Next-Generation MicroLED and QD-LED Displays

Silver nanoparticle inks improve every year. These improvements are often incremental, but very important. One ever-present direction of development is towards inks which offer ever higher conductivity levels at a low curing temperature and a short curing time. This a critical figure of merit because it opens more substrate choices, saves time, and lowers energy consumption costs.

Ag Nanoparticle Inks: Achieving Ever Higher Conductivity at Lower Curing Time and Temperature