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The Guide to Understanding the Technologies Defining the Next Phase of Edge AI

The 2026 Edge AI Technology Report Just Launched

This white paper focuses on practical design choices that improve battery life and maintain stable operation across changing load conditions.

Efficient Power Management for Portable and IoT Devices

Exploring the design, development, connectivity, security, and more aspects of IoT devices

Internet of Things: A Comprehensive Guide to its Engineering Principles and Applications

Understanding the signal names, numbering schemes, electrical limits and software control of the Raspberry Pi 5 general purpose input/output (GPIO) header empowers hardware and digital design engineers to build robust embedded solutions.

Raspberry Pi 5 GPIO Pinout: Theory and Practice for Engineers

The Raspberry Pi Zero 2W features a quadcore 64 bit processor and builtin wireless in a tiny footprint. Its 40 pin header provides engineers with a flexible interface for embedded applications. This guide explores the theory behind the pinout and offers practical guidance for learners.

Raspberry Pi Zero 2 W Pinout: Comprehensive Guide for Engineers

A comprehensive guide to half adder circuits for engineers and technical learners. Learn the theory behind half adders, explore truth tables, logic expressions, K maps, implementations with Logic gates, TTL/CMOS ICs, Verilog modelling, propagation delays, design strategies, and applications.

Half Adder Circuit—Theory, Design, and Implementation

Head Engineer monitoring plant data using SCADA, through HMI

Understanding the differences between Modbus RTU and Modbus TCP/IP is essential for designing reliable and scalable control systems. This indepth guide compares the serial and Ethernet variants of the Modbus protocol, explains their strengths and weaknesses, and provides practical advice for engine

Modbus RTU vs TCP: A Comprehensive Comparison of Industrial Protocols

Discover key differences in GDDR6 vs GDDR6X memory: compare bandwidth, power efficiency, signaling methods, and design trade-offs for advanced GPU architectures.

GDDR6 vs GDDR6X: A Comprehensive Technical Comparison for Digital Design & Hardware Engineers

A comprehensive technical comparison of low-pass and high-pass filters, covering how each works, practical circuit implementations, and when to use them in electronics and signal processing.

Low Pass Filter vs High Pass Filter – Theory, Design, and Applications

An insight into one of the most futuristic designs for power, data transfer, and communication. Find out the essentials of USB-C type pinout, its use cases, architecture, and implementation in modern computing devices

USB-C Pinout In Depth: A Comprehensive Technical Guide for Engineers

Master the language of electronics by learning to interpret schematic diagrams, from basic symbols and conventions to complex circuit analysis.

How to Read Electrical Schematics: A Comprehensive Guide for Engineers

Unexpected shutdowns? Costly errors? SCADA systems are the solution industries rely on to stay in control. Let's understand how this system allows owners to run industries through PLCs, RTUs, and other field devices, allowing them to make smarter decisions in real-time

What is SCADA?: The Basics you Need to Know

This article explores a vital power-saving technique in digital design, covering core concepts, implementations, and the differences between fine-grained, coarse-grained, and software-controlled methods. Learn why clock gating is crucial for energy efficiency, its applications in diverse systems.

Clock Gating: Powering Down Idle Circuits

Owing to its simple and straightforward nature, Modbus RTU is the engineer and technician's go-to protocol in industries such as manufacturing, energy, and transportation. Understanding Modbus RTU is crucial for seamless communication between electronic devices and optimizing system performance. 

Modbus RTU: A Comprehensive Guide to Understanding and Implementing the Protocol

A comprehensive technical analysis comparing High Bandwidth Memory 2 (HBM2) and GDDR6 memory architectures, examining architectural differences, performance metrics, and system integration considerations. Essential reading for system architects working with high-performance computing systems.

HBM2 vs GDDR6: Engineering Deep Dive into High-Performance Memory Technologies

Understanding the role of programmable automation in the field of industrial applications, its architecture, implementations, benefits, and standing amongst other types of industrial automation techniques.

What is Programmable Automation

<h2 id="isPasted">Introduction</h2><p>Industries today are increasingly focusing on speed, precision, zero-defect production, and real-time traceability. Every product, part, and process needs to be identified and logged to maintain production efficiency. One of the most practical ways to achieve this is with barcodes.</p><p>Barcode readers have evolved from simple optical scanners to become intelligent vision systems. They combine advanced hardware, sophisticated algorithms, and high-speed processing to enable scanners to consistently read all types of codes with high accuracy and high speed.</p><p>This article explores code reading, an often-overlooked yet critical aspect of modern manufacturing. It uses the OMRON VHV5-F Auto-Focus Multicode Reader as an example to illustrate how a combination of robust hardware and intelligence is transforming this critical process.</p><h2>The Challenges Behind Reliable Code Reading</h2><p>Behind every smooth-running production line, there is a constant struggle to ensure every barcode is read accurately and on time. Some challenges in code reading are:</p><ul><li><p><strong>Code diversity:</strong> Barcodes are broadly classified into just two categories: 1D and 2D. The diversity, however, comes from the different variants of these barcodes. For example, 1D barcodes include Universal Product Code (UPC), European Article Number (EAN), Code-39, Code-128, and more, whereas examples of 2D barcodes are QR code, data matrix, and more.</p></li><li><p><strong>Variable surfaces: </strong>Codes are printed on curved, reflective, textured, flexible, and sometimes irregular surfaces. Codes on metal cases, plastic containers, or films may appear distorted, faded, or partially obscured at times, resulting in inconsistent decoding by the scanner.</p></li><li><p><strong>Lighting inconsistencies:</strong> Shadows, glare, and overexposure are all a result of ambient factory lighting, which washes out critical details of the barcode. Without lighting control or customized optics, readers tend to struggle to keep working in such conditions.</p></li><li><p><strong>High-speed lines: </strong>Keeping up the synchronization with speed is a critical aspect of code reading. It is not uncommon to have production lines processing thousands of parts per minute, requiring code readers to instantly decode the barcodes without causing any bottlenecks.</p></li><li><p><strong>Manual setup dependency: </strong>Adding to all these difficulties is the dependency on manual setup. Conventional barcode scanners require extensive calibration and tuning by the trial-and-error method before they can even be deployed. This delays the initial setup and makes future reconfigurability slow.</p></li></ul><h2>OMRON’s VHV5-F: Bringing Intelligence to Code Reading</h2><p>The next generation of industrial code reading isn’t about faster processors or sharper optics, but about the solutions that think and adapt on their own. The <a href="https://www.mouser.com/new/omron-electronics/omron-ia-vhv5-f-intelligent-barcode-readers/" target="_blank">OMRON VHV5-F Auto Focus Multicode Reader</a> solves the very challenges that limit the productivity of scanners in modern manufacturing by combining advanced hardware and intelligent algorithms to enable real-time decoding of all types of barcodes in all production environments.</p><p>It is a major leap forward compared to traditional barcode readers that depend heavily on manual tuning. Operators often spend hours setting the right lighting, exposure, or other settings to achieve stable results, only to repeat the process when the product type or surface changes. OMRON’s VHV5-F eliminates this trial-and-error approach with its intelligence that continuously analyzes the image quality and achieves optimal readability.</p><p><span class="fr-img-caption fr-fic fr-dib"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzY4OTMzNDQ5NDM3LWltYWdlMS5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width:100%px" class="fr-fic fr-dib" alt="omron-vhv5-f-multicode-reader" /><span class="fr-inner">Fig. 1: <a href="https://www.mouser.com/new/omron-electronics/omron-ia-vhv5-f-intelligent-barcode-readers/" target="_blank" id="isPasted">OMRON’s VHV5-F Auto-Focus Multicode Reader</a> is available on Mouser Electronics.</span></span></span></p><p><strong>Table 1: </strong>Key technical highlights of OMRON VHV5-F</p><div><table><tbody><tr><td><p><strong>Specification</strong></p></td><td><p><strong>Notes</strong></p></td></tr><tr><td><p><strong>Imaging Sensor</strong></p></td><td><p>2.3 MP or 5.0 MP</p></td></tr><tr><td><p><strong>Lens &amp; Focus</strong></p></td><td><p>Liquid-lens Auto-Focus; Narrow / Medium / Long options up to 2 meters</p></td></tr><tr><td><p><strong>Processing Speed</strong></p></td><td><p>Multi-core parallel architecture - up to 4,000 parts/minute</p></td></tr><tr><td><p><strong>Lighting</strong></p></td><td><p>Integrated ultra-bright LED</p></td></tr><tr><td><p><strong>Protection Rating</strong></p></td><td><p>IP69K rugged enclosure - dust/water/high-pressure wash-down resistant</p></td></tr><tr><td><p><strong>Connectivity</strong></p></td><td><p>PoE, TCP/IP, EtherNet/IP, PROFINET, RS-232, Digital I/O</p></td></tr></tbody></table></div><h3>Software Designed for Speed and Simplicity</h3><p>OMRON VHV5-F comes with the X-Mode 6.0 algorithm that lets it decode barcodes in the most challenging situations, such as under exposure, over exposure, linear distortion, non-linear distortion, damage, and poor print. It comes with a Smart Assist feature that automatically applies the appropriate filters and decodes the barcodes without any manual intervention. Engineers also have an option to train OMRON VHV5-F to work with a single type of barcode to maximise the decoding speed.</p><p><span class="fr-img-caption fr-fic fr-dib"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzY4OTMzNDY3MTU3LWltYWdlNC5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width:100%px" class="fr-fic fr-dib" alt="challenging-conditions-barcode-reading" /><span class="fr-inner">Fig. 2: Examples of challenging barcode reading conditions handled by OMRON VHV5-F.</span></span></span></p><p id="isPasted">Another key highlight of OMRON VHV5-F is its remarkable ease of use. The device can be managed through OMRON’s browser-based interface, the WebLink. It eliminates the need for installing software by running directly from the device. Operators can use this interface to configure, test, and monitor the performance of the device via any other system connected to the same network by visiting the reader’s IP address.</p><p>The setup workflow is simple and requires no special training. Once deployed, the users can access the dashboard view that provides insights into the read rates, image quality, system health, and more, all at a quick glance.</p><p><span class="fr-img-caption fr-fic fr-dib"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzY4OTMzNDc4NjI5LWltYWdlMy5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width:100%px" class="fr-fic fr-dib" alt="examples-barcode-reading-conditions-vhv5-f-omron" /><span class="fr-inner">Fig. 2: Examples of challenging barcode reading conditions handled by OMRON VHV5-F.</span></span></span></p><p id="isPasted">Another key highlight of OMRON VHV5-F is its remarkable ease of use. The device can be managed through OMRON’s browser-based interface, the WebLink. It eliminates the need for installing software by running directly from the device. Operators can use this interface to configure, test, and monitor the performance of the device via any other system connected to the same network by visiting the reader’s IP address.</p><p>The setup workflow is simple and requires no special training. Once deployed, the users can access the dashboard view that provides insights into the read rates, image quality, system health, and more, all at a quick glance.</p><p><span class="fr-img-caption fr-fic fr-dib"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzY4OTMzNDkxNjkwLWltYWdlNi5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width:100%px" class="fr-fic fr-dib" alt="mounting-options-omron-vhv5-f-multicode-reader" /><span class="fr-inner">Fig. 4: Apart from being widely compatible and super-durable, OMRON VHV5-F also comes with a flexible mounting that allows seamless integration into any production line.</span></span></span></p><p id="isPasted">For system integrations, the scanner supports all commonly used industrial connectivity options such as PoE, TCP/IP, Ethernet, PROFINET, RS-232, and digital I/O. These design choices make VHV5-F the right fit for any production line.</p><h2>Applications Across the Industries</h2><p>The versatility of the VHV5-F makes it suitable for every industry, each presenting unique challenges in code reading. Some examples include:</p><h3>Food and Beverage</h3><p>In the food and beverage industry, reading barcodes is critical for package integrity, traceability, and compliance with safety standards. The VHV5-F excels in this scenario by maintaining high read rates on glossy or transparent packaging while withstanding rigorous washdown cycles. </p><p>With OMRON’s barcode scanning solution, manufacturers are able to maintain uninterrupted operation while reducing product rejections and ensuring every package is correctly identified before leaving the line.</p><h3>Automotive</h3><p>In the automotive manufacturing industry, VHV5-F can read direct part marks (DPMs) on metal parts, often placed on curved or recessed surfaces that are far from the scanner. The smart assist capabilities ensure the code is accurately decoded even when markings vary in depth and finish.</p><h3>Electronics</h3><p>The high-resolution sensor and autofocusing capabilities of VHV5-F enable it to decode tiny laser-etched 2D barcodes from the printed circuit boards (PCBs). It compensates for surface reflections, positioning errors, and low-contrast markings automatically in real-time.</p><p><span class="fr-img-caption fr-fic fr-dib"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzY4OTMzNTA4ODYwLWltYWdlMi5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width:100%px" class="fr-fic fr-dib" alt="difficult-barcodes-omron-vhv5-f-multicode-reader" /><span class="fr-inner">Fig. 5: Advanced imaging and multi-core processing enable VHV5-F to accurately read barcodes in difficult, cluttered, and even multi-part scenes.</span></span></span></p><h3>Logistics</h3><p>The large depth of field and long-distance reading capabilities enable VHV5-F to capture and process multiple barcodes in a single scene. This makes it ideal for sorting systems, conveyor belts, and mixed-package handling, where traditional scanners are slow and often struggle.</p><h2>Conclusion</h2><p>Barcode reading seems like a trivial process, but it is, in reality, a complex operation influenced by factors like material, lighting, line speed, and various environmental conditions. As manufacturing demands higher levels of automation, the need for intelligent, reliable, and adaptive code readers is more prominent than ever.</p><p>OMRON VHV5-F Auto-Focus Multicode Reader is a high-performance code-reading solution that combines high-resolution imaging, advanced optics, and intelligent decoding algorithms to read every code, on every surface, and in every industry.</p><p><em>Ready to upgrade your code-reading capabilities? Check out the <a href="https://www.mouser.com/new/omron-electronics/omron-ia-vhv5-f-intelligent-barcode-readers/" target="_blank">OMRON VHV5-F Auto-Focus Multicode Reader</a> on Mouser Electronics.</em></p><h2>References</h2><p>[1] OMRON Corporation. Auto-Focus Multicode Reader VHV5-F Brochure: Any Code. Any Application. Any Operator. Any Production Line [Internet]. Available from: <a href="https://www.mouser.com/pdfDocs/VHV5-Brochure-OAA.pdf" target="_blank">https://www.mouser.com/pdfDocs/VHV5-Brochure-OAA.pdf</a></p><p>[2] OMRON Corporation. VHV5 Quick Start Guide: How to Set Up and Use the VHV5 [Internet]. Available from: <a href="https://www.mouser.com/pdfDocs/VHV5-Quick-Start-Guide-202505-r1.pdf" target="_blank">https://www.mouser.com/pdfDocs/VHV5-Quick-Start-Guide-202505-r1.pdf</a></p><p>[3] OMRON Corporation. User Manual: Autofocus Multicode Reader VHV5-F Series [Internet]. Available from: <a href="https://www.mouser.com/pdfDocs/VHV5-Users-Manual.pdf" target="_blank">https://www.mouser.com/pdfDocs/VHV5-Users-Manual.pdf</a></p>

Barcodes play a key role across industries for tasks like inventory management, asset tracking, and quality control, where traceability is required. OMRONs VHV5-F enables accurate barcode reading on every surface, from curved metals to glossy packaging, even in the harshest environments.

Intelligent Code Reading for Every Industry: OMRONs VHV5-F Auto-Focus Multicode Reader

<p id="isPasted">Are you ready for the fourth agricultural revolution? It’s arrived just in time for a hungry planet facing unprecedented crises and opportunities. Like the three agricultural revolutions before it, our fourth agricultural revolution will drive innovation. Yet it will also leverage and advance existing technologies. To see where we’re headed, it helps to consider where we’ve been.</p><p><span class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable fr-active"><iframe src="https://c8056756.sibforms.com/serve/MUIFAH4WHDmOPfJMSjdsS64wzhDLr9_Ekkns_0sW9Sqy11_oMRUhEl-fhjm13fNhWsqBj7ilAiaajoZvs3IGxDfOnSWuGThJLjtMyybwWrTiq0pEkb2DNUsB77OqsZmuX8TEbWxrO2lppJZ93PqI2D0HsagcuXW6lpyE6JD95Ze7kL1xhCLOhISOsVQRdbldBChWT6xP_pZsBoyx" frameborder="0" scrolling="auto" style="display:block;margin-left:auto;margin-right:auto;max-width:100%;width:810px;height:353px" class="fr-draggable"></iframe></span><br /></p><p id="isPasted">The first agricultural revolution, the Neolithic Revolution, began around 10,000 B.C. when humans transitioned from hunting and gathering to farming and herding. The second, the British Agricultural Revolution, began in the 18th century and introduced mechanical farm equipment, livestock breeding, and crop rotation. The third, the Green Revolution, lasted from the 1940s to 1960s and included fertilizers, pesticides, plant breeding, and advances in irrigation.</p><p>The fourth agricultural revolution, now upon us, is known as Agriculture 4.0 because it uses smart technologies such as artificial intelligence, biotechnology, and automation to improve efficiency and productivity. Many of these technologies are also part of Industry 4.0, but the demand for agricultural innovation is especially pressing because of our burgeoning population and the condition of the planet.</p><p>Over the next 30 years, the global population is <a href="https://www.un.org/en/global-issues/population#:~:text=Our%20growing%20population&amp;text=The%20world's%20population%20is%20expected,billion%20in%20the%20mid%2D2080s." target="_blank" rel="noopener noreferrer">expected to increase</a> by nearly 2 billion people. Experts predict a 40% gap between water supply and demand by 2030, and over 30% of the world’s soils are <a href="https://www.sciencedirect.com/science/article/pii/S0160412019315855" target="_blank" rel="noopener noreferrer">moderately to highly degraded</a>, in part because of the overuse of chemical fertilizers, herbicides, and pesticides that also pose risks to human health and the environment.</p><p>Clearly, yesterday’s strategies won’t meet the challenges of the future. </p><p>Previous agricultural revolutions have focused almost exclusively on increased productivity. With Agriculture 4.0, however, there’s an essential balance between growing more food and using less resources. From water, fertilizers, and seeds to labor, chemicals, and energy, farms that learn to do more with less – and the innovative companies who support them – will be the heroes of the revolution. </p><p>In the pages that follow, you’ll learn how smart agriculture is interconnected. Automation and robotics depend upon advanced sensing and improved connectivity, as well as developments in artificial intelligence (AI) and Big Data. Genetic and biotech innovations aren’t limited to the laboratory. Rather, they’re helping to reduce demand for chemical fertilizers, pesticides, and herbicides. Renewable energy and resource conservation are also critical. </p><p>How will smart agriculture leverage these technologies? Let’s explore the answers in the chapters that follow. </p><p><strong>Steve Melito</strong></p><p>Editor-in-Chief</p><hr /><h2><br /></h2><h2>Thank you</h2><p id="isPasted">This report was developed by a small writing team, led by Editor-in-Chief Steve Melito, that included Deval Shah, Shailendra Singh, and Julia Masselos.  Additionally, interviews were conducted with leaders, researchers, and companies in the smart agriculture sector to provide practical, real-world insights from those closest to this rapidly evolving field.</p><p>We would also like to extend our sincere thanks to our sponsors, Nordic Semiconductor and Mouser, whose support enables us to deliver high-quality content to the engineering community.</p>

Introduction

Chapter I: Automation and Robotics

Chapter II: Sensing, IoT, and Advanced Connectivity in Agriculture

Chapter III: Artificial Intelligence and Big Data in Agriculture

Chapter IV: Biotechnology & Genetic Innovations in Agriculture

Chapter V: Renewable Energy and Resource Conservation

A deep dive into the technologies driving next-generation agriculture.

The Agricultural Technology Report

<p id="isPasted">It's an unfortunate truth that the industrial semiconductor market lacks the volume necessary to influence global manufacturing priorities. Without much leverage, industrial OEMs need to piggyback on a sector that shares their requirements but commands the necessary economic influence. Between the dominant semiconductor segments, the automotive industry offers the most viable parallel for the industrial sector.</p><p>Automotive vehicles and heavy industrial machinery share fundamental engineering characteristics. Both applications require safety assurance, operational lifespans measured in decades, and resilience against environmental conditions that would compromise standard consumer electronics. Because the automotive sector has established robust supply chain mechanisms to address these challenges, industrial manufacturers can fight obsolescence by aligning with automotive component standards and partnership models.</p><h2>Leveraging the Stability of AEC Standards</h2><p>Automotive semiconductors occupy a unique position in the global supply chain. They must meet strict, quality and reliability standards well-defined by the <strong>Automotive Electronics Council (AEC)</strong>, including <strong>AEC-Q100</strong> for integrated circuits and <strong>AEC-Q200 </strong>for passive components <sup>(1)</sup>. The industry designed these standards to guarantee that devices operate safely under extended environmental stress, including many of the same conditions that industrial and heavy-equipment systems also endure daily.</p><p>When industrial engineers select components that adhere to these automotive qualifications, they effectively secure a product lifecycle engineered for longevity. While data center engineers revise designs every three to five years, automotive product lifecycles last between 15-20 years. Consequently, when an industrial controller incorporates an AEC-qualified microcontroller, the design directly benefits from the longer support timeline.</p><p>Beyond technical durability, aligning with automotive provides a safeguard against the economic drivers of obsolescence. Original Component Manufacturers (OCMs) frequently discontinue products when production volumes fall into unprofitable territory. Conversely, AEC-qualified components enjoy support from high-volume, multi-year production runs across diverse vehicle platforms. By integrating these devices, industrial designers access a supply chain supported by the substantial demand of the global automotive industry, which significantly reduces the probability of discontinuation due to unmet revenue targets.</p><h2>Adopting Automotive Process Discipline</h2><p>The value of the automotive sector goes well beyond the components themselves. Automotive engineering follows a strict methodology that prioritizes functional safety, as codified in standards such as <strong>ISO 26262</strong> <sup>(2)</sup>. Although industrial manufacturers typically operate under different regulatory frameworks, such as <strong>IEC 61508</strong>, the fundamental requirement for process discipline is mostly the same.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1765887943862-1765887943862.png" width="624" height="499" class="fr-fic fr-dii" /></p><p>Image credit: <a href="https://www.iso.org/obp/ui/en/#iso:std:iso:26262:-9:ed-2:v1:en" target="_blank">ISO<sup><sup>(2)</sup></sup></a></p><p>Therefore, aligning with automotive-grade suppliers gives industrial OEMs robust documentation and traceability. AEC-qualified components come with detailed process control data, which proves essential for future reliability validation. And, because automotive programs prioritize stability to minimize risk, they utilize well-characterized packaging and test platforms that aren’t threatened by abrupt retirement.</p><p>Rochester leverages these same advantages when extending product lifecycles with internal manufacturing that follows the same quality controls expected of automotive programs, including environmental stress screening, burn-in, and lot traceability. By applying automotive manufacturing discipline to industrial components, Rochester ensures that replicated or remanufactured parts meet the same reliability expectations as their originals.</p><h2>Supplier Selection as a Risk Mitigation Strategy</h2><p>Combating obsolescence requires a strategic approach to supplier selection, as OCMs vary significantly in their long-term commitments. While some establish reputations for supporting long-lifecycle industrial and automotive programs, others prioritize the blistering innovation cycles of GPUs, FPGAs, and high-performance computing. Manufacturers of industrial controls introduce considerable risk when they select a supplier focused on short-lifecycle markets.</p><p><strong>For example</strong>, when a processor family reaches its end of life, the resolution rarely involves a simple component swap. Engineers must often rewrite firmware, revalidate hardware layouts, and retest for global certifications. These processes can take years of engineering effort and significant capital expenditure. Companies can avoid this scenario by selecting and proactively engaging with suppliers that show a proven track record of stability. </p><p>As an authorized partner to over <strong>70 OCMs</strong>, Rochester monitors hundreds of product roadmaps and identifies lifecycle risks early. Our relationships include both fabless and vertically integrated OCMs, garnering a uniquely industry-wide perspective. In that way, Rochester can advise customers on component selection, inventory preservation, and risk mitigation in ways that individual OCMs cannot.</p><h2>Case Study: NXP and TK Elevator</h2><p>Proactive engagement is necessary because the obsolescence decision within an OCM occurs long before the customer receives an LTB notice. Rochester’s long-term manufacturing, die banking, and licensed production capabilities provide continuity. We acquire design data, test programs, and original wafers directly from OCMs, allowing them to continue manufacturing devices long after the original supplier exits.</p><p><strong>For example</strong>, when <strong>NXP </strong>discontinued the <strong>P80C592 microcontroller</strong>, <strong>TK Elevator </strong>was in a major predicament <sup>(3)</sup>. They relied heavily on this MCU for their elevator designs, and losing that component wouldn’t require re-engineering their control systems, incurring substantial costs and logistical delays.</p><p>Rather than accepting the discontinuation, the supply chain adapted through licensed manufacturing. Rochester Electronics intervened by acquiring the original design IP and test data directly from NXP. Assuming full responsibility for production, Rochester engineered, qualified, and manufactured a device identical in form, fit, and function to the original. Because the solution constituted a licensed replication using original specifications, it integrated with existing hardware and software without modification.  </p><h2>A Collaborative Way Forward</h2><p>Industrial manufacturers need to recognize that, while they can’t dictate the direction of global semiconductor investment, they can strategically position themselves within the market. By aligning their BOMs with components meant for the automotive sector, industrial OEMs can realize a more stable lifecycle.</p><p>Partnering with Rochester helps OEMs translate that predictability into practical supply continuity. By maintaining 100% authorized inventory, preserving discontinued die, and replicating obsolete devices under license, Rochester provides industrial customers with a stable foundation in an otherwise unpredictable semiconductor landscape. </p><p><span class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable"><iframe width="540" height="450" src="https://c8056756.sibforms.com/serve/MUIFAFt1_uNZMl0gRdqIpx2bkxdyopcpqLsCtYcPhp2zo0lodsS0XFN1pA4wkISL9Pp7bXqab9UifXxpwu0HD7C4Tk1M0xW6IVGDpEiruQB8ArvAR6LYsO3o_M1x1xmjlpjU3cRBrWR3Zr4Ufcb95Mz5JYK4hbCUcQFTj9urfN5lXD6Bb52-mLUeCxft7hVXmD07kwWTRw7oEijI" frameborder="0" scrolling="auto" style="display:block;margin-left:auto;margin-right:auto;max-width:100%"></iframe> </span></p><h2>References</h2><p>1. <a href="http://www.aecouncil.com/AECDocuments.html" target="_blank">http://www.aecouncil.com/AECDocuments.html</a></p><p>2. <a href="https://www.iso.org/obp/ui/#iso:std:iso:26262:-9:ed-1:v1:en" target="_blank" rel="noopener noreferrer">https://www.iso.org/obp/ISO-26262-9:2011(en)</a></p><p>3. <a href="https://www.rocelec.com/news/thyssenkrupp-elevator-nxp-p80c592?srsltid=AfmBOopmlGjoC0ukK0cTxD72u46tJJqTXErFSfssLx5TtHp61VDiDoqb" target="_blank" rel="noopener noreferrer">https://www.rocelec.com/news/thyssenkrupp-elevator-nxp-p80c592</a></p>

Why Is Alignment with the Automotive Industry the Best Defence of Industrial Electronics Against Obsolescence?

Fighting Obsolescence by Aligning with Automotive

<p>Embedded SIM or eSIMs are essential to unlocking next-generation device design and scalability. At the heart of eSIM functionality is the eUICC, the Embedded Universal Integrated Circuit Card that sits inside the device, stores operator profiles, handles authentication and enables updates via Remote SIM Provisioning RSP, removing the need for physical SIM swaps and cumbersome practices that stifled prior Over-the-air update mechanisms.</p><p>The topic of always-connected isn't just about mobiles anymore. Connectivity is now a core requirement across wearables, asset tracking, EVs, e-bikes, industrial equipment, and a growing range of IoT devices. The global connected device volume is expected to hit 23.9 billion devices in 2026 [1]. This shift has been enabled by miniaturization, which reduces the physical size of components while increasing efficiency.</p><p>Today's products are expected to always be connected, work seamlessly across the globe, and meet strict security requirements. To make this happen, miniaturiization is no longer optional. It is a crucial requirement to build the next generation of connected products.</p><h3>Why designers feel the squeeze</h3><p>As user expectations continue to rise, product designers are under constant pressure to deliver more features, such as always-on connectivity and AI, while keeping devices compact. On a PCB, every millimeter matters [2]. Designers need space for processors, memory, sensors, and antennas. Even with careful layout optimization, traditional connectivity hardware can feel dated in the current scheme of things.</p><p>Removable SIM cards require trays and mechanical tolerances that use up valuable PCB area. To address this issue, many product teams are moving toward embedded SIM solutions to optimize space and efficiency. According to GSMA specifications, an embedded form factor can save up to 90% of the space compared to traditional SIM housing [3].</p><p>Embedded form factors help towards this - however, once you solder an eUICC on your device PCB, management and customization to destinations can be hard to manage as a different soldered component is needed for each geography or market. This can be a hindrance to managing product variants or SKU (Stock Keeping Units), and harmonizing reliability testing during manufacturing. This implementation challenge provided impetus to the need for eSIMs in IoT - <a href="https://www.wevolver.com/article/ces-2026-how-physical-ai-is-redefining-mobile-and-why-esim-matters">something we’ve discussed earlier.</a></p><h3>SIM form factors: what product teams need to know</h3><p>Not all SIM cards are made the same way, though. To understand why eSIMs stand out, it helps to understand how SIM form factors (FF) have evolved over the years.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1774385483914-1774385483914.png" width="602" height="343" class="fr-fic fr-dii" /><sup>Evolution of SIM technology over the years. </sup><sup>Source: Kigen</sup></p><h3>1FF (Full SIM)</h3><p>These were the first commercially used SIM cards. Introduced in 1991, 1FF cards were roughly the size of a credit card and were primarily used in early car phones. At the time, device size was not a major constraint, so the large format was acceptable.</p><h3>2FF (Mini SIM)</h3><p>This became the standard SIM for early GSM mobile phones. Measuring 25 × 15 mm, it significantly reduced size compared to 1FF while remaining removable. For many years, 2FF was the dominant format in feature phones.</p><h3>3FF (Micro SIM)</h3><p>As smartphones became slimmer, Micro SIMs reduced the plastic around the chip while keeping the same electrical interface. Popularized in the early 2010s, this format helped free up internal space for other components such as the memory card slot.</p><h3>4FF (Nano SIM)</h3><p>The smallest removable SIM format in widespread use today. Nano SIMs strip away the excess plastic, leaving just the chip with a minimal bezel. While they save space compared to earlier formats, 4FF cards still require a tray and connector.</p><h3>MFF2</h3><p>MFF2 was the first widely adopted soldered SIM form factor in IoT and is often what people mean when they refer to eSIM hardware. Defined by ETSI, MFF2 measures 5 × 6 × 0.75 mm and uses an 8-pin layout designed to operate across industrial temperature ranges.</p><p>By soldering the SIM directly onto the PCB, MFF2 removes the need for SIM trays and connectors. This improves mechanical robustness, reduces failure points, and frees up valuable board space. These advantages have made MFF2 a popular choice for industrial, automotive, and long lifecycle IoT products where reliability and longevity are crucial.</p><h3>MFF4</h3><p>MFF4 pushes miniaturization even further with its compact design. With a footprint of just 2 × 2 mm, MFF4 significantly reduces the space requirement for cellular connectivity.</p><p>Despite its small size, MFF4 is a compact 8-pin soldered package that complies with JEDEC MO-229F specifications [4]. It supports UICC signals including VCC, RST, CLK, IO, and interfaces such as I3C or SPI.</p><h3>How does MFF4 form factor work with eSIM architecture?</h3><p>By dramatically shrinking the SIM footprint, designers get more freedom at the system level. From a manufacturing perspective, soldered eSIMs lead to more streamlined assembly processes compared to removable SIMs. There are fewer mechanical failure points, making it easier to build rugged products ideal for industrial settings.</p><p>These form factors often matter in product design as physically containing the capability of an energy efficient, fully functional and remotely provisionable eSIM into the ever compact devices such as wearables, asset trackers, meters, etc, has been nigh impossible in prior years. Often, the limiting factor is the memory size that allows for adequate number of connectivity profiles as well as the critical software stack that can enable security - the primary function of the SIM or eSIM and all the business logic for eSIM functional management.</p><p>From the view of how these can be remotely provisioned, the eSIM RSP standards are largely form-factor agnostic. The same operating system and subscription management logic can run across MFF2, and MFF4-based eSIM, or iSIM implementations. But this will depend on the provisions available to you to fit the secure OS, associated applets for business logic and profile management and the needed profiles all within the memory size. The secret to achieving this is an OS tuned to the needs of energy-efficient devices, such as those IoT demands. And an added advantage with choosing the right eSIM OS is that the one time investment of the decision and implementation expertise spans across all form factors easily, keeping the toolchain consistent and simplifying scalability across product portfolios. </p><h3>Putting this into practice for eSIM Operations: Why SGP.32 Matters</h3><p>The requirement of being able to have multiple profiles either pre-provisioned or switchover can result from a variety of use-case requirements. But, this is where a new standard addresses how to manage complexity not only within one device but to take it to fleet level in various scenarios.</p><p>Managing connectivity across a fleet of thousands devices can be an operational challenge - something that now is increasingly in the realms of product design from the word go. Different regions, multiple network operators, and various data plans add to the complexity. This is where eSIM lifecycle management standard SGP.32 streamlines the process to manage devices such as robots, smart meters, and connected vehicles. It is compatible with LPWAN (Low Power Wide Area Networks), which may use HTTPS/CoAP or other data protocols and not able to support SMS for provisioning as was the case in smartphone use (as consumers) [5].<br /><br />Additionally, SGP.32 offers secure remote profile downloads and subscription switching without in-person access to devices. It also allows fallback or bespoke profiles to be deployed remotely in case of network issues or when business conditions demand.</p><h3>Key Advantages of eSIM’s multi-faceted evolution</h3><p>Moving to eSIMs deliver several benefits. For starters, soldered and embedded form factors, especially as compact as MFF4, free up valuable PCB area for additional electronics, sensors, batteries, radios, or for other innovations. The soldered approach also reduces connector points prone to mechanical failure. eSIM designs are also less susceptible to wear and tear. </p><p>Security, the primary function of SIM technology is also stronger. In the physical sense, eSIMs are harder to tamper, which is critical for industrial, automotive, and medical devices. Functionally, eSIM is the implementation of a SE (Secure Element) layer for cryptographic operations and to enforce robust authentication protocols - with the new remote management capabilities introduced in SGP.32 with the eIM, this becomes the digital anchor for trust and end-to-end security.</p><p>From a business perspective for manufacturers, eSIM enables SKU consolidation. A single hardware variant can be deployed globally, with connectivity profiles provisioned over the air. This streamlines supply chains and enables faster market entry. </p><p>Operationally, eSIMs adherent to SGP.32 and functionally certified with the GSMA eSA scheme, allow for the secure transfer of profiles through data structure that is standardised for simpler fleet level remote access. When such eSA scheme certified eSIMs are used, this allows efficient integration for the best utility for the eSIM - either through a device-side agent called the IoT Profile Assistant - native to the eUICC, or one that is resident in the device.</p><h3>Device-Side Integration: Choosing The Right eSIM Enablement Suite</h3><p>Device-side software integration plays a critical role in time-to-market and long-term success. Two popular integration approaches are IPAe and IPAd.</p><h3>IPAe</h3><p>IPAe (IoT Profile Assistant embedded) focuses on faster utilization of eSIM capabilities and simplifies GCF certification when a product uses an eSA certified eSIM. In this approach, the profile assistant resides within the eSIM chip rather than in the device's main operating system. This approach is effective for devices that need to end-to-end security or demand long battery life, or are low-power devices.</p><h3>IPAd</h3><p>On the other hand, IPAd (IoT Profile Assistant on the Device) hosts IPA software on the device's operating system. It offers more customization and control potentially desirable in complex use cases. However, it requires a device with sufficient processing power beyond the scope of many IoT devices. Additionally, it takes longer for development and certification work.</p><p>Moving on to SDKs and software utilities, product teams should look for ones that translate across most devices for maximum compatibility to development toolchains. While the choice of IPAd SDKs is increasing, it is useful to understand if it is suited for IoT implementation, or a derivative of LPA used in smartphones. Further, pay good attention to the API structures, opting for SDKs that allow the scalable, open API3.0 or similar such that upstream integration and handovers are simpler through manufacturing, volume production and ultimately device lifecycle. Choosing the right enablement suite is not just about getting connected. It paves the way for certification, operational efficiency, and scaling.</p><h3>Case study: A global smartwatch brand switches to modern eSIM for scale and innovation</h3><p>A global smartwatch heavyweight moved to bring in LTE-connectivity to its premier products and expand into further global markets. With scale came growing complexity around region-specific hardware variants. Traditional SIM-based designs would not ever meet the compact hardware specs, plus, MFF2 soldered form factors required different SKUs for different markets, which slowed regional launches. If based on prior standards, pre-determining every aspect of one-to-one relationship per market would be a severe shackle to meet the market timeline for this innovator.</p><p>Transitioning to MFF4-based eSIMs with SGP.32 features, the same hardware platform could be shipped worldwide to meet local market requirements, with the right customisation - i.e. with the right connectivity profile securely embedded per market during manufacturing.</p><p>The brand launched with multiple networks, including non-terrestrial network (NTN) connectivity as a premium feature. It could appeal to trekkers or those who need a fallback in case of network outages or switchover for the profile that was suitable for streaming usecases vs pure messaging. By relying on eSIM standards such as SGP.32, these features can be introduced with minimal changes to the core hardware - and with the confidence that end-to-end security enables new use-cases that were never imagined possible on a smartwatch.</p><p>Their success with premium product lines integrating eSIMs in volume production with over 500,000 per year should bear evidence that eSIM-first and eSIM-only device experiences are not restricted to premium smartphone brands alone, but within reach of wider IoT experiences. Furthermore, moving away from pre-determined agreements that rely on bootstrap profiles changing over to operational profiles when in field, the use of advanced SGP.32 features (typically deemed/found as ‘optional requirements’) and In-Factory Profile Provisioning from Kigen, allowed them to provision devices within minutes - shaving off multiple months of development delay.</p><h3>Partner Selection: What to Look For</h3><p>Choosing the right technology partner for eSIM integration is as critical as choosing the hardware itself. When evaluating vendors, look beyond the mandatory ‘Profile State Management Operations’ on the standards spec sheet. Prioritize vendor solutions that support quality in pragmatic scenarios, interoperability - both technically, and commercially, and troubleshooting capabilities. Look for evidence of successful deployments in similar verticals to see how they address real-world challenges.<br /><br />Effective partners can also prompt teams to address key connectivity questions early, including how devices will connect after production, how provisioning can be validated in real factory conditions, how to maintain a global SKU with local compliance, and how to scale securely across diverse networks</p><h3>Conclusion</h3><p>The future of hardware is compact and always connected. The MFF4 form factor is a key driver of this shift. It frees designers from focusing on connectivity logistics and allows them to focus more on building innovative products.</p><p>If you want to explore how MFF4 and SGP.32-ready IoT eSIMs can support your business, get in touch with Kigen. It was the first company to introduce compact MFF4 eUICC solutions.</p><p><a href="https://kigen.com/contact/">https://kigen.com/contact/</a></p><p><br /></p><p>Resources:</p><p>1.  <a href="https://iot-analytics.com/number-connected-iot-devices/" target="_blank" rel="noopener noreferrer">https://iot-analytics.com/number-connected-iot-devices/</a></p><p>2.  <a href="https://www.proto-electronics.com/blog/techniques-for-pcb-design-under-space-constraints" target="_blank" rel="noopener noreferrer">https://www.proto-electronics.com/blog/techniques-for-pcb-design-under-space-constraints</a></p><p>3.  <a href="https://www.scribd.com/document/395847381/e-SIM-Report" target="_blank" rel="noopener noreferrer">https://www.scribd.com/document/395847381/e-SIM-Report</a></p><p>4.  <a href="https://kigen.com/resources/blog/the-future-of-esim-hardware/" target="_blank" rel="noopener noreferrer">https://kigen.com/resources/blog/the-future-of-esim-hardware/</a></p><p>5.  <a href="https://kigen.com/resources/blog/sgp-32-iot-esim-certification-and-oem-success/" target="_blank" rel="noopener noreferrer">https://kigen.com/resources/blog/sgp-32-iot-esim-certification-and-oem-success/</a></p>

for the always-connected world

How MFF4 eSIM Enables Miniaturised Device Design

<p id="isPasted"><strong>Palo Alto, California – March 2, 2026 – </strong>Monogoto, the pioneer of programmable hybrid connectivity, today announced that it has been named a Gold Winner for AI: Overall in the <a href="https://www.merit-awards.com/" target="_blank">2026 Merit Awards for Telecom &amp; Wireless</a>. The award recognizes Monogoto’s leadership in pioneering a new category of AI-native connectivity infrastructure by embedding intelligence directly into the SIM, signaling, and network layers. </p><p>Monogoto is redefining how IoT, M2M, and edge devices connect, secure, and scale globally by embedding intelligence directly into the SIM, signaling, and network layers. While much of the industry relies on surface-level analytics and bolt-on AI features, Monogoto’s platform is built from the ground up to enable proactive, autonomous connectivity across public cellular, private LTE/5G, and satellite environments.</p><p>“Connected devices today range from simple sensors to fully autonomous machines, and they require far more than basic connectivity,” said Itamar Kunik, co-founder and CEO of Monogoto. “As deployments become global and enterprise-grade, networks must support security, compliance, and real-time operational intelligence by default. By combining large-scale network data with deep connectivity expertise, we’re embedding intelligence directly into the connectivity layer so monitoring, optimization, and protection become built-in capabilities rather than bolt-ons.”</p><p>Monogoto’s AI-native architecture is purpose-built for real-time network intelligence and automation, enabling proactive monitoring, anomaly detection, and autonomous response. This approach delivers tangible business outcomes for customers, including reduced downtime, improved performance, and streamlined operations.</p><p>“Telecom and wireless innovation continues to transform how people, businesses, and</p><p>communities connect,” said Marie Zander, Executive Director of Merit Awards. “This year’s winners reflect excellence across the ecosystem—demonstrating the technologies and strategies that are shaping the future of communications.”</p><p>To learn more about Monogoto’s AI-native connectivity platform, visit us at MWC Barcelona 2026. We’ll be in Hall 5, Booth 5I51, from March 2-5. </p><h3 id="isPasted">About Monogoto</h3><p>Monogoto is a cloud-based connectivity provider offering secure, programmable, and global cellular connectivity for IoT, Private LTE, and 5G applications. Built on a zero-trust architecture and API-first design, Monogoto enables developers and enterprises to provision, control, and scale connectivity like software — across public networks, private infrastructure, and satellite links. With presence in 200+ countries, Monogoto powers next-generation applications across FinTech, supply chain &amp; logistics, smart utilities, manufacturing, agriculture and more.</p><p>Learn more at <a href="http://www.monogoto.io/" target="_blank">www.monogoto.io</a></p>

Recognizing Monogoto for Leadership in AI-Native Connectivity Infrastructure

Monogoto Named Gold Winner for AI Innovation in 2026 Merit Awards for Telecom & Wireless

<p><strong>Palo Alto, California – February 24, 2026</strong> – Monogoto announced today that its <a href="https://monogoto.io/2025/08/07/from-iot-to-software-defined-connectivity-the-next-cloud-revolution/" target="_blank" rel="noopener">Software-Defined Connectivity Cloud</a> has been named a winner of the 2025 IoT Evolution Satellite IoT Innovation Award from <a href="http://www.iotevolutionworld.com/" target="_blank" rel="noopener external noreferrer">IoT Evolution World</a>, the leading online publication covering IoT technologies.</p><p>These awards honor solution providers that have developed and deployed game-changing satellite solutions and services for IoT applications and appliances.</p><p>In a market that’s rapidly evolving beyond terrestrial limits, Monogoto Software-Defined Connectivity Cloud stands out by offering a fully integrated hybrid connectivity platform that seamlessly blends cellular and satellite networks into one programmable service. Monogoto enables always-on connectivity for devices operating in areas where traditional networks fail, from rugged supply chains to remote sporting events.</p><p>“The rise of physical AI, robots, drones, and autonomous systems, marks a new phase in connected technology,” said Maor Efrati, co-founder and CTO of Monogoto. “Satellite connectivity will play a central role by supporting edge-based intelligence with resilient cloud backhaul, enabling these systems to operate far beyond the limits of terrestrial networks and accelerating the next evolution of IoT.”</p><p>“The solution selected for the IoT Evolution SatIoT Innovation Awards reflect leadership driving this fast-growing marketplace. It is my honor to congratulate Monogoto for their innovative work and contribution to this rapidly evolving industry,” said Carl Ford, Community Developer, IoT Evolution World.</p><p>“It is my pleasure to recognize Monogoto Software-Defined Connectivity Cloud, an innovative solution that earned Monogoto the 2025 IoT Evolution SatIoT Innovation Award,” said Rich Tehrani, CEO, <a href="http://www.tmcnet.com/" target="_blank" rel="noopener external noreferrer">TMC</a>. “I look forward to seeing more innovation from Monogoto in the future.”</p><h3>About Monogoto</h3><p>Monogoto is a cloud-based connectivity provider offering secure, programmable, and global cellular connectivity for IoT, Private LTE, and 5G applications. Built on a zero-trust architecture and API-first design, Monogoto enables developers and enterprises to provision, control, and scale connectivity like software — across public networks, private infrastructure, and satellite links. With presence in 200+ countries, Monogoto powers next-generation applications across FinTech, supply chain &amp; logistics, smart utilities, manufacturing, agriculture and more.</p><p>Learn more at <a href="http://www.monogoto.io/" target="_blank" rel="noopener">www.monogoto.io</a></p><h3>About Crossfire Media</h3><p><a href="http://www.crossfiremedia.com/" target="_blank" rel="noopener external noreferrer">Crossfire Media</a>, co-publishers of IoT Evolution, is an integrated marketing company with a core focus on future trends in technology. We service communities of interest with conferences, tradeshows, webinars and newsletters. Crossfire Media has a partnership with Technology Marketing Corporation (TMC) to produce events and websites related to disruptive technologies. Crossfire Media is a division of Crossfire Consulting, a full service Information Technology company based in New York.</p><h3>About TMC</h3><p>For more than 20 years, TMC has been honoring technology companies with <a href="http://www.tmcnet.com/awards/Default.htm" target="_blank" rel="noopener external noreferrer">awards</a> in various categories. These awards are regarded as some of the most prestigious and respected awards in the communications and technology sector worldwide. Winners represent prominent players in the market who consistently demonstrate the advancement of technologies. Each recipient is a verifiable leader in the marketplace.</p><p>TMC also provides global buyers with valuable insights to make informed tech decisions through our editorial platforms, live events, webinars, and online advertising. Leading vendors trust TMC, thought leadership, and our events for branding, thought leadership, and lead generation. Our live events, like the <a href="http://www.itexpo.com/" target="_blank" rel="noopener external noreferrer">ITEXPO #TECHSUPERSHOW</a>, deliver unmatched visibility, while our custom lead generation programs and webinars ensure a steady flow of sales opportunities. Display ads on trusted sites generate millions of impressions, boosting brand reputations. TMC offers a complete 360-degree marketing solution, from event management to content creation, driving SEO, branding, and marketing success. Learn more at <a href="http://www.tmcnet.com/" target="_blank" rel="noopener external noreferrer">www.tmcnet.com</a> and follow @tmcnet on <a href="https://www.facebook.com/tmcnetcom" target="_blank" rel="noopener external noreferrer">Facebook</a>, <a href="https://www.linkedin.com/company/tmc_60911/" target="_blank" rel="noopener external noreferrer">LinkedIn</a>, and <a href="https://twitter.com/tmcnet" target="_blank" rel="noopener external noreferrer">X</a>.</p>

Monogoto Software-Defined Connectivity Cloud Honored for Satellite IoT Innovation, Powering Hybrid Connectivity Across Earth and Orbit

Monogoto Receives 2025 Satellite IoT Innovation Award from IoT Evolution World

<p id="isPasted"><strong>Palo Alto, California &amp; Oslo, Norway – February 11, 2026 –</strong> Monogoto, the pioneer of programmable hybrid connectivity, announces a strategic cooperation with Nordic Semiconductor, a global leader in low-power wireless solutions, to accelerate the adoption of nuSIM (provided by Redtea-Mobile), an integrated SIM (iSIM) approach optimized for IoT devices.</p><p>As IoT devices become smaller, more power-efficient, and more globally distributed, the industry is shifting away from removable SIMs toward integrated SIM technologies. Through this collaboration, Monogoto and Nordic Semiconductor are enabling developers and device manufacturers to adopt nuSIM-ready designs that embed connectivity directly into the nRF9151 module, streamlining manufacturing, improving security, and delivering seamless global connectivity from day one.</p><p>“nuSIM represents a fundamental shift in how IoT devices are designed, manufactured, and deployed. It is part of the Software-Defined Connectivity revolution,” said Maor Efrati, CTO at Monogoto. “By removing the need for a physical SIM and enabling embedding connectivity directly into the module, we remove friction across the entire lifecycle, from prototyping to mass deployment—all without compromising on security. Our collaboration with Nordic is about growing an open, scalable ecosystem where this integrated SIM technology enables secure, low-power, and future-proof IoT connectivity across terrestrial and satellite networks.”</p><p>The collaboration allows Nordic Semiconductor customers to leverage Monogoto’s cellular, satellite (NTN), and private network connectivity as part of an integrated connectivity experience aligned with nuSIM principles. The Nordic nRF9151-SMA-DK development kit is equipped with Monogoto connectivity, giving developers immediate, hands-on access to globally optimized connectivity without the complexity of traditional SIM provisioning or physical SIM handling.</p><p>“The future of IoT depends on tight integration between silicon, software, connectivity, and cloud,” said Kristian Sæther, Senior Product Director Long-Range at Nordic Semiconductor. “Integrated nuSIM allows companies to focus on innovation rather than SIM and connectivity logistics. By working with Monogoto, we’re giving our customers access to a global, reliable connectivity layer that complements Nordic’s low-power cellular solutions and supports the next generation of scalable IoT products.”</p><p>As the IoT ecosystem evolves toward massive scale, ultra-low power operation, and hybrid terrestrial-satellite coverage, integrated SIM technologies such as nuSIM are becoming essential. Monogoto and Nordic Semiconductor are jointly enabling this transition by lowering barriers to entry and fostering an ecosystem where connectivity is embedded, programmable, and globally accessible by design. Get started <a href="https://monogoto.io/labs/nordic-nusim/" target="_blank" rel="noopener">today</a>.</p><h4>About Monogoto</h4><p>Monogoto is a cloud-based connectivity provider offering secure, programmable, and global cellular connectivity for IoT, Private LTE, and 5G applications. Built on a zero-trust architecture and API-first design, Monogoto enables developers and enterprises to provision, control, and scale connectivity like software — across public networks, private infrastructure, and satellite links. With presence in 200+ countries, Monogoto powers next-generation applications across FinTech, supply chain &amp; logistics, smart utilities, manufacturing, agriculture and more.</p><p>Learn more at <a href="http://www.monogoto.io/" target="_blank" rel="noopener">www.monogoto.io</a></p><h4>About Nordic Semiconductor</h4><p>Nordic Semiconductor is a global leader in low-power wireless connectivity solutions, providing a complete platform of world-class hardware, embedded software, development tools, and cloud lifecycle services – all simplifying and accelerating development for companies and developers to build reliable, scalable, and future-proof connected products faster across the consumer, healthcare and industrial IoT markets. Founded in 1983 and headquartered in Norway, Nordic employs around 1,450 people with presence worldwide. <a href="http://www.nordicsemi.com/" target="_blank" rel="noopener external noreferrer">www.nordicsemi.com</a>.</p><p>Visit us at Mobile World Conference at our booth #7B51 in Hall 7 to learn more.</p><p>Learn more at <a href="https://www.nordicsemi.com/" target="_blank" rel="noopener external noreferrer">https://www.nordicsemi.com/</a></p>

Monogoto and Nordic Semiconductor Launch Dedicated Partnership to Power the Future of Global Cellular + Satellite IoT

Monogoto and Nordic Semiconductor Collaborate to Accelerate the nuSIM Ecosystem for IoT-Optimized Integrated Connectivity

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How MFF4 eSIM Enables Miniaturised Device Design

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Monogoto Receives 2025 Satellite IoT Innovation Award from IoT Evolution World

Monogoto and Nordic Semiconductor Collaborate to Accelerate the nuSIM Ecosystem for IoT-Optimized Integrated Connectivity