<p id="isPasted"><span data-contrast="auto" lang="EN-US">As recently as&nbsp;2010</span><span data-contrast="auto" lang="EN-US">, class-leading activity trackers generally recorded three parameters - how much you moved, and approximately how much sleep you got and how many calories you burned. Movement was measured by an embedded accelerometer, alongside a 25 MHz processor, 8 kB RAM and 128 kB Flash memory. Add in a rechargeable battery and that was about all the tech you needed to power a wearable in the early 2000s.&nbsp;</span><span data-ccp-props='{"201341983":0,"335559739":160,"335559740":259}'>&nbsp;</span></p><p><span data-contrast="auto" lang="EN-US">In the intervening years&nbsp;as the technology has advanced,&nbsp;fitness trackers have not only become vastly more sophisticated in terms of what&nbsp;data they are able to&nbsp;record, the&nbsp;line between fitness, health and medical monitoring has become&nbsp;increasingly blurred.&nbsp;Today’s&nbsp;high-end&nbsp;wearables can support an impressive array of sensors&nbsp;to record, for example, the wearer’s V02</span><span data-contrast="auto" lang="EN-US"><span data-fontsize="11">&nbsp;</span></span><span data-contrast="auto" lang="EN-US">max, blood oxygen saturation (Sp02), temperature, heart rate,&nbsp;and&nbsp;heart rate variability&nbsp;(HRV), as well&nbsp;as&nbsp;the&nbsp;sleep and activity data&nbsp;their&nbsp;early predecessors pioneered.</span><span data-ccp-props='{"201341983":0,"335559739":160,"335559740":259}'>&nbsp;</span><span data-ccp-props='{"201341983":0,"335559739":160,"335559740":259}'>&nbsp;<br></span></p><h2>Wearables&nbsp;crossover from fitness to health</h2><p><span data-contrast="auto" lang="EN-US">The heart monitoring capability&nbsp;of today’s wrist-worn devices has&nbsp;transformed the wearable from a&nbsp;fitness tracker to a powerful tool for managing an individual’s&nbsp;cardiovascular health.&nbsp;Heart rate and&nbsp;HRV, alongside skin temperature measurements,&nbsp;have also been shown to&nbsp;be valuable in predicting and detecting&nbsp;hypoglycemia</span><span data-contrast="auto" lang="EN-US"><span data-fontsize="11">[</span><span data-fontsize="11">1]</span></span><span data-contrast="auto" lang="EN-US">, enabling&nbsp;next generation wearables to also provide insight on an individual’s&nbsp;blood glucose history and associated&nbsp;diabetic&nbsp;risk.&nbsp;Further,&nbsp;data from these same sensors can provide stress and heart rate data, that&nbsp;combined with&nbsp;sleep quality information, can&nbsp;provide&nbsp;valuable insight into&nbsp;an individual’s mental&nbsp;health,&nbsp;and&nbsp;assist&nbsp;in better managing stress and&nbsp;anxiety</span><span data-contrast="auto" lang="EN-US"><span data-fontsize="11">[</span><span data-fontsize="11">2</span><span data-fontsize="11">]</span></span><span data-contrast="auto" lang="EN-US">.</span><span data-ccp-props='{"201341983":0,"335559739":160,"335559740":259}'>&nbsp;</span></p><h2><span data-contrast="auto" lang="EN-US">Next gen SoCs optimized for sensor fusion and ML</span></h2><p><span data-contrast="auto">Demand for ever more sophisticated wearables is placing increasing demand on the wireless SoCs that power the devices. Supporting wireless connectivity and supervising a host of sensors that can generate millions of data points is one thing. But making sense of all that data in context and quickly enough to enable rapid and effective clinical intervention demands an SoC with serious processing heft, and the ability to perform machine learning (ML) and sensor fusion at the edge.</span><span data-ccp-props='{"201341983":0,"335559739":160,"335559740":259}'>&nbsp;</span></p><p><span data-contrast="auto">ML algorithms bring the ability to deal with a large volume of data and extract clinically relevant information from large datasets. This makes ML useful, for example, in healthcare wearables designed for human activity recognition (HAR). HAR enables a wearable to determine both specific ambulation activities (whether the wearer walking or jogging, for example) and functional activities (have they brushed their teeth, washed their hands, prepared food?). Assessing such activities and making inferences can help discern an individual’s health and wellness</span><span data-contrast="auto">[3]</span><span data-contrast="auto">.</span><span data-ccp-props='{"201341983":0,"335559739":160,"335559740":259}'>&nbsp;</span></p><p><span data-contrast="auto">To get that complete picture requires combining different data streams from multiple sensors, and that requires an SoC capable of sensor fusion so it can filter information and determine which data points from all the different sensors correspond to the same activity or health concern, and which do not.</span><span data-ccp-props='{"201341983":0,"335559739":160,"335559740":259}'>&nbsp;</span></p><h2><span data-contrast="auto" lang="EN-US">Nordic nRF54 Series&nbsp;future ready&nbsp;for advanced wearables</span><span data-ccp-props='{"201341983":0,"335559739":160,"335559740":259}'>&nbsp;</span></h2><p><span data-contrast="auto">Nordic Semiconductor has always taken the “if you build it the developer will find innovative ways to use it” approach to SoC development. In other words, the applications that require the processing power or memory allocation its cutting-edge technology provides may not have been dreamed up yet - but put the chips in the hands of clever engineers and they soon will be.</span><span data-ccp-props='{"201341983":0,"335559739":160,"335559740":259}'>&nbsp;</span></p><p><span data-contrast="auto">This has never been more true than with the launch of the company’s revolutionary&nbsp;</span><a href="https://www.nordicsemi.com/Products/nRF54H20" target="_blank"><span data-contrast="none">nRF54H20</span></a><span data-contrast="auto">&nbsp;and&nbsp;</span><a href="https://www.nordicsemi.com/Products/nRF54L15" target="_blank"><span data-contrast="none">nRF54L15</span></a><span data-contrast="auto">&nbsp;multiprotocol SoCs. While their immediate predecessor the&nbsp;</span><a href="https://www.nordicsemi.com/Products/nRF5340" target="_blank"><span data-contrast="none">nRF5340</span></a><span data-contrast="auto">&nbsp;was the world’s first wireless SoC to feature two Arm Cortex-M33 processors, the nRF54H20 now boasts multiple Arm Cortex-M33 processors and multiple RISC-V coprocessors. The processors are clocked at up to 320 MHz and are supported by 2 MB non-volatile memory and 1 MB of RAM. This processing power and amount of memory make the SoC perfect for running ML models and sensor fusion at the edge.</span>&nbsp;</p><h2><span data-contrast="auto" lang="EN-US">State-of-the-art&nbsp;security to protect sensitive data</span><span data-ccp-props='{"201341983":0,"335559739":0,"335559740":259}'>&nbsp;</span></h2><p><span data-contrast="auto">The nRF54H20 is also one of the most secure low power, multiprotocol SoCs on the market, essential for healthcare applications that demand security of potentially sensitive personal data. Its state-of-the-art security is designed for Platform Security Architecture (PSA) Certified Level 3 IoT security standard. The SoC also supports security services such as Secure Boot, Secure Firmware Update, and Secure Storage, and has cryptographic accelerators that are hardened against side-channel attacks and tamper sensors that detect an attack in progress and take appropriate action.</span><span data-ccp-props='{"201341983":0,"335559739":0,"335559740":259}'>&nbsp;</span><span data-ccp-props='{"201341983":0,"335559739":0,"335559740":259}'>&nbsp;</span></p><p><span data-contrast="auto">By replacing multiple components with a highly integrated SoC, and prolonging battery life with an ultra-low power radio and minimal sleep currents, tomorrow’s healthcare wearables powered by the nRF54H20 will continue to get smaller and become more efficient and functional, and in so doing will be able to capture various health metrics that are not possible to capture today. The rest will be down to the imagination of the developers.</span><strong><span data-contrast="auto">&nbsp;</span></strong><span data-ccp-props='{"201341983":0,"335559739":160,"335559740":259}'>&nbsp;</span></p><hr><h3 id="isPasted">References</h3><p><em>1. The Potential of Current Noninvasive Wearable Technology for the Monitoring of Physiological Signals in the Management of Type 1 Diabetes: Literature Survey. National Institutes of Health, 2022. &nbsp;</em></p><p><em>2. A Survey on Wearable Sensors for Mental Health Monitoring. National Institutes of Health, 2023.</em></p><p><em>3. Wearable multi-sensor data fusion approach for human activity recognition using machine learning algorithms. B Vidya, Sasikumar P, 2022</em>&nbsp;</p>

Today’s high-end wearables can support an impressive array of sensors to record, for example, the wearer’s V02 max, blood oxygen saturation (Sp02), temperature, heart rate, and heart rate variability (HRV), as well as the sleep and activity data their early predecessors pioneered.

Sky's the limit for wearables thanks to next gen wireless SoCs

<p id="isPasted">Mike Simmons, Matthew Kleyn, Joseph Vlach, Liz Josephson; Intellivation LLC</p><p>The demand for high-performance devices with enhanced functionalities continues to grow. Materials, such as graphene and MoS2, exhibit unique electrical and mechanical properties making them ideal for flexible electronic applications. To meet the rising demand and requirements for flexible 2D microelectronics devices manufactured using Roll to Roll technology, we use innovative manufacturing techniques including vacuum coatings in combination with laser technology. Laser patterning of sputtered coatings provides the ability to achieve high-volume production with precision, functionality and efficiency for a wide range of flexible applications.</p><p>Sputter deposition is a widely used technique for depositing thin films onto substrates. For flexible 2D microelectronics, sputtered coatings serve as the foundation for building functional devices. Sputtering involves bombarding a target material with ions to eject atoms or molecules, which then deposit onto a substrate to form a thin film. This process allows for precise control over the thickness and composition of the deposited film, making it a preferred method for creating uniform and reproducible coatings. &nbsp;Sputtered layers were deposited using Intellivation’s R2R Lab system. Sputtering provides an excellent method for depositing coatings uniformly over large areas, while laser patterning can create discrete devices, circuits, and other types of discontinuous features required for manufacturing. &nbsp;Using these two techniques in combination provides unique capabilities, particular during product development. &nbsp; Photolithography requires multiple steps and is time consuming, it also requires geometric commitment of features at early stage of design. &nbsp;Laser patterning offers a direct and efficient way to create and define patterns on sputtered coatings including changes in geometry while providing consistent feature size and edge quality.</p><p>Laser patterning uses a laser beam to selectively remove or modify specific areas of deposited films enabling the generation of intricate patterns with submicron-level precision. &nbsp;Control and precision of the laser is critical and the non-contact nature of laser patterning reduces the risk of contamination and damage to the underlying substrate, ideal for delicate 2D materials. &nbsp;This technique provides the ability to develop and then validate a design and process in small volumes and then easily transfer to large area roll-to-roll production without changes to the laser processing equipment.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEyMTYwNzI0ODg3LVNjcmVlbnNob3QgMjAyNC0wNC0wMyAxNTQwMzkuanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib"></p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 768px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712209387228-Boston-2024-email.jpg" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Join us and Intellivation at TechBlick's Future of Electronics RESHAPED conference and exhibition in Boston | June 2024 https://www.techblick.com/electronicsreshapedusa</span></span></span></p><p>Deposition of the conductive material onto the substrate was done with Intellivation’s R2R thin film vacuum deposition Lab coater , it is then laser patterned or the laser is used to isolate regions to crystallize them for interfacing with subsequent layers. Once the substrate, layer stacks and laser variables are optimized, the next phase is to scale these devices to large area R2R processing.</p><p><br><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEyMTYxMDkyODYyLVNjcmVlbnNob3QgMjAyNC0wNC0wMyAxNTQzMzAuanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib"></p><p>The combination of laser patterning and sputtered coatings has unlocked new possibilities in the high-volume production of flexible 2D microelectronics. This innovative approach addresses the demand for devices with enhanced performance, precision, and scalability. A roll-to-roll approach offers several significant advantages in terms of efficiency, cost and adaptability.&nbsp;</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 768px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712209445705-660d896c5506c37659840c4f.jpg" style="width: 768px;" class="fr-fic fr-dib"><span class="fr-inner">Intellivation will be exhibiting at TechBlick's Future of Electronics RESHAPED conference and exhibition in Boston | June 2024 https://www.techblick.com/electronicsreshapedusa</span></span></span></p><p><br></p>

R2R Sputtering + Direct Laser Patterning is a great way to create large-area circuits on flexible circuits, even with materials such as graphene or MoS2.  The technology R2R produces high-quality uniform films on large substrates whilst the laser forms precision circuit patterns without photolith.

Flexible Microelectronic Devices produced with Sputtered Coatings and Laser Patterning

<p><span contenteditable="false" draggable="true" class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable"><iframe width="640" height="360" src="https://www.youtube.com/embed/4_lh_1JEHPQ?&amp;wmode=opaque&amp;rel=0&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-gtm-yt-inspected-9="true" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"></iframe></span><br></p><p id="isPasted">Researchers from the <a href="https://seas.harvard.edu/" target="_blank">Harvard John A. Paulson School of Engineering and Applied Sciences</a> (SEAS) have increased the fatigue threshold of particle-reinforced rubber, developing a new, multiscale approach that allows the material to bear high loads and resist crack growth over repeated use. This approach could not only increase the longevity of rubber products such as tires but also reduce the amount of pollution from rubber particles shed during use.&nbsp;</p><p>The research is published in <a href="https://www.nature.com/articles/s41586-023-06782-2" target="_blank">Nature</a>.</p><p>Naturally occurring rubber latex is soft and stretchy. For a range of applications, including tires, hoses, and dampeners, rubbers are reinforced by rigid particles, such as carbon black and silica. Since their introduction, these particles greatly improve the stiffness of rubbers but not their resistance to crack growth when the material is cyclically stretched, a measurement known as the fatigue threshold.&nbsp;</p><p>In fact, the fatigue threshold of particle-reinforced rubbers hasn’t improved much since it was first measured in the 1950s. This means that even with the improvements to tires that increase wear resistance and reduce fuel consumption, small cracks can shed large amounts of rubber particles into the environment, which cause air pollution for humans and accumulate into streams and rivers.</p><p><a href="https://seas.harvard.edu/news/2021/10/elastic-polymer-both-stiff-and-tough-resolves-long-standing-quandary" target="_blank">In previous research</a>, a team led by<a href="https://seas.harvard.edu/person/zhigang-suo" target="_blank">&nbsp;Zhigang Suo</a>, the Allen E. and Marilyn M. Puckett Professor of Mechanics and Materials at SEAS, markedly increased the fatigue threshold of rubbers by lengthening polymer chains and densifying entanglements. But how about particle-reinforced rubbers?</p><p>The team added silica particles to their highly entangled rubber, thinking the particles would increase stiffness but not affect fatigue threshold, as commonly reported in the literature. They were wrong.<br><br>“It was quite a surprise,” said Jason Steck, a former graduate student at SEAS and co-first author of the paper. “We did not expect adding particles would increase the fatigue threshold but we discovered that it increased by a factor of ten.”</p><p>Steck is now a Research Engineer at GE Aerospace.&nbsp;</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 302px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzAzMzUxNDY0MDI0LVBpY3R1cmUxLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 300px;" class="fr-fic fr-dib"><span class="fr-inner">An illustration of the multiscale material with highly entangled polymer chains (left), and clustered particles (right). (Credit: Suo Group/Harvard SEAS)</span></span></span></p><p id="isPasted">In the Harvard team’s material, the polymer chains are long and highly entangled, while the particles are clustered and covalently bonded to the polymer chains.&nbsp;</p><p>“As it turns out,” said Junsoo Kim, a former graduate student at SEAS and co-first author of the paper, “this material deconcentrates stress around a crack over two length scales: the scale of polymer chains, and the scale of particles. This combination stops the growth of a crack in the material.”</p><p>Kim is now an Assistant Professor of Mechanical Engineering at Northwestern University.</p><p>The team demonstrated their approach by cutting a crack in a piece of their material and then stretching it tens of thousands of times. In their experiments, the crack never grew.</p><p><strong>“</strong>Our approach of multiscale stress deconcentration expands the space of material properties, opening doors to curtailing polymer pollution and building high-performance soft machines,” said Suo, senior author of the study.<strong>&nbsp;</strong></p><p>“Traditional approaches to design new elastomeric materials missed these critical insights of using multiscale stress deconcentration to achieve high performance elastomeric materials for broad industrial uses,” said Yakov Kutsovsky, an Expert in Residence at the Harvard Office of Technology Development and co-author of the paper. “Design principles developed and demonstrated in this work could be applicable across a wide range of industries, including high-volume applications such as tires and industrial rubber goods, as well as emerging applications such as wearable devices.”</p><p>Kutsovsky previously served as Chief Scientific Officer and Chief Technology Officer at Cabot Corporation for 15 years.</p><p><span contenteditable="false" draggable="true" class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable"><iframe width="640" height="360" src="https://www.youtube.com/embed/PmYrT2HW-bI?&amp;wmode=opaque&amp;rel=0&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true" data-gtm-yt-inspected-9="true" id="265766220" title="Rubber that doesn’t grow cracks when stretched many times"></iframe></span><em>Two samples under cyclic loading. The cracks grow in the left sample while the cracks in the right sample, made from the multiscale material, remain intact after 350,000 cycles. (Credit: Suo Group/Harvard SEAS)</em></p><p id="isPasted"><a href="https://otd.harvard.edu/" target="_blank">Harvard’s Office of Technology Development</a> has protected the intellectual property associated with this project and is exploring commercialization opportunities.</p><p>The research was supported in part by the MRSEC grant DMR-2011754 and by the Air Force Office of Scientific Research under grant FA9550-20-1-0397.</p>

Multi-scale approach improves the fatigue threshold of particle-reinforced rubber

Rubber that doesn't grow cracks when stretched many times

<p id="isPasted">TechBlick is proud to announce the conference and exhibition, "The Future of Electronics: RESHAPED," set against the cultural backdrop of Berlin. This expansive event serves as a canvas for printed, flexible, sustainable, R2R, additive, hybrid, 3D, structural, soft, InMold, textiles, stretchable, and wearable electronics.<br><br><b data-stringify-type="bold">17-18 October 2023 at the Estrel Congress Center (ECC), Berlin.</b><br><br>The conference is housed within the modern architecture of Berlin's Estrel Hotel and Congress Centre (ECC).<br><br><a href="https://www.techblick.com/registration" target="_blank" rel="noopener noreferrer" class="button-main-action"><b data-stringify-type="bold">Register for your slot here.</b><br></a><br>Pushing boundaries in electronics, TechBlick brings to the table categories like structural, soft, and InMold electronics which are fast making a niche for themselves. The intent is clear: to cohesively RESHAPE the electronics ecosystem to make it more inclusive, diverse, sustainable, and cutting-edge.<br><br><b data-stringify-type="bold">Highlights of the Event:</b></p><ul data-stringify-type="unordered-list" data-indent="0" data-border="0"><li data-stringify-indent="0" data-stringify-border="0">78 Exhibitors, All Booths Sold Out! An exhibition increase of 50% since 2022 ensures attendees get a panoramic view of the current market landscape.</li><li data-stringify-indent="0" data-stringify-border="0">Unique Hybrid Package: Experience the Berlin event live, coupled with a year-long access to all virtual conferences and masterclasses from TechBlick. The future is hybrid, and so is our offering.</li><li data-stringify-indent="0" data-stringify-border="0">Masterclasses and Tours: Engage with industry leaders and take guided tours to witness the revolution in electronics.</li><li data-stringify-indent="0" data-stringify-border="0">Networking and Refreshments: All attendees can enjoy a grand buffet lunch and refreshments in the heart of the convention center, ensuring meaningful conversations happen over great food.</li></ul><h2><b data-stringify-type="bold">Who should be there?</b></h2><p>This is a must-attend event for innovators, tech enthusiasts, entrepreneurs, researchers, and anyone who believes in the potential of flexible and sustainable electronics.<br><br><b data-stringify-type="bold">Registration Details:</b><br><br>For those who have already secured their spot:</p><ul data-stringify-type="unordered-list" data-indent="0" data-border="0"><li data-stringify-indent="0" data-stringify-border="0">16 October: Registration desk opens from 7.30am</li><li data-stringify-indent="0" data-stringify-border="0">17 October: From 7.00am</li><li data-stringify-indent="0" data-stringify-border="0">18 October: From 8.00am</li></ul><p>Join the global community, witness transformative innovations, and be a part of the conversation that drives the next wave in electronics. The future is being reshaped in Berlin, and you're invited.<br><br><a href="https://www.techblick.com/registration" target="_blank" rel="noopener noreferrer" class="button-main-action">Register for this once-in-a-lifetime event on 17-18 October 2023.<br></a><br><a href="https://www.techblick.com/electronicsreshaped22" target="_blank" rel="noopener noreferrer">Click here to learn more about the all-access package.<br></a><br>The next big leap in electronics awaits. Join us in Berlin!</p>

Globally recognized event, on 17-18 October 2023, seeks to explore the forefront of electronic innovations, drawing a bridge between the traditional and the groundbreaking, and taking you on a journey through the very fabric of next-gen electronics.

The Future of Electronics: A New Dimension in Berlin

<p data-pm-slice="1 1 []" id="isPasted">Andrew Stemmerman &amp; John Yundt SunRay Scientific Inc. Eatontown, NJ USA <a rel="noopener noreferrer" href="mailto:andrew@sunrayscientific.com" target="_blank">andrew@sunrayscientific.com</a> <a rel="noopener noreferrer" href="mailto:johny@sunrayscientific.com" target="_blank">johny@sunrayscientific.com</a></p><p>SunRay Scientific of Eatontown, NJ, USA has developed a new and innovative approach to electronic component assembly.&nbsp;</p><p>This article will outline the developments of this technology and show examples of this magnetically aligned Anisotropic Conductive Epoxy packaging method used on various substrates. Progress will be shared for dense and fine pitch Land Grid Arrays (LGA) on a semi-rigid interposer.</p><h3>Introduction</h3><p>Flip-chip die and die-to-die bonding, from dense to fine pitch, typically require solder balls and underfills. Underfill and/or edge encapsulant is often utilized to provide additional mechanical strength and stress reduction. The result is a complex assembly process flow. Localized placement of Anisotropic Conductive Adhesive (ACA) or Anisotropic Conductive Film (ACF) for specific components typically involves the fine-pitchuse of thermocompression bonding, an additional process step that could also be damaging to thin silicon. Another drawback for traditional interconnect materials is relatively slow processes, limiting the utility of such technologies. Development towards a wafer scale compatible packaging method will be shared, using a pressure-less and low-temperature magnetically aligned Anisotropic Conductive Epoxy (ACE).</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNDM5ODc4LUZpZyAxLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 525px;" class="fr-fic fr-dib"></p><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted"><em>Figure 1. Flip Chip assembly comparisons: traditional solder balls &amp; underfill attachment (Left); Die attach with z-axis magnetically aligned conductive epoxy (Right)</em></figcaption><p data-pm-slice="1 1 []" id="isPasted">A summary of the novel approach is shown above in Figure 1. First, ferro-magnetic particles dispersed within an epoxy are coated onto a substrate. The ferro-magnetic particles form z-axis magnetically aligned columns, fixed in place during the die-to-substrate cure process without any pressure applied. The formation of the columns during the curing process is illustrated in Figure 2. This technology simplifies the assembly process to a single adhesive application, which provides both electrical interconnection and mechanical reinforcement. No additional underfill material is needed. Fine patterning is not required as the entire area of the component target location is deposited with epoxy. The device alignment process is more.</p><p>forgiving relative to solder ball-to-solder pad alignment. Z-axis columns align after component placement, magnetic pallet exposure and cure is achieved.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNDc0MDUyLUZpZyAyLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 378px;" class="fr-fic fr-dib"></p><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted">Figure 2. X-Ray photos of Z-axis magnetically aligned particles ferromagnetic in an Anisotropic Conductive Epoxy (ACE)</figcaption><p data-pm-slice="1 1 []"><span class="fr-img-caption fr-fic fr-dib" style="width: 741px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1699453964933-B-and-B-2024%28e-mail%29.jpg" style="width: 739px;" class="fr-fic fr-dib"><span class="fr-inner">Join us in Berlin and/or Boston and lets us RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D - techblick.com</span></span></span></p><p data-pm-slice="1 1 []" id="isPasted">Thermal or UV curing methods complete the component attachment without any thermocompression (cure method is epoxy formulation dependent). Thermal curing occurs within the 80°C to 160°C temperature range.</p><p>This article outlines the developments of this technology and shows examples of this magnetically aligned Anisotropic Conductive Epoxy packaging method used on various substrates. Progress will be shared for dense and fine-pitch Land Grid Arrays (LGA) on a semi-rigid interposer. Additionally, advancements made for die-to-die bonding will be presented as well as updates towards achieving ≤ 60-micron pitch. Other proposed direct die-attach packaging concepts will be illustrated.</p><p>Example #2 covers development work performed on attaching a 126-pin Land Grid Array (LGA) bare die to a polymer semi-rigid multi-layer substrate. The use of the substrate resulted in multiple challenges for bare die attach. The non-planarity of the conductive circuit pads was one issue. The electrical resistance variation between pads had to be minimized for optimum performance. The non-uniformity of the substrate’s conductor pads is evident in the photo on the left. The schematic on the right illustrates how the ACE material allows for “leveling” in connecting the bare die to the non-planar substrate.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNTE3Njg5LUZpZyAzLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 584px;" class="fr-fic fr-dib"></p><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted">Figure 3. 126-pad semi-rigid substrate (Left) and illustration of bond between die and substrate</figcaption><p data-pm-slice="1 1 []" id="isPasted">Additional learning during this work was in identifying trapped moisture within the polymer-based substrate as a cause for voids in the ACE during cure. These bubbles not only prevented connection in some cases but interfered with proper z-axis column formation. Prebake for the substrate was added as a step for this particular type of assembly.</p><p>Two formulations were the focus of the work in Example #3. These were the Fine particles ACE and the Ultra Fine particles version. Stencil thicknesses of 0.001” to 0.005” were studied, as this tool has the most impact on establishing bond line thickness. The target for choosing the best formulation, tool and bond line thickness was lowest average resistance values with lowest deviation among the 126 pads. Iterative testing was done. “Heat maps” based on the 126 pad locations were created to visually observe resistance values within set target and acceptance ranges. The next two Figures show results from early work on process development with each epoxy formulation and stencil tools, to the progress made with the final choices on material and stencil thickness. Ultimately the Ultra Fine particles ACE with a 0.001” thick stencil was chosen for this LGA-to-substrate assembly application. Summary Table 1 shows the results of the chosen ACE and stencil, and Figure 6 is a cross-section from the development study.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNTQwNDg0LUZpZyA0LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 598px;" class="fr-fic fr-dib"></p><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted">Figure 4. Pad-by-pad resistance measurement studies, early iteration (Left: Ultrafine, Right: Fine)</figcaption><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNTcyMzk5LUZpZyA1LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 601px;" class="fr-fic fr-dib"></p><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted"><strong><em>Figure 5.&nbsp;</em></strong><em>Pad-by-pad resistance measurement studies, final iteration (Left: Ultrafine, Right: Fine)</em></figcaption><p data-pm-slice="1 1 []" id="isPasted"><strong>Table 1.&nbsp;</strong>Summary of performance metrics (continuity, resistance &amp; deviation, pad-to-pad)</p><p data-pm-slice="1 1 []"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNjAwNzk0LVRhYmxlIDEucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 564px;" class="fr-fic fr-dib"></p><p data-pm-slice="1 1 []"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNjIyODMyLUZpZyA2LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 559px;" class="fr-fic fr-dib"></p><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted">Figure 6. Cross-section of component attached and electrically connected with the Z-axis ACE (Photo courtesy of Rochester Institute of Technology)</figcaption><p data-pm-slice="1 1 []" id="isPasted">Example #2 takes the LGA and Substrate subassembly to the next level, a large area 8” x 10” circuit board populated with four of the subassemblies plus components of various sizes and function. This larger assembly involves attaching all the multiple components and subassemblies in one ACE attachment process. Passives range in size from as small as 0201 up to 2220. Other devices are a 26-pin SMT connector and SoICs. This project is underway, and results will be shown by SunRay at TechBlick live in October.</p><p>Fine-pitch die-to-die bonding with the ACE is the third example. The development methodology is like the other projects. An initial focus was on measuring continuity and resistance at pad sites as part of identifying the optimum process parameters and stencil tool for this application. The degree of difficulty is greater with finer pitch. Dense arrays of 60 microns pitch die, with 30 microns pads and 30 microns spacing, were used.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 763px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1699454054997-B-and-B-2024%28blog%29.jpg" style="width: 761px;" class="fr-fic fr-dib"><span class="fr-inner"><span contenteditable="true" id="isPasted">Join us in Berlin and/or Boston and lets us RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D - techblick.com</span></span></span></span></p><p data-pm-slice="1 1 []" id="isPasted">A Design of Experiments (DoE) was established for the stencil studies. Laser profilometry was used for 3D and 2D scans of the two surfaces to be bonded, as was employed for observing the non-planarity of the semi-rigid board in Example #1. All initial steps were done manually: hand stencil printing, die placement with die bonder, batch oven cure and electrical probing.</p><p>Prior to using fully functional devices, Quartz substrates patterned with the top layer of each die in the bond pair, were procured and used in early studies. The purpose was to provide enhanced analysis of the bonded die pair before, during, and after bonding/curing has occurred. Bond parameters were observed at each step of the process: pre-bond, bond, and post alignment &amp; cure.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNjk2MDIyLUZpZyA3LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 624px;" class="fr-fic fr-dib"></p><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted">Figure 7. Left: Target overlay of quartz substrates; Middle: ACE deposit before bond; Right: Post-bond, before z-axis alignment and cure</figcaption><p data-pm-slice="1 1 []" id="isPasted">Due to the finer pitch requirements, the test vehicles have a nickel layer applied during wafer fabrication, at the bond pad locations. Past experimentation, as pictured in Figure 8, has shown nickel application may lower the resistance of the bonded circuit by directing column formation to the metallized bond pad boundary, the nickel pads, acting as localized magnets, attract column formation during exposure to the magnetic pallet. This only applies to the bond pads themselves, to concentrate the ferromagneticmetalized particles within the ACE more towards the connection points. This creates a higher density of columns within each pad.</p><p data-pm-slice="1 1 []"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNzcyMzM0LUZpZyA4LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 488px;" class="fr-fic fr-dib"></p><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted">Figure 8. Left: No nickel interlayer and ACE; Right: ACE after cure with Nickel interlayer layer in pads</figcaption><h3 data-pm-slice="1 1 []" id="isPasted">Conclusion</h3><p>Besides the addition of the nickel layer to the functional die, key parameter targets were updated for the project’s next phase. In the short-term alignment, fiducials on the quartz plates were updated to improve bonding in X, Y, and theta; and the size of test probe pads were increased to improve accuracy and reduce testing time.</p><p>The development efforts for all three examples are still underway. The conclusions thus far are:</p><ul><li><p>Successful demonstrations of Heterogenous Packaging using z-axis magnetically aligned epoxy for structural &amp; electrical bonding.</p></li><li><p>Similar established process techniques and test methodologies are usable across applications, although each has unique requirements.</p></li><li><p>The Ultra Fine particles ACE formulation has the best performance for finer pitches and more challenging alignments.</p></li><li><p>Uniform bond lines between device pads are critical for optimum electrical performance.</p></li><li><p>Excellent performance results were obtained, even with manual assembly techniques. Performance will improve with automation.</p></li></ul><p>In concept this z-axis magnetically aligned conductive epoxy approach could integrate multiple silicon wafers on top of each other, creating the possibility for an exceptionally dense integrated System-In-a-Package (SIP). Processing temperatures can be as low as 80°C, opening room for alternate substrates and biocompatible assemblies. This anisotropic epoxy is not limited to specific device attachment; it can be used to bond multiple component sizes and styles across an entire substrate.</p><hr><p><span contenteditable="true" id="isPasted">Join us in Berlin and/or Boston and lets us RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D - techblick.com</span></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1699454093608-B-and-B-2024%28small-LinkedIn+for-email%29.jpg" style="width: 709px;" class="fr-fic fr-dib"></p>

Fine-Pitch Direct Die Attach Without Thermal Compression, Alignment or Underfill

Fine-pitch dense die assembly process with only a single adhesive application without pressure, without underfill, without fine patterning, without complex alignment vs solder ball-to-solder pad, etc? Learn here how magnetically aligned Anisotropic Conductive Epoxy (ACE) enable this

<div data-draftjs-conductor-fragment='{"blocks":[{"key":"74cni","text":"Authors Wim Christiaens | Quand Industries |  Wim.Christiaens@quad-ind.com ","type":"unstyled","depth":0,"inlineStyleRanges":[],"entityRanges":[],"data":{}}],"entityMap":{},"VERSION":"9.14.3"}' id="isPasted">Authors Wim Christiaens | Quand Industries | &nbsp;Wim.Christiaens@quad-ind.com&nbsp;</div><p id="isPasted">Textiles are tactile, sensorial and visual. Qualities can be modified or even expanded when technology is added, transforming passive textiles into active and interactive devices, monitoring and detecting bodily functions due to their constant contact with our skin.&nbsp;</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk1MTM1MDU4ODI3LTMwNzQ1LmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 532px;" class="fr-fic fr-dib"></p><h3>Printed electronics technology: the superior choice for smart textiles</h3><p>Printed electronics technology opens up possibilities that the older wired technologies simply cannot match.&nbsp;</p><ul><li>Thanks to their flexibility, stretchability and lightweight, printed electronics allow for smart garments that function as a second skin with a great level of comfort for its wearer.&nbsp;</li><li>Printed electronics are also more durable than traditional electronics and can withstand multiple washing cycles, crinkling, friction and sweating.&nbsp;</li><li>The lower production costs and easy scalability of printed electronics also stimulate the development of new (IoT) applications and a larger adoption of e-garments and smart fabrics in general, which can promote a healthier lifestyle and reduce the risk of disease, accidents and injuries in many industries.&nbsp;</li><li>Their integration is straightforward. After printing the sensors on TPU they can be transferred onto the textile material via hot press lamination. Both are well-established techniques. &nbsp; &nbsp;&nbsp;</li></ul><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk1MTM1MjQ3NDc4LWltYWdlMDAxLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 553px;" class="fr-fic fr-dib"></p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 758px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1699455670417-B-and-B-2024%28blog%29.jpg" style="width: 756px;" class="fr-fic fr-dib"><span class="fr-inner"><span contenteditable="true" id="isPasted">Join us in Berlin and/or Boston and lets us RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D - techblick.com</span></span></span></span></p><ul><li>Compared to traditional electronics manufacturing, printed electronics are easily scalable and low cost.&nbsp;</li><li>They are durable, precise, efficient and comfortable to wear.&nbsp;</li><li>They have excellent interconnectability. The PCB’s can be positioned in a remote spot, are small and don’t need much power to work. &nbsp; &nbsp; &nbsp;</li></ul><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk1MTk3OTk3Mjk4LVNjcmVlbnNob3QgMjAyMy0wOS0yMCAwOTE4MTcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 686px;" class="fr-fic fr-dib"></p><p><a href="https://www.techblick.com/post/smart-textiles-monitoring-sensing-and-heating-technology-integrated-in-fabrics#viewer-71qek" target="_blank" rel="noopener noreferrer">Click here to watch the video</a> demonstration</p><p><br></p><hr><h3>Applications that change our lifestyle</h3><p><strong>A</strong><strong id="isPasted">thletic monitoring: Train smarter, not harder</strong></p><p>A wide range of smart sportswear (e.g. shirts, insoles, sports bras) track vital signs (via printed ECG or EMG sensors), core temperature, and biomechanics both during training and in the recovery phase. It helps athletes to enhance performance, ensure a healthy athletic growth, help reduce stress and prevent different types of injuries. &nbsp; &nbsp;</p><p><strong>Alleviating the healthcare and medical sector</strong></p><p>Smart textiles serve as a functional and comfortable ‘wearable computer’ that help health care professionals by monitoring and communicating a patient's condition by detecting, storing, analysing, and transmitting physiological signals.</p><p><strong>Automotive and aerospace</strong></p><p>In the aerospace industry and in vehicle engineering, current applications focus on smart sensors integrated in interior fabrics and biometric monitoring for safety purposes. Information can provide insight into the driver's physical condition and level of fatigue, triggering haptic feedback through the steering wheel or warning alerts in the car's cockpit.&nbsp;</p><p><strong>Active workwear</strong></p><p>The monitoring of vital signs of workers in demanding environments and high-risk industries has been made easier. In regulated industries where safety rules restrict workers from wearing devices, smart workwear can give insightful information about the condition of workers or machine operators that can be used to optimize their well-being, performance and productivity. Thermal workwear to dynamically regulate body temperature of workers in cold climates is another huge application domain.</p><p><strong>Textile-integrated flexible heaters&nbsp;</strong></p><p>There is a steep rise of interest is heating technology for garments. Stretchable printed electronics heaters make it easy to incorporate heat into comfortable, elegant, flexible, lightweight clothing. The high precision that can be achieved with screen-printed circuitry also makes it simpler to provide warmth exactly where required and avoid areas of the body which don’t need any additional heat.</p><div data-draftjs-conductor-fragment="{&quot;blocks&quot;:[{&quot;key&quot;:&quot;17kt9&quot;,&quot;text&quot;:&quot;Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. For special discounts on attendee passes please contact  Wim.Christiaens@quad-ind.com &quot;,&quot;type&quot;:&quot;unstyled&quot;,&quot;depth&quot;:0,&quot;inlineStyleRanges&quot;:[{&quot;offset&quot;:0,&quot;length&quot;:107,&quot;style&quot;:&quot;{\&quot;FG\&quot;:\&quot;#424242\&quot;}&quot;},{&quot;offset&quot;:0,&quot;length&quot;:53,&quot;style&quot;:&quot;UNDERLINE&quot;},{&quot;offset&quot;:107,&quot;length&quot;:37,&quot;style&quot;:&quot;UNDERLINE&quot;},{&quot;offset&quot;:146,&quot;length&quot;:86,&quot;style&quot;:&quot;BOLD&quot;},{&quot;offset&quot;:146,&quot;length&quot;:86,&quot;style&quot;:&quot;{\&quot;FG\&quot;:\&quot;#dc3134\&quot;}&quot;}],&quot;entityRanges&quot;:[{&quot;offset&quot;:0,&quot;length&quot;:53,&quot;key&quot;:0},{&quot;offset&quot;:107,&quot;length&quot;:37,&quot;key&quot;:1}],&quot;data&quot;:{}}],&quot;entityMap&quot;:{&quot;0&quot;:{&quot;type&quot;:&quot;LINK&quot;,&quot;mutability&quot;:&quot;MUTABLE&quot;,&quot;data&quot;:{&quot;url&quot;:&quot;https://www.techblick.com/electronicsreshaped&quot;,&quot;target&quot;:&quot;_blank&quot;,&quot;rel&quot;:&quot;&quot;}},&quot;1&quot;:{&quot;type&quot;:&quot;LINK&quot;,&quot;mutability&quot;:&quot;MUTABLE&quot;,&quot;data&quot;:{&quot;url&quot;:&quot;https://www.techblick.com/electronicsreshaped&quot;,&quot;target&quot;:&quot;_blank&quot;,&quot;rel&quot;:&quot;&quot;}}},&quot;VERSION&quot;:&quot;9.14.3&quot;}" id="isPasted"><a data-hook="linkViewer" href="https://www.techblick.com/electronicsreshaped" target="_blank" rel="noopener noreferrer"><span data-offset-key="1le64-0-0"><span data-text="true"><span contenteditable="true" id="isPasted">Join us in Berlin and/or Boston and lets us RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D - techblick.com</span></span></span></a></div><p><span data-offset-key="1le64-0-0"><span data-text="true"><span contenteditable="true" id="isPasted"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1699455718770-B-and-B-2024%28small-LinkedIn+for-email%29.jpg" style="width: 766px;" class="fr-fic fr-dib"></span></span></span><br></p>

Textiles are tactile, sensorial and visual. Qualities can be modified or even expanded when technology is added, transforming passive textiles into active and interactive devices, monitoring and detecting bodily functions due to their constant contact with our skin. 

Smart Textiles: monitoring, sensing and heating technology integrated in fabrics

<p id="isPasted">Authors: Steliyan Vasilev<sup>1</sup>, Melanie Hoerr<sup>1</sup>, Michaela Kasdorf<sup>1</sup>, Sven Boehmer<sup>2</sup></p><p><em><sup>1</sup></em><em>3E Smart Solutions, Krefeld, Germany</em></p><p><em><sup>2</sup></em><em>ZSK Stickmaschinen GmbH, Krefeld, Germany</em></p><p><em>This article originally appeared </em><a href="https://www.techblick.com/post/optimizing-embroidered-conductive-traces-for-e-textiles" target="_blank" rel="noopener noreferrer"><em>here.</em></a></p><h3>1. Introduction</h3><p>Embroidery was historically a means of adorning fabrics with intricate patterns, a testament to human skill. However, in the modern era, this ancient art form has significantly evolved. In recent years, embroidery has undergone a profound transformation, emerging as a pioneering technology at the intersection of artistry and functionality. This article delves into the possibilities which embroidery offers for the production of Smart and E-Textiles, exploring technical intricacies, advantages, and challenges related to embroidered conductive traces.</p><p>&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4Mjk4MjI0LVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzU1MjIucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 649px;" class="fr-fic fr-dib"></p><p>Join us at TechBlick&#39;s Future of Electronics RESHAPED conference &amp; tradeshow in Berlin on 17-18 OCT 2023 - <a target="_blank" rel="noopener noreferrer" data-fr-linked="true" href="//www.techblick.com/electronicsreshaped" id="isPasted">www.techblick.com/electronicsreshaped</a></p><h3>2. Solutions for the E-Textiles Production Made Possible by Embroidery</h3><p>E-Textiles represent a fascinating synergy between traditional textiles and modern technology, serving diverse sectors like automotive, aerospace, sports and fitness, medical, home textiles, and wearable technology. Thanks to the exceptional precision and high degree of automation of embroidery technology, it is ideal for integrating functional elements into textiles, such as sensors, actuators, antennas, or electrodes.&nbsp;By use of conductive threads and specialized attachments for automated integration of electronic components, embroidery techniques, originally developed for aesthetic purposes, now enable reliable and scalable E-Textiles production. Embroidery makes possible the following innovative solutions, among all:</p><ul><li>Integrating and Interfacing Electrical Components and PCBs</li></ul><h4><em>Semi-Automated Integration</em></h4><p>In decorative embroidery, the Appliqu&eacute; technique is utilized to attach pre-made textile patches to the carrier fabric. This same method can be used for semi-automatic placement of printed circuit boards (PCBs). After the manual placement and adjustment of the PCB, the embroidery machine takes over, automatically fixing it to the fabric and establishing the electrical connections at the interface pads.&nbsp;</p><h4><em>Automated Integration</em></h4><p>Embroidery machines equipped with automated Sequin Placement Devices can be configured to incorporate functional sequins into textiles (Fig. 1a). Functional sequins can be equipped with SMD soldered components, such as LEDs or RFID chips. For larger circuit boards, whether rigid or flexible, embroidery machines fitted with automated PCB Placement Devices can precisely position and secure the PCBs to the textile (Fig. 1b), followed by embroidery of the electrical connections. Automated integration is especially valuable for achieving reliability and reproducibility in the production of E-Textiles on a large scale.</p><ul><li>&nbsp;Embroidery of Complete Electrical Circuits</li></ul><p>By embroidering conductive traces onto fabric, placed PCBs and peripheral components can be electrically connected to each other, as well as to power sources or external circuitry. This approach allows for the automated integration of complete electrical circuits into textiles during a single production step.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4MzM4OTEwLVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzA4NDAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 689px;" class="fr-fic fr-dib"></p><p><em id="isPasted">Figure&nbsp;</em><em>1</em><em>&nbsp;Automated integration of functional LED sequins (a) and PCBs (b) by using automated Sequin Placement Device and PCB Placement Device from ZSK Stickmaschinen GmbH</em></p><ul id="isPasted"><li>&nbsp;Integration of Conductive Fibers and Wires</li></ul><p>Tailored Wire Placement (TWP) and Tailored Fiber Placement (TFP) techniques allow precise conductor placement for applications such as illumination, textile-based heating, RFID antennas, and more.</p><ul><li>&nbsp;Embroidery of Conductive Areas</li></ul><p>With conductive threads, conductive areas in various shapes and sizes can be embroidered. These areas can serve a multitude of functions, including wide conductive traces, sensors, electrodes, and antennas, expanding applications from automotive control elements to advanced medical devices.</p><h3>3. Advantages of Embroidered Conductive Traces</h3><p>Embroidery of conductive traces has opened up new horizons for Smart and E-Textiles, driven by several distinct advantages:</p><ul><li>&nbsp;Versatility in Design and High Precision</li></ul><p>Embroidery offers unparalleled versatility in design. Complex patterns and intricate geometries become feasible, catering to diverse application needs. The precision achieved in embroidery ensures that these designs are replicated accurately and consistently.</p><ul><li>&nbsp; Flexibility and Breathability</li></ul><p>One of the standout features of embroidered conductive traces is their inherent flexibility. They easily integrate with the carrier fabric, preserving its natural drape. Unlike printed circuits, embroidered traces allow textiles to breathe, enhancing wearability in clothing and comfort in various applications.</p><ul><li>&nbsp;Durability and Washability</li></ul><p>Embroidered conductive traces exhibit impressive durability. They withstand the rigors of daily use and multiple washing cycles, remaining fully functional over extended periods. This longevity contributes to the reliability and sustainability of embroidered E-Textiles products.</p><ul><li>&nbsp;Enabling Direct Connection to Electrical Components and PCBs</li></ul><p>Embroidery facilitates the direct integration of conductive traces with electrical components and printed circuit boards (PCBs). This approach eliminates the need for additional connectors or complex wiring, enhancing the product&rsquo;s reliability and comfort and reducing production costs.</p><h3>4. Challenges and State-of-the-Art Solutions for Embroidered Conductive Traces</h3><p>While there are clear advantages to using embroidered conductive traces, there are also associated challenges. In the following sections, we will outline the primary challenges and present state-of-the-art solutions to address them.</p><p>&nbsp; &nbsp; &nbsp; &nbsp; a) &nbsp; Compensation for High Yarn Resistivity</p><p>One of the main challenges in utilizing conductive embroidery threads is their intrinsic high resistivity of up to a few hundred Ohms per meter. To address this challenge, several state-of-the-art solutions have emerged:</p><ul><li>&nbsp;<em>Multiple Passes and Use of Conductive Bobbin Thread&nbsp;</em></li></ul><p>A method to compensate for the high resistivity of the conductive thread is to embroider multiple passes using the so-called running stitch. Each pass adds to the overall conductivity, effectively acting like parallel resistors (Fig. 2a). Additionally, incorporating a conductive bobbin thread enhances conductivity by further reinforcing the electrical path (Fig. 2b). As an additional benefit, multiple embroidered passes compensate for the inhomogeneity in resistance throughout yarn length due to local damages in a single yarn pass during use, increasing the reliability of the E-Textiles product.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4NDA1MDAxLVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzEwMTYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 723px;" class="fr-fic fr-dib"></p><p><strong id="isPasted"><em>Figure 2</em></strong><em>&nbsp;Equivalent circuit of embroidered conductive trace with one, two, and three passes (a), and conductive embroidery (yellow) and bobbin (green) thread (b)</em></p><ul id="isPasted"><li><em>&nbsp;Conductive Traces Embroidered as Filled Areas</em></li></ul><p>An alternative approach for reducing resistivity is to embroider conductive traces as filled areas, using the fill stitch rather than the running stitch. The high density of stitches in the filled areas enhances the overall trace conductivity. To ensure sufficient electrical contact between the stitches along the stitch direction, an underlayer must be added beneath the fill stitch, angled to the primary stitch direction (Fig. 3) [1].</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4NDU1NTMxLVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzEwNTIucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 732px;" class="fr-fic fr-dib"></p><p><strong id="isPasted"><em>Figure 3</em></strong><em>&nbsp;Embroidered area with fill stitch without (a) and with a grid underlayer (b)</em></p><p>&nbsp; &nbsp; &nbsp; &nbsp; &nbsp;b) Avoiding Conductive Thread Damage during Embroidery</p><p>During embroidery, stitching directly into the conductive yarn can damage it, compromising electrical properties. Therefore, special attention must be given to the digitizing of the embroidery design to avoid placing stitches over previously embroidered threads as well as repetitive stitching in the same spot.</p><p>To mitigate this while embroidering multiple running stitch passes, a swing factor can be introduced in the digitizing program, altering the stitching path slightly with each pass. This minimizes localized stress on the yarn, preserving its integrity and conductivity. Fig. 4 illustrates a conductive trace with four passes and an added swing factor, shown as a visualization in the embroidery machine&rsquo;s programming software (a) along with a photograph of the embroidered trace (b).</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4NDk4MjQ1LVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzExMjAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 731px;" class="fr-fic fr-dib"></p><p><strong id="isPasted"><em>Figure 4&nbsp;</em></strong><em>Conductive trace with four passes for increased conductivity and added swing factor, shown in the digitizing software (a) and after embroidery (b).</em></p><p><em>When adding a swing factor, corners pose a specific challenge, leading to repeated puncturing at the same location (Fig. 5a). Rounding corners in the embroidery design is essential, as it significantly reduces the risk of stitching into the yarn, maintaining its electrical properties (Fig. 5b) [1].</em></p><p><em><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4NjIyNTQ5LVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzEyMTQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 704px;" class="fr-fic fr-dib"></em><strong id="isPasted"><em>Figure 5</em></strong><strong><em>&nbsp;</em></strong><em>Running stitch with three passes and an added swing factor, with multiple punctures in sharp edges (a) and without multiple punctures in rounded corners (b)</em></p><p>&nbsp; &nbsp; &nbsp; &nbsp; c) Enabling Crossing and Insulation of Conductive Traces</p><p>Complex E-Textiles designs often require multiple closely adjacent or intersecting conductive traces. Without proper insulation, unwanted electrical connections can occur&nbsp;when these traces come into contact. Adding non-conductive bridges between traces prevents unintended short circuits and maintains the desired electrical paths. Insulating bridges can be created by embroidering multiple layers of satin stitch with non-conductive thread, as depicted in Fig. 6a. It is crucial to ensure that the stitch directions of the bridge layers are angled in relation to the intersecting conductive traces.</p><p>Covering conductive traces with non-conductive thread can also be used for insulation towards the surrounding environment. Fig. 6b illustrates an example of covered conductive traces connected to moss-embroidered electrodes for body signal acquisition. The covering prevents direct contact with the skin outside the electrode areas. For applications requiring waterproofing of the conductive traces, seam sealer in the form of tape or liquid, or dispensed polymer coatings can be utilized.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4NjcxMzQwLVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzEyNDAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 702px;" class="fr-fic fr-dib"></p><p><strong id="isPasted"><em>Figure 6</em></strong><em>&nbsp;Covering conductive traces with non-conductive thread to create insulating bridges between intersecting traces (a) and as a method of insulation towards the surrounding environment (b).</em></p><h3>&nbsp;5. Conclusion</h3><p>The integration of conductive traces into textiles through embroidery offers a promising avenue for the development of Smart and E-Textiles. While the advantages of embroidered conductive traces make them a compelling choice for a wide range of applications, there are technical hurdles. Fortunately, various state-of-the-art solutions have been developed to address these challenges, ensuring that embroidered conductive traces can meet the demands of diverse applications.</p><p>&nbsp;As technology advances and the demand for Smart Textiles grows, continued research and innovation in the field of technical embroidery will be essential. With ongoing efforts to refine techniques and materials, we can expect to see even more sophisticated and reliable embroidered E-Textiles, opening up new possibilities in wearable technology, healthcare, fashion, and beyond.</p><p>&nbsp;<strong>References</strong></p><p>[1] McCann, J., &amp; Bryson, D. (2023). Smart Clothes and Wearable Technology, Second Edition. Elsevier.</p><p><br></p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4NzExOTEwLVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzU0NDgucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 671px;" class="fr-fic fr-dib"></p><p>Join us at TechBlick&#39;s Future of Electronics RESHAPED conference &amp; tradeshow in Berlin on 17-18 OCT 2023 - <a target="_blank" rel="noopener noreferrer" data-fr-linked="true" href="//www.techblick.com/electronicsreshaped" id="isPasted">www.techblick.com/electronicsreshaped</a></p>

Embroidery was historically a means of adorning fabrics with intricate patterns,a testament to human skill.In the modern era, this ancient art form has significantly evolved, becoming a pioneering tech at the intersection of artistry & functionality. Learn here about Embroidered Electronics Textiles

Optimizing Embroidered Conductive Traces for E-Textiles

Cavitation dispersion process improves the properties of materials used in additive manufacturing of circuits. You will learn how one can control hydrodynamic cavitation to produce unique dispersions, formulated inks & pastes, high aspect ratio nanoparticle & ‘2D’ filler particle masterbatches. 



Cavitation dispersion process: how it works and how it improves properties of printed materials

<p id="isPasted">As part of the TechBlick (wwww.TechBlick.com) series we invited Hyun Lee, Ph.D, &nbsp;Lead Scientist at Celanese Micromax&trade; Electronic Inks and Pastes to tell us a special development in the world of additive electronics: high temperature pastes. This article was originally published on TechBlick<a href="https://www.techblick.com/post/innovative-high-temperature-inks-for-printed-electronics" target="_blank" rel="noopener noreferrer"> here. </a></p><p>To learn more all aspects of printed and additive electronics, join us in Berlin <a target="_blank" rel="noopener noreferrer noopener noreferrer noopener noreferrer noopener noreferrer noopener noreferrer" data-fr-linked="true" href="https://www.techblick.com/electronicsreshaped" id="isPasted">https://www.techblick.com/electronicsreshaped</a></p><p>The global printed electronics market is huge and estimated to reach USD 23 billion in revenue by 2026, growing at a CAGR of 18.3% from 2023 to 2028 [1]. Increased demand for printed electronic products in automotive and the growth of consumer electronics are two key fueling factors to drive the market growth. The two critical segments require various reliable printed electronic products for applications from low temperature to high temperature.&nbsp;</p><p><br></p><p><span contenteditable="false" class="fr-img-caption  fr-fic fr-dii fr-draggable" style="width: 758px;" draggable="false"><span class="fr-img-wrap"><a href="https://www.techblick.com/exhibitors-2023-berlin" target="_blank" rel="noopener noreferrer"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTYwMDY1LTE2OTE1OTM1NjAwNjQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_5254521966ad48ac916c7baf7ccea480~mv2.png/v1/fill/w_1081,h_265,al_c,lg_1,q_85/090711_5254521966ad48ac916c7baf7ccea480~mv2.png" class="fr-fic fr-dii" style="width: 758px;"><span class="fr-inner" contenteditable="true">Join us and the global additive electronics community in Berlin on 17-18 OCT 2023. Lets RESHAPE the Future of Electronics, making it Additive, Sustainable, Flexible, Hybrid, Wearable, and 3D. &nbsp;</span></a></span></span></p><p><br></p><p>The key enabler for reliable device fabrication in printed electronics is functional inks with tunable electrical properties such as conductivity, dielectric strength, and electrical resistance. &nbsp;Celanese Micromax&trade; Electronic Inks and Pastes is a global supplier of thick film pastes/inks and recently launched HT (High Temperature) ink series - HT602/603 resistors, HT702 dielectric and HT802 conductive inks for high-temperature and high-power applications. HT series inks can be printed additively by using screen printing or nozzle dispensing process on various flexible/rigid substrates including Kapton&reg; FPC, Kapton&reg; RS, FR-4, Aluminum, Alumina, and glass. &nbsp;The operation temperature of conventional PTF (Polymer Thick Film) ink is typically limited up to 200&deg;C due to the thermal degradation issue of polymeric</p><p>&nbsp;resin in ink formulations.&nbsp;</p><p>In the printed electronic industry, high-temperature and high-power applications often require operation temperatures above 200&deg;C. HT series inks were developed by using novel polyimide resin whose thermal resistant temperature is up to 300&deg;C. &nbsp;Polyimide resin is flexible thermoplastic allowing much more flexibility compared to rigid thermoset Epoxy resins that have been used for the majority of high-temperature applications. Another key benefit of our polyimide resin is its chemical resistance. The unique combination of high-temperature resistance, flexibility and chemical resistance of HT series inks is expected to provide solutions for new high-temperature applications in the printed electronics industry which couldn&rsquo;t be achievable by conventional PTF inks. This article will discuss key technical features of HT inks and their potential applications.&nbsp;</p><p><a href="https://www.techblick.com/exhibitors-2023-berlin" target="_blank" rel="noopener noreferrer"></a></p><p><br></p><p><strong>HT602/603 resistors</strong></p><p>Printable resistor ink can be used to deposit passive resistive components directly on a substrate. &nbsp;Applications include heated floors, pressure sensors and variable potentiometers. HT602 and HT603 were formulated by adding different types of Carbon black powders in a polyimide medium for high-temperature or high-power applications. The average Rs (Resistivity) is 25 Ω/□/mil for HT602 and 300 Ω/□/mil for HT603, respectively. Two HT resistors may be blended to meet specific Rs targets. If a higher Rs value is required than Rs of HT603, HT702 dielectric can be blended with HT603. Figure 1 shows (a) plot of Rs vs. blend ratio of HT603 and HT602, and (b) Rs vs. blend ratio of HT603 and HT702.&nbsp;</p><div type="empty-line" data-hook="rcv-block19"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTU5MzMxLTE2OTE1OTM1NTkzMzEucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_24a091b42ee94fbc8b1dad56f9794d32~mv2.png/v1/fill/w_1056,h_421,al_c,q_90/090711_24a091b42ee94fbc8b1dad56f9794d32~mv2.png" class="fr-fic fr-dii"></div><div type="image" data-hook="rcv-block21"><br></div><p>Figure 1. (a) Plot of Rs vs. blend ratio between HT602 and HT603; (b) Plot of Rs vs. blend ratio between HT603 and HT702.&nbsp;</p><div type="empty-line" data-hook="rcv-block23"><br></div><p>For reliable device operation, the resistance variation of the printed resistor should be minimal with temperatures. TCR (Temperature Coefficient of Resistance) of two HT resistors were measured at four different temperatures as shown in Figure 2. TCR data of HT602, 603 showed much lower values vs. conventional resistor inks (7082M, 7102) formulated with non-polyimide resin demonstrating more stable resistance values of HT resistors with temperatures.&nbsp;</p><div type="empty-line" data-hook="rcv-block26"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTU5MTU2LTE2OTE1OTM1NTkxNTYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_101b2a58975e4fbab04423aeebe44864~mv2.png/v1/fill/w_823,h_555,al_c,q_90/090711_101b2a58975e4fbab04423aeebe44864~mv2.png" class="fr-fic fr-dii"></div><div type="image" data-hook="rcv-block27"><br></div><p>Figure 2. TCR comparison between HT602/603 containing polyimide and 7102/7082M containing non-polyimide resin.&nbsp;</p><div type="empty-line" data-hook="rcv-block29"><br></div><p>STOL (Short time overload) test was also performed to check how high power HT602 and HT603 could endure without resistance change. Chip resistor&rsquo;s standard criterion is less than +/- 1% of R change up to 2.5 times of desired operating voltage. Different size of HT resistor pattern was screen printed over Ag electrode as shown in Figure 3 and 0.5mm x 0.5mm printed resistor was used to monitor resistance deviation during STOL test. Test condition is 5sec dwelling time with step increase of voltage. Both HT602 and HT603 showed excellent stable resistance up to 200W/cm2 power density (Figure 4).</p><div type="empty-line" data-hook="rcv-block32"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTU5OTgwLTE2OTE1OTM1NTk5ODAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_29e7cbc68bea4e90b4309dd55b7276d8~mv2.png/v1/fill/w_641,h_673,al_c,lg_1,q_90/090711_29e7cbc68bea4e90b4309dd55b7276d8~mv2.png" class="fr-fic fr-dii" style="width: 624px;"></div><div type="image" data-hook="rcv-block33"><br></div><p>Figure 3. HT603 printed over Ag electrode on Alumina substrate for STOL test.</p><div type="empty-line" data-hook="rcv-block35"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTU5ODU1LTE2OTE1OTM1NTk4NTQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_a57ecf5c424e421d9b175b2464edff80~mv2.png/v1/fill/w_1136,h_568,al_c,q_90/090711_a57ecf5c424e421d9b175b2464edff80~mv2.png" class="fr-fic fr-dii"></div><div type="empty-line" data-hook="rcv-block37"><br></div><p>Figure 4. STOL test to check Resistance change with step-changing voltage (power density).</p><p><br></p><p><strong>HT702 dielectric</strong></p><p>To prevent mechanical damage or chemical oxidation of electronic circuits on Flex or Rigid PCB (printed circuit board), the protective layer is applied on top of the metalized circuit. &nbsp;A Conventional protective layer in the PCB industry is applied by photoimagible soldermask (typically epoxy material) on the rigid substrate or high-pressure assisted thermal lamination of Coverlay (polyimide with acrylic adhesive) on flex circuit. Both photoimaging of solder mask and coverlay lamination not only require multiple process steps but also generate waste of materials. The incumbent protective layers also have deficiencies on the material side; the thermoset epoxy solder mask is typically not flexible and coverlay contains acrylic adhesive which is not thermal resistant above 200&deg;C. &nbsp;</p><p>HT702 formulated with thermoplastic polyimide resin is more flexible than thermoset epoxy solder mask and has much higher thermal resistance than acrylic adhesive used in coverlay. The unique combination of flexibility and thermal resistance of HT702 is expected to create new applications in PCB industry where incumbent protective materials have a deficiency. In addition, direct printable HT702 dielectric ink can lower the overall cost of ownership by decreasing process steps and material waste. Good dielectric strength (BDV &gt; 0.5kV), excellent chemical resistance and excellent adhesion on various substrates are additional benefits of HT702. To achieve good dielectric strength and uniform coverage without pinhole defects, 2~3 printing and drying cycles are recommended. &nbsp;</p><p><strong>HT802 conductor</strong></p><p>HT802 is highly conducive and thermal-resistant ink formulated with silver powders and polyimide resin. High thermal/chemical resistant polyimide resin enables HT802 to be applicable to high-temperature applications such as electrodes for heaters or platable conductors where the plating process involves a caustic acid/base bath process. For example, figure 5(a) shows the HT802 electrode printed on 16in. x 16in. Kapton&reg; RS flexible heater. Uniform heating performance was achieved up to 240&deg;C (Figure 5(b)).&nbsp;</p><div type="empty-line" data-hook="rcv-block47"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTYwMzkwLTE2OTE1OTM1NjAzOTAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_9d9b14d321bc430fb26b20f4d99bd5f7~mv2.png/v1/fill/w_1312,h_540,al_c,q_90/090711_9d9b14d321bc430fb26b20f4d99bd5f7~mv2.png" class="fr-fic fr-dii"></div><div type="empty-line" data-hook="rcv-block49">Figure 5. (a) HT802 printed on Kapton&reg; RS film as an electrode for flexible heater fabrication. (b) Uniform heating up to 240&deg;C was demonstrated.&nbsp;</div><div type="empty-line" data-hook="rcv-block51"><br></div><p>Table 1 shows the performance of HT802 with different cure conditions. Resistivity decreased with higher cure temperatures while maintaining excellent adhesion on Kapton&reg; film. Interestingly, crease resistance also became better (lower % increase of electrical resistance) when HT802 was cured at higher temperatures. &nbsp;</p><div type="empty-line" data-hook="rcv-block53">Table 1. Resistivity, adhesion, and crease resistance of HT802 with cure condition. HT802 was screen printed on Kapton&reg; film.&nbsp;</div><div type="empty-line" data-hook="rcv-block56"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTU5NDIxLTE2OTE1OTM1NTk0MjAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_f1057c15757b49be87f225d832c50c73~mv2.png/v1/fill/w_1313,h_317,al_c,lg_1,q_90/090711_f1057c15757b49be87f225d832c50c73~mv2.png" class="fr-fic fr-dii"></div><div type="empty-line" data-hook="rcv-block58"><br></div><p><strong>Summary</strong></p><p>Micromax&trade; Electronic Inks and Pastes launched a new HT product line using noble Polyimide resin chemistry for high-temperature printed electronics applications. &nbsp;The unique combination of high thermal/chemical resistance, flexibility, and additive printability of HT inks is expected to provide solutions for various high-temperature applications on both flexible and rigid substrates. &nbsp;Visit our website: https://www.celanese.com/products/micromax to find a technical datasheet of HT products [2].</p><div type="paragraph" data-hook="rcv-block60"><strong>References</strong></div><div type="paragraph" data-hook="rcv-block62">[1] <a data-hook="linkViewer" href="https://www.marketsandmarkets.com/Market-Reports/printed-electronics-market-197.html?gclid=EAIaIQobChMIrY-Bu_CdgAMVBNzICh1yNA1FEAAYASAAEgKtI_D_BwE" target="_blank" rel="noopener noreferrer"><u>Printed Electronics Market Revenue Trends and Growth Drivers | MarketsandMarkets</u></a></div><div type="paragraph" data-hook="rcv-block63">[2] <a data-hook="linkViewer" href="https://www.celanese.com/en/products/micromax" target="_blank" rel="noopener noreferrer"><u>Micromax&trade; Electronic Inks and Pastes (celanese.com)</u></a></div><div type="empty-line" data-hook="rcv-block66"><br></div><p><a href="https://www.techblick.com/electronicsreshaped" target="_blank" rel="noopener noreferrer"></a></p><div data-hook="imageViewer" tabindex="0"><span contenteditable="false" class="fr-img-caption  fr-fic fr-dii fr-draggable" style="width: 758px;" draggable="false"><span class="fr-img-wrap"><a href="https://www.techblick.com/electronicsreshaped" target="_blank" rel="noopener noreferrer"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTYwODg4LTE2OTE1OTM1NjA4ODgucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_dc5d68d6d8a849f6a309f71aa7d483e3~mv2.jpg/v1/fill/w_1707,h_1707,al_c,q_90/090711_dc5d68d6d8a849f6a309f71aa7d483e3~mv2.jpg" class="fr-fic fr-dii" style="width: 758px;"><span class="fr-inner" contenteditable="true">Join us and the global community in Berlin on 17-18 OCT 2023. Lets RESHAPE the Future of Electronics together, making it Additive, Sustainable, Hybrid, Wearable and 3D. https://www.techblick.com/electronicsreshaped</span></a></span></span></div><p><br></p><div type="image" data-hook="rcv-block67"><br></div><p><br></p>

The key enabler for reliable device fabrication in printed electronics is functional inks with tunable electrical properties incl. conductivity, dielectric strength & electrical resistance. Here, you will learn about unique polyimide based pastes able to withstand temperatures up to 300°C. 

Innovative High-Temperature Inks for Printed Electronics

<p id="isPasted">As part of the TechBlick (wwww.TechBlick.com) series we invited <a data-hook="linkViewer" href="https://www.linkedin.com/in/wladimirpunt/" id="isPasted" rel="noopener noreferrer" target="_blank"><u>Wladimir Punt</u></a> from Molex to tell us about how &nbsp;hybrid printed electronics can enhance function and manufacturing of wearable medical sensors.&nbsp; Here you wll learn about the trends, archirectures and challenges. Wladimir and his team at Molex are very well placed in this field, having had the opportunity to develop, prototype, and mass produce many wearable medical sensors over the years. This article was originally published on TechBlick<a href="https://www.techblick.com/post/smart-skin-patches-and-noninvasive-medical-sensing-molex" rel="noopener noreferrer" target="_blank">&nbsp;here.</a>&nbsp;</p><p>The advance of electronics miniaturization is opening new frontiers in Medtech, including in the field of adhesive skin patches. In the past, a skin patch might contain a single wired sensor. But today&rsquo;s smart skin patches incorporate a broader range of functions. Hybrid printed electronics permit a variety of electronic devices and noninvasive sensors to be affixed to a thin and flexible substrate, enabling designers to integrate sensors, microcontrollers, wireless connectivity and batteries into a capable, durable and connected device.&nbsp;</p><p>Whether in a clinical or home setting, this enables far more comprehensive patient monitoring. Adding enhanced capabilities to lightweight and flexible skin patches allows patients to go about their day while they (or their healthcare provider) monitor vital signs or activity noninvasively. There is tremendous potential for this flexibility to improve patient monitoring and make it simpler, more comfortable and more accessible.</p><div data-hook="rcv-block9" type="paragraph"><br></div><p><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"></a></p><div data-hook="imageViewer" tabindex="0"><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1690284990194-1690284990194.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_9f48526d064f49abb931769f58299b01~mv2.png/v1/fill/w_1231,h_298,al_c,lg_1,q_90/090711_9f48526d064f49abb931769f58299b01~mv2.png" class="fr-fic fr-dii"></a></div><div data-hook="rcv-block12" type="empty-line"><br></div><h3>The Evolving Need for Connected Medical Sensing</h3><div data-hook="rcv-block14" type="empty-line"><br></div><p>The demand for mobile, connected and noninvasive medical sensing capabilities is growing. During the COVID-19 pandemic, the need for hospitals and clinics to monitor patients remotely became clear. This capability did more than allow doctors to track their patients&rsquo; vital signs while maintaining social distancing &mdash; it also helped address hospital overcrowding and assisted in alleviating staffing issues. Smart skin patches have emerged as a lightweight, comfortable and portable method of monitoring patients both inside and outside a healthcare facility.&nbsp;</p><p>The market for home health monitoring is flourishing as well. With smart skin patches, home users can monitor their heart activity, temperature and muscle health. These devices can be used for monitoring sleep and brainwave activity, making the low profile and light weight nature of smart skin patches especially helpful. Skin patches are increasingly popular for femtech applications such as pregnancy monitoring as well.&nbsp;</p><p>Smart skin patches all use flexible printed circuit technology and safe skin contacting adhesive, but their design architecture varies depending on the application. Each skin patch design is customized and, depending on the need, can be disposable or reusable. Disposable and one-time-use skin patches have a flexible substrate, usually polyethylene terephthalate (PET), with the electronics affixed directly to the substrate. In reusable patches, the electronics are mounted inside a removable &ldquo;puck&rdquo; housing that mechanically and electrically connects to the substrate. The electronic components are reusable and only the electrodes in contact with the skin are disposable, reducing waste. This can, however, add logistics challenges and costs for the refurbishing process in some cases.</p><h3>Opportunities and Challenges of Smart Skin Patches</h3><div data-hook="rcv-block21" type="h3"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1690284989596-1690284989595.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_fe0334c255c64ef9b8d8fba7949a06f2~mv2.jpg/v1/fill/w_900,h_661,al_c,q_85/090711_fe0334c255c64ef9b8d8fba7949a06f2~mv2.jpg" class="fr-fic fr-dii" style="width: 578px;"></div><div data-hook="rcv-block24" type="image"><br></div><p>Designers of monitoring systems can leverage a wide range of smart skin patch feature options. The skin patch can include various types of electronic devices. One or more sensors can be fitted, including temperature sensors, chemical sensors, electrodes and even optical sensors. The skin patch can also include a battery, a microcontroller and a radio frequency (RF) antenna to maintain a wireless connection to the network.&nbsp;</p><p>These are the physical building blocks of the system, and to achieve a specific purpose designers can mix, match and customize them to meet performance targets. Different combinations of sensors and other devices can work with sophisticated software to noninvasively paint a picture of a patient&rsquo;s condition or vital signs.&nbsp;</p><p>Sounds simple, right? Alas, system reliability requires several different engineering disciplines. For example, material science is vital to ensure the substrate can accommodate the expected wear, yet also provide a secure anchor for the electronic components. The type of conductive paste and hydrogel must meet the system&rsquo;s requirements for manufacturability, shelf life and performance. Electronic components need to operate reliably during the expected lifetime of the product. Robust testing and validation are necessary to ensure product performance and support regulatory compliance.</p><h3>From Concept to Production</h3><p>Creating a smart skin patch means assembling multiple puzzle pieces to create a complete system. Collaborating with a company with decades of experience in this field is crucial. At Molex, several engineering disciplines work together to achieve a unified goal:</p><ul><li><p>Hybrid printed electronics desig</p></li><li><p>Material science</p></li><li><p>Wireless connectivity</p></li><li><p>Sensor integration</p></li><li><p>Prototyping</p></li><li><p>Testing and validation</p></li><li><p>Production</p></li><li><p>Packaging</p></li></ul><p>Involving Molex engineers from the earliest stages of the design process helps ensure the product meets performance specifications and manufacturing requirements. In addition to engineering expertise, Molex also offers global manufacturing capabilities to reduce supply chain risks and speed time to market.&nbsp;</p><p>The need for smart skin patches to improve patient wellness and outcomes is enormous and continues to grow. Our medical expertise and collaborative design approach coupled with our diversified supply chain, high-volume production capabilities and regulatory compliance experience (including ISO 13485 standards) enables Molex to support development of innovative skin patches that improve lives. Explore the benefits of this evolving technology - contact us about customized smart skin patch solutions.</p><h3>We exhibiting in Berlin on 17-18 OCT 2023. Join us, 78 other exhibitors, 68 presenters and 600+ peers.&nbsp;</h3><p>Lets RESHAPE Electronics Together, making it Additive, Sustainable, Flexible, and Wearable. <a data-hook="linkViewer" href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><u>Explore now www.techblick.com/electronicsreshaped</u></a></p><p><a data-hook="buttonViewer" href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" tabindex="0" target="_blank">Info &amp; Registration</a></p><p><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"></a></p><div data-hook="imageViewer" tabindex="0"><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1690284990355-1690284990355.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_bfe22a07dc6e40a7996e12e0eda33f46~mv2.jpg/v1/fill/w_1000,h_1000,al_c,q_85/090711_bfe22a07dc6e40a7996e12e0eda33f46~mv2.jpg" class="fr-fic fr-dii"></a></div><p><br></p><div data-hook="rcv-block50" type="image"><br></div><p><br></p>

Status and evolution of intelligent skin patches, enabled by flexible hybrid electronics, going from a single wired sensors to complex wireless multi-function capability. Learn about trends, archirectures and challenges from a manufacturer's point of view to understand how to design for production.

Smart Skin Patches and Noninvasive Medical Sensing

In this episode, we discuss the breakthrough research by MIT engineers to effectively deliver drugs through the skin allowing for a lower dosage of active ingredients needed per use and a potentially pill-free implementation of commonly used drugs!

Podcast: Pills No More: Patches As The Future of Drug Delivery

<p id="isPasted">Since the 1970s, the role of pets in the family has changed. Back then, pets were pets, but now sociologists have found that more than eighty percent of dog owners consider their dog a fully-fledged family member, while more than seventy percent of cat owners feel the same (according to <em>Phys Org</em>).</p><p>That means we want to keep our pets safe, healthy, and happy more than ever. But it&rsquo;s not easy; for example, according to Australian pet supply chain PetBarn, the average adult dog requires between 30 and 60 minutes of exercise daily, with higher-energy and working breeds needing even more. With people living increasingly busy lives, ensuring a pet receives the correct amount of exercise and stimulation can be hard.</p><p>Lost pets are a problem too. Wandering off is easy for a curious animal, locating an errant hound is much more difficult. According to the American Humane Association, almost 10 million dogs and cats go missing each year in the U.S. alone.</p><h2><strong>Communication through technology</strong></h2><p>While humans can tell each other what they need, it&rsquo;s not quite so simple for a cat or a dog armed only with a meow or a bark. To better help owners understand their pets&rsquo; needs, technology is coming to the rescue. The wearables that have been used to keep tabs on human health and fitness are now being adapted for animals.</p><p>But it&rsquo;s not just fitness products finding a new market through pets. In recent years, several products have been launched with the purpose of providing emergency notifications and tracking for both children and people with Alzheimer&rsquo;s, dementia, or autism. Such location tech is now being turned to help find lost pets.</p><p>The new applications are powering a booming smart pet device market. Market insights company GMI has found that this segment was valued at $5 billion in 2022 and has an expected CAGR of 15 percent between 2023 and 2032.</p><p>Sales are largely made up of smart cameras (allowing owners to keep an eye on their pets during the day while at work), some including microphones so owners can speak to their pet, and others even providing a remotely triggered treat. The other growing sector is smart collars; these are ideal for monitoring a four-legged friend&rsquo;s health and fitness habits and locating them if they are ever lost.</p><h2><strong>Keeping tabs with Bluetooth LE</strong></h2><p>Pet wearables startup Huan&rsquo;s <a href="https://www.nordicsemi.com/News/2020/05/Huan-Tag-pet-wearable-helps-owners-keep-track-of-pets-via-crowd-location-system?utm_campaign=2021%20wevolver" rel="noopener noreferrer" target="_blank">Huan Tag</a> can be attached to a dog or cat&#39;s collar and paired with the owner&#39;s smartphone via Nordic <a href="https://www.nordicsemi.com/Products/Bluetooth-Low-Energy?utm_campaign=2021%20wevolver" rel="noopener noreferrer" target="_blank">Bluetooth LE</a> connectivity. This lets users view their pet&#39;s whereabouts via the &#39;Huan&#39; app.</p><p>Suppose a pet was to wander outside of Bluetooth range. In that case, the company has created &lsquo;Huan Sensors&rsquo; that can be placed in outdoor locations or vehicles to create a wireless network using additional Nordic SoCs. If a pet wearing a Huan Tag is within range of any of these SoCs, its collar triggers a Bluetooth LE to Wi-Fi or LTE-M gateway to notify the owner of the pet&rsquo;s location via the smartphone app.</p><h2><strong>Widespread coverage with cellular IoT</strong></h2><p>Another option for when a domestic animal strays outside of Bluetooth range is cellular IoT. Using the established cellular network, cellular IoT tracking solutions enjoy widespread metropolitan coverage, ensuring that Fido can be located even if he heads off on an ambitious journey.</p><p>An example of a cellular IoT tracking product is Smart Tracking Technologies&rsquo; <a href="https://www.nordicsemi.com/News/2021/09/Link-smart-pet-wearable-uses-nRF9160-SiP-and-nRF52840-SoC?utm_campaign=2021%20wevolver" rel="noopener noreferrer" target="_blank">Link</a> device, which is designed to attach to a pet&rsquo;s collar. It uses the LTE-M connectivity of Nordic&#39;s <a href="https://www.nordicsemi.com/products/nrf9160?utm_campaign=2021%20wevolver" rel="noopener noreferrer" target="_blank">cellular</a> IoT SiP to allow the user to track their pet via the cellular network.</p><p>The device can also measure the animal&rsquo;s activity via an included inertial measurement unit (IMU), and will enter &lsquo;idle&rsquo; mode when the pet is sleeping to reduce power consumption. Activity information can also be sent to the user&rsquo;s smartphone via Nordic Bluetooth LE connectivity.</p><h2><strong>Applying Machine Learning</strong></h2><p>The <a href="https://www.nordicsemi.com/News/2023/02/The-Lilbit-smart-wearable-employs-nRF9160-SiP-and-nRF52811-SoC" rel="noopener" target="_blank">Lilbit</a> pet tracker also uses the cellular IoT connectivity and the GNSS capabilities of Nordic&rsquo;s SiP to send the pet&rsquo;s location to its owner. Again, this provides a precise locationing when the animal is not within Bluetooth range.</p><p>The tracker can be paired to the owner&rsquo;s smartphone using Nordic Bluetooth LE connectivity, sending movement metrics from the product&rsquo;s accelerometer, magnetometer, and gyroscope to the corresponding app. Using proprietary machine learning (ML) algorithms powered by the Arm M33 processor in Nordic&rsquo;s SiP, Lilbit can identify behaviors and potential health issues using the movement data.</p><h2><strong>Extendable range</strong></h2><p>Another option for providing coverage over a more extended range is the introduction of Amazon Sidewalk. This low-throughput wireless infrastructure combines Bluetooth LE and sub-GHz radio technologies to extend the transmission range of suitably equipped pet trackers by up to a kilometer, using a new protocol in the 900 MHz band. The technology can alert the owner if the pet leaves the property boundary.</p><p>Wireless tech is not only directly benefiting cats and dogs, but also providing peace of mind for loving owners by confirming that their furry companions are safe and happy. Moreover, thanks to the data provided by pet wearables, we are learning much more about the formerly secret lives of pets &ndash; enabling us to use the information to make these important family members even more content.</p><hr><p>This article was first published on Nordic&#39;s&nbsp;<a href="https://blog.nordicsemi.com/getconnected" target="_blank" rel="nofollow" id="isPasted"></a><a href="https://blog.nordicsemi.com/getconnected?utm_campaign=2021%20wevolver" rel="nofollow" target="_blank">Get Connected Blog</a>.  &nbsp;</p>

While humans can tell each other what they need, it’s not quite so simple for a cat or a dog armed only with a meow or a bark. To better help owners understand their pets’ needs, technology is coming to the rescue. The wearables that have been used to keep tabs on human health and fitness are now being adapted for animals.

Bluetooth LE and cellular IoT wearables help us take care of our pets

<div data-hook="post-title" id="isPasted" tabindex="-1"><p data-hook="post-title">This article is part of the TechBlick [www.TechBlick.com] series covering innovations in the amazing world of printed and additive electronics. Here, we hear from one of the main global manufacturers [Tapecon | <a href="https://www.tapecon.com/" id="isPasted" rel="noopener noreferrer" target="_blank">https://www.tapecon.com/</a>], discussing a key rising application: stick-to-skin wearable monitoring devices. This article first appeared <a href="https://www.techblick.com/post/revolutionizing-healthcare-the-rise-of-the-stick-to-skin-wearable-monitoring-devices" rel="noopener noreferrer" target="_blank">here </a>and the author is &nbsp; <a href="https://www.linkedin.com/in/casey-cephas-259a8892/" rel="noopener noreferrer" target="_blank">Casey Cephas &nbsp;</a></p></div><div data-hook="post-description"><article><div data-rce-version="9.11.0"><div data-id="rich-content-viewer" dir="ltr"><div data-hook="rcv-block1" type="empty-line"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1688373125604-1688373125604.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_2c81169952854503a32904d5c4954611~mv2.png/v1/fill/w_1819,h_416,al_c,q_90/090711_2c81169952854503a32904d5c4954611~mv2.png" class="fr-fic fr-dii" style="width: 221px;"><span style='background-color: transparent; color: rgb(66, 66, 66); font-family: "PT Serif", serif; font-size: 19px;'>Healthcare is undergoing a transformative shift with the rise of stick-to-skin wearable monitoring devices. These innovative data-collecting marvels, such as continuous glucose monitoring devices and cardiac monitoring devices, offer a new level of convenience and real-time insights into our health status and wellbeing. This article explores the capabilities required, the diverse application areas, and the market trends that and driving the growth of this groundbreaking technology.</span></div><div data-hook="rcv-block3" type="paragraph"><br></div><div data-hook="rcv-block4" type="empty-line"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1688373126201-1688373126201.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_e1ea9ec691614b68be5859ba6f1c8002~mv2.jpg/v1/fill/w_612,h_395,al_c,lg_1,q_80/090711_e1ea9ec691614b68be5859ba6f1c8002~mv2.jpg" class="fr-fic fr-dii" style="width: 616px;"></div><div data-hook="rcv-block5" type="image"><br></div><p><strong>Use Cases:&nbsp;</strong></p><p>Stick-to-Skin Wearable Monitoring Devices with flexible hybrid electronics find applications in a variety of areas within the life sciences and healthcare industry. For instance, continuous glucose monitoring devices enable individuals with diabetes to track their glucose levels throughout the day, promoting effective management of this chronic disease. Cardiac monitoring devices help monitor heart rate, heart rhythm, and other cardiac parameters, aiding in the detection and prevention of cardiovascular conditions. These devices exemplify the potential of stick-to-skin wearables to provide continuous, non-invasive monitoring for a wide range of healthcare needs.</p><div data-hook="rcv-block10" type="empty-line"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1688373125711-1688373125711.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_5113486e98084dd79129852d9166526c~mv2.jpg/v1/fill/w_434,h_554,al_c,lg_1,q_80/090711_5113486e98084dd79129852d9166526c~mv2.jpg" class="fr-fic fr-dii" style="width: 329px;"></div><div data-hook="rcv-block11" type="image"><br></div><p><strong>Production Considerations:&nbsp;</strong></p><p>The production of stick-to-skin wearable monitoring devices necessitates a partner with a very unique set of capabilities. Flexible circuit fabrication is essential but ideally having the abilities to both advance TRL and MRL prototyping and proof of concept creation, as well as fully scaled roll-to-roll long-run manufacturing is the very best of both worlds. Flexible Hybrid Electronics enables the creation of thin, conformable hardware containing both printed electronics and traditional IC all on a flexible substrate. Sensor integration expertise is crucial for seamlessly incorporating sensors, such as biosensors, thermistors, or electrodes, into on-body compatible, FDA approved materials resulting in devices that are comfortable, lightweight, and conformable to the body. Additionally, knowledge of packaging techniques, wireless connectivity, and quality control and testing are vital to produce reliable and effective stick-to-skin wearables.</p><div data-hook="rcv-block13" type="paragraph"><br></div><div data-hook="rcv-block14" type="empty-line"><br></div><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1688373126163-1688373126163.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_790a28c801d34860bf10e62fa1ffad1b~mv2.png/v1/fill/w_1282,h_306,al_c,q_90/090711_790a28c801d34860bf10e62fa1ffad1b~mv2.png" class="fr-fic fr-dii"></div></a><div data-hook="rcv-block15" type="image"><br></div><p><em>We exhibiting in Berlin on 17-18 OCT 2023 - join us, 78 other</em>, <em>exhibitors, 68 presenters and 600+ peers.&nbsp;</em>Let&#39;s<em>&nbsp;RESHAPE Electronics &nbsp;Together, making it Additive, Sustainable, Flexible, and Wearable.&nbsp;&nbsp;</em><a data-hook="linkViewer" href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><em><u>Explore now www.techblick.com/electronicsreshaped</u></em></a>&nbsp;</p><div data-hook="rcv-block18" type="empty-line"><br></div><p><strong>Market Trends:&nbsp;</strong></p><p>The need for stick-to-skin wearable monitoring devices is on the rise driven in part by sharp demand for remote healthcare monitoring. These non-invasive, comfortable wearables allow individuals and their caregivers to monitor their health conditions from the privacy and comfort of their homes. The increasing prevalence of chronic diseases and the desire to be proactive in monitoring and maintaining a heahealthythy lifestyle at any age necessitates solutions that provide continuous, remote monitoring, making stick-to-skin wearables a valuable asset. Particularly our aging population seeks healthcare solutions that support independent living, but family members and loved ones don&rsquo;t always live nearby. This makes FHE wearables indispensable for ensuring the well-being of older adults. Technological advancements, wellness and fitness tracking trends, and integration with digital health ecosystems are further propelling adoption.</p><div data-hook="rcv-block20" type="paragraph"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1688373125895-1688373125895.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_e73da94ae1ea400798c244ee26d965a3~mv2.jpg/v1/fill/w_834,h_451,al_c,q_85/090711_e73da94ae1ea400798c244ee26d965a3~mv2.jpg" class="fr-fic fr-dii" style="width: 709px;"></div><div data-hook="rcv-block22" type="image"><br></div><div data-hook="rcv-block23" type="empty-line"><br></div><p><strong>Forecasted Market Growth:&nbsp;</strong></p><p>Over the next 5-10 years, the market for stick-to-skin wearable monitoring devices is poised for significant growth. Market research reports project the industry will experience a very robust compound annual growth rate (CAGR) averaging 12-16% during this period. Contributing factors include increasing awareness of wearable technologies, advancements in sensor technologies, rising healthcare expenditures, and supportive government initiatives. The COVID-19 pandemic has also accelerated the adoption of remote monitoring solutions, further driving the market growth of stick-to-skin electronics-based wearables. Stick-to-skin wearable monitoring is revolutionizing healthcare by offering continuous, non-invasive monitoring capabilities. With their diverse applications in chronic disease management and general wellness tracking, wearables empower individuals to actively monitor their health and make informed decisions. Ongoing technological advancements in this field will play a pivotal role in transforming healthcare delivery and improving patient outcomes.</p><h3>Join us in Berlin to RESHAPE Electronics making it Additive, Flexible, and Wearable. Explore the program now <a data-hook="linkViewer" href="http://join/" rel="noopener noreferrer" target="_blank"><u>www.techblick.com/electronicsreshaped</u></a></h3><div data-hook="rcv-block27" type="h3"><br></div><div data-hook="rcv-block28" type="empty-line"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1688373126116-1688373126116.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_95e4a5b16bce45d7a4b0f791e0150298~mv2.jpg/v1/fill/w_1707,h_1707,al_c,q_90/090711_95e4a5b16bce45d7a4b0f791e0150298~mv2.jpg" class="fr-fic fr-dii"></div><div data-hook="rcv-block29" type="image"><br></div><div data-hook="rcv-block30" type="empty-line"><br></div><div data-hook="rcv-block-last" type="last"><br></div></div></div></article></div><div data-hook="post-main-actions-desktop"><br></div>

Healthcare is undergoing a transformative shift with the rise of stick-to-skin wearable monitoring devices. These data-collecting marvels, such as continuous glucose or cardiac monitoring devices, offer convenience & real-time insights.This article explores capabilities, applications & market trends

Revolutionizing Healthcare: The Rise Of The Stick-To-Skin Wearable Monitoring Devices

<div data-hook="post-title" id="isPasted" tabindex="-1"><p data-hook="post-title">In wearables, the design on paper often does not work in practice. In this world, your idea may only go as far as your chosen contract manufacturer can take you. It is the key role of the contract manufacturers to help you make the vital adjustments and help you realize your products.&nbsp;</p><p data-hook="post-title">For this article we invite<a href="https://www.linkedin.com/in/scottlavine/" rel="noopener noreferrer" target="_blank">d Scott Lavine</a> from <a href="https://conductivetech.com/" rel="noopener noreferrer" target="_blank"><strong>Conductive Technologies</strong></a> Inc to explain more on the key role of contract manufacturers in developing wearable and flexible product.&nbsp; This article originally appeared<a href="https://www.techblick.com/post/how-far-can-we-flex" rel="noopener noreferrer" target="_blank">&nbsp;here.</a></p><p data-hook="post-title"><br></p></div><div data-hook="post-description"><article><div data-rce-version="9.11.0"><div data-id="rich-content-viewer" dir="ltr"><h3>The Role of the Contract Manufacturer in the Wearables Market.</h3><div data-hook="rcv-block1" type="h3"><br></div><p>In the world of wearables, your idea may only go as far as the contract manufacturer you chose to partner with can take it. &nbsp;Taking a concept from the lab to commercialization frequently requires a number of adjustments. &nbsp;Working with a contract manufacturer who has the flexibility to make adjustments in order to bring your product to market may be the difference between commercial success and failure.</p><p>A wearable sensor design, at its basic concept, consists of conductive inks printed on a substrate. &nbsp;In the manufacturing world, a basic concept can quickly turn into a complicated process. The contract manufacturer needs to marry all the aspects of a design together in order to create the perfect component.</p><div data-hook="rcv-block5" type="paragraph"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3ODUyODQzNjU2LTE2ODc4NTI4NDM2NTYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_f506854ff341475e9d5bd75c11c49f09~mv2.jpg/v1/fill/w_1920,h_400,al_c,q_85/090711_f506854ff341475e9d5bd75c11c49f09~mv2.jpg" class="fr-fic fr-dii"><br></div><div data-hook="rcv-block6" type="empty-line"><br></div><p><strong>Conductive Inks</strong></p><p>Your wearable product will call for a conductive ink made of carbon or silver and possibly with a dielectric ink as an insulator. &nbsp;The first instinct with a wearable may be to go with inks that provide the most elasticity. &nbsp;This sounds like it would make sense especially if the wearable is intended to move with the person&rsquo;s body. &nbsp;Even the most elastic of inks start to break down as they are stretched. &nbsp;There are many factors that go into selecting the correct inks. &nbsp;Partnering with a contract manufacturer with established ink vendor relationships, experience in the manufacturing of wearables, and enough experience to identify design change is important to the success of your product.</p><div data-hook="rcv-block8" type="paragraph"><br></div>&nbsp;<a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"></a><div data-hook="imageViewer" tabindex="0"><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><span class="fr-img-caption fr-fic fr-dii" style="width: 758px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3ODUyODQzODMwLTE2ODc4NTI4NDM4MzAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_53ff0a0434aa4a5caa159f56cecb8a17~mv2.jpg/v1/fill/w_868,h_214,al_c,lg_1,q_80/090711_53ff0a0434aa4a5caa159f56cecb8a17~mv2.jpg" class="fr-fic fr-dii" style="width: 758px;"><span class="fr-inner" data-dl-input-translation="true">Conductive Technologies Inc and the entire global community will be in Berlin on 17-18 OCT 2023 to RESHAPE Electronics, making it Wearable, Flexible, and Additive. &nbsp;Explore the programme and book your meetings now to take your next products from concept to pilot to mass production.</span></span></span></a><div id="isPasted"><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"></a><a target="_blank"></a><a target="_blank">https://www.techblick.com/electronicsreshaped</a></div></div><div data-hook="rcv-block12" type="empty-line"><br></div><p><strong>Substrates</strong></p><p>The substrate, or the base material that the sensor is printed on, is a key component to the design of a wearable device. &nbsp;Chosen based on flexibility, durability, or other physical characteristics, the substrate in the planned design may not be compatible with the manufacturing process. &nbsp;So, what do you do now? &nbsp;Your contract manufacturer should have experience with a number of substrates and be able to recommend other materials/</p><div data-hook="rcv-block16" type="empty-line"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3ODUyODQ0NDg2LTE2ODc4NTI4NDQ0ODYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_e3f442731b474f678e145883a1cbb589~mv2.jpg/v1/fill/w_1200,h_969,al_c,q_85/090711_e3f442731b474f678e145883a1cbb589~mv2.jpg" class="fr-fic fr-dii"></div><div data-hook="rcv-block17" type="image"><br></div><p><strong>Carriers</strong></p><p>Projects may require, either by design or as a design change during manufacturing, to have the conductive printing applied to an image carrier and then transferred to a substrate. &nbsp;You may find that the substrate used in prototyping doesn&rsquo;t work in the actual manufacturing process. &nbsp;Issues can arise tied to the thickness of the substrate or the ability of the substrate to tolerate the temperature required for the drying process. &nbsp;The design of the housing for the printed sensor may not be flat and a carrier with an adhesive would be required in order to print the sensor and then attach it to the housing.</p><p><strong>More than Printers</strong></p><p>When considering contract manufacturers for your product, it is important to identify all of the capabilities that one vendor can provide. &nbsp;While it&rsquo;s not always possible, it is preferable to have one vendor complete as much of the manufacturing and assembly process as possible.</p><p>The contract manufacturer you pick should have both clean rooms and environmentally controlled rooms available. &nbsp;Environmental contamination from either debris or temperature and/or humidity can damage or degrade printed electronics if they are not stored or handled properly during the manufacturing, assembly, packaging, or shipping processes.&nbsp;</p><div data-hook="rcv-block25" type="empty-line"><br></div><p>Lastly, but likely the most important is that your contract manufacturer be compliant with FDA 21 CFR Part 820 and certification to ISO 13485 ensures their ability to assist your company&rsquo;s medical device project along the path to FDA clearance.&nbsp;</p><p><strong>Conclusion &nbsp;</strong></p><p>The adage, &ldquo;You don&rsquo;t know what you don&rsquo;t know&rdquo; holds true when taking a wearable design from prototype to full-scale commercialization this is all the more reason to pick the contract manufacturer who knows what you don&rsquo;t. &nbsp;</p><hr>Conductive Technologies Inc and the entire global community will be in Berlin on 17-18 OCT 2023 to RESHAPE Electronics, making it Wearable, Flexible, and Additive. Explore the programme and book your meetings now to take your next products from concept to pilot to mass production.<div id="isPasted"><a target="_blank"></a><a target="_blank">https://www.techblick.com/electronicsreshaped</a></div><div data-hook="rcv-block31" type="paragraph"><br></div><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><div data-hook="imageViewer" tabindex="0"><span class="fr-img-caption fr-fic fr-dii" style="width: 758px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3ODUyODQ0Mzg3LTE2ODc4NTI4NDQzODcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/634751_85c56031946043f1971e0c4602c1abfe~mv2.jpg/v1/fill/w_1280,h_1280,al_c,q_85/634751_85c56031946043f1971e0c4602c1abfe~mv2.jpg" class="fr-fic fr-dii"><span class="fr-inner" data-dl-input-translation="true">Image Caption</span></span></span></div></a><div data-hook="rcv-block32" type="image"><br></div><div data-hook="rcv-block33" type="empty-line"><br></div><div data-hook="rcv-block-last" type="last"><br></div></div></div></article></div><div data-hook="post-main-actions-desktop"><br></div>

In wearables, the design on paper often does not work in practice. In this world, your idea may only go as far as your chosen contract manufacturer can take you. It is the key role of the contract manufacturers to help you make the vital adjustment to make your product a success.

How far can we flex?

<div data-hook="post-title" id="isPasted" tabindex="-1"><p data-hook="post-title">As part of our series, TechBlick has invited <a href="http://linkedin.com/in/sandra-lepak-kuc-5a333b75" rel="noopener noreferrer" target="_blank">Sandra Lepak-Kuc</a> from Warsaw University to discuss the trends towards sustainable materials in additive electronics and to share their insights on the development of printable graphene pastes for printing on paper to produce disposable electronics. This article originally appeared<a href="https://www.techblick.com/post/sustainable-printed-electronics-warsaw-university" rel="noopener noreferrer" target="_blank">&nbsp;here&nbsp;</a></p></div><div data-hook="post-description"><article><div data-rce-version="9.11.0"><div data-id="rich-content-viewer" dir="ltr"><p><strong>Print Intelligence: &nbsp;<em>Print innovative, print smart, print sustainable, print green</em></strong></p><p><em>Why?&nbsp;</em>In recent years, sustainable printed electronics have gained tremendous interest in both science and industry. Novel electronics focus on enhancing environmental friendliness while maintaining functionality. Researchers are exploring materials and manufacturing techniques that enable the production of biodegradable or recyclable electronic components, reducing electronic waste and its impact on the environment.&nbsp;</p><div data-hook="rcv-block10" type="empty-line"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1687851950656-1687851950656.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_6eebe4e223cc408ab873f4d2f2d64d01~mv2.jpg/v1/fill/w_1046,h_545,al_c,q_85/090711_6eebe4e223cc408ab873f4d2f2d64d01~mv2.jpg" class="fr-fic fr-dii"></div><div data-hook="rcv-block11" type="image"><br></div><div data-hook="rcv-block12" type="empty-line"><span class="fr-img-caption fr-fic fr-dib" style="width: 739px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1687852203719-Warsaw+University+%28BERLIN-Oct-2023%2950+%281%29.jpg" style="width: 737px;" class="fr-fic fr-dib"><span class="fr-inner" data-dl-input-translation="true">We will be exhibiting together with 77 other exhibitors in Berlin (17-18 OCT 2023). &nbsp;Lets RESHAPE Electronics Together, making it Additive, Sustainable, and Wearable. Explore the programme and plan your visit now. Learn more&nbsp;<a href="https://www.techblick.com/electronicsreshaped" id="isPasted" rel="noopener noreferrer" target="_blank">https://www.techblick.com/electronicsreshaped</a></span></span></span></div><p><em>Where particularly?</em> Some of the most dominant subjects involved in this trend are those related to materials and methods in <strong>biomedical applications</strong>. Rapid advances in medical technology have historically contributed to significant improvements in patient healthcare. The challenge is to develop modern or improved methods of preventive care. It will also allow to reduce the cost of instrumentation, as well as its deterioration and maintenance expenses.</p><p>Very often, disposable products are desired in biomedical applications. Their main advantages are that they do not require disinfection and reduce the risk of spreading pathogens[1]. The COVID pandemic has further escalated the emphasis on single-use products, both due to the increased awareness of pathogen risk and simultaneously by spreading and improving telemedicine, which has become a permanent part of private and public healthcare[2,3].</p><p><em>Why there?&nbsp;</em>In addition to several&nbsp;advantages of disposable appliance components, their disadvantages are increasingly being highlighted. The environmental aspect is recognized as one of the biggest. In the case of ECG electrodes, for example, the solutions currently proposed on the medical market, both traditional and modern disposable ones, are based on substrates made of materials such as PET or PE and sensors or conductive pathways made of Ag/AgCl. These materials are not environmentally&nbsp;friendly. They are not biodegradable, and their combustion produces harmful gases[4].</p><p>In the stream of pro-environmental actions mentioned above, an attempt to replace precisely these materials with environmentally friendly, biodegradable, and biocompatible ones would seem the right course[5,6].</p><p><em>What do we need?</em> Challenges are not only directed toward obtaining an electrically conductive layer from recyclable materials. Many more factors are required. It is essential to ensure printability, preferably by methods allowing large-scale printing. Ensuring recyclability of both the print and the substrate. Ensuring proper adhesion of the print to the substrate. Ensuring functionality under complex conditions - as in the above-given example of ECG, the need to work in contact with the human body, sometimes under various external conditions - temperature, exposure to UV light, or humidity (sweat). Moreover, in the case of electronics dedicated to medical applications, it is also necessary to meet the relevant specific standards.</p><p><em>HOW?</em> Alternative materials are being explored that, in between being suitable for printing techniques and having their functionalities, are being made sustainable and less harmful to the environment. This includes using biodegradable substrates, such as cellulose-based materials, instead of traditional non-biodegradable substrates, such as plastic. However, it is a key issue to produce sustainable printing pastes alongside substrates. These are being challenged with increasing demands, the fulfillment of which is often a complex matter, requiring unconventional approaches and innovative ideas.</p><p>In our research, we go beyond the usual patterns and use materials not previously associated with electronics. These are often unsuccessful attempts, often time-consuming, necessitating unusual methodological solutions. Nevertheless, <strong>we have successfully printed graphene pastes based on sodium alginate and glycerine on paper. Subjecting them to cytotoxicity tests showed a total lack of toxic effect of the obtained structures on living cells.&nbsp;</strong></p><p><strong>Pastes based on glycerine and various reagents such as gelatine, modified starch or xanthan gum. A huge difficulty we encountered was that such materials often did not allow us to achieve the right rheology for screen printing and thus the relevant printability in this method.</strong></p><div data-hook="rcv-block33" type="paragraph"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1687851951289-1687851951289.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_735b363209e64a2a85b587a82072a90b~mv2.jpg/v1/fill/w_1000,h_515,al_c,q_85/090711_735b363209e64a2a85b587a82072a90b~mv2.jpg" class="fr-fic fr-dii"></div><div data-hook="rcv-block36" type="image"><br></div><p><em>Fig. 1. Digital microscope photographs of prints on paper (b-f) photos of conductive paths in selected positions as marked in (a);</em></p><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1687851950444-1687851950444.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_0d19d168448d4e61aae8ba88543f2076~mv2.jpg/v1/fill/w_1000,h_452,al_c,q_85/090711_0d19d168448d4e61aae8ba88543f2076~mv2.jpg" class="fr-fic fr-dii"></div><div data-hook="rcv-block39" type="image"><br></div><p><em>&nbsp;Fig. 2. Metabolic activity of L929 cells treated with sodium alginate, glycerol and graphene layer extract on a paper substrate compared to a negative control (paper). XY plot (GraphPad Prism 9.5.0)</em></p><div data-hook="rcv-block41" type="paragraph"><br></div><p><em>The goal?</em> Our research aims to develop a range of available solutions that will make the greatest possible contribution to protecting the environment and saving the climate.</p><div data-hook="rcv-block44" type="paragraph"><span class="fr-img-caption fr-fic fr-dii" style="width: 758px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1687851951373-1687851951373.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_f1cc269175174493904c6873569e3f82~mv2.png/v1/fill/w_1197,h_673,al_c,q_90/090711_f1cc269175174493904c6873569e3f82~mv2.png" class="fr-fic fr-dii"><span class="fr-inner" data-dl-input-translation="true"><span contenteditable="true" data-dl-input-translation="true" id="isPasted">We will be exhibiting together with 77 other exhibitors in Berlin (17-18 OCT 2023). &nbsp;Lets RESHAPE Electronics Together, making it Additive, Sustainable, and Wearable. Explore the programme and plan your visit now. Learn more&nbsp;<a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank">https://www.techblick.com/electronicsreshaped</a></span></span></span></span></div><p>Ultimately, we aim to obtain electrodes (e.g., for ECG) and other electronic structures that are <strong>environmentally friendly</strong>, <strong>recyclable,</strong> or even <strong>compostable</strong>. Ones that could be rinsed under the tap or thrown into the fireplace and burned. The road may be long and complicated, but it is an effort worth taking.</p><p>[1] C. Bloe, Br J Nurs 30 (2021) 628&ndash;633.</p><p>[2] G.B. Colbert, A.V. Venegas-Vera, E.V. Lerma, Rev Cardiovasc Med 21 (2020) 583&ndash;587.</p><p>[3] J. Portnoy, M. Waller, T. Elliott, J Allergy Clin Immunol Pract 8 (2020) 1489&ndash;1491.</p><p>[4] K. Sovov&aacute;, M. Ferus, I. Matulkov&aacute;, P. &Scaron;paněl, K. Dryahina, O. Dvoř&aacute;k, S. Civi&scaron;, Molecular Physics 106 (2008) 1205&ndash;1214.</p><p>[5] Z. Fang, H. Zhang, S. Qiu, Y. Kuang, J. Zhou, Y. Lan, C. Sun, G. Li, S. Gong, Z. Ma, Advanced Materials Technologies 6 (2021) 2000928.</p><p>[6] C. Zhang, R. Cha, P. Zhang, H. Luo, X. Jiang, Chemical Engineering Journal 430 (2022) 132562.</p></div></div></article></div>

Additive electronics is intrinsically more sustainable than subtractive processes. Yet the current materials are often based on metallic inks and plastic substrates. This is a particular issue in medical wearables with disposable devices. Hence the need to develop sustainable material options

wearables

Profiles