Article #2 of Connectivity and Sensing in Harsh Environments Series: As the bandwidth consumed by vehicular electronics increases, manufacturers need to adopt the latest communication standards, and make various design considerations to ensure signal integrity in harsh environments.
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Article #1 of Connectivity and Sensing in Harsh Environments Series: Electrical components that enable the transfer of control and power are improving to fulfill the requirements of cutting-edge industrial applications.
Introducing the Connectivity and Sensing in Harsh Environments Series: Advancements in aerospace, defense, construction, power systems, automobiles, nuclear reactors, and various other fields have made it necessary for systems engineers to ensure reliable performance in the harshest environments.
Designed to address the exploding computational demands of deep neural networks, physical neural networks (PNNs) branch out from electronics into optics and even mechanics to boost performance and efficiency.
A charge-neutral information carrier could cut energy waste from computing, now that it can potentially be transported within chips.
3 minutes read
Highly sensitive microelectromechanical systems (MEMS) pressure sensor chip utilizing a novel piezosensitive differential amplifier with negative feedback loop (PDA-NFL) circuit.
The performance and lifetime of lithium-ion batteries can be improved thanks to the addition of an ultrathin protective layer on the electrodes a few atom layers thick.
Article #6 of our Industrial IoT revolution series: Antennas are devices enabling wireless communication by interconverting electrical signals and electromagnetic waves.
Engineers at EPFL have developed a method for reading several qubits – the smallest unit of quantum data – at the same time. Their method paves the way to a new generation of even more powerful quantum computers.
2 minutes read
The semiconductor manufacturing field employs a range of etching techniques to craft intricate patterns and structures on material surfaces, with dry etching and wet etching being primary methods.
Despite specific industries experiencing slowdowns caused by the Covid-19 pandemic, projections in the Bluetooth technology market are optimistic through the remainder of 2021 and beyond.
3 minutes read
Silicon wafers are thin slices of highly pure crystalline Silicon, used in the production of integrated circuits. This article delves into the fascinating world of silicon wafers, unraveling their production process, unique properties, and the wide range of applications that make them indispensable.
Puntozero redesigned the cold plate of the power electronics of Dynamis PRC’s electric race car for additive manufacturing. The result was a 25% lighter liquid-cooled heat sink and bioinspired flow guides that increased the heat transfer surface area by 300%.
5 minutes read
The article covers the basics of TinyML, a technology that improves the privacy, energy efficiency, affordability and reliability of devices utilising artificial intelligence. Be a part of TinyML for good, an online event and showcase of ideas that aims at exploring the topic in more detail.
Understanding forward bias vs reverse bias configurations in diodes, exploring the theoretical aspects, implementation, applications, and considerations while noting the key differences between forward bias vs reverse bias operating modes in diodes.
