CAD file types are fundamental to modern engineering workflows. This guide explores different CAD file formats, explaining their uses, advantages, and how to choose the right format.
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Many of the long-held beliefs surrounding date codes have been empirically proven erroneous.
Designing a Wi-Fi front end module using a wireless SoC based on the new Wi-Fi standards can be complex and costly, so choosing a pre-certified module is the most straightforward way to get to market quickly.
Surface Mount Technology (SMT) revolutionized electronics manufacturing by enabling smaller, faster, and more efficient circuit designs. This guide delves into the core principles of SMT, explores its cutting-edge advancements, and addresses the challenges in implementing this technology.
The integration of Git for hardware platform AllSpice addresses communication silos between firmware, software, and hardware teams, enhancing synergy and efficiency within tech enterprises.
This technical guide explores the framework of IPC classes, their hierarchical structure, modern implementation methodologies, and the significant role they play in the global intellectual property landscape.
In this comprehensive guide, we will explore the design, manufacturing process, advantages, and limitations of single sided PCBs, helping you understand their critical role in modern electronics.
Explore how PCB drilling forms the backbone of modern electronics by enabling seamless circuit connectivity and ensuring robust device performance. Learn practical insights and expert tips to optimize your manufacturing process.
Using Git enhances the scalability of hardware development by providing robust version control and seamless integration with design and project management tools, supporting efficient collaboration across increasingly large and complex teams.
This article begins with a general introduction to microcontrollers, what they are and how we might use them and their challenges.
Your PCB copper traces form the connecting bridge for your electrical signals.
4 minutes read
Thin film deposition applies material layers at the atomic/molecular level, vital for advancing electronics, energy, and aerospace. Key methods like CVD, PVD, and ALD enhance material properties, driving innovations in semiconductors, solar cells, and precision tech.
Choosing between solder-mask-defined and non-solder-mask-defined pads is an imperative when constructing footprints for BGA-style components.
4 minutes read
A comprehensive technical analysis of PCB prepreg and core materials, examining their distinct material properties, manufacturing implications, and selection criteria for multilayer PCB design.
This technical guide examines aluminum PCB architecture, manufacturing processes, thermal characteristics, and implementation methodologies for optimal thermal performance in high-power electronic systems.
