<p dir="ltr" id="isPasted">Designing parts for CNC machining may seem straightforward—raw materials is removed from a solid block to create the desired shape. However, there are many ways your designs can encounter issues may arise from parts that are not designed with manufacturability in mind.</p><p dir="ltr">We conclude some of the most critical issues, that our engineering experts frequently meet in quote requests. Avoiding the issues will help you improve your part design, shorten lead time, and even perhaps save some costs along the way.&nbsp;</p><h2 dir="ltr">Avoid the Sharp Internal Corners</h2><p dir="ltr">Not all features are achievable, a typical example is an internal angle of 90°. See Figure-1. This is because all current CNC milling tools have a cylindrical shape, which creates a rounded edge instead of a straight or sharp angle when cutting along the edges of the machined cavity. If a straight angle must be retained, the usual approach is to use EDM (electrical discharge machining), which is a more expensive manufacturing process than CNC machining.</p><p dir="ltr"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712909572420-1712909572420.png" width="602" height="157" id="isPasted" class="fr-fic fr-dii"></p><h2 dir="ltr" id="isPasted">Avoid Designing Thin, Tall Walls</h2><p dir="ltr">When designing for CNC machining, it is important to avoid designing excessively thin or tall walls. While thin walls may be necessary for certain projects, it is important to note that studies have shown that wall thickness is proportional to the stiffness of the material, which can impact the achievable accuracy due to vibrations during machining. The standard minimum thickness for walls is 0.8 mm for metals and 1.5 mm for plastics. See Figure-2, tall walls may result in issues such as undesirable surfaces, difficulty in meeting part tolerances, and the risk of chipping, bending, or breaking. A good rule of thumb for walls is a width-to-height ratio of 3:1.</p><p dir="ltr"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712909612525-1712909612525.png" width="602" height="179" id="isPasted" class="fr-fic fr-dii"></p><h2 dir="ltr">Avoid Parts with Unnecessary Tight Tolerances</h2><p dir="ltr">Although CNC machining can tolerate some of the tightest tolerances in manufacturing process, it doesn't mean that every part needs to have the strictest tolerances. In fact, using tight tolerances only when absolutely necessary can greatly reduce costs. As precision requirements increase, more precision manufacturing processes are needed, leading to lower production efficiency and higher costs.</p><p dir="ltr">&nbsp;<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712909593141-1712909593141.png" width="602" height="212" class="fr-fic fr-dii"></p><p dir="ltr">But sometimes, the flawless assembly can be achieved through creating reasonable gaps, simplifying assembly relationships, and using positioning features. In addition, it is also important to maintain same tolerancing as this would reduce machining time. See an example in Figure-3.</p><h2 dir="ltr">Avoid the Small and Deep Holes, and the Curved Holes</h2><p dir="ltr">The small, deep holes should be avoided as they can cause drill breakage and make chip removal difficult. The ratio of hole depth to diameter should not exceed 3, and one method to avoid deep holes is to use stepped holes. Blind holes require an additional 25% of hole depth for chip storage. Additionally, the curved holes cannot be machined using CNC methods. However, if this feature is required in your design, Electrical Discharge Machining (EDM) can be used to achieve, with the raised production cost along the way.</p><p dir="ltr"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712909593562-1712909593562.png" width="602" height="355" class="fr-fic fr-dii"></p><h2 dir="ltr">Avoid the Deep Cavity</h2><p dir="ltr">There is a certain proportional limit to the machining depth of CNC cutting tools, and the best machining performance is achieved when the cavity depth is 2-3 times the diameter of the tool. Of course, it is possible to machine deeper cavities, up to a maximum of 4 times the tool diameter, but this will increase costs, especially when using multi-axis CNC machine tools. For example, a milling cutter with a diameter of 12mm can safely machine a cavity with a maximum depth of 25mm, not exceeding 48mm. See Figure-5.</p><p dir="ltr"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712909593090-1712909593090.png" width="598" height="361" class="fr-fic fr-dii"></p><h2 dir="ltr">Summing it Up</h2><p>Of course, no one single design tip can address every practical design issues. For additional assistance, feel free to CONTACT US, and you can get the in-depth and customized design analysis. To get your next design project started today, simply Upload a 3D CAD model now.</p>

Optimize part design to reduce CNC machining time and cost

5 Mistakes to Avoid When Designing Machined Parts

<p id="isPasted">Applications for <a href="https://www.protolabs.com/en-gb/services/3d-printing/?utm_source=wevolver&utm_medium=referral&utm_campaign=uk-design-tip-0424&utm_content=wevolver-comparing-3dp-and-im-cost-dt-0424" target="_blank">3D printing</a> are expanding rapidly in response to new materials, technologies and secondary processes announced seemingly daily. We now see additive manufacturing being used for not only prototyping, but also production parts to reduce assemblies and fabricate complex geometries.</p><p><a href="https://www.protolabs.com/en-gb/services/injection-moulding/?utm_source=wevolver&utm_medium=referral&utm_campaign=uk-design-tip-0424&utm_content=wevolver-comparing-3dp-and-im-cost-dt-0424" target="_blank">Injection moulding</a> continues as the workhorse that produces parts globally, without much fanfare. Perfected over decades, moulding remains the go-to service for cost-effective parts at quantities from 50 to over a million.</p><p>A future where 3D printing replaces injection moulding may be far off, but today the two work beautifully in tandem. While 3D printing is often touted as a go-to service for prototyping, costs are typically prohibitive when scaling up to production volumes, which is where injection moulding can come in.</p><p>Deciding which service is the right route for you? Let’s start with a look at cost drivers with both manufacturing services.</p><p><strong>Post processing work</strong></p><p>Build time and post-processing are two main cost drivers. Determining ways to streamline your design or do without unnecessary finishes cuts down significantly on expenses.</p><p>&nbsp;</p><p><img border="0" width="394" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEyNjY5NjQ5NDc0LTE3MTI2Njk2NDk0NzQuanBlZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" alt="DMLS post processing" class="fr-fic fr-dii"></p><p><strong>3D Printing</strong>&nbsp;</p><p><strong>Build time</strong>: Far and away the most significant cost driver for 3D printing, a longer build time means a more expensive part. Take a solid cube, for example. While a simple part, printing the condensed cube layer by layer would take more time than if the cube’s interior used a cross-linked design, which requires less material and subsequently less machine time. Any necessary support structures during the printing process also increases machine time and cost.</p><p><strong>Material cost</strong>: Depending on the technology, 3D printing materials can add expense. While direct metal laser sintering (DMLS) recycles all unused powder, a process like selective laser sintering (SLS) uses a powder-based polymer process that does not allow for recycling, driving up cost.</p><p><strong>Post-processing</strong>: Required with nearly all 3D-printed parts, these processes strengthen parts, improve cosmetic appearance and more, but also require manual work that can be time consuming. Each 3D printing service also comes with necessary post-processing, so researching what is required on the front end will help determine cost.</p><p><br></p><p><br></p><p><strong>Injection Moulding</strong></p><p><strong>Part complexity</strong>: Several design factors can lead to a more complex part with injection moulding. <a href="https://www.protolabs.com/en-gb/automated-design-analysis/?utm_source=wevolver&utm_medium=referral&utm_campaign=uk-design-tip-0424&utm_content=wevolver-comparing-3dp-and-im-cost-dt-0424" target="_blank">Design for manufacturability</a> (DFM) analysis is critical to identify modifications that reduce cost. For example, a small part doesn’t automatically translate to a smaller mould size. If your part design requires an undercut or side action, mould base size (and cost) increases significantly. If a cam or insert is required, your overall mould size can increase by £1,000-£2,000 per component.</p><p><br></p><p><strong>Design Time</strong></p><p>For engineers under increasing pressure to bring products to market, time is money. Quick iteration is key to shorten the timeline to perfect your design and move from concept to final part. That’s why we see our customers start with 3D printing during the prototyping process before moving to injection moulding once a part is ready for production volumes.</p><p>Product iteration with 3D printing is faster and less expensive compared to injection moulding. If you identify a design flaw once a part is 3D printed, the CAD file can be easily tweaked and uploaded with another iteration printed and sent your way in days. Injection moulding requires significant expense with each design change due to the reworking of the mould. Furthermore, injection moulding usually requires more upfront design work since creating a mould can be a complex process with many factors to consider.</p><p><img border="0" width="461" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEyNjY5NjQ5NDgzLTE3MTI2Njk2NDk0ODMuanBlZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" alt="Worker inspecting moulded part." class="fr-fic fr-dii"></p><p><strong>&nbsp;</strong></p><p><strong>Set Up and Tooling</strong></p><p>Set up and tooling costs are another area where 3D printing is the clear winner, as it does not require investment in either. Injection moulding on the other hand comes with tooling costs and often a set-up fee with each run of moulded parts. As we discussed earlier, DFM analysis will help reduce tooling costs, but a mould may still bring thousands in up-front expense.</p><p><br></p><p><strong>Piece-Part Price</strong></p><p>Now here’s an opportunity for injection moulding to shine. Piece-part price for injection moulding is going to be significantly lower compared to 3D printing once we reach a high volume of parts. While we have discussed the cost of tooling at length, each part that comes off that mould will be more cost-effective once you reach quantities that rationalise the initial investment.</p><p>Fortunately, our applications engineers are well-versed in helping our customers determine if piece-part price cost savings justify the initial upfront costs of injection moulding.</p><p><img border="0" width="408" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEyNjY5NjQ5NDkzLTE3MTI2Njk2NDk0OTMuanBlZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" alt="Black vapor smooth 3D printed parts." class="fr-fic fr-dii"></p><p><strong>Post-processing</strong></p><p>Regardless of technology, nearly all 3D-printed parts will require some level of post-processing. Mandatory processes after a part is printed include removing support structures or excess resin, depending on the technology you choose. The emergence of post-processing options, such as <a href="https://www.protolabs.com/en-gb/services/3d-printing/enhanced-surface-quality-for-sls-and-mjf-parts/?utm_source=wevolver&utm_medium=referral&utm_campaign=uk-design-tip-0424&utm_content=wevolver-comparing-3dp-and-im-cost-dt-0424" title="Enhanced Surface Quality for SLS and MJF parts" target="_blank">vapour smoothing</a>, improving strength and aesthetics have been critical in expanding the applications of additive manufacturing, but each comes with an additional expense.</p><p>Injection moulding on the other hand comes with more than 100 thermoplastic and thermoset materials that eject from the mould with high-quality finishes fit for production. Finishing process are available to texture a mould, add threaded inserts, laser engraving and more, but aren’t necessary for the durability and finish of the part.</p><p><br></p><p><strong>Prototyping vs. On-Demand Manufacturing</strong></p><p>Injection moulding is still a viable option at the prototyping stage. When prototyping at Protolabs, we use a single-cavity aluminium mould that can produce hundreds of parts and can be typically delivered in a week or less. Our customers often choose prototyping with injection moulding if they need to complete design or material iterations, as well as assess cost or manufacturability trade-offs.</p><p>Once past the prototyping stage, our customers often move to on-demand manufacturing, producing injection moulded parts at Protolabs speeds. Using a steel mould, part quantities are virtually unlimited. On-demand injection moulding with us allows you to meet inventory needs with no minimum order quantities, and offers supply chain flexibility through bridge tooling, just-in-time production, or dual-sourcing strategies.</p><p><br></p><p><br></p><p>Subscribe for monthly design tips <a href="https://explore.protolabs.com/design-tips-registration/?utm_source=wevolver&utm_medium=referral&utm_campaign=uk-design-tip-0424&utm_content=wevolver-design-tip-subscribe-banner-0424" target="_blank" rel="noopener noreferrer">here.</a></p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEyNjY5Njc2NTYwLTE3MTI2Njk2NzY1NjAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" class="fr-fic fr-dib"></p><p><br></p><p><br></p>

Explore key components such as build time, material cost, and part complexity, which can add or reduce cost to your part.

Comparing the Cost between Injection Moulding and 3D Printing

<p>You’re a design firm. You have engineering expertise. You have the know-how. Now, you need access to the technology to bring your part to life. So, how do you choose a manufacturing partner? And how do you ensure you get the most out of that relationship?</p><p>When choosing a production partner, thankfully, the decision can be narrowed down. Undoubtedly, you will require specific processes, materials, expertise, etc., which not everyone can offer. Once you have narrowed down this list of capabilities, the next question is often, who can give me the best value? Who can deliver my part the quickest? But it is worth looking into your manufacturing partner’s process.</p><p>&nbsp;<strong>Back to the drawing board</strong></p><p>Pick a partner who allows you to upload your CAD file and amend it as often as you want! Ideally, for free! At Protolabs, our automated <a href="https://www.protolabs.com/en-gb/automated-design-analysis/?utm_source=wevolver&utm_medium=referral&utm_campaign=uk-desgin-firms-0224&utm_content=wevolver-design-firms-manufacturing-partners-0324" target="_blank" rel="noopener noreferrer">design for manufacturability</a> software has no cost. You can amend and upload as many times as you like. If you are keen to use us and can’t quite get your part to meet our capability requirements, why not book a meeting with one of our engineers? Our complimentary consultant design service offers up Protolabs engineering expertise. Whilst we are not a design consultancy, our engineers are experts in the services we provide here, and they will work with you to help you achieve your aim of producing a manufacturable part.</p><p><strong>Rapid Prototyping</strong></p><p>Pick a partner who can produce your <a href="https://www.protolabs.com/en-gb/rapid-prototyping/?utm_source=wevolver&utm_medium=referral&utm_campaign=uk-desgin-firms-0224&utm_content=wevolver-design-firms-manufacturing-partners-0324" target="_blank" rel="noopener noreferrer">prototypes</a> quickly! When you’re designing, prototyping is key. Rather than waiting weeks for prototypes to come back so you can test them. Why not work with Protolabs, who can provide parts as fast as a day? While speed depends on complexity and size, we are the quickest in manufacturing, so upload your CAD and find out how soon you could be holding your first test part.</p><p><strong>Aluminium Tooling?</strong></p><p>You may read that heading and think; I<em>&nbsp;do not want aluminium tooling –&nbsp;</em>we would ask you why. At Protolabs, we often use aluminium tooling due to its speed and cost efficiency. If you eventually move to production with us and are concerned that your tool won’t last, don’t worry. At Protolabs, when you move to our on-demand production service, your tool comes with a lifetime guarantee! That means if that aluminium tool you are worried about needs replacing, we will do it at no extra cost.</p><p><strong>No minimum order quantities (MoQs)</strong></p><p>Chances are, when you are starting out, you will be keen to find a supplier who doesn’t have a minimum order quantity to make the process more expensive and less efficient. At Protolabs, we have no MoQs, so order away as little as 1 part and as many as 25,000+.</p><p><strong><br>&nbsp;On-Demand Production</strong></p><p>Find someone who can support you with scaling up. Whilst a small prototyping house might seem like the perfect solution at the start, if you do decide to move on to production, you then have to start again with someone who can offer production capabilities. At Protolabs, we offer both!</p><p>So you’ve prototyped with us, and now you want to start considering production runs? We are not just a prototyping service (as our name might imply) our extensive on-demand manufacturing service is here to support you with your low-volume production needs. We offer bridge tooling to help support you with the transition. &nbsp;We also pride ourselves on the size and scale of our shopfloors and on our infinite capacity. How can we say infinite capacity? Easy, we scale up as the business need requires. Not convinced? Feel free to come and <a href="https://explore.protolabs.com/book-a-visit/?utm_source=wevolver&utm_medium=referral&utm_campaign=uk-desgin-firms-0224&utm_content=wevolver-design-firms-manufacturing-partners-0324" target="_blank" rel="noopener noreferrer">book a tour</a> with us and see what we’re about.</p><p>&nbsp;</p><p><img border="0" width="432" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEwMzIxOTQ3MTA0LTE3MTAzMjE5NDcxMDQuanBlZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" alt="A large room with several machinesDescription automatically generated" class="fr-fic fr-dii"></p><p>&nbsp;</p><p><strong>Quality is key</strong></p><p>Select a supplier who doesn’t cut corners. You want speed, you want low cost, but you also don’t want to cut down on quality. Here at Protolabs, we adhere to ISO 9001 standards in regard to the quality of our production parts, but we also adhere to other quality standards. Some are process-specific, for example, we offer ISO 13485 in our Direct Metal Laser Sintering service, which is important for parts required in the medical industry.</p><p>We also offer various inspection reports, measurement reports, manufacturing analyses, etc. to read more on these, please visit our process pages.</p><p>Finally, find a partner with global reach. Many manufacturing partners have a global presence, which can help design firms access international markets and customers. Here at Protolabs, we have production facilities across the globe, but it doesn’t stop there. Have a part that doesn’t fit our capabilities? We also have our <a href="https://www.protolabs.com/en-gb/about-us/what-is-the-digital-network/?utm_source=wevolver&utm_medium=referral&utm_campaign=uk-desgin-firms-0224&utm_content=wevolver-design-firms-manufacturing-partners-0324" target="_blank" rel="noopener noreferrer">Digital Network</a> and kind find the capabilities you require at one of our network facilities across the globe.</p><p><img border="0" width="566" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEwMzIxOTQ3MTE5LTE3MTAzMjE5NDcxMTkucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" class="fr-fic fr-dii"></p><p>Most design firms won’t have onsite production facilities and will require a partner to support this provision, bridging the gap between the design concept and the actual product. These partnerships should offer manufacturing expertise, cost-effectiveness, time efficiency, quality assurance, scalability, access to technology and risk mitigation.</p><p>A partnership with Protolabs can help bring your ideas to life quickly and efficiently whilst maintaining high-quality standards. Check out our dedicated <a href="https://www.protolabs.com/en-gb/industries/design-firms/?utm_source=wevolver&utm_medium=referral&utm_campaign=uk-desgin-firms-0224&utm_content=wevolver-design-firms-manufacturing-partners-0324" target="_blank" title="Design Firms" rel="noopener noreferrer">Design Firms industry page</a> to give you the insight you need to choose Protolabs as your manufacturing partner.</p>

Protolabs Global Digital Manufacturing Locations

As a design firm, how do you choose a manufacturing partner? And how do you ensure you get the most out of that partnership?

How can design firms get the best from their manufacturing partnership?

This article delves into the world of RF PCBs, exploring the design considerations that ensure signal integrity, the materials that minimize signal loss, and the intricate processes that bring these high-performance boards to life.

RF PCB: Design, Materials, and Manufacturing Processes

<p id="isPasted">In order to successfully 3D print a metal part to the exacting specifications that many in industry demand, process parameters, including printing speed, laser power, and layer thickness of the deposited material, must all be optimized.</p><p>But to develop additive manufacturing process maps that ensure those optimal results, researchers have had to rely upon conventional methods—lab experiments that use ex situ materials characterization to test parts that have been printed using various parameters.</p><p>Testing so many combinations of parameters in order to develop the optimal process can be both time consuming and expensive, especially considering the wide range of metals and alloys that can be used in additive manufacturing.</p><p>David Guirguis, <a href="https://engineering.cmu.edu/directory/bios/beuth-jack.html" target="_blank">Jack Beuth</a>, and <a href="https://engineering.cmu.edu/directory/bios/tucker-conrad.html" target="_blank">Conrad Tucker</a> developed a system using ultra high-speed in-situ imaging and vision transformers that can not only optimize those process parameters but is also generalizable so that it can be applied to various metal alloys.</p><p>Vision transformers are a form of machine learning that apply neural network architectures originally developed for natural language processing tasks to computer vision tasks such as image classification. And the video vision transformers take that a step further by using video sequences instead of still images to capture both spatial and temporal relationships that enable the model to learn complex patterns and dependencies in video data.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 768px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1709336830375-0223-em-ai-metal-alloys.gif" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Videos of molten pools of the titanium alloy Ti-6Al-4V captured at different printing regimes.</span></span></span></p><p id="isPasted">The self-attention mechanism, which allows natural language processing models to weigh the importance of different words in a sequence, allows the model Guirguis created to weigh the importance of different parts of the input sequence for making predictions about the occurrence of defects.</p><p>“We needed to automate the process, but it can’t be done with computer programming alone,” explained Guirguis, a postdoctoral associate in <a href="https://www.meche.engineering.cmu.edu/index.html" rel="noopener" target="_blank">mechanical engineering</a>. “In order to capture the patterns, we need to apply machine learning.”</p><p>"We are excited to have developed an AI method that leverages temporal features in AM imaging data to detect different types of defects. Demonstrating the generalizability of the AI method using different AM metals is groundbreaking and reveals that the same trained AI model can be employed without costly retraining using additional data,” remarked Tucker, a professor of mechanical engineering.</p><p>Guirguis says he is fortunate to have had such strong training in machine learning at Carnegie Mellon because it is more important than ever that mechanical engineers know how to apply both experimental and computational solutions to the problems they solve.</p><blockquote><p>We are excited to have developed an AI method that leverages temporal features in AM imaging data to detect different types of defects.</p><cite><strong>Conrad Tucker</strong><cite id="isPasted"><cite><em>Professor<cite>, Mechanical Engineering</cite></em></cite></cite><cite id="isPasted"><em><br></em></cite></cite></blockquote><p>In this case, Guirguis was trying to overcome the primary limitation of in-situ imaging of the laser powder bed fusion (LPBF) additive manufacturing process. The technology uses a high-power laser as an energy source to melt and fuse powders in specific locations to form certain shapes, a re-coater then spreads a new layer of powder, and the process repeats until 3D objects are formed.</p><p>But the molten metal seen by a camera during the printing process is saturated, so it’s not possible to see its physical features, which can identify possible defects that can deteriorate the mechanical properties and reduce fatigue life of the printed part.</p><p>Guirguis used funding from the Army Research Laboratory to develop a high-speed imaging setup that can capture clear features of the molten pool and a machine learning model that could see the patterns associated with the defects they were trying to detect and prevent.</p><p>He incorporated the temporal features of molten metal as it changed over time by using high-speed imaging and video vision transformers.</p><p>By using the vision transformers to classify the different types of defects that can occur during the 3D printing process, Guirguis enhanced the algorithmic accuracy to greater than 90% depending on the material.</p><p>“In additive manufacturing processing of a new alloy, the first goal is to find a ‘window’ of process variables yielding flaw-free parts,” explained Beuth, a professor of mechanical engineering. “Dave’s use of vision transformers to relate the variability in high-speed melt pool images to flaw formation can greatly reduce the time needed to find that window. &nbsp;It is a huge step forward.”</p><p>The researchers developed an off-axial imaging setup using a high-speed video camera and magnification lens to capture the high-frequency oscillation in the melt-pool shape with video recorded with extremely high temporal resolution of over 50,000 frames per second. The videos were then classified into four categories: a desirable regime and printing regimes of the three different types of defects: keyholing, balling, and lack-of-fusion.</p><p>Keyholing defects, which are characterized by unstable, deep, and narrow penetration, can lead to enclosed pores inside the printed parts and result in cracks that can degrade the fatigue life of the parts. The keyhole regime is typically characterized by fluctuations in the width and depth of the keyhole.</p><p>With balling defects, known as humping in welding, the melted tracks exhibit a rough surface with a periodic ball cross-section shape and are associated with undercuts at the corners. In the balling regime, the molten pool elongates and disconnects, leaving behind peaks in the track.</p><p>Lack-of-fusion defects, where the energy density is not sufficient to fully melt the powder, cause unmelted powder and irregular gaps between the melted tracks. Melt pools captured in the lack-of-fusion regime are very small with a low length-to-width ratio, as the energy density is very low, and the laser beam does not penetrate deeply into the material.</p><p>To explore the generalizability of the method, they conducted single-bead experiments with different P-V combinations, covering the four printing regimes on stainless steel SS316L, titanium alloy Ti-6AL-4V, and Inconel alloy IN718. They performed a cross-dataset evaluation, where the model was trained on the recorded videos of one alloy and tested on the videos while the hyperparameters were kept unchanged.</p><p>Their findings that video vision transformers with temporal embedding can enable in situ detection of melt-pool defects with a simple off-axial imaging setup and generate process maps that can potentially accelerate the qualification of printability and process development for newly developed 3D printed alloys were recently published in <a href="https://www.nature.com/articles/s41467-024-44783-5" rel="noopener" target="_blank"><em>Nature Communications</em></a>.</p>

Researchers use AI and high-speed in-situ imaging to optimize process parameters for 3D printing metal alloys.

AI accelerates process design for 3D printing metal alloys

In this episode, we talk about the initiative from PolySpectra to generate 3D CAD models from text using AI.

Podcast: Creating 3D Objects With AI

<p id="isPasted">Whether you're an experienced engineer, student or enthusiast, you'll likely be wondering what an <a href="https://www.protolabs.com/en-gb/services/injection-moulding/?utm_source=wevolver&utm_medium=referral&utm_campaign=uk-im-0224&utm_content=wevolver-anatomy-of-a-mould-blog-0224" target="_blank">injection mould</a> tool consists of. In this comprehensive guide, we will delve deep into the anatomy of a mould tool, unravelling its components, functions, and the process that occurs when it's in action.</p><p><br></p><h2><strong>What are the different block sizes for injection moulding?</strong></h2><p>The specific block sizes used in injection moulding vary based on a number of factors including mould design, machine specifications, material requirements, and the dimensions of the final product being manufactured. Here at Protolabs we can produce parts within the following dimensions.<br>&nbsp;Size: 480mm x 980mm<br>&nbsp;Volume: 966,837mm³<br>&nbsp;Depth: 101mm from parting line with 3° of draft, up to 280mm of the part<br>Projected Mould Area: 112,903mm<sup>2</sup></p><p><br></p><h3><strong>What are the different elements of an injection mould tool?</strong></h3><p><span class="fr-img-caption fr-fic fr-dii" style="width: 758px;"><span class="fr-img-wrap"><img border="0" width="570" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA4OTM4OTA3NTY4LTE3MDg5Mzg5MDc1NjgucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="Protolabs Demo Mould Mould A-Side" class="fr-fic fr-dii"><span class="fr-inner">Mould A-side</span></span></span></p><h3>&nbsp;Mould A-Side</h3><p><strong>Cavity</strong> – the void or negative space within the mould that forms the desired shape of the product being manufactured. Essentially the inverse of the final product. When molten plastic is injected into the mould, it fills the cavity to take on the specific shape and dimensions of the finished product.</p><p><strong>Clamp Pocket</strong> – a feature within the mould that assists in securely holding or clamping the mould halves together during the moulding process.</p><p><strong>Leader Pin</strong> – Used to align and guide the two halves of the mould together during the closing process. These pins are typically cylindrical and are located on one half of the mould, fitting into the holes on the opposite half.</p><p><strong>Locking Wedge Interface</strong> – a mechanism used to secure and tightly seal the two halves of the mould during the injection process. Prevents any mould misalignment or movement whilst the <a href="https://www.protolabs.com/en-gb/materials/?utm_source=wevolver&utm_medium=referral&utm_campaign=uk-im-0224&utm_content=wevolver-anatomy-of-a-mould-blog-0224" target="_blank">material</a> is injected into the cavity.</p><p><strong>Sliding Shutoff</strong> – a component within the mould that allows for the creation of undercuts or complex features in the moulded part. It’s used to create internal or external details that cannot bee formed with a simple two-part mould.</p><p><strong>Sprue Hole</strong> – a channel or passage within the mould that allows molten material to be injected into the mould cavity. It’s the entry point into the cavity.</p><p><span class="fr-img-caption fr-fic fr-dii" style="width: 758px;"><span class="fr-img-wrap"><img border="0" width="570" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA4OTM4OTA3NTc3LTE3MDg5Mzg5MDc1NzcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="Protolabs Demo Mould B-Side" class="fr-fic fr-dii"><span class="fr-inner">Mould B-side</span></span></span></p><h4><br></h4><h3><strong>Mould B-Side</strong></h3><p><strong>Clamp Toe</strong> – the area where the clamp force is applied to, in order to ensure the mould remains closed during the injection process.</p><p><strong>Core</strong> – one of two main components used to create a desired shape. The core is the part of the mould that shapes the internal features of the final product. It is the interior surface of the part and creates voids, holes and other internal details.</p><p><strong>Ejector Pin Holes</strong> – small cylindrical recesses or openings in a mould that accommodate ejector pins.</p><p><strong>Leader Hole</strong> – hole used for aligning or guiding components during the assembly or disassembly of the mould.</p><p><strong>Return Pin Hole</strong> – accommodates the return pin. The return pin is used in moulds with moving elements like slides or cores, to retract or return these elements to their initial / starting position at completion of the mould cycle.</p><p><strong>Side-Action</strong> – also known as sliders, lifters, or side cores, are movable components within the mould that create features on the part that would otherwise be impossible or difficult to form using a two-part mould. These side-actions move perpendicularly or at an angle.</p><p><strong>Side-Action Track</strong> – path or guide along which the side-action components move within the mould. The tracks are designed within the mould to facilitate the controlled and precise movement of the side-actions.</p><p><span class="fr-img-caption fr-fic fr-dii" style="width: 758px;"><span class="fr-img-wrap"><img border="0" width="286" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA4OTM4OTA3NTg1LTE3MDg5Mzg5MDc1ODUucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="Protolabs Demo Mould Part" class="fr-fic fr-dii"><span class="fr-inner">Part</span></span></span></p><p><br></p><h3><strong>Part</strong></h3><p><strong>Clip Feature</strong> – a specific part or featured designed into a moulded product that enables it to be attached, secured, or fastened to another component or surface.</p><p><strong>Cold Slug</strong> – a portion of unmelted or partially melted plastic that enters the mould during the early stages of the injection process. Usually occurs when there’s inadequate or inefficient heating and melting of the plastic material in the injection unit.</p><p><strong>Edge Gate</strong> – a gate that allows molten plastic into the mould cavity. It’s called an “edge” gate because it’s positioned at the edge of the part.</p><p><strong>Sprue</strong> – the primary channel or passage through which molten plastic enters the mould cavity. It’s the initial pathway that connects the moulding machine’s nozzle to the runners in the mould.</p><p><span class="fr-img-caption fr-fic fr-dii" style="width: 758px;"><span class="fr-img-wrap"><img border="0" width="286" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA4OTM4OTA3NTkyLTE3MDg5Mzg5MDc1OTIucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="Protolabs Demo Mould Ejector System" class="fr-fic fr-dii"><span class="fr-inner">Ejector System</span></span></span></p><p>&nbsp;</p><h3><strong>Ejector System</strong></h3><p><strong>Ejector Pin</strong> – used to push or eject the finished part out of the mould cavity, once the moulding process is complete. Ejector pins are located in specifically designed holes or recesses in the mould and extend into the mould cavity and exert force on the part to push it out of the mould.</p><p><strong>Ejector Plate</strong> – a flat plate or section within the mould that contains multiple ejector pin assemblies used to push the finished part out of the mould cavity.</p><p><strong>Retaining Tab</strong> – a specific feature or component designed within a mould to secure or hold a movable part, preventing it from disengaging or moving unintentionally during them moulding process or while the mould is in use.</p><p><strong>Return Pin</strong> – serves the purpose of retracting or returning movable components to their initial or starting positions after a moulding cycle is complete.</p><p><span class="fr-img-caption fr-fic fr-dii" style="width: 758px;"><span class="fr-img-wrap"><img border="0" width="286" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA4OTM4OTA3NTk5LTE3MDg5Mzg5MDc1OTkucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="Protolabs Demo Mould Side-Action Cam" class="fr-fic fr-dii"><span class="fr-inner">Side-Action Cam</span></span></span></p><p>&nbsp;</p><p>&nbsp;</p><p>&nbsp;</p><h3><strong>Side-Action Cam</strong></h3><p><strong>Guide</strong> – assists in directing the movement of a side-action mechanism within the mould.</p><p><strong>Locking Wedge</strong> – a mechanism used to secure or lock the movement of a side-action mechanism within the mould.</p><p><br></p><h3><strong>What constitutes a well-designed part for injection moulding?</strong></h3><p>There are many factors to consider when designing a part. Before any design is sent for tooling, you need to perform the <a href="https://www.protolabs.com/en-gb/automated-design-analysis/?utm_source=wevolver&utm_medium=referral&utm_campaign=uk-im-0224&utm_content=wevolver-anatomy-of-a-mould-blog-0224" target="_blank">design for manufacturability</a> (DFM) process. This is a systematic process that focuses on optimising a product's design to enable efficient and cost-effective manufacturing. The DFM process involves collaboration between design engineers and manufacturing engineers to identify potential challenges which might impacts the overall quality of the end-product and making refinements in order to overcome these challenges. The main steps in the process are:</p><ul><li>Design Analysis</li><li>Design Optimisation</li><li>Material Selection</li><li>Prototyping and Testing</li><li>Review</li></ul><p>But what constitutes a well-designed injection moulded part? There are several critical factors to ensure successful and efficient manufacturing processes.</p><ul><li>Uniform Wall Thickness – consistent wall thickness throughout, promotes even colling, reduces warp, and minimises sink marks and voids.</li><li>Rounded Corners and Fillets – reduce stress concentration points, minimise material stress and, improve mould filling.</li><li>Ribs and Bosses – ribs provide structural support and bosses serve as mounting points or structural elements.</li><li>Draft Angles – facilitates easy part ejection and minimises the risk of damage or sticking.</li><li>Avoiding Undercuts – to reduce mould complexity, simplify ejection, and minimise production challenges.</li><li>Gating and Venting – gates ensure even flow of material and even filling, whilst vents prevent trapped air or gases.</li><li>Material Selection – crucial for meeting functional requirements, durability, and cost-effectiveness.</li><li>Minimal Texturing – limiting textures surfaces or complex features reduces mould complexity and ejection challenges.</li><li>Surface Finishes – aid in achieving desired aesthetic and functional qualities of a part.</li><li>Consideration of Tolerances – designing within achievable tolerances ensures part consistency and facilitates cost-effective production.</li></ul><p>A well-designed part not only considers the part’s functional requirements, but also aims to optimise the manufacturing process, reduce production challenges and ensure the final part meets quality standards efficiently and economically. For further information on how you can produce a well designed part with Protolabs, please view our <a href="https://www.protolabs.com/en-gb/resources/design-for-mouldability-toolkit/?utm_source=wevolver&utm_medium=referral&utm_campaign=uk-im-0224&utm_content=wevolver-anatomy-of-a-mould-blog-0224" title="Design for Mouldability Toolkit" target="_blank">Injection Moulding Toolkit</a>, which not only explains our advisories and how to avoid them, but also gives further information on designing complex features for moulded parts.</p><p><strong>&nbsp;</strong></p><p>&nbsp;</p>

Have you ever wondered what an injection mould tool consists of? Explore our comprehensive guide to learn more about the ins and outs of mould tool anatomy. 

Unveiling the Secrets: The Anatomy of a Mould Tool

<p><span contenteditable="false" draggable="true" class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable"><iframe width="640" height="360" src="https://www.youtube.com/embed/w4q6apP-xBw?&amp;wmode=opaque&amp;rel=0&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"></iframe></span></p><div data-id="c66a2bb" data-element_type="widget" data-widget_type="heading.default" id="isPasted"><h2>The All-Material Platform Workflow</h2></div><div data-id="a063078" data-element_type="widget" data-widget_type="text-editor.default"><p>In this article we showcase the process of transforming a digital file into a fully functional part by means of the Sintratec <a href="https://sintratec.com/sls-3d-printer/amp/" target="_blank"><strong>All-Material Platform</strong></a> – our modular SLS system. If you are new to the Selective Laser Sintering process, we have <a href="https://sintratec.com/demystifying-the-selective-laser-sintering-process/" target="_blank"><strong>another article</strong></a> that will get you started. To illustrate this workflow, we are going to print <strong>100 cable pulleys</strong> with <strong><a href="https://sintratec.com/3d-printing-materials/sintratec-pa12-powder/" target="_blank">Sintratec PA12</a></strong> for our production, using the new <a href="https://sintratec.com/sls-3d-printer/amp/sintratec-s3/" target="_blank"><strong>Sintratec S3</strong></a> and <a href="https://sintratec.com/sls-3d-printer/amp/mcu-220/" target="_blank"><strong>MCU-220</strong></a> Build Module. As our modules are all cross-compatible, the process remains the same across our AMP product range.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA1NTk1OTM2MDQzLTE3MDU1OTU5MzYwNDIucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 766px;" class="fr-fic fr-dib"></p><div data-id="ff8201a" data-element_type="widget" data-widget_type="heading.default" id="isPasted"><h2>Step 1: Digital Preparing</h2><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA1NTk2MDAxNTc3LU5lc3RlZF9wcmludGpvYi5qcGcud2VicCIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 766px;" class="fr-fic fr-dib"></p></div><div data-id="fbef267" data-element_type="widget" data-widget_type="text-editor.default"><p>First, we prepare the print job inside the <a href="https://sintratec.com/software/sintratec-central/" target="_blank"><strong>Sintratec Central Software</strong></a>. In the print settings, we select the Fusion Module (S3), the Build Module (MCU-220) and the print material (PA12). The 3D model (STL) is then imported, placed and duplicated. With Selective Laser Sintering (SLS), it is beneficial to stack your parts densely to reduce waste and print time. This can be done automatically using our <a href="https://sintratec.com/software/sintratec-nesting-solution/" target="_blank"><strong>Nesting Solution</strong></a>. Next, the software slices the print job, transforming the 3D models into 2D layers. The preview allows us to check for collisions and errors. If all is well, the job can be exported and sent to the 3D printer via a local network or USB drive.</p><div data-id="f17ceb6" data-element_type="widget" data-widget_type="heading.default" id="isPasted"><h2>Step 2: Material Loading</h2><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA1NTk1OTg2MjIxLVNtb290aFBvd2RlclN1cmZhY2UuanBnLndlYnAiLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 766px;" class="fr-fic fr-dib"></p></div><div data-id="2c67180" data-element_type="widget" data-widget_type="text-editor.default"><p>To load the Build Module with powder, we move it to the <a href="https://sintratec.com/sls-3d-printer/amp/mhs/" target="_blank"><strong>Material Handling Station</strong></a>. The graphical user interface guides us step by step through the process. We insert the USB stick and select the correct print job. With the proper safety precautions we begin by filling the powder containers with SLS printing powder. The amount of material is automatically calculated by our software. We condense the powder and add a few more layers if necessary. Once the surface is smooth and even, we can remove the material unit and transfer it to the <a href="https://sintratec.com/sls-3d-printer/amp/sintratec-s3/" target="_blank"><strong>Fusion Module</strong></a>.</p><div data-id="426e8f7" data-element_type="widget" data-widget_type="heading.default" id="isPasted"><h2>Step 3: Glasses Cleaning and 3D Printing</h2></div><div data-id="fc3658e" data-element_type="widget" data-widget_type="text-editor.default"><p>Before starting the print job, we first remove the laser protection glass and the IR sensor glass from the Sintratec S3. During the Selective Laser Sintering process, fumes can coat these glasses. As a result they have to be cleaned with tissues and isopropanol. Once done, we are ready to start the sintering process by selecting the print job on the touch screen. After heating up, the laser starts to operate, which can be followed in real time via the live view on the display. Once sintering is complete, we can remove the build module to cool down, leaving the Fusion Module ready for the next print job.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA1NTk2MDI5MDM0LTE3MDU1OTYwMjkwMzQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 766px;" class="fr-fic fr-dib"></p><div data-id="eb73a43" data-element_type="widget" data-widget_type="heading.default" id="isPasted"><h2>Step 4: Depowdering and Post-Processing</h2></div><div data-id="f86dfe0" data-element_type="widget" data-widget_type="text-editor.default"><p>Now that the print has finished and cooled down, we move the Build Module back to the Material Handling Station. While the powder cake comes up, we connect <a href="https://sintratec.com/sls-3d-printer/peripherals/vacuum-cleaning-solution/" target="_blank"><strong>the vacuum</strong></a> to the used powder barrel. With the brush and the additional tools we now extract our parts, while collecting the unsintered powder with the vacuum. The laser sintered parts are then <a href="https://sintratec.com/sls-3d-printer/peripherals/sintratec-blasting-station/" target="_blank"><strong>sandblasted</strong>&nbsp;</a>and polished in our<a href="https://sintratec.com/sls-3d-printer/peripherals/sintratec-polishing-station/" target="_blank">&nbsp;<strong>magnetic tumbler</strong></a> to achieve an optimum surface finish.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1705596095696-CleaningPowderCake.jpg.webp" style="width: 766px;" class="fr-fic fr-dib"></p><div data-id="bf596a7" data-element_type="widget" data-widget_type="heading.default" id="isPasted"><h2>Step 5: Powder Mixing</h2></div><div data-id="12f26f5" data-element_type="widget" data-widget_type="text-editor.default"><p>To prepare for a new print, we can mix fresh powder inside the <a href="https://sintratec.com/sls-3d-printer/amp/mhs/" target="_blank"><strong>Material Handling Station</strong></a>. First, we set up the motorized sieve. We fill the right powder container with used powder, using a sieve to filter out any large particles. Next, the build cylinder can be filled with virgin powder. The amount of powder is again determined by the software (depending on the material). We then start the automatic mixing process. After cleaning the surface of the used material, we can finally collect the printing powder from the left container.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1705596118748-collecting.jpg.webp" style="width: 766px;" class="fr-fic fr-dib"></p><div data-id="bf596a7" data-element_type="widget" data-widget_type="heading.default" id="isPasted"><section data-particle_enable="false" data-particle-mobile-disabled="false" data-id="e59149d" data-element_type="section" id="isPasted"><div data-id="f3af38e" data-element_type="column"><div data-id="e2857be" data-element_type="widget" data-widget_type="heading.default"><h2>Final Parts and Application</h2></div></div></section><div data-id="aca1ad7" data-element_type="widget" data-widget_type="text-editor.default"><p>Once post-processing is done, we end up with the final parts. These&nbsp;<a href="https://sintratec.com/3d-printing-materials/sintratec-pa12-powder/" target="_blank"><strong>PA12</strong></a> cable pulleys transport the coater on our&nbsp;<a href="https://sintratec.com/sls-3d-printer/amp/mcu-220/" target="_blank"><strong>Build Modules</strong></a> and are used in our production facility in Switzerland. As the part is in direct contact with the powder, our engineers have integrated flow channels to ensure that the mechanism does not get stuck. Due to this complexity, it is much more economical to produce the piece by 3D printing through selective laser sintering instead of traditional manufacturing.</p></div></div><div data-id="12f26f5" data-element_type="widget" data-widget_type="text-editor.default"><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1705596149057-1705596149057.png" style="width: 766px;" class="fr-fic fr-dib"></p></div></div></div></div></div></div></div>

We take a deep dive into the Sintratec All-Material Platform and explain in great detail how our modular Selective Laser Sintering system works. Starting from a digital file, we cover all the key steps from preparing, loading, 3D printing, depowdering and mixing to the final part.

From digital Design to industrial 3D Print

<p id="isPasted"><a href="https://www.intav-europe.com/en/index.php" target="_blank">INTAV SRL</a> is an Italian company with more than 30 years of experience in designing and manufacturing luminous and acoustic warning devices for emergency, rescue, and operative vehicles.</p><p>To improve its technological measurement and design capacities, the company was looking for a metrology solution able to quickly capture part dimensions – especially when original drawing data could not be provided by the customer or supplier. Until then, measurements were made the old-fashioned way with manual devices such as caliper gauges and measuring tapes. This was extremely time consuming, and the results were not always precise. Consequently, the objective was to find a tool that would speed up the measurement process and would provide 3D data instantly for their projects, as well as for reverse engineering tasks.</p><p>The&nbsp;<a href="https://www.creaform3d.com/en/handheld-portable-3d-scanner-goscan-3d" target="_blank">Go!SCAN SPARK</a> scanner convinced the company after a practical test, as it fulfilled all the requirements, and provided great value for money and precise data. The implementation was seamless, and, after some practice, all operators were able to use the scanning tool.</p><h2><strong>Creation of side case shelters for motorcycles</strong></h2><p>Recently the Go!SCAN SPARK was used for the creation for steel side case shelters for motorcycles.</p><p>For this project, a motorcycle was partially scanned to get 3D references, in order to get data into the 3D CAD software SolidWorks.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1704882489255-GoSCAN-SPARK_Angle_Front_Left.webp" style="width: 300px;" class="fr-fic fr-dib"></p><p id="isPasted">INTAV took advantage of the good quality of the scan to have very realistic chassis interfaces that could be used as a template to create the best possible fit with the part they needed to develop. The final product was assembled without problems, right out of the box.</p><p>According to Hermann Molteni, Mechanical Designer at INTAV, the&nbsp;<a href="https://www.creaform3d.com/en/handheld-portable-3d-scanner-goscan-3d" target="_blank">3D scanner</a> greatly facilitated the process of integrating parts within both large and small narrow spaces. It enabled the generation of 3D drawings of parts, where no original drawings existed, to quickly have a replica produced in the design software SolidWorks. Overall, the scanner facilitated the work of the engineers and designers.</p>

INTAV SRL is an Italian company with more than 30 years of experience in designing and manufacturing luminous and acoustic warning devices for emergency, rescue, and operative vehicles.

Revolutionizing Design: INTAV's Journey with 3D Scanning for Motorcycle Accessories

<p id="isPasted">If you were building a house, you’d want a solid blueprint outlining a carefully planned layout of where every room, hallway, window, and door should be. Making changes later, while the home is under construction, would be costly and time consuming. Similar considerations apply to chip design, including multi-die systems, where the foundation is built through meticulous architecture planning.</p><p>For complex multi-die systems, the stakes are even higher to get the architecture as close to right as possible from the very beginning.</p><p>Multi-die systems have emerged in response to the scale and systemic complexities that are threatening the efficacy of Moore’s law. Through heterogeneous integration of dies in a single package, multi-die systems enable accelerated scaling of system functionality, reduced risk and time to market, lower system power, and faster creation of new product variants. They’re becoming the architecture of choice for compute-intensive applications such as high-performance computing, automotive, and mobile.</p><p>Moving into the mainstream of the semiconductor world, multi-die systems require a new approach at the architecture planning phase. Even early in the architecture specification process—while drawing the blueprint of the new house—chip designers can’t ignore physical effects such as layout, power, temperature, or even IR-drop. In this blog post, we’ll discuss architecture planning considerations and challenges, and provide insights on methodologies and technologies to achieve multi-die system success. You can also gain additional insights by watching our on-demand, six-part webinar series, <a href="https://www.synopsys.com/multi-die-system/multi-die-webinar-series.html" target="_blank">“Requirements for Multi-Die System Success.”</a> The series covers multi-die system trends and challenges, early architecture design, co-design and system analysis, die-to-die connectivity, verification, and system health.</p><h2 id="isPasted">So Many Dimensions, So Many Decisions</h2><p>Because multi-die systems have so many interdependencies, every chip design choice should be made from a system-wide perspective to address the impacts that could permeate through the system. Power and performance analysis must be conducted at a system-level standpoint, given the new dimensions that these systems bring to the architecture design space. For instance, at 3D, thermal and power delivery problems tend to be more severe because it becomes much more difficult to dissipate heat. You’d need to find a way to transfer the power through the lower level dies up to those at the top level to remove the power dissipation heat.</p><p>There are a host of considerations for multi-die systems, from the different ways to realize the interfaces to the choices of protocols, whether to place the dies next to one another or stack the dies vertically, what type of packaging to use, and much more. What are deemed the right choices will be driven by the power, performance, function, cost, and thermal considerations of the target application.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzAxMjc3OTEyODU5LW11bHRpLWRpZS1maWcud2VicCIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 766px;" class="fr-fic fr-dib"></p><section id="isPasted"><p>Key decisions fall into two main buckets. First, there are the multi-die system-architecture decisions. Here, designers could opt for aggregation, assembling the multi-die system from dies (or chiplets), or disaggregation, partitioning an application onto multiple dies. Design teams must also choose the protocols, location, and dimensioning of the die-to-die interfaces, the process technologies for each die, as well as the packaging technology. Then, there are the SoC-level architecture decisions. These choices involve hardware/software partitioning; IP selection, configuration, and connectivity; interconnect/memory dimensioning to configure the shared interconnect and memory subsystem; and system-level power analysis.</p><p>Design partitioning provides an illustration of the differences between monolithic SoCs and their multi-die system counterparts. In a monolithic SoC, designers must decide which functionality goes into which component, which subsystem handles the processing, and what type of IP to include to process the functionality. They also need to partition the data, determining where to store it and also how to connect all of the components so they can efficiently access the data they need.</p><p>A multi-die system adds many more dimensions to the design space, more degrees of freedom, if you will. Consider the cutlines between the different dies in the system—if designed improperly, these can introduce bottlenecks, as die-to-die communication is afflicted with higher latency and reduced bandwidth compared to unconstrained on-chip communication. At this early stage in a design, however, it can be difficult to know the implications of all the decisions. The outcome of the first partitioning step is the top-level design spec. From then, it’s on to implementation, which requires quite a lot of effort. The final performance of the system only becomes clear later downstream.</p></section><section><h2>How Virtual Prototyping Tools Uncover Architecture Insights</h2><p>One of the biggest challenges at the architecture planning phase is, so many important decisions must be made at the start of a project, when only a minimal amount of design data is available. It is also quite risky to rely solely on static spreadsheet analysis, given that many key performance indicators (KPIs), such as performance, power, and thermal, depend on dynamic effects of the application workload running on limited processing and communication resources.</p><p>How can design teams overcome this particularly vexing challenge?</p><p>Virtual prototyping of the multi-die system architecture presents an answer. Like an early electronics digital twin, a virtual prototype can be used to analyze the impact of architecture design decisions. The process begins with a definition of the workload and architecture: Which applications need to be executed? What are the non-functional requirements, like end-to-end latency and throughput? Which hardware components should execute this workload, and what are their power and performance properties?</p><p>For a realistic estimation of what the answers to these questions mean for the multi-die system, these functional and non-functional requirements need to be translated into the physical hardware properties of the system. The properties include the target process technology for the dies, their area, and the aspect ratios of the different components.</p><p>From this initial assessment, the design team can progress to a virtual assembly of the multi-die system. During this step, there are some important questions to answer: How are the components partitioned into dies? How are the workload and data structures mapped onto these components? The answers together determine the traffic across the die boundaries.&nbsp;</p><p>There are, of course, many trade-offs to consider. For example, larger on-chip memories and caches are more expensive in terms of die area, but can help to reduce die-to-die traffic.&nbsp;By building an executable model of how the workload is running on the multi-die system architecture resources, the chip architects can collect a lot of data on how the actual system will behave. There are many key considerations here, including:</p><ul><li>What is the resulting utilization of resources?</li><li>What are end-to-end latencies to execute a certain task?</li><li>How much data needs to be transferred between the different&nbsp;chiplets?</li></ul><p>Based on all the analysis, the team can modify all the aspects of the system architecture, quickly arriving at a feasible specification that meets the product requirements in an optimized way.</p></section><section><h2>Insights into Root Causes</h2><p>There are, fortunately, technologies from the monolithic SoC world that can be applied to multi-die systems. SoC architecture analysis and optimization technology, for instance, can be used for system analysis and optimization of multi-die systems. These technologies can quickly model the expected performance early on to help engineers arrive at a feasible architecture concept. Such early architecture analysis can yield data to be used in downstream implementation tasks by silicon, package, and software teams.</p><p>Of course, power, temperature, IR-drop effects, and such must be analyzed early and systematically during the architecture definition phase. The classic SoC design flow, where design phases are decoupled and can be considered in isolation, simply doesn’t work in the multi-die arena. A multi-die architecture must be designed and verified from a system-wide lens through functional and physical architecture co-optimization. By capturing the physical architecture early during the architectural specification phase, designers can validate their assumptions in the functional architecture. If the initial proposal isn’t feasible for any reason, the results and guidance from the physical architecture analysis can be fed back to the functional architects to determine a better specification.</p><p><a href="https://www.synopsys.com/verification/virtual-prototyping/platform-architect.html" target="_blank">Synopsys Platform Architect</a> is an example of such an analytical solution, providing a virtual prototyping environment for early architecture analysis. The solution allows design teams to capture the hardware resources of their multi-die system, including key processing elements, the communication fabric, and the memory hierarchy. The solution also captures the die-to-die interfaces, which represent the effect of the cutline between the chiplets on latency and bandwidth.</p><p>Processing and communication requirements of the end application are captured by Platform Architect as workload models. Mapping the workload models on the architecture model creates an executable specification of the multi-die system architecture that enables the efficient analysis KPIs. Through the mapping process, designers can optimize their system for KPIs such as power and cost.</p><p>The system performance model representing the executable specification is highly configurable and simulates 1000x to 10,000x faster than RTL. The turnaround time for changing the partitioning of the system or an IP configuration is short, and many simulations can run in parallel on normal compute hosts. The solution provides a variety of analytical views that helps teams investigate root causes of performance and power issues.</p><p>Platform Architect is part of the comprehensive <a href="https://www.synopsys.com/multi-die-system.html" target="_blank">Synopsys Multi-Die Solution</a>, including EDA and IP products, designed for fast heterogenous integration. With this solution, teams can architect, design, verify, and test their multi-die systems holistically, accounting for interdependencies that can impact PPA.</p></section><section><h2>Conclusion</h2><p>Compared to their monolithic counterparts, multi-die systems are a different animal: complex, yet elegantly designed to extract better PPA for applications with compute-intensive workloads. Because of this, every step in their creation—including architecture planning—must be approached from a system-wide perspective. The earlier issues are addressed, the more feasible it is to make impactful changes to optimize the system. However, because meaningful design data isn’t typically available until downstream in the process, virtual prototyping has emerged as a method to analyze the impact of early architecture decisions. Through virtual prototyping technology, design teams can get a good grasp of power and performance while they can still course correct for optimal outcomes—and achieve an optimal blueprint for their multi-die system.</p><p><em>This blog was co-authored by <a href="https://www.synopsys.com/blogs/chip-design/authors/dr-johannes-stahl.html#1" target="_blank" rel="noopener noreferrer">Dr. Jhannes Stahl</a>.</em></p></section>

Because multi-die systems have so many interdependencies, every chip design choice should be made from a system-wide perspective to address the impacts that could permeate through the system.

Developing the Blueprint for Multi-Die Systems with Virtual Prototyping Tools

<section id="isPasted"><p>Reusing established designs and concepts is standard practice in some industries, but not in others. For example, the automobile industry has been creating product lines out of a single basic design for decades. Mobile phone developers slightly tweak and add features to the cellphone design and release a new iteration every year.</p><p><br>This concept also extends beyond technology. For instance, housing developers mass-produce homes using a common layout, while clothing designers employ templates for apparel in various colors and materials.</p><p><br>In the context of PCBA manufacturing, design reuse is simply implementing established circuitry and designs in product development. This practice allows developers to utilize proven electrical circuits and PCBA layouts repeatedly, rather than starting from scratch with each new project. While this may sound like a no-brainer, PCBA development is still catching up to other industries when it comes to reusing proven design concepts.</p><p><br>In this blog we’ll look at the potential benefits of design reuse, what’s holding it back in the PCBA arena, and what the future might look like for PCBA developers implementing established IP in their designs.</p><h2><br></h2><h3>Why PCBA Design Reuse is Becoming More Common</h3><img data-fr-image-pasted="true" src="https://www.macrofab.com/assets/uploads/blog/checkpoint-pcba-board.webp" alt="Checkpoint pcba board" class="fr-fic fr-dii"><p>The rapidly evolving market today demands quick product development cycles. This fast pace presents a challenge, particularly for PCBA design teams where qualified workers are in short supply and are hard or impossible to replace.</p><p><br>Recognizing this, many teams now use design reuse strategy as an efficient countermeasure. By reapplying successful circuitry and designs, these lean teams can streamline their design process. Rather than starting from scratch and building new designs, they adapt and enhance existing layouts. This accelerates product development and rollout.</p><p><br>Ultimately, design reuse empowers PCBA design teams to achieve more with fewer resources, providing an agile workflow that can swiftly respond to dynamic market needs.</p><h2><br></h2><h3>Benefits of Design Reuse</h3><p>Applying existing designs throughout the entire design process can lead to significant savings in time and resources. Many PCBA layouts and designs use similar circuitry for power supplies, drivers, memory, etc, allowing developers to leverage these for basic functionality and save valuable design and troubleshooting time. It is advantageous to use established designs since they have already been tested in real-life applications.</p><img data-fr-image-pasted="true" src="https://www.macrofab.com/assets/uploads/blog/small-pcba-held-up-to-a-light.webp" alt="Small pcba held up to a light" class="fr-fic fr-dii"><p>Signal integrity analysis and simulation are time-consuming aspects of the development process, especially when high-speed memory interfaces are involved that can lead to signal crosstalk and/or reflections, which can degrade signal integrity. These kinds of unpredictable potential issues have already been vetted into existing, established circuitry.</p><p><br>When the time comes to deliver a product to the client, existing designs with compatible connectors that have already been successfully integrated into a customer’s system save troubleshooting time for the customer as well.</p><p><br>Taking the idea a step further, PCBA developers can design basic templates for modular PCBA layouts with common components that designers can use as a foundation for more intricate designs with enhanced functionality. For instance, a designer could swap out the interface board on a PCBA board template for another wireless interface without having to swap out the processor or the storage boards as well.</p><p><br>Developers will still have to adjust their designs based on factors like form factor and physical board space, but it’s usually easier to tweak an existing design than to start from scratch. In the aggregate, design reuse can result in shorter and more frequent development cycles, a wider range of products, and the opportunity to get those products to the market more quickly.</p><h2><br></h2><h3>Ways to Effectively Implement Design Reuse</h3><p>For an organization to fully realize the potential of design reuse, it usually requires the creation of a resource library that cross-references designs based on factors such as layout, components, and form factor.</p><img data-fr-image-pasted="true" src="https://www.macrofab.com/assets/uploads/blog/mans-hands-testing-pcba-electronic-equipment.webp" alt="Mans hands testing pcba electronic equipment" class="fr-fic fr-dii"><p>For example, a developer working on a project can look back on previous product designs for a specific customer to identify previously integrated components or connectors. Basic designs with commonly implemented components (i.e., power supply, processor, memory boards, etc.) can then be repurposed and modified to meet a different client’s needs without having to start from scratch.</p><p><br>By thinking of PCBA design as moving chess pieces on, off, or around the board, modular design practices make this kind of cutting and pasting approach more feasible. Making an older design a viable solution for a new project could be as simple as swapping out a connector or an interface board. Modular design can also help in the development of product lines, like boards with the same basic layouts but with different processors or added functionality for different implementations.</p><p><br>Organizational awareness and communication is the prevailing factor, ensuring developers have access to one another’s schematics, templates, and PCBA layouts and the practical history of those designs, i.e. how they’ve performed in certain settings and implementations.</p><p><br>This shared knowledge can help avoid common design problems like connector wear after repeated insertions or power trace aging at high currents, information that can be extremely valuable in avoiding similar design issues in the future.</p><p><br>Initially, these advantages might not seem significant on a project-by-project basis, but over time, this kind of design sharing will have a cumulative effect on the bottom line.</p><img data-fr-image-pasted="true" src="https://www.macrofab.com/assets/uploads/blog/close-up-pcba-robotic-testing.webp" alt="Close up pcba robotic testing" class="fr-fic fr-dii"><h3>The Future of Design Reuse in PCBA Design</h3><p>While repeatedly reusing the same modules and components can enhance efficiency, it also risks design complacency. This occurs when developers prioritize tried-and-true solutions over innovative, creative ones.</p><p><br>It’s an issue PCBA developers should be aware of. However, the potential long-term benefits of design reuse are too crucial to overlook. Not only does this strategy alleviate developers’ workload, but it also simplifies the customer experience and trims down troubleshooting and beta testing time. Thus, for PCBA developers seeking to optimize their processes, embracing design reuse can be an obvious and sensible choice.</p><h4>Want more design tips? Download MacroFab’s</h4><a href="https://www.macrofab.com/documents/pcba-design-handbook-2023/" target="_blank">ENGINEERING ESSENTIALS: THE PCBA DESIGN HANDBOOK</a></section><section><h4><br></h4></section>

Today’s rapidly evolving market requires quick product development cycles, presenting a challenge for PCBA design teams that are short on qualified workers

Why PCBA Design Reuse is Becoming More Common

<section id="isPasted"><p>Imagine pouring countless hours, resources, and brainpower into designing the perfect Printed Circuit Board Assembly (PCBA) for your cutting-edge product. It’s a labor of love, a technical masterpiece. Then imagine someone else, a competitor perhaps, quickly reverse engineering your design, essentially decoding your hard work and using it to their advantage. That’s a scenario no innovator–or innovative company–wants to face.</p><p>Reverse engineering (RE) is a real and persistent threat in the world of electronics. It is performed to glean a product’s inner workings, replicate, create similar or better products, or, in worst-case scenarios, infiltrate a system to exploit vulnerabilities. Undeniably, it’s a threat that can potentially undercut your market position and dilute your product’s unique value proposition.</p><p>However, guarding against RE, or ‘hardening’ your PCB assembly design, can drive up development time and manufacturing difficulty, creating a more expensive bill of materials (BOM).</p><p>This article offers valuable tips and effective strategies on how to protect your PCBA designs from various reverse engineering techniques so that it’s more challenging, time-consuming, and expensive for anyone to reverse engineer them, from both hardware and software perspectives.</p><h2><p>Understanding Piracy of Intellectual Property (IP) in Hardware</p></h2><p>IP refers to creations of the mind, such as inventions, literary and artistic works, designs, symbols, names, and images used in commerce. In the hardware world, IP can manifest as proprietary technologies or a reusable unit of logic, cell or unique design layouts, and custom software algorithms, among other things.</p><p>Hardware IP piracy involves the unauthorized use or duplication of another’s hardware design or proprietary technology. This can take several forms in the PCBA industry:</p><ul><li>Unauthorized Replication: This is a common form of IP piracy where an entity copies a PCBA design without permission. They may manufacture identical or near-identical units, often sold at a lower price. It hurts the profits of the original developers through unfair competition and can harm their brand reputation if counterfeit products are of inferior quality but are confused with the originals.</li><li>Technology Theft: This involves the theft of proprietary technology developed by a company. A competitor might reverse engineer a product to gain access to its technical secrets and then use those secrets to create their own products. This kind of piracy can dilute a company’s competitive advantage.</li><li>Trademark and Brand Piracy: This form of piracy involves the unauthorized use of a company’s branding or trademarks. For instance, a pirate may manufacture PCBAs that are visually identical to a legitimate product, complete with counterfeit logos and branding. This can mislead consumers and damage the reputation of the original brand.</li></ul><p>IP embodies the heart and soul of your product – it is the unique blueprint that distinguishes your work from others. <a href="https://www.macrofab.com/prototyping/intellectual-property/" target="_blank" rel="noopener noreferrer">Defend your hardware IP</a> from adversaries who are capable of reverse engineering, piracy, and malicious changes.</p><h2><p>Understanding the Purpose of Reverse Engineering</p></h2><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1698781617567-1698781617567.png" alt="Purpose reverse engineering" class="fr-fic fr-dii"><p>Reverse engineering, often seen as the art of ‘undesigning,’ involves disassembling an existing product to understand its inner workings, designs, and structures. Like solving a complex puzzle, the final image is known, but finding how the pieces fit together is the challenge.</p><p>The goal of reverse engineering PCBAs is manifold. On one hand, it is useful for benign applications like analyzing the PCBA for potential enhancements, identifying and fixing faults (chip- and board-level failure analysis and testing), ensuring compatibility with other products, or re-creating a previous design that has lost its documentation. It is benign, however, only if the original IP owner consents and knows about it.</p><p>In contrast, a malicious party could reverse engineer your PCBA to extract your intellectual property. They could then use your IP for the creation of products for sale or integration into their own products without compensating you, the rightful IP owner. Besides reverse engineering, they might also find security vulnerabilities in your IP, exploit them later, or even add a backdoor once they gain a white-box understanding of it.</p><h3><p>Techniques Used in Reverse Engineering of PCBAs</p></h3><p>PCBAs consist of PCBs, which are constructed with layers of thin copper foil (conductive) layers laminated to insulating (non-conductive) layers. These layers form the physical foundation for electronic components and provide electrical pathways between them. By disassembling the PCBA and imaging each individual copper layer of the PCB, it is possible to reverse engineer the entire PCBA layout.</p><p>Key techniques used in reverse engineering a PCBA include:</p><ul><li>Solder Mask Removal: The solder mask is a protective layer covering most of the PCBA, preventing solder bridges from forming between closely spaced pads. However, it also hides the copper traces beneath. The primary goal of this process is to expose the copper traces on the top and/or bottom layers with minimal damage.</li><li>Delayering: This is a destructive technique used to access the inner copper layers of a multi-layer PCB. The aim is to reveal the circuitry on each layer of the PCB, which is particularly useful when dealing with complex, multi-layer designs. Like solder mask removal, this technique is typically used on unpopulated PCBs. Dremel tools, CNC milling machines, and surface grinders can be used for delayering.</li><li>Imaging: The technique can be used even on fully populated PCBs as it helps document the PCB’s design and layout at different stages of reverse engineering. This process involves the use of X-ray inspection equipment, which allows for internal imaging without physical disassembly or delayering</li></ul><h3><p>Why Protect Your PCBA Designs from Reverse Engineering?</p></h3><p>Your PCBA designs are more than just circuit layouts and component lists; they’re the embodiments of your unique ideas, countless hours of development, and substantial investment in research and development (R&amp;D).</p><p>The implications of not securing your PCBA designs from reverse engineering are significant. Not only can it lead to financial losses due to reduced market share and eroded profit margins, but it can also result in a loss of trust from your customers and partners. If your product can be easily copied and sold at a lower price, why should customers remain loyal to your brand? Furthermore, it could discourage your R&amp;D team, who may feel their hard work and innovation are not adequately protected.</p><p>But the threats aren’t just from competitors. If your PCBA designs contain security-sensitive elements or is used as part of a security-sensitive device, reverse engineering can lead to vulnerabilities being exploited, causing severe harm to your customers and potential legal repercussions for your company. A <a href="https://spectrum.ieee.org/three-ways-to-hack-a-printed-circuit-board" target="_blank">2020 article in IEEE Spectrum</a> noted that “the vulnerabilities of the printed circuit board itself are only now starting to get the attention they deserve.”</p><p>Moving into an increasingly global economy, IP protection cannot solely rely on passive methods such as patents and copyrights. While these provide legal recourse, the enforcement of such rights can be a complex and expensive process, especially when infringements occur in jurisdictions with different legal systems and attitudes toward IP protection.</p><p>Therefore, a more active form of protection is necessary – one that makes reverse engineering your PCBA designs a more difficult, time-consuming, and costly endeavor. This is where obfuscation techniques come into play.</p><h2><p>Strategies for Obfuscating PCBA Designs</p></h2><p>Obfuscation refers to the practice of deliberately making a product more difficult to understand or decipher by hiding its true meaning or functionality to protect the IP inherent in the product.</p><p>Here are some key strategies for obfuscating your PCBA designs during the design process:</p><h3><p>Sealing the PCBA or parts of the PCBA in epoxy:</p></h3><p>This technique involves encapsulating the entire PCBA or specific critical components in a layer of epoxy resin. Epoxy sealing provides a physical barrier that makes it difficult to access or tamper with the PCBA, thereby hindering reverse engineering attempts.</p><p>However, sealing the PCBA in epoxy may make repairs and maintenance more challenging. Additionally, the epoxy itself can add weight and bulk to the final product. Moreover, epoxy can change the thermal properties of your board and lead to other design challenges.</p><h3><p>Washing the markings off ICs:</p></h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1698781617918-1698781617918.png" alt="Washing markings ics" class="fr-fic fr-dii"><p>This method entails removing the identifying markings from the integrated circuits (ICs) on your PCBA, making it more difficult for someone to determine which components are being used.</p><p>Washing off IC markings can impede reverse engineering efforts by making it harder to identify the specific components and their functions within the design. In some cases, designers go so far as to rename components with misleading identifiers that will confuse potential hackers. But, a skilled reverse engineer might still be able to identify the ICs based on their physical characteristics.</p><h3><p>Using blind vias:</p></h3><p>Blind vias are non-through holes that connect one external layer of a PCB to one or more internal layers but do not pass through the entire board. By using blind vias in your PCBA design, you can make the circuit layout more challenging to decipher, as connections between layers become less obvious.</p><p>Nonetheless, blind vias can increase manufacturing complexity and costs, as well as reduce the overall reliability of the PCBA due to potential issues with the interconnections between layers.</p><h3><p>Using a custom IC:</p></h3><p>A custom IC, also known as an application-specific integrated circuit (ASIC), is designed specifically for your product and tailored to perform a unique function. An ASIC makes it more difficult for competitors to reverse engineer your design, as they would need to design their own IC or find an off-the-shelf alternative that may not offer the same performance or functionality.</p><p>However, custom ICs can be expensive to develop and manufacture, particularly for smaller production runs. Additionally, you may face challenges related to sourcing and supply chain management, as you’ll be dependent on the specific IC provider for continued availability. In addition, you should consider how you will keep all documentation relating to the ASIC secure for the foreseeable future.</p><h2><p>Other Protection Techniques to Consider</p></h2><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1698781617996-1698781617996.png" alt="Protecting hardware copying" class="fr-fic fr-dii"><p>Further security may be provided by tamper detection or encryption on any programmable device on your PCBA. Regularly updating and patching software or firmware can also help to protect any programmable component against reverse engineering.</p><p>Protecting hardware from copying often involves programming an MCU in One-Time-Programmable (OTP) mode, disabling external data access. This includes turning off JTAG and debug facilities. However, this strategy restricts debugging and remote updates, limiting improvements to system integrity or service quality.</p><p>Certain MCUs, like Texas Instruments’ MSP430FR family, offer secure methods for on-chip memory access. It allows either password-based JTAG port security or complete disablement. It also enables the creation of secure and non-secure zones within the memory space using IP Encapsulation (IPE), with the secure area impervious to external access but permitting intra-area data interaction.</p><p>Other MCUs, like the Microchip PIC32MZ family, have a built-in hardware crypto engine. This engine supports common encryption and decryption ciphers, like AES, DES, and Triple DES, and uses a secret key for data protection. It also provides hardware-implemented data authentication. This hardware crypto engine’s performance is vital for systems requiring frequent, high-volume data processing, like during high-speed transmissions or boot processes.</p><h2><p>Threats in the Supply Chain</p></h2><p>While much of the focus on PCBA protection is geared toward external threats such as reverse engineering by competitors, it’s crucial not to overlook potential threats within your supply chain. Supply chain threats can occur at your design house or at the PCBA manufacturer.</p><h3><p>Design House:</p></h3><p>This is where the ideation and creation of your PCBA design occur. Threats at this stage can come in various forms:</p><p>Sometimes, the risk comes from within. Disgruntled employees, for example, could leak sensitive design information. Unsecure networks or insufficient cybersecurity measures can also leave your designs vulnerable to hacking or unauthorized access.</p><h3><p>PCBA Manufacturing Partners:</p></h3><p>The production stage also presents its own set of challenges:</p><p><strong>Unscrupulous manufacturers:</strong> When outsourcing manufacturing, particularly to overseas partners, there’s a risk of IP theft if your designs are not adequately protected. Unscrupulous manufacturers might sell your designs to other parties or use them to produce unauthorized versions of your product.</p><p><strong>Unauthorized Production:</strong> Some manufacturers might be tempted to produce more units of your product than agreed upon. These unauthorized units could be sold without your knowledge, cutting into your profits and potentially damaging your brand’s reputation. To mitigate these risks, there are non-engineering tactics you can use.</p><h2><p>Non-engineering Methods for Protecting PCBA IP Design</p></h2><p>Beyond technical obfuscation and embedded security measures, several non-engineering methods can further secure your PCBA design IP. These strategies involve the careful selection of partners and the strategic management of your designs.</p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1698781618070-1698781618070.png" alt="Protecting pcba ip design" class="fr-fic fr-dii"><ul><li>Pick a Trustworthy Manufacturer: Choose your manufacturing partner carefully. An ethical, trustworthy manufacturer is a cornerstone of protecting your PCBA designs. Conduct due diligence, check references, and establish solid contractual agreements that bind the manufacturer to respect and protect your IP.</li><li>Manufacture Under Robust IP Laws: Opt for countries with robust IP laws, such as the United States or Mexico. These countries have well-established legal frameworks that safeguard intellectual property and provide recourse in case of infringement.</li><li>Maintain Digital Design Control: Retain digital control of your design at all times. <a href="https://www.macrofab.com/electronics-manufacturing-platform/" target="_blank" rel="noopener noreferrer">Limit access to your design files</a> and securely store them using encryption or other cybersecurity measures. This ensures that only authorized personnel can access and modify your design data, reducing the risk of unauthorized use or leakage.</li><li>Contracts and Non-Disclosure Agreements (NDAs): Legal agreements play a crucial role in IP protection. A well-drafted contract or NDA can provide substantial legal protection for your designs, offering a clear recourse in the event of a breach.</li></ul><p>Remember, while engineering methods are crucial for protecting your PCBA designs, these non-engineering strategies offer valuable additional layers of security. They may not be the first line of defense, but they are certainly an important part of a comprehensive IP protection plan.</p><h2><p>Conclusion</p></h2><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1698781618134-1698781618134.png" alt="Reverse engineering threat" class="fr-fic fr-dii"><p>The threat of reverse engineering is real, and the consequences, ranging from lost profits to brand reputation damage, can be severe.</p><p>As we’ve explored, various methods can help secure your designs – from obfuscation techniques to embedding “Easter eggs” in code and addressing supply chain threats. Each approach has its pros and cons, and the most effective strategy is often a combination of these methods, tailored to your specific needs.</p><p>By implementing a multi-faceted approach, you’ll be well-equipped to safeguard your valuable PCBA designs from reverse engineering threats and maintain your competitive edge.</p><h4>Read more about PCBA Design Essentials</h4><p>Download MacroFab’s Engineering Essentials: The PCBA Design Handbook</p><a href="https://www.macrofab.com/documents/pcba-design-handbook-2023/" target="_blank">DOWNLOAD THE GUIDE</a></section><section><h4><br></h4><div data-aos="fade-up" data-aos-duration="750"><br></div><div data-aos="fade-up" data-aos-duration="750"><br></div></section>

Not securing your PCBA designs can lead to financial losses due to reduced market share and eroded profit margins, but it can also affect customer and partner trust.

Protect PCBA Designs From Reverse Engineering:Tips and Tricks

<p id="isPasted"><strong>In today’s world, a high level of precision and fast delivery times are crucial to the production of individual components. Online Manufacturer </strong><a href="http://www.facturee.de" target="_blank" rel="noopener noreferrer"><strong>FACTUREE</strong></a><strong> is meeting these new requirements with its wide range of manufacturing services, quick response times and on-time delivery. To benefit from this cutting-edge procurement process, leading engineering company Parker Hannifin commissioned FACTUREE to produce special turned and milled parts for mounting devices in their engineering department. The move enables the company to efficiently drive its own digital transformation without being affected by capacity bottlenecks and disproportionate personnel involvement.</strong></p><p>In many companies, the procurement of turned and milled parts is a very complex process due to operational structures and special requirements. Material, processing, execution and delivery time are essential and time- and cost-intensive factors that must be well planned and usually involve many different resources such as personnel and costs.</p><h2>Parker Hannifin opts for efficient purchasing of components</h2><p>As a leading supplier in its industry, Parker Hannifin relies on short procurement times and precision workmanship for the components it needs.<br>The engineering company, founded in 1917 with headquarters in Cleveland, Ohio, USA, is considered a global leader in the manufacture of motion and control technologies. Parker Hannifin, which has been operating in Germany since 1962, specialises in hydraulics, pneumatics, electromechanics, filtration, connection technology, refrigeration/air conditioning, sealing technology, aerospace and EMI shielding.</p><p>Daniel Scharnowski, test bench engineer at Parker Hannifin, explains: “Until November 2019, these components were still being manufactured in Germany at our prototype department. Up to 80% of our trainees were involved in the process, which the company felt was a problem. That’s why we decided to outsource the production of the parts to an online manufacturer. We hope that the end-to-end digitisation and automation of the ordering process resulting from this advanced approach to procuring turned and milled parts via an online network will lead to greater efficiency. When combined with high quality, this should give us a competitive advantage”.</p><p>After an evaluation phase, Parker Hannifin chose FACTUREE, a brand of Berlin- based company cwmk GmbH. “We obviously wanted to avoid the often time- consuming search for new manufacturers, different contacts when concluding contracts, missed delivery deadlines, etc. Online manufacturer FACTUREE won us over with a quick quote and a relatively short delivery time. Ultimately, their fast response time and wide range of manufacturing services were the deciding factors”, explains Scharnowski.</p><h2><strong>Components for mounting devices produced in a complex process</strong></h2><p>Parker Hannifin first commissioned FACTUREE in November 2019 to produce special components for mounting devices in their engineering department. FACTUREE proved the perfect choice, with its extensive production network of over 500 manufacturing partners in the fields of CNC machining and surface technology. It has over 6,000 CNC machines at its disposal at any given time. All partners comply with the requirements of an ISO 9001-certified, data-driven quality management system.</p><p>The components were manufactured using sophisticated turning and milling methods, with extremely narrow tolerances and, in some cases, additional fits. The complex manufacturing process also involved special surface treatments. The surfaces were first copper-plated, then nickel-plated in a subsequent step, before being partially polished and laser engraved.</p><h2><strong>Delivery earlier than expected</strong></h2><p>Daniel Scharnowski sums up: “Despite the complex manufacturing process involving high quantities and tight delivery deadlines, FACTUREE was actually able to deliver the components before the agreed delivery date. The speed at which orders were processed and the personal customer service also impressed us. We therefore look forward to strengthening our working relationship with FACTUREE”.</p>

Leading motion and control technology manufacturer benefits from short delivery times, unrestricted capacity and high-quality components

Fast and precise: Parker Hannifin relies on state-of-the-art Online Manufacturing of turned and milled parts

<section id="isPasted"><p>W. Edwards Deming, a renowned engineer, once emphasized, “Quality is everyone’s responsibility.” In electronics, this is especially true.</p><p>As someone involved in printed circuit board assembly (PCBA) design, you know just how vital quality is for creating reliable and efficient products. Even a small design flaw found after production can result in costly delays, rework, and negative customer feedback, damaging your reputation.</p><p>In this blog post, we will delve into essential aspects of incorporating Poka Yoke principles into PCBA design including Design for Manufacturability (DFM), and Clear Labeling and Documentation. Using these methods, you can significantly reduce errors and flaws in your products, ensuring they meet the high standards of quality, dependability, and performance that users expect.</p><p>To understand Poka Yoke’s core concepts, it’s essential to first distinguish between mistakes and defects.</p><h2></h2><h3>Clarifying the Concepts: Mistakes vs. Defects</h3><p>Although the terms ‘mistakes’ and ‘defects’ might initially appear synonymous, they embody separate nuances in meaning. A mistake denotes an error that occurs during a task’s execution, whereas a defect is the flawed output or product derived from such a mistake. In effect, a defect represents a mistake that has made its way to the customer.</p><p>Suppose you are designing a PCB layout and accidentally place a component too close to another, violating the minimum clearance requirements. This misplacement is a mistake.</p><p>Should the PCBA be produced without rectifying this error, potential defects could arise, such as electrical shorts, overheating, or even a diminished product lifespan. Therefore, by reducing errors during the design process, you simultaneously decrease the probability of defective PCBAs.</p><p>Poka-Yoke’s primary objective is to establish processes that either avert mistakes completely or rapidly detect and correct them. This is why it’s often referred to as “mistake-proofing.”</p><h2></h2><h3>A Glimpse into Poka-Yoke’s Origins</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1696361714497-1696361714497.png" alt="Poka yoke introduction" class="fr-fic fr-dii"><p>Shigeo Shingo, a Japanese industrial engineer at Toyota, introduced Poka-Yoke in the 1960s. Back then, the manufacturing industry extensively used statistical process control (SPC) to oversee product quality, analyzing data to identify and adjust for variations. However, Shingo was discontented, realizing that SPC couldn’t fully eliminate defects. He sought a proactive approach to prevent errors at the outset.</p><p>During a 1961 visit to the Yamada electric plant, Shingo noticed assembly workers occasionally forgot a crucial spring in switches, resulting in defects. These errors weren’t always caught, leading to customer dissatisfaction and reputational harm.</p><p>Shingo recognized that solely depending on workers’ attentiveness was inadequate for error prevention. He advocated for a more robust process that, should a worker make an error, could be prevented or corrected before the product left the factory.</p><p>Inspired by these experiences, Shingo developed Poka-Yoke, reshaping the assembly process to lessen reliance on worker memory or skill for error prevention.</p><h2></h2><h3>Prevention and Detection Poka Yoke Techniques</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1696361714748-1696361714747.png" alt="Prevention detection poka yoke" class="fr-fic fr-dii"><p>Poka-Yoke techniques can be classified into two main categories: prevention and detection.</p><p>Prevention techniques are designed to prevent errors from occurring in the first place. Detection techniques are designed to detect errors after they occur, so they can be corrected before they cause a problem.</p><p>Prevention techniques include designing parts so they can only be assembled correctly through keying or asymmetrical design, using sensors to detect when parts are in the wrong position, and using color coding or labeling to ensure that the right parts are used in the right place. PCBA designers commonly use asymmetrical or keyed connectors or software that detects clearance violations during layout to prevent incorrect connections.</p><p>Detection techniques include using warning lights or alarms to alert operators when a problem occurs, using automated inspection systems to detect defects, and using statistical process control to monitor the quality of the process.</p><p>By incorporating both types of Poka-Yoke techniques into your PCBA design process, you can significantly reduce defects and enhance the overall quality of your products.</p><h2></h2><h3>Design Strategies for Mistake-Proofing</h3><p>Poka Yoke techniques can significantly improve PCBA product quality, reduce rework costs, and enhance overall operational efficiency. Here are four ways you can utilize Poka Yoke principles to optimize your PCBA designs:</p><ul><li><strong>Identify Potential Failure Points in Product Assembly:</strong> One of the core tenets of Poka Yoke is to scrutinize the assembly process, identifying areas where a product could fail if parts are not assembled correctly. In the context of PCBA, this involves conducting thorough risk analyses for each component and its position on the board. Should a resistor or capacitor be placed wrongly, for instance, the resulting malfunction could lead to significant downtime and financial loss. Utilize tools like Failure Mode and Effects Analysis (FMEA) to systematically detect potential points of failure and address them proactively, or work with your CM to take these steps.</li></ul><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1696361715021-1696361715021.png" alt="Prioritize critical features pcba" class="fr-fic fr-dii"><ul><li><strong>Prioritize Critical Features for Proper Assembly:</strong> PCBA designs often involve small yet critical features that determine the proper assembly of the product. As a designer, you need to be acutely aware of these elements, from specific soldering points to the precise positioning of vias and traces. Highlight these features in your assembly instructions and ensure the assembly team fully understands their importance. You can also use visual aids or color codes to help assembly personnel identify these crucial features more easily.</li><li><strong>Avoid Dependence on Subtle Differences for Orientation:</strong> Be cautious when your design relies on subtle differences to differentiate between the top and bottom, or front and back of a component, especially when these parts are painted in dark colors. This can lead to mistakes in assembly due to poor visibility or misunderstanding. If possible, consider using physical cues for orientation. For instance, asymmetrical designs or tactile indicators can help in correctly orienting the parts. Also, consider implementing standard color-coding or labeling methods to further enhance clarity.</li><li><strong>Steer Clear of Excessively Complicated Designs:</strong> Overly complex designs can pose significant challenges for assembly operators, particularly those with less experience. A design that is hard to interpret could lead to mistakes during assembly and increase production time. To apply Poka Yoke in this aspect, strive for simplicity and clarity in your PCBA designs. Utilize clear, concise labeling, ensure traces and pads are easily discernible, and make your assembly instructions as straightforward as possible. Remember, a well-designed PCB is easy to assemble and reduces the risk of error.</li></ul><p>By incorporating these expanded principles of Poka Yoke into your PCBA design strategy, you’ll be better equipped to create designs that minimize assembly errors, reduce production costs, and<br>ultimately deliver more reliable and efficient products.</p><h2></h2><h3>Design for Manufacturability (DFM) in PCBA Design</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1696361714856-1696361714855.png" alt="Dfm pcba design" class="fr-fic fr-dii"><p>DFM makes your design easier and cheaper to produce by reducing manufacturing issues and ensuring it fits well with production methods. Design for Manufacture and Poka Yoke work synergistically to enhance PCBA design and production, creating a seamless and error- minimized manufacturing process. This helps both the company and the end user by making production faster and less wasteful, getting products out quicker, improving product quality and service, an leading to longer-lasting products at competitive prices.</p><p>How to integrate DFM into your PCBA design process:</p><ul><li><strong>Material Selection:</strong> Choose materials compatible with your manufacturing processes and end-use requirements. Consider factors like thermal and mechanical properties, electrical performance, and availability.</li><li><strong>Component Placement:</strong> Optimize component placement to minimize manufacturing complexity, reduce interference, and maintain proper clearances.</li><li><strong>Trace Routing and Widths:</strong> Design traces to meet electrical requirements, prevent signal interference, and facilitate easy manufacturing.</li><li><strong>Design for Testability (DFT):</strong> Incorporate test points and fixtures to facilitate easy testing and inspection during manufacturing, ensuring high-quality products.</li><li><strong>Design for Assembly (DFA):</strong> Minimize unique parts and assembly steps, improving manufacturing efficiency and reducing assembly errors.</li></ul><h2></h2><h3>Clear Labeling and Documentation in PCBA Design</h3><p>Clear labeling on the PCBA board and comprehensive design documentation are critical complements to Poka Yoke techniques, together forming a powerful trio that enhances PCBA design and manufacturing efficiency.</p><p>The use of clear labeling on the board ensures that components are correctly placed and oriented, reducing potential assembly errors, a principle that aligns perfectly with the error-avoidance goal of Poka Yoke. In parallel, robust and detailed design documentation serves as a reliable guide for assembly personnel, clarifying assembly processes and making explicit the critical features of the design.</p><p>By providing comprehensive information and guidance throughout the design and manufacturing process, you can minimize errors, improve communication among team members, and ensure that your products consistently meet high-quality standards.</p><p>Here’s how you can integrate clear labeling and documentation into your PCBA design process:</p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1696361715100-1696361715100.png" alt="Component labeling pcb layout" class="fr-fic fr-dii"><ul><li><strong>Component Labeling:</strong> Clearly label components on your PCB layout, indicating their reference designators, values, and orientations. This helps prevent errors during assembly by providing easy-to-understand visual guidance for technicians and assemblers.</li><li><strong>Color Coding and Symbols:</strong> Use color coding and standardized symbols to differentiate between various component types, signal traces, and power planes. This visual aid can help designers and assemblers quickly identify specific elements, reducing the risk of errors.</li><li><strong>Bill of Materials (BOM):</strong> Create a detailed and accurate BOM that lists all components, their specifications, and quantities required for assembly. An organized BOM simplifies procurement and inventory management, minimizing the potential for errors due to incorrect or missing components.</li><li><strong>Revision Control:</strong> Implement a robust revision control system to track changes and updates to your design and documentation. This system helps prevent confusion and errors arising from using outdated or incorrect information during design, manufacturing, or testing processes. Cloud-based CMs like MacroFab allow your team to remain synchronized while also reverting back to earlier versions when needed.</li></ul><h2></h2><h3>Conclusion</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1696361715061-1696361715061.png" alt="Poka yoke technique pcba conclusion" class="fr-fic fr-dii"><p>In a nutshell, Poka Yoke techniques are a game-changer in PCBA design. They provide a robust and proactive approach to preventing errors and ensuring top-notch quality. By incorporating standardization, DFM, clear labeling, documentation, and continuous improvement, you create a solid foundation for consistently delivering reliable and efficient products.</p><p>So, don’t hesitate to jump on the Poka Yoke bandwagon. Adopt these invaluable practices, and watch as your designs flourish, keeping your customers happy and your reputation shining. Remember, quality is everyone’s responsibility, and with Poka Yoke, you’re well on your way to achieving just that.</p><h3>Choose MacroFab, a CM that Prioritizes Quality</h3><a href="https://factory.macrofab.com/signup" target="_blank">UPLOAD YOUR DESIGN TODAY</a></section><section><br></section>

Quality is everyone's responsibility 

How Poka Yoke Can Improve Your PCBA Design Process

<p dir="ltr" id="isPasted">Yes, we won&#39;t be discussing the common sense in CNC design, such as fillets, thin walls, or deep cavities. You&#39;re probably already well-versed in these principles. As experienced mechanical parts engineers, we&rsquo;ve encountered many times design practices that can be enhanced to achieve efficient manufacturing, higher quality, and greater precision. By keeping in mind the following six easily overlooked considerations in CNC part design, you can unlock a world of possibilities and maximize the potential of your designs.</p><h2 dir="ltr">1. Ensure the Quality of Parts After Heat Treatment</h2><p dir="ltr">When designing machined parts, it is necessary to consider the quality of subsequent processes such as heat treatment. Sharp edges and corners of parts can lead to stress concentration during quenching, resulting in cracking. Therefore, prior to quenching, the root of the shoulder of a heavy-duty stepped shaft should be designed with fillets, and chamfers should be provided on the shaft end and shoulder, as shown in Figure-1.</p><p dir="ltr">&nbsp;<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1695815829570-1695815829570.png" width="204" height="171" class="fr-fic fr-dii"></p><p dir="ltr">Additionally, uneven wall thickness of the part can easily cause deformation during heat treatment. It is advisable to add a process hole appropriately to achieve uniform wall thickness and prevent deformation during heat treatment.&nbsp;</p><h2 dir="ltr">2. Design for Easy Clamping</h2><p dir="ltr">Clamping in CNC machining refers to the process of securely securing or holding a workpiece in place during machining operations to ensure stability and accuracy. Designing components for easy clamping means the parts can be accurately positioned and securely clamped, which improves machining efficiency, and ensures the part quality.</p><p dir="ltr">As shown in Figure-2, in original design, when the part is clamped on the three-jaw chuck, the part and the jaws have point contact, which does not securely hold the workpiece. In the optimized design, a cylindrical section is added to increase the contact area between the workpiece and the jaws, making clamping easier and improving clamping reliability.</p><p dir="ltr"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1695815829585-1695815829585.png" width="369" height="176" class="fr-fic fr-dii"></p><p dir="ltr">&nbsp;</p><h2 dir="ltr">3. Add Flanges or Process Holes to the Large Flat Workpiece</h2><p dir="ltr">The large flat workpiece was initially challenging to clamp securely during the machining process. By adding flanges to the part, the clamping of the workpiece becomes more convenient and reliable. With the inclusion of flanges, screws and pressure plates can be used to securely hold the workpiece in place. Additionally, the incorporation of flanges facilitates the lifting and handling of the workpiece, making it easier to transport and manipulate.</p><p dir="ltr"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1695815829600-1695815829600.png" width="373" height="222" class="fr-fic fr-dii"></p><h2 dir="ltr">4. Reduce the Tool Running Times</h2><p dir="ltr">By reducing the times of machining tool passes, we can decrease the machining time and consequently reduce the machining costs. As shown in the original design of Figuture-4, when machining features with different heights, it was necessary to individually raise or lower the worktable, which increased the machining time. In the optimized design, several features with different heights are designed to have the same height. This allows machining all the features in a single tool pass, thus improving production efficiency and maintaining relative positional accuracy more easily.&nbsp;</p><p dir="ltr"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1695815829487-1695815829487.png" width="352" height="233" class="fr-fic fr-dii"></p><h2 dir="ltr">5. Reduce Machining Area</h2><p dir="ltr">Reducing the machining area can decrease machining time and subsequently reduce the cost of mechanical machining. As shown in Figure-5, in the original design, the bottom surface of the bearing component has a large machining area. In the improved design, the machining area was reduced through optimized design, resulting in a decrease in machining volume and tool consumption, improved machining efficiency, and reduced machining costs. Additionally, optimizing the component design by adding convex features or grooves can also help reduce the machining area.</p><p dir="ltr"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1695815829502-1695815829502.png" width="373" height="255" class="fr-fic fr-dii"></p><h2 dir="ltr">6. Design for Ensuring Positional Accuracy</h2><p dir="ltr">Surfaces with mutual positional accuracy requirements are preferably processed in a single clamping operation, which helps ensure the positional accuracy between the machining surfaces and reduces the number of clamping operations. In Figure-6, the inner and outer cylindrical surfaces require coaxiality accuracy. In the original design, the part needs to be clamped twice to machine the outer cylindrical surface and the inner hole separately, making it difficult to meet the coaxiality accuracy requirements.</p><p><br></p><p dir="ltr"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1695815829516-1695815829516.png" width="547" height="251" class="fr-fic fr-dii"></p><p dir="ltr">In the improved design, by adding a raised platform structure, the inner and outer cylindrical surfaces can be machined in a single clamping operation, making it easier to meet the coaxiality requirements while also reducing the machining cost.</p>

By keeping in mind the following six easily overlooked considerations in CNC part design, you can unlock a world of possibilities and maximize the potential of your designs.

6 Easily Overlooked Considerations in CNC Part Design

Remix Robotics-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

Remix Robotics-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Remix Robotics-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Remix Robotics-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

Remix Robotics-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

nTopology-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

nTopology-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

nTopology-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

nTopology-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

nTopology-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

RPWORLD-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

RPWORLD-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

RPWORLD-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

RPWORLD-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

RPWORLD-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Ansys-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

Ansys-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Ansys-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Ansys-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

Ansys-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Ansys-Fri Oct 06 2023 08:49:31 GMT-0500 (Eastern Standard Time)

Ansys-Tue Oct 31 2023 23:59:59 GMT+0200 (Eastern European Standard Time)

Ansys-Mon Oct 30 2023 08:45:26 GMT-0400 (Eastern Daylight Time)

High Tech Campus Eindhoven

TestCompany Ltd

Testcompany 20210115

Blueprint Lab-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

Blueprint Lab-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Blueprint Lab-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Blueprint Lab-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

Blueprint Lab-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

MistyWest

design cycle

design cycle

Profiles