Vias are small holes in a PCB that enable electrical connections between different layers of the board. In the context of PCB design, via tenting refers to the process of covering the vias with a protective layer, typically a solder mask or dry film. This protective layer shields the vias from environmental factors, such as dust, moisture, and chemicals, which can lead to corrosion or short circuits. As PCB technology continues to advance, the importance of via tenting in maintaining the performance and reliability of complex, high-density interconnect (HDI) and flexible PCB designs cannot be overstated. This guide explores the art and science of via tenting, shedding light on its significance, techniques, and applications in modern PCB design and manufacturing.
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