The progress of screen printing towards fine line printing has been incredible going from 100 µm features before 2010 to 70 µm to 2015 to 40 µm in 2018 and now pushing - in development- towards 20 µm and less. In parallel, the wet thickness of the printed line have gone down from 12um or so in 2018 to now just 4um.
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As microLEDs inevitably shrink in size, the micro-bumping requirements for the microLED dies becomes more challenging. Direct wafer-based printing based on gravure offset techniques offers a promising solution in this regard. Indeed, this is another field where printed electronics can play a role.




