To scale up microLED displays to large areas, smaller displays can be titled. Because microLEDs can be truely edge-less devices, the tiling can function, yielding a seemless look.
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Stretchable Electronics and inks for durable wearable electronics. These inks can be printed on TPU films which can be bonded to fabrics. This results in devices that stretch without cracking and maintain excellent electrical properties. Examples include biometric sensors & fixed resistance heaters
Silver nanoparticle inks improve every year. These improvements are often incremental, but very important. One ever-present direction of development is towards inks which offer ever higher conductivity levels at a low curing temperature and a short curing time. This a critical figure of merit because it opens more substrate choices, saves time, and lowers energy consumption costs.
This article explores the key differences between active and passive filters, detailing their transfer functions, frequency responses, components, circuit configurations, stability, design challenges, approximation methods, and CAD tools for filter simulation and optimization.
Circuit card assemblies (CCA) give birth to a complete printed circuit board (PCB) after assembling every component. A printed circuit board has no electrical components and needs to go through a manufacturing process called circuit card assemblies which are the complete board assembly.
Carnegie Mellon University collaborators pioneer the CMU Array—a customizable, 3D nano-printed, ultra-high-density microelectrode array platform for next-generation brain-computer interfaces. This technology can transform the way doctors are able to treat neurological disorders.
3 minutes read
Printed batteries offer thinness and flexibility, enabling new applications, but their production is deceivingly complex. Gunter Hübner from Stuttgart Media University offered some insights at the e-Swiss conference last week.
Experimenting in the world of Flexible Hybrid Electronics (FHE) comes with a variety of hurdles. Printing technologies are vastly different in terms of materials compatibility and have pros and cons that make them suitable for particular applications. Choosing materials that match the printing technology you intend to use is the most important decision you’re going to make. But what if one could print, digitally, using any paste and ink on any substrate? Read more
3 minutes read
Sometimes manufacturers would like to install heating in objects that are difficult to heat. The armrest of your car. Your sporty winter coat. Bags for food delivery. Sleeping bags. etc This has been difficult to achieve until now. Read more about printed heater technology
2 minutes read
Wearable electronic textiles are a demanding environment for reliable interconnects – the ability to function with movement and survive multiple cleanings and reuse. Good adhesion is particularly challenging in these wearable and conformable electronics applications. While solders provide the most conductive electrical connection, they are rigid and require not only the addition of an underfill adhesive but usually a post bond encapsulation. This Anisotropic Conductive Epoxy, provides reliable interconnections between electronic components and circuitry on textiles with excellent structural bonding, without encapsulation, even under repeated stretching and washings. This technology has been shown as a scalable assembly process for e-Textile manufacturing in an SMT line.
5 minutes read
Cost of production has been a major barrier despite the fact that Cu raw material prices are far lower than Ag. This is because this large raw material cost difference does not often get translated into equally large nanoparticle dispersion or ink costs. Can this be overcome?
In general, silicone based conductive pastes are rare and the versions with AgCl fillers- needed for many medical wearable applications- are even rarer!
Warp knitting is an excellent candidate. It combines weaving and weft knitting, allowing the warp knitted fabrics to have the stability of woven fabrics and the elasticity of knitted ones.
Conformal EMI shielding is a megatrend on its way to become ubiquitous in electronics. The incumbent process is based on sputtering a tri-layer structure consisting of SUS on the EMC of the package. In these slides, you can see performance analysis and detailed cost analysis/projections.
2 minutes read
The progress of screen printing towards fine line printing has been incredible going from 100 µm features before 2010 to 70 µm to 2015 to 40 µm in 2018 and now pushing - in development- towards 20 µm and less. In parallel, the wet thickness of the printed line have gone down from 12um or so in 2018 to now just 4um.