Amphenol FCI Flexible Printed Circuit Assembly

Amphenol FCI Flexible Printed Circuit Assemblies are a board-to-board connectivity solution designed for high-speed and space-constrained applications. They feature different positions, heights, and lengths of flexible cable with gold flash tail plating for reliable electrical performance. The assemblies support data transmission speeds up to 16Gb/s and have a 0.3A–20A current rating per contact, making them suitable for high-performance applications.

Operating within a -55°C to +125°C temperature range, the assemblies are an alternative to traditional PCB-based connections where rigid boards are impractical. They support surface-mount technology (SMT) assembly, ensuring process consistency and cost-effective manufacturing. The design is customizable, allowing users to select different pitch sizes, positions, and stack heights. Common applications include automotive, consumer electronics, industrial equipment, and medical devices, where flexibility, high-speed signal integrity, and mating reliability are critical.

Features of Amphenol FCI Flexible Printed Circuit Assemblies

Amphenol FCI Flexible Printed Circuit Assemblies offer a range of features designed for high-density, high-speed connectivity in space-constrained applications. These features contribute to the assemblies’ versatility and suitability for diverse industries. Let’s explore some of these:

Compact and High-Speed Connectivity

Amphenol FCI Flexible Printed Circuit Assemblies are designed for compact board-to-board connections, with different positions, heights, and lengths of flexible cable. They support high-speed data transmission up to 16Gb/s, making them suitable for high-performance applications requiring minimal signal loss. The gold flash tail plating ensures reliable conductivity and durability in demanding environments.

Flexible Design for Space-Constrained Applications

The assemblies provide an alternative to traditional PCB-based connections, making them ideal for compact electronic systems. With a broad offering of pitch sizes (0.4mm–2.0mm), positions (2–200), and heights (1.5mm–20mm), they accommodate various design constraints. The flexible printed cable (FPC) eliminates the need for rigid board-to-board connections, allowing seamless integration into automotive, medical, industrial, and consumer electronics.

Enhanced Manufacturing and Assembly Process

The FPC assemblies are designed for SMT processes, offering higher process consistency and reduced assembly costs. Compared to conventional PCB-to-board or cable-to-wire (CTW) assemblies, they minimize manufacturing complexity and enhance mechanical stability. The flexible structure helps reduce space, weight, and material costs, improving overall system efficiency.

Reliable Performance and Customization Options

With an operating temperature range of -55°C to +125°C, the assemblies are suitable for harsh environments requiring long-term reliability. They offer multiple mating interfaces, vibration resistance (USCAR specifications), and locking features, ensuring a secure electrical connection. Customization options include FPC lengths from 100mm to 500mm, special FPC shapes, and various current rating capabilities, making them adaptable to diverse application requirements.

Applications

Amphenol FCI Flexible Printed Circuit Assemblies find applications across diverse sectors. In automotive systems, they facilitate connections in space-constrained areas within dashboards, infotainment systems, and lighting assemblies. In communication equipment, they support high-speed data transfer in networking devices and mobile infrastructure. Consumer electronics, such as portable devices and wearables, benefit from the assemblies’ compact size and flexibility.  

Within IT/DA, they can be utilized in high-density storage and server applications. Industrial settings employ them for instrumentation and control systems where space is limited. Medical devices, including diagnostic equipment and patient monitoring systems, leverage their reliability and miniaturization. These applications take advantage of the high-speed capabilities, compact form factor, and robust design for interconnect solutions of FPC assembly in challenging environments.