<p id="isPasted">3D IC design has evolved beyond the point where traditional EDA flows can keep up. Stacking dozens of chiplets and millions of interconnects into a single package multiplies thermal, mechanical, and electrical interactions faster than engineering teams can analyze them. Power, performance, area, cost, and reliability decisions that once happened sequentially must now be evaluated concurrently at the system level.</p><p>The challenge is not simply predicting performance. Thermal hotspots, thermo-mechanical stress, and power/signal integrity issues are often determined by architectural and packaging decisions made long before detailed implementation begins. When these issues are discovered late in the design cycle, the cost of mitigation can be significant.</p><p>In this webinar, Andras Vass-Varnai and Sudarshan Deo will demonstrate how multiphysics-driven workflows bring thermal, thermo-mechanical, and signal and power integrity analysis into the earliest stages of 2.5D and 3D IC development, enabling engineers to identify and address reliability risks while there is still time to influence the architecture.</p><p><a href="https://event.on24.com/wcc/r/5491608/33A2607318C36215E4F29DBBD3E0D59C?utm_source=website&amp;utm_medium=landingpage&amp;utm_id=Siemens" target="_blank" rel="noopener noreferrer" class="button-main-action">Register Now</a></p><h2><a href="https://event.on24.com/wcc/r/5491559/76FE994C30F1099A634FC4ABF239D262" target="_blank" rel="noopener noreferrer"><br /></a></h2><h2>What you'll learn</h2><ul><li><p>How early thermal, thermo-mechanical, and power integrity analysis can uncover reliability risks before they become costly late-stage issues</p></li><li><p>Where multiphysics co-analysis should be introduced in the design flow to guide architecture and packaging decisions</p></li><li><p>How AI-powered design space exploration accelerates evaluation of chiplet, package, and system architectures while maintaining multiphysics insight</p></li><li><p>How AI agents can automate and orchestrate complex simulation workflows, enabling faster and more informed engineering decisions</p></li></ul><h2>Who should attend</h2><p>This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.</p><p id="isPasted"><a href="https://event.on24.com/wcc/r/5491608/33A2607318C36215E4F29DBBD3E0D59C?utm_source=website&amp;utm_medium=landingpage&amp;utm_id=Siemens" target="_blank" rel="noopener noreferrer" class="button-main-action">Register Now</a></p><h2><a href="https://event.on24.com/wcc/r/5491559/76FE994C30F1099A634FC4ABF239D262" target="_blank" rel="noopener noreferrer"><br /></a></h2><h2 id="isPasted">Why Siemens</h2><p>Siemens is uniquely positioned to help engineering teams address the challenges of advanced 3D ICs by bringing together robust 3D IC and package design technologies with comprehensive thermal, thermo-mechanical, and electrical multiphysics solutions. This enables reliability and performance considerations to be evaluated much earlier in the development process, when architectural decisions have the greatest influence on outcomes. By connecting design, multiphysics analysis, and AI-driven automation within a common workflow, Siemens helps teams gain insight into complex system interactions without requiring deep expertise in every physical domain, allowing them to identify issues sooner and converge on better designs faster.</p><p>Building on this foundation, they will show how AI technologies are transforming the design process. Attendees will see how AI-powered design space exploration can evaluate thousands of architecture and packaging options with far fewer simulations, and how AI agents can automate and orchestrate complex multiphysics workflows, helping engineering teams move from analysis-driven design to intelligence-driven design.</p><h2 id="isPasted">Meet the speakers</h2><p id="isPasted"><em><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzg4OTUwNjU3NzU5LVNhZ2VyIGVibXBhcHN0IFNvbHZpbmcgUmFjayBDb29saW5nIE5vaXNlIFdQLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width:100%px" class="fr-fic fr-dib" /></em></p><p>Andras holds MSc and PhD degrees in Electrical Engineering from the Budapest University of Technology and Economics. He spent over a decade at Mentor Graphics as a product manager, leading R&amp;D projects focused on thermal test hardware and methodologies, and later served as a business development lead in South Korea and the United States. </p><p>Now based in Chicago and working as a 3D IC reliability solution engineer, he's contributing to the development of a novel 3D IC package toolchain, drawing on his background in thermal and reliability engineering. His interests include thermal management of electronic systems, thermal transient testing and modeling, semiconductor packaging, TIM material characterization, and reliability testing of semiconductor devices.</p><p id="isPasted"><strong><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzg4OTUwNjY5NTgwLVNhZ2VyIGVibXBhcHN0IFNvbHZpbmcgUmFjayBDb29saW5nIE5vaXNlIFdQICgyKS5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width:100%px" class="fr-fic fr-dib" /></strong></p><p>Sudarshan leads the development of AI-native engineering platforms for advanced semiconductor design at Siemens Digital Industries Software, enabling intelligent workflows for 3D ICs, chiplets, advanced packaging, and multiphysics analysis. </p><p>He holds a Master's degree in Computer Science from California State University, Sacramento, where his thesis focused on convolutional neural networks for image recognition. With experience spanning Siemens, Intel, Synopsys, and Cadence, he specializes in applying AI to accelerate semiconductor engineering and advance next-generation EDA technologies.</p><p><strong><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzg4OTUwNjc5NTg1LVNhZ2VyIGVibXBhcHN0IFNvbHZpbmcgUmFjayBDb29saW5nIE5vaXNlIFdQICgzKS5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width:100%px" class="fr-fic fr-dib" /></strong></p><p>Samir Jaber is an editor, writer, and industry expert on topics of technology, science, and engineering. He is the editor-in-chief of the 2025, 2024, and 2023 Edge AI Technology reports with Wevolver. Samir is the Chief Editor and Founder of Wryters, a content marketing and consulting agency. He has comprehensive experience working with Fortune 500 companies and industry leaders as a writer, editor, content manager, and consultant.</p><p>He is an online content specialist with an academic background in mechanical engineering, nanotechnology, and scientific research. Samir is also a featured author in 30+ industrial magazines with a focus on Artificial Intelligence (AI), the Internet of Things (IoT), 3D printing, Autonomous Vehicles (AV), nanotechnology, materials science, and sustainability. His experience includes award-winning engineering research and patented engineering design in the fields of nanofabrication and microfluidics.</p>

AI-powered design space exploration for multiphysics-aware 3D IC and chiplet integration.

Reimagining 3D IC Design: Where Multiphysics Meets AI

<h2 id="isPasted">embedded world North America 2026</h2><p>From<strong> September 22–24</strong>, <a href="https://embedded-world-na.com/" target="_blank" rel="noopener noreferrer">embedded world North America</a> brings together design engineers, systems architects, firmware developers, and product leaders at the <strong>Anaheim Convention Center</strong> for three days dedicated to the future of embedded innovation.</p><h2><a href="https://www.prereg.net/2026/ewna/" target="_blank" rel="noopener noreferrer">Register Now</a></h2><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1787147241216-1787147241214.png" width="624" height="69" class="fr-fic fr-dii" /></p><p><span class="fr-img-caption fr-fic fr-dii"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1788213282343-embedded+world+North+America+2026+images.png" width="624" height="350.9896845230088" class="fr-fic fr-dii" /><span class="fr-inner">Copyright: NürnbergMesse North America</span></span></span></p><h3>What to Expect</h3><p>With 150+ exhibitors, 100+ technical sessions, and 100,000 square feet of exhibition space, embedded world North America brings the full embedded ecosystem into one venue. From agentic AI and autonomous systems to open hardware platforms, this event is built to give you both big-picture context and takeaways you can apply directly to your own work.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1787147038128-1787147038128.jpeg" width="624" height="468" class="fr-fic fr-dii" /></p><h3>Hear from the People Who Are Building What's Next</h3><p>Keynote speakers this year include <strong>Deepu Talla</strong>, VP of Robotics and Edge AI at NVIDIA, presenting on an open platform for autonomous, agentic systems, and <strong>F</strong><strong>abio Violante</strong>, VP and GM of Arduino at Qualcomm, on powering AI in the physical world.</p><p><a href="https://embedded-world-na.com/conference-program/" target="_blank" rel="noopener noreferrer">See the full conference program.</a></p><p><span class="fr-img-caption fr-fic fr-dib"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1787147275006-embedded+world+North+America+2026+images+%281%29.jpg" style="width:100%px" class="fr-fic fr-dib" /><span class="fr-inner">Copyright: NürnbergMesse North America</span></span></span></p><h3>A Show Floor Built Around Real Engineering Challenges</h3><p id="isPasted">The technical conference is led by the developers and innovators doing the work. Breakout sessions are organized around real development challenges, current trends, and emerging applications, not vendor pitches.</p><p>On the show floor, 150+ exhibitors give you direct access to the components, tools, and platforms shaping embedded design today. The Hackathon and Robotics Lab add a hands-on layer, letting you test ideas as working demos rather than just hear about them from a stage.</p><p>In between sessions, there's room to step back, keep conversations going, and connect with others solving similar problems.</p><p><br /></p><h3>Join the Conversation</h3><p>More than anything, embedded world North America is about bringing the embedded community together in one place. It's a chance to learn, compare notes, and see how others are approaching the same problems you are.</p><p><a href="https://www.prereg.net/2026/ewna/" target="_blank" rel="noopener noreferrer" id="isPasted">Register for your tickets now online</a>, and join us September 22-24 in Anaheim, California.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1787147642928-1787147642928.jpeg" width="624" height="327" class="fr-fic fr-dii" /></p><p><br /></p>

embedded world North America is the premier trade show and conference dedicated to the community of innovators and developers in the embedded tech ecosystem.

embedded world North America 2026 - Anaheim, CA

<p id="isPasted">The automotive sector is in the middle of an important transition. In 2026, electric car sales are expected to exceed 23 million, driven largely by major adoption in China and Europe. <sup>[1]</sup> Meanwhile, an increase in software-defined vehicles (SDVs), with functions like autonomous driving and over-the-air updates, is contributing to increased manufacturing complexity. </p><p>Despite this complexity, EV and SDV producers are logging shorter and shorter development times for new vehicles, with startups often needing just 24 to 30 months for new vehicle development—around half the time taken by traditional OEMs.<sup>[2]</sup></p><p><span class="fr-img-caption fr-fic fr-dii"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1786998512758-1786998512758.jpeg" width="624" height="416" class="fr-fic fr-dii" /><span class="fr-inner">Source/Copyright: Formnext Mesago Messe Frankfurt. Mathias Kutt</span></span></span></p><p>Shifting expectations in development times, coupled with supply chain disruptions and uncertainties surrounding global tariffs, have put pressure on OEMs and suppliers. Furthermore, the high cost of new vehicle production and limited consumer spending power means the automotive market is looking for innovative ways to streamline production, shorten supply chains, and increase profit margins.</p><p>Additive manufacturing (AM) is uniquely positioned to assist the automotive industry in its efforts to ensure that hardware production keeps pace with innovation. By offering hyper-local production and reduced supply chain dependence, AM is becoming increasingly important for prototyping, tooling, and even serial production of automotive components. The convergence of automotive and AM will be demonstrated at Formnext 2026, which brings together leading and emerging figures from the automotive and AM industry.</p><p><span class="fr-img-caption fr-fic fr-dii"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1786998512764-1786998512764.jpeg" width="568" height="426" class="fr-fic fr-dii" /><span class="fr-inner">Close-up of advanced suspension system components from 3D printing. Source: AdobeStock</span></span></span></p><h2>Additive Manufacturing in Automotive Today</h2><p>Additive manufacturing is often considered a cutting-edge or even futuristic technology. However, its use in the automotive industry goes back to the 1980s, not long after the first 3D printers appeared. This makes it about as futuristic as the DeLorean. Back then, AM was synonymous with rapid prototyping, and many automotive suppliers and OEMs still use polymer 3D printing to prototype items like interiors, dash components, and body panels. This is an area in which companies can exploit some of the technology’s main advantages: design freedom, tool-free production with short lead times, and minimal up-front costs.</p><p>However, rapid prototyping represents just one application of additive manufacturing in today’s transport-related industries. Companies like GM and Tesla have used binder jetting, a form of AM that prints materials like metals and ceramics suspended with binder material, to fabricate complex sand casting molds that can then be used to produce high-strength cast metal parts. Ford is one of many companies to use AM for final part production, deploying metal 3D printing for EV battery cooling components.</p><p><span class="fr-img-caption fr-fic fr-dii"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1786998512769-1786998512769.jpeg" width="624" height="416" class="fr-fic fr-dii" /><span class="fr-inner">Source/Copyright: Formnext Mesago Messe Frankfurt. Mathias Kutt</span></span></span></p><p>Beyond the major OEMs, other businesses like part suppliers, mechanics, and body shops are using 3D printing for jobs like custom part production, repair of legacy vehicles, and reverse engineering. In polymer 3D printing, low-end professional extrusion and photopolymerization systems are available below the five-figure mark and serve as an ideal entry point for smaller firms. </p><p>AM use can be subsequently scaled up by introducing further printers controlled by print farm management software or deploying larger production-ready systems. Metal AM systems and more complex polymer printing technologies come with greater material handling and post-processing demands, but even these machine categories are becoming steadily more accessible in terms of machine cost and usability.</p><h2>Three Diverse Use Cases</h2><p>Automotive, transportation, and mobility companies now use AM for applications beyond prototyping. At Daimler Truck, the largest commercial vehicle producer in the world, the technology is deployed for efficient spare part production, particularly in the Daimler Buses division. That company is working with AM leader 3D Systems to overcome supply chain bottlenecks and reduce part delivery times. Digitizing its spare parts library allows it to use certified local AM service bureaus while a unique digital rights management solution protects its IP, ensuring those third-party bureaus only print the exact part quantity required.</p><p>Additive technology is proving equally valuable in other areas of transportation. Siemens Mobility, the rail transport division of Siemens, is a long-time user of AM technology and recently 3D printed a three-meter front panel for a rail vehicle approved for speeds up to 124 mph (200 km/h). </p><p>Like Daimler Truck, Siemens Mobility also uses AM hardware in conjunction with a digital spare parts library, allowing it to provide fast replacements even on decades-old vehicles. The company says this library of 2,100+ virtual parts reduces costs, allows for easy redesign, lowers CO2 emissions, and shortens delivery times by up to 90%.</p><p><span class="fr-img-caption fr-fic fr-dii"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1786998512774-1786998512774.jpeg" width="624" height="349" class="fr-fic fr-dii" /><span class="fr-inner">A 3D rendering of CAE simulations showing the thermal management system of EV batteries. Source: AdobeStock.</span></span></span></p><p>In the growing EV space, additive manufacturing exhibits some of its most creative applications. For instance, Silicon Valley disruptor Sakuu has combined expertise in AM and battery production to develop a proprietary dry process for the 3D printing of custom-shaped functional batteries with patterned openings for thermal management. Key advantages of 3D printing these batteries with the company’s unique Kavian process include elimination of toxic solvents, substantial gains in energy density, and fully customizable form factor.</p><h2>Accessing the AM Ecosystem</h2><p>The world’s leading automotive and transportation OEMs are demonstrating the value and versatility of additive manufacturing. However, there remain several common obstacles to AM adoption in the sector, including: </p><ul><li><p>Choosing between different 3D printing technologies</p></li><li><p>Choosing between in-house and external AM production</p></li><li><p>Material selection</p></li><li><p>Integrating AM into established workflows</p></li><li><p>Scaling up AM use or moving from prototyping to production</p></li><li><p>Understanding the application of industry-specific regulations to AM</p></li></ul><p>At the 2026 edition of the annual Formnext trade show, AM technology providers, material providers, and service providers will present proven solutions to these problems for users in automotive, transportation, and other relevant industries. </p><p>The event will bring together over 800 exhibitors along the <a href="https://www.wevolver.com/article/the-additive-manufacturing-process-chain-and-its-industry-interfaces">entire process chain</a>, allowing industry decision-makers to see technology demonstrations and use cases up close while forming new business connections.</p><p>As the world’s largest additive manufacturing industry event, Formnext serves as a unique entry point to the AM ecosystem, giving end-users direct access to the world’s foremost AM companies and serving as a catalyst for the formation of strategic partnerships.</p><p><span class="fr-img-caption fr-fic fr-dii"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1786998512804-1786998512804.png" width="624" height="351" class="fr-fic fr-dii" /><span class="fr-inner">Source / Copyright: Formnext Mesago Messe Frankfurt. (Bottom left &amp; bottom right: Marc Jacquemin. Bottom center: Mathias Kutt)</span></span></span></p><p>This year’s edition of Formnext takes place November 17–20, 2026 at the Messe Frankfurt exhibition grounds. Subscribe to the <a href="https://info.mesago.de/-lp/5HKPB14784/p4jkP173">AM4U newsletter</a> and Formnext Magazine to receive updates about the event and secure your <a href="https://formnext.mesago.com/frankfurt/en/expo/visitor-information.html#tickets">Formnext ticket with the Early Bird discount, available until 22 October</a>.</p><p>Learn more about <a href="https://formnext.mesago.com/frankfurt/en/industry-insights/automotive_industry.html?wt_mc=Display-Banner.ahgz.mf-mesago.formnext.cross-country.vt.cv.wevolver_automotive_2026">Automotive at Formnext</a> by downloading the free industry whitepaper and registering for the Formnext Technology Talk "<em>AM in the automotive, transportation &amp; mobility industry</em>".</p><hr /><h3>References:</h3><ol><li>https://www.iea.org/reports/global-ev-outlook-2026/trends-in-electric-cars</li><li>https://www.mckinsey.com/industries/automotive-and-assembly/our-insights/winning-the-automotive-software-development-race</li></ol>

Formnext 2026 will provide automotive, transportation, and mobility companies with a unique gateway to the global additive manufacturing ecosystem.

Automotive and Additive Manufacturing Converge at Formnext 2026

<p>Robotics is expanding across manufacturing, automotive production, aerospace, healthcare, logistics, and industrial automation. Despite their different uses in various industries, all modern robots share the same procedural requirements: sensing conditions, processing data, making decisions, and acting in the physical world.</p><p><a href="https://wevlv.co/ew_na_lp" id="isPasted"><strong>embedded world North America</strong></a><strong> </strong>will take place from <strong>September 22nd to the 24th, 2026</strong>, at the <strong>Anaheim Convention Center</strong> in Anaheim, CA, US. It provides a focused platform for the embedded technology community across the United States, Canada, and Mexico. Organisers expect more than 5,000 visitors, over 250 exhibitors, more than 60 technical sessions, and 100,000 square feet of exhibition space.<sup>[1]</sup></p><p>The Robotics Lab is a hands-on show-floor feature connecting embedded systems, AI, human-machine interaction, and practical applications. It shifts attention from robots as finished machines to the technology stack behind them.</p><h2>Why Robotics Belongs at an Embedded Systems Event</h2><h3>Embedded Systems as the Foundation of Robotics</h3><p>Robots depend on microcontrollers, systems-on-chip, sensors, real-time operating systems, connectivity, and embedded software. Sensors collect data, processors interpret it, and software turns it into movement. Timing is critical because delays can affect accuracy and safety.</p><p>AI cannot compensate for weak sensing, limited processing, high energy use, or unreliable control. The wider embedded world platform encompasses the components, modules, operating systems, communication systems, and design tools that underpin this foundation.<sup>[2]</sup></p><h3>Robotics as a Clear Use Case for Embedded Innovation</h3><p>Robotics combines hardware, firmware, software, AI, and connectivity. A mobile robot may process urgent tasks locally while sending selected data to an edge or cloud platform.</p><p>This makes technical choices visible. Processing delays affect movement, sensor errors affect decisions, and network loss can interrupt remote functions. Robotics therefore matters to engineers, developers, integrators, product managers, and research leaders. It also provides a practical way to examine productivity, safety, automation, and industrial change.<sup> [3]</sup></p><h2>The Robotics Lab Visitor Journey</h2><h3>A Structured Four-Zone Experience</h3><p>The approximately 800-square-foot Robotics Lab is planned as a journey through four connected zones: Embedded Intelligence, AI and Autonomy Engine, Human-Machine Interaction, and Industry Applications and Future Robotics.</p><p>The route moves from control components to decision-making, interaction with people, and final industry use. It shows that autonomy depends on the embedded platform, data, software, AI models, interfaces, and operating environment.</p><h3>From Embedded Intelligence to Industry Application</h3><p>Embedded systems provide sensing, processing, and control. AI adds perception, learning, and autonomy. Human-machine interaction connects robots with operators, while industry applications place the complete system in environments with specific safety, performance, and reliability needs.</p><p>Following this sequence helps visitors see how decisions at one level affect those at other levels. A strong AI model may still fail on limited hardware, while a capable robot may remain difficult to use if its interface is unclear.</p><h2>The Four Robotics Lab Zones</h2><h3>Zone 1: Embedded Intelligence</h3><p>This zone covers microcontrollers, SoCs, sensors, RTOS platforms, and connectivity. Together, they manage robotic control, collect operational data, support predictable timing, and connect robots with other systems.</p><p>The main point is simple: every intelligent robot begins with an embedded platform designed for its task.</p><h3>Zone 2: AI and Autonomy Engine</h3><p>Machine learning supports pattern recognition and adaptive behaviour, while computer vision enables inspection, object detection, and navigation. Simulation allows teams to test and improve systems before physical deployment.</p><p>AI processing may run on the robot, at the edge, or in the cloud. On-device and edge processing can reduce latency, while cloud systems can support training, storage, and coordination. Research on edge robotics identifies reduced latency, mobility, location awareness, and real-time processing as key benefits.<sup> [4]</sup></p><h3>Zone 3: Human-Machine Interaction</h3><p>This zone includes cobots, control displays, AR and VR, voice and gesture control, and safety systems. These tools can support training, monitoring, programming, and maintenance.</p><p>Robots working near people need clear status information, predictable movement, accessible emergency controls, and defined limits. Augmented and mixed reality can support robot control, training, monitoring, and clearer communication between people and machines. <sup>[5]</sup> Human-Centered design should make robotic behaviour easier to understand without hiding uncertainty or risk.</p><h3>Zone 4: Industry Applications and Future Robotics</h3><p>The final zone connects robotics with automotive manufacturing, aerospace, healthcare, logistics, industrial automation, smart factories, and emerging fields.</p><p>Requirements differ by sector. Factory robots may work in controlled cells, warehouse robots must handle changing routes and people, and healthcare systems require close attention to safety, privacy, hygiene, and reliability.</p><p>Displays should explain not only what a robot does, but also the sensors, processing systems, safety controls, and operating conditions behind it.</p><h2>Hands-On Experiences and Technical Programming</h2><h3>Interactive Show-Floor Elements</h3><p>The lab can include live robotics demonstrations, AI inference examples, cobots, sensor walls, simulation tools, AR and VR interfaces, gesture control, and industry-specific application pods. These displays can show how sensor input becomes an AI result and then a physical action.</p><p>embedded world North America offers a hands-on technical setting where companies can demonstrate technologies directly to engineers and other technical visitors.<sup>[3] </sup>Demonstrations should also state whether processing is remote, routes are pre-mapped, or models are trained for selected objects.</p><h3>Engagement Through Learning Formats</h3><p>Ten-minute technical sessions, expert-led tours, and workshops can cover robotics programming, sensing, simulation, and AI model tuning.</p><p>Tours can connect the four zones, while workshops let visitors examine trade-offs involving processing, memory, power, and deployment. These formats can serve embedded engineers, robotics and AI developers, product leaders, and technical executives.</p><h2>Value for Attendees, Exhibitors, and Sponsors</h2><h3>Attendee </h3><p>For attendees, the lab shows how robotic systems move from individual components to deployment. It brings together embedded systems, AI, HMI, and industry applications, and connects robotics trends with practical challenges in sensing, integration, connectivity, safety, and reliability.</p><p>Compared with a standard booth display, live and interactive exhibits offer a more active way to understand how robotic technologies operate in real applications.</p><h3>Exhibitor and Sponsor</h3><p>For exhibitors and sponsors, the lab can offer zone-level sponsorship, ownership of selected demonstrations, branded robotics experiences, and participation in technical sessions, tours, and workshops.</p><p>Direct engagement with engineers and decision-makers can support lead generation and provide a clearer way to show real-world technology impact. The official exhibitor information also presents live demonstrations, technical discussions, brand visibility, and lead generation as key reasons for participation.<sup> [3]</sup></p><p>Sensor companies can demonstrate data collection, processor suppliers can show performance under timing and power limits, and software providers can present tools for simulation, control, or deployment.</p><p>Sponsored activities should be clearly identified, while technical content should discuss limits and compatibility rather than present products as universal solutions.</p><h1>Conclusion</h1><p>Robotics is one of the clearest examples of embedded systems becoming intelligent physical machines. The Robotics Lab can present the complete embedded-to-AI pipeline by connecting embedded intelligence, autonomy, human interaction, and industry applications.</p><p>As robotics adoption grows across U.S. industries, hands-on demonstrations, technical sessions, tours, and workshops can help engineers and decision-makers understand both the opportunities and practical requirements of deployment.</p><p>The lab’s value lies not only in displaying robots but in explaining the technologies, operating conditions, and design choices behind them.</p><p><strong>For more info about <a href="https://wevlv.co/ew_na_lp" target="_blank" rel="noopener noreferrer">embedded world North America, check out their event page</a>.</strong></p><hr /><h3>References</h3><ol><li><p><a href="https://embedded-world-na.com/?utm_source">embedded world North America official event page</a> </p></li><li><p><a href="https://embedded-world-na.com/exhibit/?utm_source">embedded world North America exhibitor information page</a> </p></li><li><p><a href="https://www.embedded-world.de/en?utm_source">embedded world global exhibition and conference page</a> </p></li><li><p><a href="https://arxiv.org/abs/2507.00523?utm_source">Edge Computing and Its Application in Robotics: A Survey</a> </p></li><li><p><a href="https://arxiv.org/abs/2203.03254?utm_source">Augmented Reality and Robotics: A Survey and Taxonomy for AR-enhanced Human-Robot Interaction and Robotic Interfaces</a></p></li></ol>

How Embedded Systems, AI, and Human-Centered Design Are Driving the Future of Robotics

Robotics Lab at embedded world North America

<p id="isPasted">Date: <strong>September 22–24, 2026</strong><br />Location: <strong>Anaheim, California</strong></p><h2>Build and Demonstrate Edge AI in Action</h2><p>The inaugural <a href="https://embedded-world-na.com/activations/" target="_blank" rel="noopener noreferrer">embedded world North America Edge AI Hackathon</a> will allow teams to design and prototype real-time, on-device AI applications on the show floor.</p><p>Working in teams of four to five people and supported by professional mentors, participants will move from initial concept to working prototype during conference hours. The event will conclude with live demonstrations and an awards ceremony on the show floor.</p><p>Teams will work across four practical edge AI challenge tracks, including robotics and sustainability, using hardware and development tools supplied by event sponsors.</p><h3>What to Expect</h3><ul><li><p>A live embedded hardware hackathon on the show floor</p></li><li><p>University teams working alongside professional mentors</p></li><li><p>Real-time, on-device AI development</p></li><li><p>Live commentary and project updates</p></li><li><p>Final team demonstrations and an awards ceremony</p></li><li><p>Four $1,000 prizes, along with hardware and gear from event sponsors</p></li></ul><h3>Event Partners and Sponsors</h3><p>Arduino and Qualcomm are the title sponsors of the hackathon. Quilter is supporting the robotics challenge, while ASUS is supporting the sustainability challenge.</p><p>The program brings together embedded world North America, Hackaday, Supplyframe, and Wevolver to connect a live engineering challenge with wider project documentation and editorial coverage.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1788499321825-Electroplating+%26+Coatings+%286%29.jpg" style="width:100%px" class="fr-fic fr-dib" /></p><p>Powered by title sponsors Arduino and Qualcomm, robotics challenge sponsor Quilter, and sustainability challenge sponsor ASUS.</p><h3>Follow the Projects</h3><p>Wevolver will provide ongoing coverage of the hackathon, including features on the projects developed by participating teams. Check back for updates and highlights as the final builds take shape.</p><h2>Attend embedded world North America</h2><p>See university teams put edge AI into practice, and <a href="https://embedded-world-na.com/" target="_blank" rel="noopener noreferrer">follow their progress live from the show floor</a> in Anaheim.</p><p><a href="https://www.prereg.net/2026/ewna/" target="_blank" rel="noopener noreferrer">Register for embedded world North America here.</a></p><p><br /></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1788498747387-EW-1200x628.png" style="width:100%px" class="fr-fic fr-dib" /></p>

Build, test, and demonstrate on-device AI systems during a live engineering challenge on the embedded world North America show floor.

Edge AI Hackathon at embedded world North America 2026

<p id="isPasted">Formnext Asia Shenzhen 2026 brings together manufacturers, engineers, technology providers, and business leaders from across the additive manufacturing industry to focus on innovation, industry collaboration, and the latest developments in digital manufacturing and precision production. </p><p>On August 26–28, 2026, professional visitors from around the world will attend Formnext Asia Shenzhen to collaborate with more than 320 exhibitors and learn more about the rapid expansion of industrial and consumer 3D printing technologies. </p><p>Join exhibitors like Bambu Lab, Creality, Farsoon Technologies, Raise3D, HBD, Intamsys, UnionTech, Han's Laser, Meshy AI, and Tripo AI to discover how to print beyond limits.</p><p>Take a look at the <a href="https://wevlv.co/FormnextShenzhen1" target="_blank" rel="noopener noreferrer">event brochure</a> for more exciting information.</p><h2>Learn More</h2><p>Formnext Asia Shenzhen attracts attendees from a wide range of industries, including aerospace, automotive, consumer electronics, healthcare, tooling, and industrial manufacturing. The combination of exhibition spaces, technical presentations, and business meetings makes it a valuable event for companies looking to stay up to date with developments in advanced manufacturing.</p><p>The exhibition covers the entire additive manufacturing supply chain. Visitors can explore industrial 3D printers, advanced materials, software platforms, post-processing equipment, automation systems, and precision manufacturing technologies. Alongside the exhibition, the event includes conferences, live demonstrations, and networking sessions that help professionals connect and exchange ideas.</p><p>320+ exhibitors across additive manufacturing and advanced production</p><p id="isPasted"><strong>Additive Manufacturing &amp; 3D Printing</strong></p><ul><li>Industrial 3D printers</li><li><p>Desktop 3D printing systems</p></li><li><p>Metal additive manufacturing</p></li><li><p>Polymer and ceramic printing technologies</p></li><li><p>Precision forming technologies</p></li></ul><p><strong>Materials &amp; Production Technologies</strong></p><ul><li><p>High-performance materials</p></li><li><p>Metal powders and resins</p></li><li><p>Composite materials</p></li><li><p>Post-processing solutions</p></li><li><p>Surface finishing and sintering technologies</p></li></ul><p><strong>Software &amp; Digital Manufacturing</strong></p><ul><li><p>CAD and simulation software</p></li><li><p>Workflow automation tools</p></li><li><p>AI-assisted design platforms</p></li><li><p>Production management systems</p></li><li><p>Smart manufacturing solutions</p></li></ul><p><strong>Industrial Applications</strong></p><ul><li><p>Automotive manufacturing</p></li><li><p>Aerospace applications</p></li><li><p>Consumer electronics</p></li><li><p>Medical and dental technologies</p></li><li><p>Tooling and mold production</p></li></ul><p><strong>Services &amp; Solutions</strong></p><ul><li><p>Contract manufacturing services</p></li><li><p>Engineering consulting</p></li><li><p>Inspection and quality control</p></li><li><p>Logistics and supply chain services</p></li><li><p>Research and development organizations</p></li></ul><p>For more information, visit the <a href="https://wevlv.co/FormnextShenzhen2" target="_blank" rel="noopener noreferrer">Formnext Asia Shenzhen</a> official website.</p>

Print beyond limits, create beyond imagination.

Formnext Asia Shenzhen 2026 - Shenzhen, China

<p id="isPasted">If you sell, qualify, or print parts across more than one region, you already know the problem. A component certified to one standard does not automatically clear the bar somewhere else. Procurement teams ask for proof of compliance that does not map cleanly between Chinese, European, and US frameworks. Qualification paths that took months to build for one market often need to be rebuilt for the next.</p><p>For most manufacturers and service providers, the real bottleneck is not a lack of standards. It is the lack of a shared reference for how those standards are converging, and where they are not.</p><h2><strong>What the panel covers</strong></h2><p>Four people working from four different vantage points in the standardization chain join one conversation.</p><p>You will hear:</p><ul><li>What ASTM's current role looks like in setting and revising AM standards globally</li><li>Where qualification and certification practices differ most between Eastern and Western markets</li><li>How trade media in both regions is tracking and reporting on standardization progress</li><li>What practical impact these differences have on component comparability and market access</li><li>Where genuine convergence between the regions is happening, and where it is not</li><li>What service providers and manufacturers should be watching over the next phase of standards development</li></ul><p><a href="https://wevlv.co/3DRuck-Panel" id="isPasted" class="button-main-action" target="_blank" rel="noopener noreferrer">Register for free</a></p><h2><strong>Why attend</strong></h2><p>Additive manufacturing is no longer confined to prototyping. As parts move into regulated, safety critical, and cross border supply chains, the gap between regional standards becomes a commercial problem, not just a technical one. A part that passes qualification in one market can stall at the border of another simply because the paperwork speaks a different standards language.</p><p>If your work touches more than one of these regions, this is a chance to hear where the friction actually is, straight from the people negotiating it.</p><h2><strong>Who's on the panel</strong></h2><p>Li Chen joins from 3DZYK, covering the Chinese additive manufacturing industry. Andy Lu represents ASTM, one of the central standardization bodies for AM globally. Johannes Gartner brings the European trade media perspective through 3Druck.com. Gregor Reichle joins from QualifiedAM, focused on qualification and certification practice.</p><h2><strong>Event details</strong></h2><p>The panel runs live on <strong>June 29, 2026</strong>. Start times: 21:00 Beijing, 15:00 CEST, 14:00 UK, 09:00 US East Coast, 06:00 US West Coast. International viewers join via Google Meet. A WeChat livestream is available for viewers in China.</p><p><a href="https://wevlv.co/3DRuck-Panel" class="button-main-action" target="_blank" rel="noopener noreferrer">Register for free</a></p>

A live panel on how China, Europe, and the US are building, certifying, and reconciling additive manufacturing standards, and where those approaches still don't line up.

The AM Standard Journey: East vs. West

<p id="isPasted">3D PRINT Lyon brings together manufacturers, engineers, technology providers, researchers, and industrial decision makers from across the additive manufacturing industry. The event highlights the latest developments in 3D printing, industrial applications, and production technologies that are shaping modern manufacturing.</p><h2><strong>Learn More</strong></h2><p>The exhibition covers the full additive manufacturing value chain. Visitors can explore industrial 3D printers, advanced materials, software solutions, post-processing technologies, and live machine demonstrations across a variety of industries. The event also includes conferences, workshops, and networking sessions featuring industry experts and innovators from around the world.</p><p>3D PRINT Lyon attracts professionals from sectors such as aerospace, automotive, healthcare, industrial manufacturing, plastics, composites, and consumer products. The event combines a trade exhibition with technical education and business development opportunities for companies involved in advanced manufacturing technologies.</p><p>The exhibition has become one of Europe’s leading meeting points for additive manufacturing professionals. Companies attend to discover new technologies, evaluate industrial solutions, connect with suppliers, and exchange knowledge with experts from across the industry.</p><p>Held annually in Lyon, 3D PRINT Lyon has grown into France’s leading additive manufacturing trade show since launching in 2014. The 2026 edition is expected to feature more than 150 exhibitors and attract thousands of professional visitors from across Europe and beyond.</p><h2><strong>Who attends 3D PRINT Lyon?</strong></h2><p>Participants include additive manufacturing companies, industrial manufacturers, engineers, software developers, research institutions, and technology suppliers. Attendees include production managers, R&amp;D teams, product designers, distributors, and manufacturing decision makers.</p><h3><strong>150+ exhibitors and brands across additive manufacturing and industrial production</strong></h3><h3><strong>Additive Manufacturing &amp; 3D Printing</strong></h3><ul><li>Industrial 3D printing systems</li><li>Metal additive manufacturing</li><li>Polymer and composite printing technologies</li><li>Large-format production systems</li><li>Rapid prototyping solutions</li></ul><h3><strong>Materials &amp; Industrial Technologies</strong></h3><ul><li>Metal powders and resins</li><li>Engineering plastics and composites</li><li>Surface finishing solutions</li><li>Post-processing technologies</li><li>Precision manufacturing equipment</li></ul><h3><strong>Software &amp; Digital Manufacturing</strong></h3><ul><li>CAD and simulation software</li><li>Workflow automation tools</li><li>Production management platforms</li><li>AI-driven manufacturing solutions</li><li>Digital factory technologies</li></ul><h3><strong>Industrial Applications</strong></h3><ul><li>Aerospace manufacturing</li><li>Automotive production</li><li>Medical and dental technologies</li><li>Tooling and mold production</li><li>Consumer and industrial products</li></ul><h3><strong>Services &amp; Innovation</strong></h3><ul><li>Engineering and consulting services</li><li>Research and development organizations</li><li>Quality control and inspection</li><li>Logistics and supply chain solutions</li><li>Training and technical education</li></ul><p>The event also features keynote speakers, expert-led conferences, and live demonstrations focused on real-world industrial applications of additive manufacturing technologies.</p><p>For more information, visit the <a href="https://www.3dprint-exhibition-lyon.com/en">3D PRINT Lyon </a>official website.</p>

An annual industry event focused on additive manufacturing, industrial 3D printing, and advanced manufacturing technologies in Europe.

3D PRINT Lyon 2026

<p id="isPasted">The event takes place from May 18 to May 22, 2026 at Resorts World in Las Vegas, United States.</p><p>EDS Leadership Summit brings together manufacturers, distributors, and representatives from across the electronics industry. The event focuses on building business relationships and aligning priorities for the year ahead.  </p><p><a href="https://edssummit.com/" target="_blank" rel="noopener noreferrer" class="button-main-action">Learn More</a></p><p>The summit is centered around scheduled meetings between companies. These meetings are used to discuss partnerships, review performance, and plan future opportunities. The event also includes networking functions and informal gatherings where attendees connect with industry partners.  </p><p>EDS is primarily attended by decision makers from electronic component manufacturers, distributors, and sales organizations. The event is structured around business discussions rather than a traditional exhibition format.  </p><p>The summit serves as a yearly meeting point for companies working in electronic components and related technologies. Participants use the event to set goals, exchange ideas, and maintain industry relationships.  </p><p>EDS takes place annually in Las Vegas and is considered a key business event for the electronic components ecosystem. The schedule typically includes several days of meetings and networking activities.  </p><h2 id="isPasted">Who attends EDS?</h2><p>Par­tic­i­pants in EDS are pri­mar­i­ly man­u­fac­tur­ers of elec­tron­ic com­po­nents, plus sup­pli­ers of goods and ser­vices used by dis­trib­u­tors and sale reps. Atten­dees at EDS are dis­trib­u­tors and sales reps. </p><h3><strong>400 Man­u­fac­tur­ers who sell through elec­tron­ic Distributors</strong></h3><ul><li>Pas­sive and electro­mechan­i­cal components</li><li>Instru­ments</li><li>Dat­a­com products</li><li>Acces­sories</li><li>Active com­po­nents</li></ul><h3><strong>Sup­pli­ers who sell to elec­tron­ic Distributors</strong></h3><ul><li>Third par­ty logistics</li><li>Val­ue added equipment</li><li>Data pro­cess­ing equip­ment and software</li><li>Office and ware­house equipment</li><li>Con­sult­ing services</li></ul>

An annual industry event focused on business meetings and strategic planning in the electronic components supply chain.

EDS Leadership Summit 2026

<p id="isPasted">On April 23rd, Siemens and Altair are bringing together engineers, innovators, and industry leaders for a full day dedicated to the future of simulation.</p><p>Hosted at the British Motor Museum in Gaydon, this in-person event will explore how simulation, AI, and digital engineering are coming together to reshape the way products are designed, tested, and brought to market.</p><p id="isPasted">The conference takes place on April 23rd, 2026, running from 09:00 AM to 05:00 PM.</p><p><a href="https://resources.sw.siemens.com/en-GB/altair-technology-conference-by-siemens/?utm_source=wevolver&amp;utm_medium=landingpage&amp;utm_id=simscale" target="_blank" rel="noopener noreferrer" class="button-main-action"><strong>Reserve your seat now.</strong></a></p><h2><strong>What to expect</strong></h2><p>The Simcenter Technology Conference 2026 builds on the strong legacy of Altair Technology Conferences, while expanding its scope through the combined expertise of Siemens and Altair.</p><p>If you’ve attended an ATC before, you’ll recognize the same energy, depth, and practical insights, but this year goes further, with a stronger focus on convergence across tools, technologies, and workflows.</p><p>If this is your first time, it’s a chance to get a clear view of where simulation is heading. From AI-driven engineering to digital twins and multi-physics modeling, the agenda is designed to give you both inspiration and practical takeaways you can apply directly in your work.</p><h2 id="isPasted"><strong>Explore the full agenda</strong></h2><p>If you’re curious about the full lineup of sessions and speakers, you can <a href="https://na-admin.eventscloud.com/docs/10372/462624" target="_blank" rel="noopener noreferrer">download</a> the detailed agenda and start planning your day in advance.</p><h2><strong>A day built around real engineering challenges</strong></h2><p>The program brings together voices from across industries, including automotive and aerospace, alongside experts from Siemens.</p><p>Throughout the day, you’ll hear how organizations are using simulation not just to validate designs, but to fundamentally change how they develop products. Topics range from AI-driven multi-physics design and automated workflows to virtual prototyping and digital twin applications.</p><p>There will also be a panel discussion focused on the growing role of AI in engineering, exploring both the opportunities and the challenges it introduces.</p><p>In between sessions, there will be time to step back, continue conversations, and connect with others working on similar problems.</p><h2><br /></h2><h2><strong>Why attend</strong></h2><p>This event is designed for engineers and technical leaders who want to stay ahead of where simulation is going.</p><p>Whether you’re working hands-on with CAE tools, leading product development teams, or exploring how to integrate AI into your workflows, the conference offers a grounded, practical perspective on what’s actually working today — and what’s coming next.</p><h2><strong>Join the conversation</strong></h2><p>More than anything, the Simcenter Technology Conference is about bringing people together. It’s a chance to learn, exchange ideas, and see how others are approaching similar challenges</p><p>If you’re looking to accelerate your approach to simulation and better understand the role of AI and digital twins in your work, this is a day worth being part of.</p><p id="isPasted"><strong>The event is free to attend but spaces are limited. </strong></p><p><a href="https://resources.sw.siemens.com/en-GB/altair-technology-conference-by-siemens/?utm_source=wevolver&amp;utm_medium=landingpage&amp;utm_id=simscale" target="_blank" rel="noopener noreferrer" class="button-main-action"><strong>Reserve your seat now.</strong></a></p>

Join Siemens and Altair for a full day of innovation, insights, and real-world applications shaping the future of simulation.

Simcenter Technology Conference 2026

<p id="isPasted">RAPID + TCT 2026 is North America’s leading event for industrial additive manufacturing and 3D printing. Over four days, engineers, R&amp;D leaders, and production professionals will explore the latest technologies, materials, and processes that are shaping the future of manufacturing. The event combines a technical conference, industry-leading exhibits, and specialized showcases with high-value networking opportunities, giving attendees practical insights and direct access to the innovators and solutions driving industrial 3D printing adoption.</p><p>Whether evaluating production-scale additive solutions or exploring emerging workflows, RAPID + TCT provides engineers with actionable knowledge, hands-on demonstrations, and peer-to-peer engagement to support real-world implementation and innovation.</p><p><a href="https://xpressreg.net/register/rapd0426/landing.asp?sc=&amp;aban=&amp;hkey=&amp;iq=&amp;vip=&amp;tm=&amp;_ga=" target="_blank" rel="noopener noreferrer" class="button-main-action">Register today</a></p><h2 id="isPasted">Why Attend</h2><ul><li><strong>Access emerging technologies</strong> from leading industrial 3D printing and additive manufacturing providers.</li><li><strong>Learn from experts</strong> via technical presentations, case studies, and in-depth workshops.</li><li><strong>Discover practical solutions</strong> for production-scale additive implementation.</li><li><strong>Expand your professional network</strong> with industry peers, technology providers, and potential collaborators.</li></ul><p><span class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable fr-active"><iframe src="https://www.youtube.com/embed/uJvr0I61av0?&amp;wmode=opaque&amp;rel=0" frameborder="0" class="fr-draggable" style="width:640px;height:460px"></iframe></span><br /></p><p>This event is relevant for engineers, designers, R&amp;D leaders, production managers, and decision-makers implementing additive technologies.</p><h2>Event Highlights</h2><h3><span class="fr-img-caption fr-fic fr-dib fr-draggable"><span class="fr-img-wrap"><a href="https://www.rapid3devent.com/" target="_blank" rel="noopener noreferrer"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1774357361744-exhibits_768x432.webp" style="width:100%px" class="fr-fic fr-dib" /><span class="fr-inner">Source: Rapid + TCT.</span></a></span></span>Exhibits</h3><p>Interact with the latest additive manufacturing hardware, software, and materials. Examine innovations in metal, polymer, and composite 3D printing and gain direct insights from manufacturers and suppliers.</p><h3>Technical Conference</h3><p>Attend expert-led sessions covering:</p><ul><li>Advanced applications in aerospace, medical, automotive, and industrial sectors</li><li>Process optimization and production strategies</li><li>Emerging trends in additive design, materials, and workflow integration</li></ul><h3>Showcases</h3><p>Specialized zones highlight high-impact industry solutions, allowing attendees to focus on areas most relevant to their work.</p><p><span class="fr-img-caption fr-fic fr-dib fr-draggable"><span class="fr-img-wrap"><a href="https://www.rapid3devent.com/" target="_blank" rel="noopener noreferrer"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1774357416802-am-industry-networking-event_768x432.webp" style="width:100%px" class="fr-fic fr-dib" /><span class="fr-inner">Source: RAPID + TCT</span></a></span></span></p><h3>Networking</h3><p>Structured and informal networking opportunities help engineers and decision-makers connect with peers, potential collaborators, and leading solution providers.</p><h2>Why It Matters</h2><ul><li>Evaluate technologies before they are widely adopted in production environments.</li><li>Gain actionable insights to improve efficiency, reduce costs, and accelerate project timelines.</li><li>Access direct feedback from practitioners who have implemented additive manufacturing in industrial settings.</li></ul><p id="isPasted"><a href="https://xpressreg.net/register/rapd0426/landing.asp?sc=&amp;aban=&amp;hkey=&amp;iq=&amp;vip=&amp;tm=&amp;_ga=" target="_blank" rel="noopener noreferrer" class="button-main-action">Register today</a></p>

RAPID + TCT is the industry’s launch pad for new product announcements, AM innovations and leading-edge research.

Join the largest gathering of industrial 3D printing and additive manufacturing professionals in North America. Discover emerging technologies, hear from leading innovators, and make connections that drive real industrial impact.

RAPID + TCT 2026: Register today

<p id="isPasted">Modern ventilation and HVAC systems are undergoing a significant transformation. As priorities including energy efficiency, indoor air quality (IAQ), and sustainability take center stage, traditional approaches such as demand-controlled ventilation (DCV) and variable air volume (VAV) systems are evolving. This webinar brings together industry insight and technical perspectives to help you understand how sensor technology is shaping smarter, healthier, and more efficient building environments.</p><p><a href="https://emea.info.mouser.com/sensirion-greenbuildingwebinar-event-emea-emeaen?pid=wevolver&amp;cid=landingpage" class="button-main-action">Register here.</a></p><h2>Why Attend</h2><p>This live session examines the latest trends influencing HVAC design and performance, with a focus on sensing technologies that go beyond conventional CO₂ monitoring.</p><p>You’ll learn how advanced environmental sensing enables:</p><ul><li><p>Enhanced indoor air quality, with insights on humidity, airflow, and CO₂ measurement.<br /><br /></p></li><li><p>Improved energy performance, especially through strategies like energy–recovery ventilation.<br /><br /></p></li><li><p>Regional HVAC trends in Europe and North America, and how they influence system requirements.<br /><br /></p></li><li><p>Compliance considerations, including ASHRAE 62.1 IAQP and filtration strategies.<br /><br /></p></li></ul><p>This session will be recorded. Registered participants who can’t attend live will receive access to the recording automatically. <a href="https://emea.info.mouser.com/sensirion-greenbuildingwebinar-event-emea-emeaen?pid=wevolver&amp;cid=landingpage">Confirm your attendance here.</a></p><h2>Host &amp; Speakers</h2><h3>Host</h3><p><strong>Stuart Cording – Technical Content Creator</strong><br /><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1769603098576-Untitled+design+%2841%29.png" style="width:100%px" class="fr-fic fr-dib" /></p><p id="isPasted">Stuart is an accomplished engineer and creator known as The Electronics Reporter. With over two decades of experience in semiconductors and embedded systems, he brings practical context and deep technical understanding to complex design challenges.</p><h3>Speakers</h3><p><strong>Christian Ebneter – Senior Global Market Manager HVAC &amp; Appliance, Sensirion</strong></p><p><strong><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1769603139134-Untitled+design+%2842%29.png" style="width:100%px" class="fr-fic fr-dib" /></strong><br />Christian combines international experience in product strategy and market development with technical insights in sensor applications. He has supported sensor technology adoption across Europe, North America, and Asia.</p><p><strong>Dr. Kaitlin Howell – Senior Product Manager CO₂ Gas Sensing, Sensirion</strong><strong><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1769603153764-Untitled+design+%2843%29.png" style="width:100%px" class="fr-fic fr-dib" /></strong><br />Kaitlin blends expertise in microsystems engineering with hands-on experience in developing advanced CO₂ sensors. Her work focuses on enabling practical solutions for indoor air quality improvement.</p><h2>Featured Sensor Technologies</h2><p>Explore these key sensor solutions highlighted in conjunction with the webinar:</p><ul><li><a href="https://app.info.mouser.com/e/er?s=1742027581&amp;lid=45004&amp;elqTrackId=808ee0f8f55f441ab393606c4a37c1c1&amp;elq=00000000000000000000000000000000&amp;elqaid=6409&amp;elqat=2&amp;elqak=8AF5A3117A14296920892753F304139FB62FBB2836E7E3176BD6601CA1D6D0B42CDF">SDP3x Differential Pressure Sensors</a> – Precision airflow measurement<br /><br /></li><li><a href="https://app.info.mouser.com/e/er?s=1742027581&amp;lid=45003&amp;elqTrackId=ad60ab589f904c1d9db9283db6563a0c&amp;elq=00000000000000000000000000000000&amp;elqaid=6409&amp;elqat=2&amp;elqak=8AF5AC903512195B126CD31A33D7AADDCCCBBB2836E7E3176BD6601CA1D6D0B42CDF">SCD43 CO₂ Sensor Evaluation Kit</a> – CO₂ sensing calibration and prototyping<br /><br /></li><li><a href="https://app.info.mouser.com/e/er?s=1742027581&amp;lid=45002&amp;elqTrackId=3242c5e107314f1fb6f908b9b7da01fd&amp;elq=00000000000000000000000000000000&amp;elqaid=6409&amp;elqat=2&amp;elqak=8AF50B5F7E3DD470F8584E210274FDB60DACBB2836E7E3176BD6601CA1D6D0B42CDF">STCC4 Miniature CO₂ Sensor</a> – Compact CO₂ sensing integration</li></ul><p><a href="https://app.info.mouser.com/e/er?s=1742027581&amp;lid=45004&amp;elqTrackId=808ee0f8f55f441ab393606c4a37c1c1&amp;elq=00000000000000000000000000000000&amp;elqaid=6409&amp;elqat=2&amp;elqak=8AF5A3117A14296920892753F304139FB62FBB2836E7E3176BD6601CA1D6D0B42CDF"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1769603431212-SDP3x+Differential+Pressure+Sensors.png" style="width:100%px" class="fr-fic fr-dib" /></a></p><h2><br /><br /><br /><br /></h2><h2><br /></h2><h2><br /></h2><h2>What You’ll Take Away</h2><p>By participating, you will walk away with:</p><ul><li><p>A clearer understanding of how advanced sensing influences HVAC design</p></li><li><p>Technical context for choosing and integrating humidity, airflow, and CO₂ sensors</p></li><li><p>Awareness of compliance and performance considerations in smart ventilation systems</p></li></ul><h2>Recording Availability</h2><p>If you can’t make the live session, <a href="https://emea.info.mouser.com/sensirion-greenbuildingwebinar-event-emea-emeaen?pid=wevolver&amp;cid=landingpage">registering</a> ensures you will receive the webinar recording once available. The live webinar takes place on 17th March 2026 - 5:00 PM CET.</p><p><a href="https://emea.info.mouser.com/sensirion-greenbuildingwebinar-event-emea-emeaen?pid=wevolver&amp;cid=landingpage" class="button-main-action">Sign up for the webinar here.</a></p>

17 March 2026 - 5:00 PM CET

Webinar: What to Know About Smart Air Quality & Flow Sensing in HVAC

<p id="isPasted">The event takes place from March 10 to March 12, 2026 in Nuremberg, Germany. It brings together companies, engineers, and technology providers from across the embedded systems ecosystem.  </p><p><a href="https://www.embedded-world.de/en" target="_blank" rel="noopener noreferrer" class="button-main-action">Learn More</a></p><p>embedded world covers the full stack of embedded development, from hardware components and modules to operating systems, software development tools, and system integration. The exhibition presents new products and services while the conference program focuses on technical and industry topics related to embedded systems design.  </p><p>The event is a meeting point for engineers, developers, system architects, and product teams working with embedded technologies. Attendees can explore solutions related to hardware design, software engineering, machine to machine communication, safety and security, and connected devices.  </p><p>Alongside the exhibition, the conference includes technical presentations and expert sessions covering current developments in embedded systems. Topics include embedded AI, embedded vision, IoT, system architecture, and secure system design.  </p><p>The exhibition floor includes companies presenting semiconductors, development tools, software platforms, and embedded computing solutions. Visitors can learn about new technologies, meet suppliers, and explore tools used in embedded system development.  </p><p>embedded world takes place annually in Nuremberg and serves as a central meeting point for the embedded systems industry. The event provides an overview of current technologies and ongoing developments across the embedded ecosystem.  </p><h2 id="isPasted">Core topics of the industry</h2><p>The embedded world offers an unparalleled insight into the whole world of embedded systems:  </p><ul><li>Hardware </li><li>Systems </li><li>Distribution </li><li>Services </li><li>Tools </li><li>Application software </li><li>Electronic displays </li><li>Embedded vision </li><li>Safety&amp;security </li><li>IC&amp;IP design </li><li>Start-up  </li></ul><h2 id="isPasted">embedded world Conference</h2><p>The embedded world Conference 2026 offers three days of knowledge transfer at the highest level. From 10 to 12 March 2026, participants and speakers will take the opportunity to exchange ideas and expand their knowledge with top-class experts.</p><p>In 2026, the embedded world Conference will once again bring together the state of the art with trend topics in a very clearly structured programme. Experts from research and development will exchange ideas with colleagues from practice. The entire embedded industry benefits from this knowledge transfer.</p><p><a href="https://www.embedded-world.de/en/conferences-programme/embedded-world-conference" target="_blank" rel="noopener noreferrer" class="button-main-action">Learn More</a></p><p><br /></p>

An international trade fair and conference focused on embedded systems and the technologies used to design and build them.

embedded world Exhibition & Conference 2026

<p id="isPasted">As robotics rapidly shifts toward systems that can safely assist, collaborate, and adapt in human environments, the ability to perform coordinated, human-like actions has become a defining frontier. From precision assembly to remote intervention, bimanual manipulation and intuitive teleoperation are unlocking new levels of dexterity and autonomy in modern robots.</p><p>In this webinar, hosted by Franka Robotics, <strong>Prof. Fei Chen, </strong>one of the leading voices in collaborative and humanoid robotics—shares how the CURI human-like robot is advancing this frontier through innovative control, interaction, and teleoperation strategies. Join us to explore the technologies shaping the next generation of intelligent, versatile robotic systems. </p><p><a href="https://wevlv.co/frank_webinar_lp_direct" target="_blank" rel="noopener noreferrer" class="button-main-action">Register now</a></p><h2>Event Details</h2><h3 id="isPasted">📅 Date: December 10, 2025</h3><table><tbody><tr><td><p>Location</p></td><td><p>Virtual (Join from anywhere)</p></td></tr><tr><td><p>Time</p></td><td>10 AM (CET)</td></tr></tbody></table><h2><br /></h2><h2 id="isPasted"><strong>Who should attend</strong></h2><h2><p><br /></p><p><br /></p><p><br /></p></h2><ul><li><p>Industrial automation leaders exploring next-generation collaborative robotic systems</p></li><li><p>Robotics engineers and researchers working on manipulation, teleoperation, or human–robot interaction</p></li><li><p>Developers and integrators interested in dexterous, human-like robotic capabilities</p></li><li><p>Academics and students studying advanced control, bimanual manipulation, or humanoid robotics</p></li><li><p>Innovation teams assessing emerging robotic technologies for real-world applications</p></li></ul><h2><strong>About the Speaker</strong></h2><table><tbody><tr><td><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzYzNjM4MzUwODkxLUZlaV9fLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width:100%px" class="fr-fic fr-dib" /></td><td><strong>Prof. Fei Chen</strong>, Head of the Collaborative and Versatile Robots Laboratory at The Chinese University of Hong Kong, focuses his research on humanoid bimanual manipulation and human-robot collaboration. Prior to joining CUHK, he led research efforts at the Italian Institute of Technology and contributed to numerous European, Italian, and Hong Kong projects. With more than 100 publications, he is also deeply engaged in the IEEE community, serving in key leadership roles across major international robotics conferences and technical committees. In his talk on Bimanual Manipulation and Teleoperation of the CURI Human-like Robot, he highlights how advanced control and interaction strategies are shaping the next generation of intelligent, versatile robotic systems.<br /></td></tr></tbody></table><h2 id="isPasted"><strong>Why you should attend</strong></h2><ul><li>Learn how bimanual manipulation enables more complex, human-level tasks in collaborative robotics</li><li>Understand cutting-edge control and interaction strategies used in the CURI human-like robot</li><li>Discover how researchers working on advanced manipulation can benefit from using a highly sensitive <a href="https://franka.de/franka-research-3" target="_blank" id="isPasted">cobot arm</a> that complements bimanual teleoperation studies. <a href="https://wevlv.co/frank_webinar_lp_direct" target="_blank" rel="noopener noreferrer"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzYzNjM4Mjg2MjE2LVdlYmluYXIgcG9zdCAxMCBEZWMgKDEpLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width:100%px" class="fr-fic fr-dib" /></a></li></ul><p><br /></p><p><br /></p>

Join Prof. Fei Chen as he explores advanced bimanual manipulation and teleoperation techniques shaping the future of intelligent human-like robots in this expert-led robotics session.

Bimanual Manipulation and Teleoperation of the CURI Human-like Robot

<article dir="auto" data-testid="conversation-turn-26" data-scroll-anchor="true" id="isPasted"><div tabindex="-1"><div data-message-author-role="assistant" data-message-id="5c05d88c-5716-4aba-814a-898350a0e1f7" dir="auto" data-message-model-slug="gpt-4o"><p data-start="147" data-end="328" class="highlight-box">We’re thrilled to announce that <a href="https://wevlv.co/Hackaday-supercon"><strong data-start="179" data-end="205">Hackaday Supercon 2025</strong></a> is officially happening! Mark your calendars: the event takes place from <strong data-start="267" data-end="299">October 31st to November 2nd</strong> in&nbsp;<strong data-start="303" data-end="327">Pasadena, California</strong>.<br><br><a href="https://4c3nl.share.hsforms.com/2G1jB8qQoTz-0GDOnsBcCZw" class="button-main-action">sign up now</a></p><p data-start="330" data-end="599">Supercon is where hardware hackers, engineers, and creators converge to share projects, insights, and innovations. If you've been working on something technical, clever, or just plain cool, this is your opportunity to tell the world about it.&nbsp;</p><p data-start="601" data-end="886">As in past years, we're accepting proposals for both long-form technical talks and short lightning presentations.<strong data-start="688" data-end="721">&nbsp;</strong>We’re especially eager to see new voices join the speaker lineup alongside returning Supercon veterans. Know someone doing great work? <a href="https://wevlv.co/Hackaday-supercon"><strong>Encourage them to apply.</strong></a></p><p data-start="888" data-end="1149">The <strong>Call for Participation</strong> is open now through July 3rd. Submit your talk idea and be part of a weekend filled with cutting-edge projects, firmware magic, badge hacking, hands-on demos, and the kind of hallway conversations you won’t find anywhere else.</p><p data-start="1151" data-end="1300">Presenters receive free admission and the priceless opportunity to engage with one of the most technically curious and supportive communities around.</p><p data-start="1302" data-end="1428" data-is-last-node="" data-is-only-node="">Stay tuned for ticket details and more announcements soon.&nbsp;</p><p data-start="1302" data-end="1428" data-is-last-node="" data-is-only-node=""><a href="https://wevlv.co/Hackaday-supercon" class="button-main-action"><strong>SIGN UP NOW</strong></a></p></div></div></article><div data-edge="true"><br></div>

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