From November 17–20, Formnext transforms Frankfurt am Main into the global hub for additive manufacturing, bringing together manufacturers, engineers, technology providers, and business leaders across the entire AM process chain at the Messe Frankfurt exhibition grounds.<a href="https://visitortickets.messefrankfurt.com/ticket/en/ticket_select.html?_appshop=mf_tap20160620_3561" target="_blank" rel="noopener noreferrer" class="button-main-action">REGISTER NOW</a><h2><a href="https://visitortickets.messefrankfurt.com/ticket/en/ticket_select.html?_appshop=mf_tap20160620_3561" target="_blank" rel="noopener noreferrer"> </a></h2><h2>What to Expect</h2>With over 800 exhibitors and more than 38,000 visitors from around the world, Formnext is the ultimate who's who of Additive Manufacturing. A comprehensive stage program delivers concentrated knowledge and practical insight, whether you work in automotive, aerospace, medical technology, or any other industry building AM into its production strategy.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1791974467091-FON2025_MJ_00172+%281%29.jpg" style="width:100%px" class="fr-fic fr-dib" /><h3>A Show Floor Built Around the Full AM Process Chain</h3>Formnext covers additive manufacturing end to end, giving visitors direct access to the components, materials, and platforms shaping industrial production today.Additive Manufacturing &amp; 3D Printing<ul><li>Industrial 3D printers</li><li>Desktop 3D printing systems</li><li>Metal additive manufacturing</li><li>Polymer and ceramic printing technologies</li><li>Precision forming technologies</li></ul>Materials &amp; Production Technologies<ul><li>High-performance materials</li><li>Metal powders and resins</li><li>Composite materials</li><li>Post-processing solutions</li><li>Surface finishing and sintering technologies</li></ul>Software &amp; Digital Manufacturing<ul><li>CAD and simulation software</li><li>Workflow automation tools</li><li>AI-assisted design platforms</li><li>Production management systems</li><li>Smart manufacturing solutions</li></ul>Industrial Applications<ul><li>Automotive manufacturing</li><li>Aerospace applications</li><li>Medical technology</li><li>Consumer electronics</li><li>Tooling and mold production</li></ul>Services &amp; Solutions<ul><li>Contract manufacturing services</li><li>Engineering consulting</li><li>Inspection and quality control</li><li>Logistics and supply chain services</li><li>Research and development organizations</li></ul><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1791974494117-FON2025-MK3_6189+%281%29.jpg" style="width:100%px" class="fr-fic fr-dib" /><h2>Hear from the People Who Are Building What's Next</h2>The Formnext stage program pairs an Industry Stage and Application Stage with the Formnext Awards and the Defence Summit, giving visitors both big-picture context on where AM is headed and takeaways they can apply directly to their own production lines.<a href="https://formnext.mesago.com/frankfurt/en/expo/visitor-information.html" class="button-main-action" target="_blank" rel="noopener noreferrer">See the full conference program</a><h2>Join the Conversation</h2>More than a trade show, Formnext is where the AM community compares notes, tests ideas as working demos, and picks up the connections that shape next year's projects — including the Formnext Party, a dedicated networking evening for visitors and exhibitors alike.<a href="https://visitortickets.messefrankfurt.com/ticket/en/ticket_select.html?_appshop=mf_tap20160620_3561" class="button-main-action" target="_blank" rel="noopener noreferrer">Register for your tickets now online, and join us November 17–20 in Frankfurt am Main</a>

The international meeting point for additive manufacturing, industrial 3D printing, and the entire AM process chain.

Formnext 2026 - Frankfurt am Main, Germany

NEXT HORIZONS, a new cross-industry event from Vector, brings together software architects, engineers, technical decision-makers and business leaders for two days of discussion around the challenges shaping software-defined systems. <a href="https://nexthorizons.com/?etcc_cmp=nxh26&amp;etcc_med=paid&amp;et_cmp_seg4=newsletter&amp;et_cmp_seg5=eventpromo&amp;etcc_par=wevolver" target="_blank" rel="noopener noreferrer"></a><a href="https://nexthorizons.com/?etcc_cmp=nxh26&amp;etcc_med=paid&amp;et_cmp_seg4=newsletter&amp;et_cmp_seg5=eventpromo&amp;etcc_par=wevolver" target="_blank" rel="noopener noreferrer" class="button-main-action">Register now for this free event.</a><h2>Decide What You Can Build Next: 4 Tech Tracks</h2>Each track starts from a question practitioners are already grappling with, and the sessions are built to answer it.<h3>Control Software-Defined Systems at Scale</h3>Day 1, November 17How can you maintain control when systems, supply chains, and organizations become more complex?Complexity compounds across architecture, supplier relationships, and org charts at the same time, and control has to be designed in at each of those levels. This track covers architecture decisions, lifecycle governance, organizational transformation, and operating models.<h3>Make AI Deployable and Trustworthy</h3>Day 1, November 17How can you make AI deployable while ensuring accountability, traceability, and regulatory oversight?A model that performs well in a lab still has to meet technical, regulatory, and safety requirements before it reaches a product. This track works through AI governance, regulatory compliance, safety engineering, and the workflows that make AI evidence traceable.<h3>Accelerate Engineering Workflows Without Compromise</h3>Day 2, November 18How can you streamline end-to-end engineering workflows without compromising safety, security, quality, or compliance?The challenge is not simply to move faster, but to make speed sustainable across the development lifecycle. This track focuses on DevOps, verification and validation, virtualization, and engineering automation that shorten cycles while keeping the safeguards intact.<h3>Scale Platforms Beyond Projects</h3>Day 2, November 18How do you build scalable, safe, and secure software platforms while keeping control over architecture, partners, and lifecycle ownership?A platform outlives the project that created it, so ownership questions arrive sooner than most roadmaps assume. This track addresses platform architecture, legacy modernization, partnerships, and lifecycle ownership.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzkxODc3NTA5NDIwLVZlY3Rvci1UZWFzZXJiaWxkXzEyMDB4OTAwcHguanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width:100%px" class="fr-fic fr-dib" /><h2>Four Formats, One Personal Agenda</h2>You choose which sessions to attend, and the formats reward different kinds of attention:<ul><li>Keynotes set the strategic frame, with perspectives from AI, futurology, OEM leadership, and industrial pioneers.</li><li>Presentations deliver proven knowledge, use cases, and success stories from people who have shipped.</li><li>Deep Dives put small groups on concrete challenges, working hands-on with tools alongside peers who share their technical reality.</li><li>Networking &amp; Exhibition spans 800 sqm, with open areas for conversations that go beyond the usual industry routine.</li></ul>Three stages and four deep-dive rooms host sessions run in English or German. AI-based interpretation makes every session available in English.<h2>Who's Speaking</h2>The lineup keeps growing. Confirmed voices include:<ul><li>Maik Manthey, CTO, Jungheinrich</li><li>Steffen Tacke, Director R&amp;D, Mercedes-Benz</li><li>Prof. Eric Sax, Head of ITIV, Karlsruhe Institute of Technology</li><li>Dr. Hiie-Mai Unger, CEO, DB Systemtechnik</li><li>Dr. Ravi Subramanian, Chief Product Management Officer, Synopsys</li><li>John Wall, President, QNX</li></ul>Speakers from Neura Robotics, Intellias, Harmann, T-Systems, Bertrandt and many other leading companies round out the program.<a href="https://nexthorizons.com/speakers?etcc_cmp=nxh26&amp;etcc_med=paid&amp;et_cmp_seg4=newsletter&amp;et_cmp_seg5=eventpromo&amp;etcc_par=wevolver">See all speakers here.</a><h2>Who Should Attend</h2>Strategic keynotes and curated exchange formats serve C-level leaders and technical decision-makers. Deep dives and exhibits are built for software architects, engineers, and developers. You can attend one day or both, so the track that matches your priorities sets your schedule.<h2>Plan Your Visit</h2>When: November 17–18, 2026 Where: Vector Headquarters, Holderäckerstraße 36, 70499 Stuttgart Cost: Free. Registration is personalized, so colleagues register individually. Getting There: Free parking with charging stations on site, Weilimdorf S-Bahn station five minutes away on foot, Stuttgart Airport about 30 minutes by road.<h4><a href="https://nexthorizons.com/?etcc_cmp=nxh26&amp;etcc_med=paid&amp;et_cmp_seg4=newsletter&amp;et_cmp_seg5=eventpromo&amp;etcc_par=wevolver" class="button-main-action">Register for NEXT HORIZONS 2026.</a></h4>

November 17–18, 2026 - Vector Headquarters, Stuttgart

NEXT HORIZONS 2026 - Move Faster. Stay in Control.

TASKING Conference brings together automotive, aerospace &amp; defense, industrial, and robotics engineers for a full day of technical sessions, live demos, and customer insights focused on building next-generation safety- and security-critical embedded systems.On 29 October 2026, attendees will gather at Design Offices München Macherei in Munich for practical, engineering-first guidance on the toolchain and workflow challenges shaping modern embedded development from heterogeneous SoCs and multi-core timing behavior to shift-left validation and safety qualification.Join speakers from TASKING, Infineon Technologies, Cadence Design Systems, deltaVision, and DeepDrive to explore how compile, debug, test, workflows are evolving together for today's safety-critical systems.<a href="https://www.tasking.com/tasking-conference-germany/?utm_source=wevolver&amp;utm_medium=referral&amp;utm_campaign=tasking_conference_2026" target="_blank" rel="noopener noreferrer" class="button-main-action">REGISTER NOW</a><h2>Event Details</h2><ul><li>Date: 29 October 2026</li><li>Location: Design Offices München Macherei, Weihenstephaner Str. 12, 81673 München, Germany</li><li>Format: Full-day in-person conference with technical sessions, live demos, and a panel discussion</li></ul><h2>Learn More</h2>TASKING Conference Germany is built for engineers working across automotive ECUs, aerospace &amp; defense systems, industrial control platforms, and robotics applications. Sessions are designed to translate today's hardest embedded engineering problems - heterogeneous SoC architectures, multi-core timing analysis, and shift-left validation - into practical workflows engineers can apply directly.Attendees will also get direct access to TASKING's product and engineering teams to discuss roadmap direction and industry-specific requirements, alongside customer case studies from organizations already applying these workflows in production.Product &amp; Roadmap<ul><li>Latest updates and roadmap direction from TASKING</li><li>Insights on modern ECU architecture across automotive, A&amp;D, industrial, and robotics domains</li></ul>Development Workflows<ul><li>Compile, debug, and test productivity gains on heterogeneous SoCs</li><li>Shift-left validation - from virtual ECUs to real silicon - ahead of hardware availability</li><li>Build, debug, test, and trace workflows integrated into CI/CD, DevOps, and AI-assisted engineering pipelines</li></ul>Timing &amp; Functional Safety<ul><li>Timing analysis across software tracing and on-chip hardware trace, for multi-core and multi-SoC systems</li><li>Certified tools and qualification packages supporting ISO 26262 (automotive), IEC 61508 (industrial/robotics), and DO-178C (aerospace)</li></ul>Customer Insights<ul><li>Key outcomes and lessons learned from organizations deploying these workflows in production</li></ul><a href="https://www.tasking.com/tasking-conference-germany/?utm_source=wevolver&amp;utm_medium=referral&amp;utm_campaign=tasking_conference_2026" target="_blank" rel="noopener noreferrer" class="button-main-action">REGISTER NOW</a><h2> </h2><h2>Who Should Attend</h2>TASKING Conference is for engineers and technical decision-makers building safety- and security-critical embedded systems, including:Automotive<ul><li>ECU software developers</li><li>Functional safety engineers targeting ISO 26262</li></ul>Aerospace &amp; Defense<ul><li>Embedded software engineers targeting DO-178C</li><li>Verification and validation teams</li></ul>Industrial &amp; Robotics<ul><li>Control platform developers</li><li>Engineers targeting IEC 61508 compliance</li></ul>Toolchain &amp; DevOps<ul><li>Engineers integrating build, debug, test, and trace into CI/CD and DevOps pipelines</li><li>Teams evaluating AI-assisted development workflows</li></ul><h2>Registration</h2>This is an exclusive event for TASKING customers and invited prospects and partners. A few things to know before registering:<ul><li>Register using a company email address. Gmail, Google, and other personal email providers are not accepted.</li><li>Registration is subject to confirmation; a separate confirmation email with agenda, venue, and logistics details will follow.</li><li>Attendance requires official confirmation.</li></ul>For more information, visit the<a href="https://www.tasking.com/tasking-conference-germany/?utm_source=wevolver&amp;utm_medium=referral&amp;utm_campaign=tasking_conference_2026" target="_blank" rel="noopener noreferrer"> TASKING Conference Germany</a> official event page.

Certified for Safe & Secure Systems

TASKING Conference 2026 - Munich, Germany

<h2 id="isPasted">Hardware Made Live, on the Floor</h2>Hackaday is bringing the Keychain Hack to TCT Shenzhen 2026, a shared, multi-sponsor booth built around one idea: put real 3D printers to work in front of attendees and send everyone home with something they built themselves.This isn't a display of finished parts behind glass. Sponsor machines run for all three days of the show, each producing a different enclosure variant for the badge that attendees assemble on site. The printers are the demo.Hackaday's first activation in China sits inside TCT Shenzhen's wider Hackaday Program, which also includes a hackathon and a run of maker project showcases.Date: October 14–16, 2026 Location: Shenzhen World Exhibition &amp; Convention Center, Hall 15, Shenzhen<h3>What to Expect</h3><ul><li>Sponsor 3D printers running live on the show floor, all three days</li><li>A hands-on badge build: a 3D-printed enclosure plus a small electronics kit</li><li>A photo booth kiosk where attendees upload a logo, photo, QR code, or custom graphic</li><li>A personalized, sponsor-branded keychain to take home</li><li>Open to everyone; no 3D printing or electronics background needed</li></ul><h3>How the Keychain Hack Works</h3>Attendees start at a sponsor's printer, which produces a distinct 3D-printed frame.Assembly is simple: slot in the display module, snap the enclosure together, attach the keychain loop.Then at the photo booth kiosk, attendees upload a logo, photo, QR code, or custom graphic that gets built into the piece itself.Everyone leaves with a working, personalized keychain that has sponsor branding baked into the object, not simply printed on top of it. Produced with reprogrammable e-ink, attendees can continue to add personalized content to their keychains far beyond the event.<h3><a href="https://85458006.beschannels-plus.com/forms/71U4ZP1" target="_blank" rel="noopener noreferrer"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1790701778532-roll-out-33x79+copy.jpg" style="width:100%px" class="fr-fic fr-dib" /></a></h3><h3>Event Partners and Sponsors</h3>The Keychain Hack is sponsored by Snapmaker, Polymaker, and TCT Shenzhen.<a href="https://www.snapmaker.com">Snapmaker</a> supplies the desktop 3D printers running the badge build live on site. The company built its name on 3-in-1 machines combining 3D printing, laser engraving and CNC carving, and has shipped to more than 100,000 users worldwide.<a href="https://polymaker.com">Polymaker</a> supplies the filament. The Shanghai-headquartered materials company has been developing 3D printing filaments and composites since 2013, with distribution across North America, Europe and Asia.<a href="https://www.3dprint-expo.com/">TCT Shenzhen</a> is hosting the program as part of its own show, South China's exhibition for additive manufacturing and 3D printing, held in the heart of the Greater Bay Area.<h3 id="isPasted"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1790701787256-roll-out-33x79+copy+2.jpg" style="width:100%px" class="fr-fic fr-dib" /></h3>Why ShenzhenShenzhen sits at the intersection of electronics manufacturing, rapid prototyping and hardware supply chains, alongside a fast-growing additive manufacturing scene. That combination is what makes a build mixing 3D printing and electronics feel native to the city rather than bolted on.<h2>Attend TCT Shenzhen 2026</h2>TCT Shenzhen runs October 14 to 16, 2026, at the Shenzhen World Exhibition &amp; Convention Center, Hall 15. Visitor <a href="https://finderexpo.com/tickets/m0lk634f3e6u">registration for TCT Shenzhen</a> is free until October 13, 2026.<a href="https://85458006.beschannels-plus.com/forms/71U4ZP1">Register for Hackaday Keychain Hack here.</a>Find the Keychain Hack on the show floor.

Snapmaker, Polymaker, and TCT Shenzhen put working 3D printers on the show floor for a hands-on badge build that mixes electronics with additive manufacturing.

The Keychain Hack: Hackaday at TCT Shenzhen 2026

On October 14, 2026, under the towering canopy of the Shenzhen World Exhibition &amp; Convention Center (Shenzhen World for short), thousands will come together for the third edition of <a href="https://en.tctasia.cn/tctshenzhen.shtml">TCT Shenzhen</a>, an event focused on the growing 3D printing industry in South China’s Greater Bay Area. <img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1789757540429-1789757540429.jpeg" width="554" height="303" class="fr-fic fr-dii" />The region, which comprises tech hub Shenzhen, as well as Hong Kong, Macao, and Guangzhou, is becoming increasingly important within the broader additive manufacturing sector by driving innovation in the consumer and electronics subsegments and establishing large-scale AM factories to meet growing demand for 3D printed products in Southeast Asia and beyond. TCT Shenzhen is a reflection of the region’s significance as a global 3D printing hub, and serves as a place for industry players to connect, to showcase the latest innovations, and to create new business opportunities. Notably, for Chinese companies, TCT Shenzhen acts as a gateway into international markets, while international buyers and visitors of the event can see firsthand the region’s cutting-edge manufacturing capabilities.As we’ll cover, the three-day event has a full schedule and a diversity of things to discover, from over 250 exhibitors showcasing hundreds of new products, to over 80 sessions covering key industry trends, to various programs like the 3D Genius Hub and a Hackaday hackathon. <h2>Driving the New Wave of 3D Printing Innovation</h2>In Hall 15 of Shenzhen World, TCT Shenzhen organizers are preparing to host over 250 exhibitors spanning the entire value chain of additive manufacturing, including hardware, materials, software, services, and end-use applications. While the full list of exhibitors has not been disclosed yet, here’s a glimpse of what will be on show.<h3>Hardware</h3>Under the theme “Drive the New Wave of 3D Printing Innovation”, the event will showcase the latest 3D printing equipment, including metal, polymer, ceramic, and sand mold printing technologies. Among the leading exhibitors in the hardware space are Avimetal, ELEGOO, Formlabs, Makera, Creality, lingxi, eufyMake, Xhorse, MINGPIN, Douchuan 3D, WSX, GUANGSU.<h3>Materials</h3>In the materials segment, exhibitors including Zhongyuan, Honggang Petrochemical, Royal, Global Laser Box, and HISUN will display a wide variety of 3D printing consumables, from consumer polymers and engineering composites, to industrial metal powders and technical ceramics.  <h3>Software and Services</h3>On the software and services side, TCT Shenzhen will welcome a host of innovative exhibitors, including specialists in CAD modeling, topology optimization, digital twin technology, process simulation, slicing, and digital manufacturing services. While the exhaustive list of exhibitors has not yet been released, visitors can expect to see key players in the software and services space, including GENI, HOME-LINK, Pliith, Demute Intelligence, FLOW 3D, ZHUJIN, and pancolour. <h3>Applications</h3>Of course, no trade show would be complete without a focus on end-use applications that demonstrate the versatility of 3D printing technologies and the capacity of the value chain components exhibited. Various applications will be on show, including consumer products, consumer electronics, luxury goods like jewelry, tooling and molds, new energy vehicles, dental and medical devices, and low-altitude economy systems. Notably, TCT Shenzhen 2026 will highlight AI-enabled 3D printing applications, especially related to the use of AI for 3D printing design and manufacturing workflow efficiency. On this front, several AI innovators will be present, including Tripo AI, Meshy, DreamTech, Hi3D, Deemos, QUWAN, and SeaMe. <h2>Seven Highlights at TCT Shenzhen 2026</h2>In addition to the main exhibition hall, TCT Shenzhen also invites visitors to participate in a range of discussions, networking events, and interactive experiences, all geared towards driving AM innovation and creating valuable connections. Here are the seven key highlights to look forward to:<ol><li>80+ Sessions on Industry Trends</li></ol>Over the course of the three-day trade show, there will be over 80 sessions covering the 3D printing industry’s latest developments and biggest trends. These sessions comprise industry forums, technical presentations, product launches, maker activities, and networking opportunities. Topics to be covered include medical and dental applications, consumer products, thermal management, the low-altitude economy, and global market expansion. <img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1789757540451-1789757540451.jpeg" width="624" height="390" class="fr-fic fr-dii" />Source: TCT Shenzhen<ol><li>3D Genius Hub</li></ol>After previous successful editions, the 3D Genius Hub is back again for TCT Shenzhen 2026. With a dedicated space for innovation, discussions, and maker culture, the 3D Genius Hub emphasizes 3D printing’s role as a creative technology, enabling new ideas to come to life. As TCT Shenzhen says: “Rather than simply viewing products on the show floor, visitors can discover new ideas around future products, innovative design and digital manufacturing.” As part of the 3D Genius Hub, the organizers are also connecting with INNO100 Global Innovation Flagship Store to showcase new 3D printing projects—including popular Kickstarters—from around the world.<ol><li>Business Matchmaking</li></ol>Networking is an integral part of industry events and to support this side of TCT Shenzhen, organizers have set up a Business Matchmaking program that facilitates face-to-face meetings between exhibitors, buyers, distributors, agents, and end users from Southeast Asia, Japan, South Korea, and beyond. As part of this program, matches are strategically made based on specific business requirements that are collected ahead of the event by TCT Shenzhen.<ol><li>AI + 3D Printing Intelligent Manufacturing Forum</li></ol>In this topical forum, a number of AI experts and companies will come together to discuss how AI is impacting the 3D printing industry, with a particular focus on how AI tools, such as Tripo AI and Hi3D, can aid in the development of new products through generative design. The forum will also cover AI’s role in optimizing production processes and increasing manufacturing efficiency, showing how the technology can lead to new commercial opportunities. <ol><li>Hackaday Program</li></ol>Hackaday, the global open-source hardware platform, will be making its first appearance in China as part of a TCT Shenzhen program. The collaborative program will consist of a hackathon, maker project showcases, and a DIY activity that will invite participants to make their own electronic badges. This interactive segment of TCT Shenzhen is open to all visitors, including those without professional AM experience, and aims to drive connection and innovation through hands-on making.<ol><li>3D Printing Footwear Summit</li></ol>TCT Shenzhen will be hosting the second edition of the China 3D Printing Footwear Summit this October. As the name suggests, this summit will be focused on 3D printed footwear, which is one of the most visible and fastest growing consumer AM application areas. From sandals to performance athletic shoes, 3D printing is transforming how designers and manufacturers approach shoe development. To discuss this transformation, footwear brands, equipment and materials companies, and segment experts will come together to talk about the current state and future of footwear 3D printing.<ol><li>The 3D Printing Farm Ecosystem Summit</li></ol>Last but certainly not least in TCT Shenzhen’s event round-up is the 3D Printing Farm Ecosystem Summit. This event will showcase one of the region’s particular strengths: the establishment of large-scale 3D print farms, capable of massive production volumes. The 3D Printing Farm Ecosystem Summit will bring together experts in the field to look at what’s behind the rise in these production sites (i.e., advances in desktop 3D printing, AI, cross-border e-commerce), as well as discuss print farm operations, supply-chain collaboration, and more. <h2>Visitor Information &amp; Directions</h2>As TCT Shenzhen organizers make their final preparations, visitors are welcome to <a href="https://en.tctasia.cn/tctshenzhen.shtml">pre-register for the upcoming event</a>. (Note that registration for visitors is free until October 13, 2026.) As we said, the event will be held over three days, from October 14 to 16, 2026, at the Shenzhen World Exhibition &amp; Convention Center.  <img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1789757540465-1789757540465.jpeg" width="517" height="442" class="fr-fic fr-dii" />Source: TCT ShenzhenThe venue is accessible by public transit, and TCT Shenzhen has provided the following directions:Getting to the venue by metro:Line 12 → Guozhan North Station, Exit D; approximately 15 minutes on foot or 5 minutes by bike to Hall 15. Or, Line 20 → Guozhan Station, Exit D; approximately 15 minutes on foot or 5 minutes by bike to Hall 15.Getting to the venue from Shenzhen North Railway Station:Take Line 5 from Shenzhen North Station to Lingzhi Station, transfer to Line 12 and get off at Guozhan North Station, Exit D. Hall 15 is approximately a 15-minute walk from the station. Total journey time is around 1.5 hours.Getting to the venue from Shenzhen Bao'an International Airport:Grab a taxi (approximately 25 minutes) or take the metro line 11 from Airport Station to Airport North Station, transfer to Line 20 and get off at Guozhan Station, Exit D. Walk approximately 15 minutes to Hall 15. Total journey time is around 45 minutes.<a href="https://en.tctasia.cn/tctshenzhen.shtml" target="_blank" rel="noopener noreferrer">For additional information about the event, check out the TCT Shenzhen event page.</a><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1789760027466-TCT%232.png" style="width:100%px" class="fr-fic fr-dib" />

With just one month before the South Asian 3D printing trade show, we look at the events and showcases visitors will be able to take part in.

What Not to Miss at TCT Shenzhen 2026

3D IC design has evolved beyond the point where traditional EDA flows can keep up. Stacking dozens of chiplets and millions of interconnects into a single package multiplies thermal, mechanical, and electrical interactions faster than engineering teams can analyze them. Power, performance, area, cost, and reliability decisions that once happened sequentially must now be evaluated concurrently at the system level.The challenge is not simply predicting performance. Thermal hotspots, thermo-mechanical stress, and power/signal integrity issues are often determined by architectural and packaging decisions made long before detailed implementation begins. When these issues are discovered late in the design cycle, the cost of mitigation can be significant.In this webinar, Andras Vass-Varnai and Sudarshan Deo will demonstrate how multiphysics-driven workflows bring thermal, thermo-mechanical, and signal and power integrity analysis into the earliest stages of 2.5D and 3D IC development, enabling engineers to identify and address reliability risks while there is still time to influence the architecture.<a href="https://event.on24.com/wcc/r/5491608/33A2607318C36215E4F29DBBD3E0D59C?utm_source=website&amp;utm_medium=landingpage&amp;utm_id=Siemens" target="_blank" rel="noopener noreferrer" class="button-main-action">Register Now</a><h2><a href="https://event.on24.com/wcc/r/5491559/76FE994C30F1099A634FC4ABF239D262" target="_blank" rel="noopener noreferrer"> </a></h2><h2>What you'll learn</h2><ul><li>How early thermal, thermo-mechanical, and power integrity analysis can uncover reliability risks before they become costly late-stage issues</li><li>Where multiphysics co-analysis should be introduced in the design flow to guide architecture and packaging decisions</li><li>How AI-powered design space exploration accelerates evaluation of chiplet, package, and system architectures while maintaining multiphysics insight</li><li>How AI agents can automate and orchestrate complex simulation workflows, enabling faster and more informed engineering decisions</li></ul><h2>Who should attend</h2>This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.<a href="https://event.on24.com/wcc/r/5491608/33A2607318C36215E4F29DBBD3E0D59C?utm_source=website&amp;utm_medium=landingpage&amp;utm_id=Siemens" target="_blank" rel="noopener noreferrer" class="button-main-action">Register Now</a><h2><a href="https://event.on24.com/wcc/r/5491559/76FE994C30F1099A634FC4ABF239D262" target="_blank" rel="noopener noreferrer"> </a></h2><h2 id="isPasted">Why Siemens</h2>Siemens is uniquely positioned to help engineering teams address the challenges of advanced 3D ICs by bringing together robust 3D IC and package design technologies with comprehensive thermal, thermo-mechanical, and electrical multiphysics solutions. This enables reliability and performance considerations to be evaluated much earlier in the development process, when architectural decisions have the greatest influence on outcomes. By connecting design, multiphysics analysis, and AI-driven automation within a common workflow, Siemens helps teams gain insight into complex system interactions without requiring deep expertise in every physical domain, allowing them to identify issues sooner and converge on better designs faster.Building on this foundation, they will show how AI technologies are transforming the design process. Attendees will see how AI-powered design space exploration can evaluate thousands of architecture and packaging options with far fewer simulations, and how AI agents can automate and orchestrate complex multiphysics workflows, helping engineering teams move from analysis-driven design to intelligence-driven design.<h2 id="isPasted">Meet the speakers</h2><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzg4OTUwNjU3NzU5LVNhZ2VyIGVibXBhcHN0IFNvbHZpbmcgUmFjayBDb29saW5nIE5vaXNlIFdQLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width:100%px" class="fr-fic fr-dib" />Andras holds MSc and PhD degrees in Electrical Engineering from the Budapest University of Technology and Economics. He spent over a decade at Mentor Graphics as a product manager, leading R&amp;D projects focused on thermal test hardware and methodologies, and later served as a business development lead in South Korea and the United States. Now based in Chicago and working as a 3D IC reliability solution engineer, he's contributing to the development of a novel 3D IC package toolchain, drawing on his background in thermal and reliability engineering. His interests include thermal management of electronic systems, thermal transient testing and modeling, semiconductor packaging, TIM material characterization, and reliability testing of semiconductor devices.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzg4OTUwNjY5NTgwLVNhZ2VyIGVibXBhcHN0IFNvbHZpbmcgUmFjayBDb29saW5nIE5vaXNlIFdQICgyKS5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width:100%px" class="fr-fic fr-dib" />Sudarshan leads the development of AI-native engineering platforms for advanced semiconductor design at Siemens Digital Industries Software, enabling intelligent workflows for 3D ICs, chiplets, advanced packaging, and multiphysics analysis. He holds a Master's degree in Computer Science from California State University, Sacramento, where his thesis focused on convolutional neural networks for image recognition. With experience spanning Siemens, Intel, Synopsys, and Cadence, he specializes in applying AI to accelerate semiconductor engineering and advance next-generation EDA technologies.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzg4OTUwNjc5NTg1LVNhZ2VyIGVibXBhcHN0IFNvbHZpbmcgUmFjayBDb29saW5nIE5vaXNlIFdQICgzKS5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width:100%px" class="fr-fic fr-dib" />Samir Jaber is an editor, writer, and industry expert on topics of technology, science, and engineering. He is the editor-in-chief of the 2025, 2024, and 2023 Edge AI Technology reports with Wevolver. Samir is the Chief Editor and Founder of Wryters, a content marketing and consulting agency. He has comprehensive experience working with Fortune 500 companies and industry leaders as a writer, editor, content manager, and consultant.He is an online content specialist with an academic background in mechanical engineering, nanotechnology, and scientific research. Samir is also a featured author in 30+ industrial magazines with a focus on Artificial Intelligence (AI), the Internet of Things (IoT), 3D printing, Autonomous Vehicles (AV), nanotechnology, materials science, and sustainability. His experience includes award-winning engineering research and patented engineering design in the fields of nanofabrication and microfluidics.

AI-powered design space exploration for multiphysics-aware 3D IC and chiplet integration.

Reimagining 3D IC Design: Where Multiphysics Meets AI

<h2 id="isPasted">Where Simulation Meets the People Building What's Next</h2>Modeling and simulation have moved from specialized engineering tools to a shared language across aerospace, energy, life sciences, mobility, semiconductor manufacturing, and electronics development. The COMSOL Conference exists to put the technical users, researchers, students, and the managers trying to get more out of their simulation teams in the same room to focus on solving one question: how is multiphysics modeling actually changing what gets built?<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1789484701366-CC26_web_Keynotes-1.png" class="fr-fic fr-dii" />Keynotes. Source: COMSOL Conference. <h3>What to Expect</h3>Five editions run this fall, each drawing its own regional community into the same core program: keynote talks from industry leaders, poster and slideshow presentations on live research and design work, and 20+ minicourses that cut across engineering disciplines rather than sticking to one. Every pass includes access to keynotes, presentations, minicourses, the exhibition hall, evening events, receptions, meals, and refreshments.Minicourses form the technical backbone at both events: instructor-led, hour-long sessions covering modeling techniques, software functionality, and the theory underneath them, each with live demos in COMSOL Multiphysics® and a closing Q&amp;A. Sessions have been designed to serve both new users and experienced ones. Demo stations pair attendees one-on-one with COMSOL applications engineers on their own modeling projects rather than sending them home with a technique to test alone.<a href="https://www.comsol.com/conference">See the full conference program.</a><h3>COMSOL Conference 2026: Five Editions, One Community</h3>Same program architecture, different regional centers. <img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1789485099244-COMSOL+Conference+2026+.2.jpg" class="fr-fic fr-dii" />Talks, Minicourses, &amp; User Presentations. Source: COMSOL Conference.<h3>COMSOL Conference 2026 Cambridge</h3>September 23–25 · Churchill College, CambridgeThe Cambridge edition draws technical teams and entrepreneurs from across EMEA, and the people who keep coming back describe the same value in different ways. Eleonora Manoli of Barilla Group has attended multiple editions and calls the mix of technical talks, plenaries, and hands-on minicourses a consistent source of fresh ideas across simulation fields. Alexey Popov of VTT Technical Research Centre of Finland points to the access itself — the chance to sit down with a COMSOL engineer and work through a specific simulation challenge in depth.Keynote talks include:<ul><li>Douglas Herbert of Rolls-Royce discusses the challenges and opportunities of developing advanced electrical machines for aerospace.</li><li>Dr. Jonathan Horne-Jones of the UK Atomic Energy Authority (UKAEA) presents his approach to identifying and evaluating simulation capabilities in fusion engineering solutions.</li><li>Raju Yalagada of Airbus will discuss how simulation plays a vital role in the aerospace industry.</li><li>James Ellis of Oxford Instruments Plasma Technology (OIPT), joins to talk about predictive science in plasma processing.</li><li>Dr. Christian Geitner of Fraunhofer UMSICHT presents a multiscale COMSOL model for a two-story moving DRI reactor with a 1.7 m reaction zone.</li><li>François Cornat of CorWave dives into the role of numerical simulation in the development of ventricular assist devices.</li><li>Robert Mathershaw of Dstl highlights case studies where the COMSOL Multiphysics® software addresses a range of defense challenges.</li></ul>Engineers and researchers from organizations like Tetra Pak, STMicroelectronics, and Johnson Matthey present their modeling work through slideshows and posters, walk through methodology, share results, and take questions directly, turning the exhibition hall into a working session rather than a trade floor.<a href="https://www.comsol.com/conference/cambridge#pricing-section" target="_blank" rel="noopener noreferrer">Register for Cambridge</a><h3> COMSOL Conference 2026 Boston</h3>October 7–9 · Boston Marriott BurlingtonSpeakers from NASA, Intel, General Motors, MIT, Formula E, Rice University, Vertex Pharmaceuticals, and Oak Ridge National Laboratory anchor the Boston program, each speaking to how modeling and simulation moves their work from concept to result. Keynote sessions put them on stage to walk through the modeling decisions behind their most demanding engineering problems, supplemented with Q&amp;A, plus a COMSOL-led keynote giving an early look at an upcoming version of the software.The Boston edition also runs the COMSOL Innovation Contest, raising the stakes on the user-presentation format: six finalists across aerospace and defense, automotive and mobility, energy, life sciences, manufacturing, and semiconductors present their work live, competing for a $50,000 grand prize and a $5,000 popular-vote award.<a href="https://www.comsol.com/conference/boston#pricing-section" target="_blank" rel="noopener noreferrer">Register for Boston</a><h3>COMSOL Conference 2026 Tokyo</h3>October 21–22 · Akasaka Intercity Conference, TokyoThe Tokyo edition brings the same architecture to Japan's simulation community: keynote talks from industry leaders, poster sessions, and presentations from invited speakers, aimed at giving technical users, R&amp;D-track students, and team leads a shared look at where modeling and simulation are heading next. As with every stop on the tour, the program is built to work through discipline lines rather than around them, so an attendee working in electronics can walk out with a technique that started in life sciences or energy.<a href="https://www.comsol.com/conference/tokyo#pricing-section" target="_blank" rel="noopener noreferrer">Register for Tokyo</a><h3>COMSOL Conference 2026 Shenzhen</h3>October 22–23 · Sheraton ShenzhenLanding the day after Tokyo closes, the Shenzhen edition gives China's simulation community its own stop on the tour, with the same keynote, minicourse, and poster-session structure running under it. Poster presentations carry particular weight here: attendees vote directly on their favorites, and the conference names up to three Best Poster by Popular Vote winners on the final day, judged by committee when submissions tie.<a href="https://www.comsol.com/conference/shenzhen#pricing-section" target="_blank" rel="noopener noreferrer">Register for Shenzhen</a><h3>COMSOL Conference 2026 Bengaluru</h3>December 3–4 · Hyatt Centric Hebbal, BengaluruThe Bengaluru edition brings minicourses in modeling workflow, electromagnetics, structural &amp; acoustics, fluid &amp; heat, chemical engineering, and more. Join us December 3 and 4 for minicourses, talks, six keynote sessions, and the COMSOL award ceremony. Attendees of the COMSOL Conference 2026 Bengaluru will have the opportunity to win various awards for innovative uses of the COMSOL Multiphysics®. 2026's awards include:<ul><li>2 Best Paper awards selected by the program chair</li><li>2 Best Poster awards selected by the program chair</li><li>1 Best Poster award by popular vote</li></ul><a href="https://www.comsol.com/conference/bengaluru" target="_blank" rel="noopener noreferrer">Register for Bengaluru</a>

The COMSOL Conference provides a space for technical teams and entrepreneurs to meet in person, exchange ideas, and learn from each other. Join us for the COMSOL Conference 2026 in a city near you.

COMSOL Conference 2026: Connecting the Minds Behind Innovation

<h2 id="isPasted">embedded world North America 2026</h2>From September 22–24, <a href="https://embedded-world-na.com/" target="_blank" rel="noopener noreferrer">embedded world North America</a> brings together design engineers, systems architects, firmware developers, and product leaders at the Anaheim Convention Center for three days dedicated to the future of embedded innovation.<h2><a href="https://www.prereg.net/2026/ewna/" target="_blank" rel="noopener noreferrer">Register Now</a></h2><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1787147241216-1787147241214.png" width="624" height="69" class="fr-fic fr-dii" /><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1788213282343-embedded+world+North+America+2026+images.png" width="624" height="350.9896845230088" class="fr-fic fr-dii" />Copyright: NürnbergMesse North America<h3>What to Expect</h3>With 150+ exhibitors, 100+ technical sessions, and 100,000 square feet of exhibition space, embedded world North America brings the full embedded ecosystem into one venue. From agentic AI and autonomous systems to open hardware platforms, this event is built to give you both big-picture context and takeaways you can apply directly to your own work.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1787147038128-1787147038128.jpeg" width="624" height="468" class="fr-fic fr-dii" /><h3>Hear from the People Who Are Building What's Next</h3>Keynote speakers this year include Deepu Talla, VP of Robotics and Edge AI at NVIDIA, presenting on an open platform for autonomous, agentic systems, and Fabio Violante, VP and GM of Arduino at Qualcomm, on powering AI in the physical world.<a href="https://embedded-world-na.com/conference-program/" target="_blank" rel="noopener noreferrer">See the full conference program.</a><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1787147275006-embedded+world+North+America+2026+images+%281%29.jpg" style="width:100%px" class="fr-fic fr-dib" />Copyright: NürnbergMesse North America<h3>A Show Floor Built Around Real Engineering Challenges</h3>The technical conference is led by the developers and innovators doing the work. Breakout sessions are organized around real development challenges, current trends, and emerging applications, not vendor pitches.On the show floor, 150+ exhibitors give you direct access to the components, tools, and platforms shaping embedded design today. The Hackathon and Robotics Lab add a hands-on layer, letting you test ideas as working demos rather than just hear about them from a stage.In between sessions, there's room to step back, keep conversations going, and connect with others solving similar problems. <h3>Join the Conversation</h3>More than anything, embedded world North America is about bringing the embedded community together in one place. It's a chance to learn, compare notes, and see how others are approaching the same problems you are.<a href="https://www.prereg.net/2026/ewna/" target="_blank" rel="noopener noreferrer" id="isPasted">Register for your tickets now online</a>, and join us September 22-24 in Anaheim, California.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1787147642928-1787147642928.jpeg" width="624" height="327" class="fr-fic fr-dii" />

embedded world North America is the premier trade show and conference dedicated to the community of innovators and developers in the embedded tech ecosystem.

embedded world North America 2026 - Anaheim, CA

The automotive sector is in the middle of an important transition. In 2026, electric car sales are expected to exceed 23 million, driven largely by major adoption in China and Europe. [1] Meanwhile, an increase in software-defined vehicles (SDVs), with functions like autonomous driving and over-the-air updates, is contributing to increased manufacturing complexity. Despite this complexity, EV and SDV producers are logging shorter and shorter development times for new vehicles, with startups often needing just 24 to 30 months for new vehicle development—around half the time taken by traditional OEMs.[2]<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1786998512758-1786998512758.jpeg" width="624" height="416" class="fr-fic fr-dii" />Source/Copyright: Formnext Mesago Messe Frankfurt. Mathias KuttShifting expectations in development times, coupled with supply chain disruptions and uncertainties surrounding global tariffs, have put pressure on OEMs and suppliers. Furthermore, the high cost of new vehicle production and limited consumer spending power means the automotive market is looking for innovative ways to streamline production, shorten supply chains, and increase profit margins.Additive manufacturing (AM) is uniquely positioned to assist the automotive industry in its efforts to ensure that hardware production keeps pace with innovation. By offering hyper-local production and reduced supply chain dependence, AM is becoming increasingly important for prototyping, tooling, and even serial production of automotive components. The convergence of automotive and AM will be demonstrated at Formnext 2026, which brings together leading and emerging figures from the automotive and AM industry.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1786998512764-1786998512764.jpeg" width="568" height="426" class="fr-fic fr-dii" />Close-up of advanced suspension system components from 3D printing. Source: AdobeStock<h2>Additive Manufacturing in Automotive Today</h2>Additive manufacturing is often considered a cutting-edge or even futuristic technology. However, its use in the automotive industry goes back to the 1980s, not long after the first 3D printers appeared. This makes it about as futuristic as the DeLorean. Back then, AM was synonymous with rapid prototyping, and many automotive suppliers and OEMs still use polymer 3D printing to prototype items like interiors, dash components, and body panels. This is an area in which companies can exploit some of the technology’s main advantages: design freedom, tool-free production with short lead times, and minimal up-front costs.However, rapid prototyping represents just one application of additive manufacturing in today’s transport-related industries. Companies like GM and Tesla have used binder jetting, a form of AM that prints materials like metals and ceramics suspended with binder material, to fabricate complex sand casting molds that can then be used to produce high-strength cast metal parts. Ford is one of many companies to use AM for final part production, deploying metal 3D printing for EV battery cooling components.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1786998512769-1786998512769.jpeg" width="624" height="416" class="fr-fic fr-dii" />Source/Copyright: Formnext Mesago Messe Frankfurt. Mathias KuttBeyond the major OEMs, other businesses like part suppliers, mechanics, and body shops are using 3D printing for jobs like custom part production, repair of legacy vehicles, and reverse engineering. In polymer 3D printing, low-end professional extrusion and photopolymerization systems are available below the five-figure mark and serve as an ideal entry point for smaller firms. AM use can be subsequently scaled up by introducing further printers controlled by print farm management software or deploying larger production-ready systems. Metal AM systems and more complex polymer printing technologies come with greater material handling and post-processing demands, but even these machine categories are becoming steadily more accessible in terms of machine cost and usability.<h2>Three Diverse Use Cases</h2>Automotive, transportation, and mobility companies now use AM for applications beyond prototyping. At Daimler Truck, the largest commercial vehicle producer in the world, the technology is deployed for efficient spare part production, particularly in the Daimler Buses division. That company is working with AM leader 3D Systems to overcome supply chain bottlenecks and reduce part delivery times. Digitizing its spare parts library allows it to use certified local AM service bureaus while a unique digital rights management solution protects its IP, ensuring those third-party bureaus only print the exact part quantity required.Additive technology is proving equally valuable in other areas of transportation. Siemens Mobility, the rail transport division of Siemens, is a long-time user of AM technology and recently 3D printed a three-meter front panel for a rail vehicle approved for speeds up to 124 mph (200 km/h). Like Daimler Truck, Siemens Mobility also uses AM hardware in conjunction with a digital spare parts library, allowing it to provide fast replacements even on decades-old vehicles. The company says this library of 2,100+ virtual parts reduces costs, allows for easy redesign, lowers CO2 emissions, and shortens delivery times by up to 90%.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1786998512774-1786998512774.jpeg" width="624" height="349" class="fr-fic fr-dii" />A 3D rendering of CAE simulations showing the thermal management system of EV batteries. Source: AdobeStock.In the growing EV space, additive manufacturing exhibits some of its most creative applications. For instance, Silicon Valley disruptor Sakuu has combined expertise in AM and battery production to develop a proprietary dry process for the 3D printing of custom-shaped functional batteries with patterned openings for thermal management. Key advantages of 3D printing these batteries with the company’s unique Kavian process include elimination of toxic solvents, substantial gains in energy density, and fully customizable form factor.<h2>Accessing the AM Ecosystem</h2>The world’s leading automotive and transportation OEMs are demonstrating the value and versatility of additive manufacturing. However, there remain several common obstacles to AM adoption in the sector, including: <ul><li>Choosing between different 3D printing technologies</li><li>Choosing between in-house and external AM production</li><li>Material selection</li><li>Integrating AM into established workflows</li><li>Scaling up AM use or moving from prototyping to production</li><li>Understanding the application of industry-specific regulations to AM</li></ul>At the 2026 edition of the annual Formnext trade show, AM technology providers, material providers, and service providers will present proven solutions to these problems for users in automotive, transportation, and other relevant industries. The event will bring together over 800 exhibitors along the <a href="https://www.wevolver.com/article/the-additive-manufacturing-process-chain-and-its-industry-interfaces">entire process chain</a>, allowing industry decision-makers to see technology demonstrations and use cases up close while forming new business connections.As the world’s largest additive manufacturing industry event, Formnext serves as a unique entry point to the AM ecosystem, giving end-users direct access to the world’s foremost AM companies and serving as a catalyst for the formation of strategic partnerships.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1786998512804-1786998512804.png" width="624" height="351" class="fr-fic fr-dii" />Source / Copyright: Formnext Mesago Messe Frankfurt. (Bottom left &amp; bottom right: Marc Jacquemin. Bottom center: Mathias Kutt)This year’s edition of Formnext takes place November 17–20, 2026 at the Messe Frankfurt exhibition grounds. Subscribe to the <a href="https://info.mesago.de/-lp/5HKPB14784/p4jkP173">AM4U newsletter</a> and Formnext Magazine to receive updates about the event and secure your <a href="https://formnext.mesago.com/frankfurt/en/expo/visitor-information.html#tickets">Formnext ticket with the Early Bird discount, available until 22 October</a>.Learn more about <a href="https://formnext.mesago.com/frankfurt/en/industry-insights/automotive_industry.html?wt_mc=Display-Banner.ahgz.mf-mesago.formnext.cross-country.vt.cv.wevolver_automotive_2026">Automotive at Formnext</a> by downloading the free industry whitepaper and registering for the Formnext Technology Talk "AM in the automotive, transportation &amp; mobility industry".<hr /><h3>References:</h3><ol><li>https://www.iea.org/reports/global-ev-outlook-2026/trends-in-electric-cars</li><li>https://www.mckinsey.com/industries/automotive-and-assembly/our-insights/winning-the-automotive-software-development-race</li></ol>

Formnext 2026 will provide automotive, transportation, and mobility companies with a unique gateway to the global additive manufacturing ecosystem.

Automotive and Additive Manufacturing Converge at Formnext 2026

Robotics is expanding across manufacturing, automotive production, aerospace, healthcare, logistics, and industrial automation. Despite their different uses in various industries, all modern robots share the same procedural requirements: sensing conditions, processing data, making decisions, and acting in the physical world.<a href="https://wevlv.co/ew_na_lp" id="isPasted">embedded world North America</a> will take place from September 22nd to the 24th, 2026, at the Anaheim Convention Center in Anaheim, CA, US. It provides a focused platform for the embedded technology community across the United States, Canada, and Mexico. Organisers expect more than 5,000 visitors, over 250 exhibitors, more than 60 technical sessions, and 100,000 square feet of exhibition space.[1]The Robotics Lab is a hands-on show-floor feature connecting embedded systems, AI, human-machine interaction, and practical applications. It shifts attention from robots as finished machines to the technology stack behind them.<h2>Why Robotics Belongs at an Embedded Systems Event</h2><h3>Embedded Systems as the Foundation of Robotics</h3>Robots depend on microcontrollers, systems-on-chip, sensors, real-time operating systems, connectivity, and embedded software. Sensors collect data, processors interpret it, and software turns it into movement. Timing is critical because delays can affect accuracy and safety.AI cannot compensate for weak sensing, limited processing, high energy use, or unreliable control. The wider embedded world platform encompasses the components, modules, operating systems, communication systems, and design tools that underpin this foundation.[2]<h3>Robotics as a Clear Use Case for Embedded Innovation</h3>Robotics combines hardware, firmware, software, AI, and connectivity. A mobile robot may process urgent tasks locally while sending selected data to an edge or cloud platform.This makes technical choices visible. Processing delays affect movement, sensor errors affect decisions, and network loss can interrupt remote functions. Robotics therefore matters to engineers, developers, integrators, product managers, and research leaders. It also provides a practical way to examine productivity, safety, automation, and industrial change. [3]<h2>The Robotics Lab Visitor Journey</h2><h3>A Structured Four-Zone Experience</h3>The approximately 800-square-foot Robotics Lab is planned as a journey through four connected zones: Embedded Intelligence, AI and Autonomy Engine, Human-Machine Interaction, and Industry Applications and Future Robotics.The route moves from control components to decision-making, interaction with people, and final industry use. It shows that autonomy depends on the embedded platform, data, software, AI models, interfaces, and operating environment.<h3>From Embedded Intelligence to Industry Application</h3>Embedded systems provide sensing, processing, and control. AI adds perception, learning, and autonomy. Human-machine interaction connects robots with operators, while industry applications place the complete system in environments with specific safety, performance, and reliability needs.Following this sequence helps visitors see how decisions at one level affect those at other levels. A strong AI model may still fail on limited hardware, while a capable robot may remain difficult to use if its interface is unclear.<h2>The Four Robotics Lab Zones</h2><h3>Zone 1: Embedded Intelligence</h3>This zone covers microcontrollers, SoCs, sensors, RTOS platforms, and connectivity. Together, they manage robotic control, collect operational data, support predictable timing, and connect robots with other systems.The main point is simple: every intelligent robot begins with an embedded platform designed for its task.<h3>Zone 2: AI and Autonomy Engine</h3>Machine learning supports pattern recognition and adaptive behaviour, while computer vision enables inspection, object detection, and navigation. Simulation allows teams to test and improve systems before physical deployment.AI processing may run on the robot, at the edge, or in the cloud. On-device and edge processing can reduce latency, while cloud systems can support training, storage, and coordination. Research on edge robotics identifies reduced latency, mobility, location awareness, and real-time processing as key benefits. [4]<h3>Zone 3: Human-Machine Interaction</h3>This zone includes cobots, control displays, AR and VR, voice and gesture control, and safety systems. These tools can support training, monitoring, programming, and maintenance.Robots working near people need clear status information, predictable movement, accessible emergency controls, and defined limits. Augmented and mixed reality can support robot control, training, monitoring, and clearer communication between people and machines. [5] Human-Centered design should make robotic behaviour easier to understand without hiding uncertainty or risk.<h3>Zone 4: Industry Applications and Future Robotics</h3>The final zone connects robotics with automotive manufacturing, aerospace, healthcare, logistics, industrial automation, smart factories, and emerging fields.Requirements differ by sector. Factory robots may work in controlled cells, warehouse robots must handle changing routes and people, and healthcare systems require close attention to safety, privacy, hygiene, and reliability.Displays should explain not only what a robot does, but also the sensors, processing systems, safety controls, and operating conditions behind it.<h2>Hands-On Experiences and Technical Programming</h2><h3>Interactive Show-Floor Elements</h3>The lab can include live robotics demonstrations, AI inference examples, cobots, sensor walls, simulation tools, AR and VR interfaces, gesture control, and industry-specific application pods. These displays can show how sensor input becomes an AI result and then a physical action.embedded world North America offers a hands-on technical setting where companies can demonstrate technologies directly to engineers and other technical visitors.[3] Demonstrations should also state whether processing is remote, routes are pre-mapped, or models are trained for selected objects.<h3>Engagement Through Learning Formats</h3>Ten-minute technical sessions, expert-led tours, and workshops can cover robotics programming, sensing, simulation, and AI model tuning.Tours can connect the four zones, while workshops let visitors examine trade-offs involving processing, memory, power, and deployment. These formats can serve embedded engineers, robotics and AI developers, product leaders, and technical executives.<h2>Value for Attendees, Exhibitors, and Sponsors</h2><h3>Attendee </h3>For attendees, the lab shows how robotic systems move from individual components to deployment. It brings together embedded systems, AI, HMI, and industry applications, and connects robotics trends with practical challenges in sensing, integration, connectivity, safety, and reliability.Compared with a standard booth display, live and interactive exhibits offer a more active way to understand how robotic technologies operate in real applications.<h3>Exhibitor and Sponsor</h3>For exhibitors and sponsors, the lab can offer zone-level sponsorship, ownership of selected demonstrations, branded robotics experiences, and participation in technical sessions, tours, and workshops.Direct engagement with engineers and decision-makers can support lead generation and provide a clearer way to show real-world technology impact. The official exhibitor information also presents live demonstrations, technical discussions, brand visibility, and lead generation as key reasons for participation. [3]Sensor companies can demonstrate data collection, processor suppliers can show performance under timing and power limits, and software providers can present tools for simulation, control, or deployment.Sponsored activities should be clearly identified, while technical content should discuss limits and compatibility rather than present products as universal solutions.<h1>Conclusion</h1>Robotics is one of the clearest examples of embedded systems becoming intelligent physical machines. The Robotics Lab can present the complete embedded-to-AI pipeline by connecting embedded intelligence, autonomy, human interaction, and industry applications.As robotics adoption grows across U.S. industries, hands-on demonstrations, technical sessions, tours, and workshops can help engineers and decision-makers understand both the opportunities and practical requirements of deployment.The lab’s value lies not only in displaying robots but in explaining the technologies, operating conditions, and design choices behind them.For more info about <a href="https://wevlv.co/ew_na_lp" target="_blank" rel="noopener noreferrer">embedded world North America, check out their event page</a>.<hr /><h3>References</h3><ol><li><a href="https://embedded-world-na.com/?utm_source">embedded world North America official event page</a> </li><li><a href="https://embedded-world-na.com/exhibit/?utm_source">embedded world North America exhibitor information page</a> </li><li><a href="https://www.embedded-world.de/en?utm_source">embedded world global exhibition and conference page</a> </li><li><a href="https://arxiv.org/abs/2507.00523?utm_source">Edge Computing and Its Application in Robotics: A Survey</a> </li><li><a href="https://arxiv.org/abs/2203.03254?utm_source">Augmented Reality and Robotics: A Survey and Taxonomy for AR-enhanced Human-Robot Interaction and Robotic Interfaces</a></li></ol>

How Embedded Systems, AI, and Human-Centered Design Are Driving the Future of Robotics

Robotics Lab at embedded world North America

Date: September 22–24, 2026 Location: Anaheim, California<h2>Build and Demonstrate Edge AI in Action</h2>The inaugural <a href="https://embedded-world-na.com/activations/" target="_blank" rel="noopener noreferrer">embedded world North America Edge AI Hackathon</a> will allow teams to design and prototype real-time, on-device AI applications on the show floor.Working in teams of four to five people and supported by professional mentors, participants will move from initial concept to working prototype during conference hours. The event will conclude with live demonstrations and an awards ceremony on the show floor.Teams will work across four practical edge AI challenge tracks, including robotics and sustainability, using hardware and development tools supplied by event sponsors.<h3>What to Expect</h3><ul><li>A live embedded hardware hackathon on the show floor</li><li>University teams working alongside professional mentors</li><li>Real-time, on-device AI development</li><li>Live commentary and project updates</li><li>Final team demonstrations and an awards ceremony</li><li>Four $1,000 prizes, along with hardware and gear from event sponsors</li></ul><h3>Event Partners and Sponsors</h3>Arduino and Qualcomm are the title sponsors of the hackathon. Quilter is supporting the robotics challenge, while ASUS is supporting the sustainability challenge.The program brings together embedded world North America, Hackaday, Supplyframe, and Wevolver to connect a live engineering challenge with wider project documentation and editorial coverage.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1788499321825-Electroplating+%26+Coatings+%286%29.jpg" style="width:100%px" class="fr-fic fr-dib" />Powered by title sponsors Arduino and Qualcomm, robotics challenge sponsor Quilter, and sustainability challenge sponsor ASUS.<h3>Follow the Projects</h3>Wevolver will provide ongoing coverage of the hackathon, including features on the projects developed by participating teams. Check back for updates and highlights as the final builds take shape.<h2>Attend embedded world North America</h2>See university teams put edge AI into practice, and <a href="https://embedded-world-na.com/" target="_blank" rel="noopener noreferrer">follow their progress live from the show floor</a> in Anaheim.<a href="https://www.prereg.net/2026/ewna/" target="_blank" rel="noopener noreferrer">Register for embedded world North America here.</a> <img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1788498747387-EW-1200x628.png" style="width:100%px" class="fr-fic fr-dib" />

Build, test, and demonstrate on-device AI systems during a live engineering challenge on the embedded world North America show floor.

Edge AI Hackathon at embedded world North America 2026

Formnext Asia Shenzhen 2026 brings together manufacturers, engineers, technology providers, and business leaders from across the additive manufacturing industry to focus on innovation, industry collaboration, and the latest developments in digital manufacturing and precision production. On August 26–28, 2026, professional visitors from around the world will attend Formnext Asia Shenzhen to collaborate with more than 320 exhibitors and learn more about the rapid expansion of industrial and consumer 3D printing technologies. Join exhibitors like Bambu Lab, Creality, Farsoon Technologies, Raise3D, HBD, Intamsys, UnionTech, Han's Laser, Meshy AI, and Tripo AI to discover how to print beyond limits.Take a look at the <a href="https://wevlv.co/FormnextShenzhen1" target="_blank" rel="noopener noreferrer">event brochure</a> for more exciting information.<h2>Learn More</h2>Formnext Asia Shenzhen attracts attendees from a wide range of industries, including aerospace, automotive, consumer electronics, healthcare, tooling, and industrial manufacturing. The combination of exhibition spaces, technical presentations, and business meetings makes it a valuable event for companies looking to stay up to date with developments in advanced manufacturing.The exhibition covers the entire additive manufacturing supply chain. Visitors can explore industrial 3D printers, advanced materials, software platforms, post-processing equipment, automation systems, and precision manufacturing technologies. Alongside the exhibition, the event includes conferences, live demonstrations, and networking sessions that help professionals connect and exchange ideas.320+ exhibitors across additive manufacturing and advanced productionAdditive Manufacturing &amp; 3D Printing<ul><li>Industrial 3D printers</li><li>Desktop 3D printing systems</li><li>Metal additive manufacturing</li><li>Polymer and ceramic printing technologies</li><li>Precision forming technologies</li></ul>Materials &amp; Production Technologies<ul><li>High-performance materials</li><li>Metal powders and resins</li><li>Composite materials</li><li>Post-processing solutions</li><li>Surface finishing and sintering technologies</li></ul>Software &amp; Digital Manufacturing<ul><li>CAD and simulation software</li><li>Workflow automation tools</li><li>AI-assisted design platforms</li><li>Production management systems</li><li>Smart manufacturing solutions</li></ul>Industrial Applications<ul><li>Automotive manufacturing</li><li>Aerospace applications</li><li>Consumer electronics</li><li>Medical and dental technologies</li><li>Tooling and mold production</li></ul>Services &amp; Solutions<ul><li>Contract manufacturing services</li><li>Engineering consulting</li><li>Inspection and quality control</li><li>Logistics and supply chain services</li><li>Research and development organizations</li></ul>For more information, visit the <a href="https://wevlv.co/FormnextShenzhen2" target="_blank" rel="noopener noreferrer">Formnext Asia Shenzhen</a> official website.

Print beyond limits, create beyond imagination.

Formnext Asia Shenzhen 2026 - Shenzhen, China

If you sell, qualify, or print parts across more than one region, you already know the problem. A component certified to one standard does not automatically clear the bar somewhere else. Procurement teams ask for proof of compliance that does not map cleanly between Chinese, European, and US frameworks. Qualification paths that took months to build for one market often need to be rebuilt for the next.For most manufacturers and service providers, the real bottleneck is not a lack of standards. It is the lack of a shared reference for how those standards are converging, and where they are not.<h2>What the panel covers</h2>Four people working from four different vantage points in the standardization chain join one conversation.You will hear:<ul><li>What ASTM's current role looks like in setting and revising AM standards globally</li><li>Where qualification and certification practices differ most between Eastern and Western markets</li><li>How trade media in both regions is tracking and reporting on standardization progress</li><li>What practical impact these differences have on component comparability and market access</li><li>Where genuine convergence between the regions is happening, and where it is not</li><li>What service providers and manufacturers should be watching over the next phase of standards development</li></ul><a href="https://wevlv.co/3DRuck-Panel" id="isPasted" class="button-main-action" target="_blank" rel="noopener noreferrer">Register for free</a><h2>Why attend</h2>Additive manufacturing is no longer confined to prototyping. As parts move into regulated, safety critical, and cross border supply chains, the gap between regional standards becomes a commercial problem, not just a technical one. A part that passes qualification in one market can stall at the border of another simply because the paperwork speaks a different standards language.If your work touches more than one of these regions, this is a chance to hear where the friction actually is, straight from the people negotiating it.<h2>Who's on the panel</h2>Li Chen joins from 3DZYK, covering the Chinese additive manufacturing industry. Andy Lu represents ASTM, one of the central standardization bodies for AM globally. Johannes Gartner brings the European trade media perspective through 3Druck.com. Gregor Reichle joins from QualifiedAM, focused on qualification and certification practice.<h2>Event details</h2>The panel runs live on June 29, 2026. Start times: 21:00 Beijing, 15:00 CEST, 14:00 UK, 09:00 US East Coast, 06:00 US West Coast. International viewers join via Google Meet. A WeChat livestream is available for viewers in China.<a href="https://wevlv.co/3DRuck-Panel" class="button-main-action" target="_blank" rel="noopener noreferrer">Register for free</a>

A live panel on how China, Europe, and the US are building, certifying, and reconciling additive manufacturing standards, and where those approaches still don't line up.

The AM Standard Journey: East vs. West

3D PRINT Lyon brings together manufacturers, engineers, technology providers, researchers, and industrial decision makers from across the additive manufacturing industry. The event highlights the latest developments in 3D printing, industrial applications, and production technologies that are shaping modern manufacturing.<h2>Learn More</h2>The exhibition covers the full additive manufacturing value chain. Visitors can explore industrial 3D printers, advanced materials, software solutions, post-processing technologies, and live machine demonstrations across a variety of industries. The event also includes conferences, workshops, and networking sessions featuring industry experts and innovators from around the world.3D PRINT Lyon attracts professionals from sectors such as aerospace, automotive, healthcare, industrial manufacturing, plastics, composites, and consumer products. The event combines a trade exhibition with technical education and business development opportunities for companies involved in advanced manufacturing technologies.The exhibition has become one of Europe’s leading meeting points for additive manufacturing professionals. Companies attend to discover new technologies, evaluate industrial solutions, connect with suppliers, and exchange knowledge with experts from across the industry.Held annually in Lyon, 3D PRINT Lyon has grown into France’s leading additive manufacturing trade show since launching in 2014. The 2026 edition is expected to feature more than 150 exhibitors and attract thousands of professional visitors from across Europe and beyond.<h2>Who attends 3D PRINT Lyon?</h2>Participants include additive manufacturing companies, industrial manufacturers, engineers, software developers, research institutions, and technology suppliers. Attendees include production managers, R&amp;D teams, product designers, distributors, and manufacturing decision makers.<h3>150+ exhibitors and brands across additive manufacturing and industrial production</h3><h3>Additive Manufacturing &amp; 3D Printing</h3><ul><li>Industrial 3D printing systems</li><li>Metal additive manufacturing</li><li>Polymer and composite printing technologies</li><li>Large-format production systems</li><li>Rapid prototyping solutions</li></ul><h3>Materials &amp; Industrial Technologies</h3><ul><li>Metal powders and resins</li><li>Engineering plastics and composites</li><li>Surface finishing solutions</li><li>Post-processing technologies</li><li>Precision manufacturing equipment</li></ul><h3>Software &amp; Digital Manufacturing</h3><ul><li>CAD and simulation software</li><li>Workflow automation tools</li><li>Production management platforms</li><li>AI-driven manufacturing solutions</li><li>Digital factory technologies</li></ul><h3>Industrial Applications</h3><ul><li>Aerospace manufacturing</li><li>Automotive production</li><li>Medical and dental technologies</li><li>Tooling and mold production</li><li>Consumer and industrial products</li></ul><h3>Services &amp; Innovation</h3><ul><li>Engineering and consulting services</li><li>Research and development organizations</li><li>Quality control and inspection</li><li>Logistics and supply chain solutions</li><li>Training and technical education</li></ul>The event also features keynote speakers, expert-led conferences, and live demonstrations focused on real-world industrial applications of additive manufacturing technologies.For more information, visit the <a href="https://www.3dprint-exhibition-lyon.com/en">3D PRINT Lyon </a>official website.

An annual industry event focused on additive manufacturing, industrial 3D printing, and advanced manufacturing technologies in Europe.

3D PRINT Lyon 2026

The event takes place from May 18 to May 22, 2026 at Resorts World in Las Vegas, United States.EDS Leadership Summit brings together manufacturers, distributors, and representatives from across the electronics industry. The event focuses on building business relationships and aligning priorities for the year ahead.  <a href="https://edssummit.com/" target="_blank" rel="noopener noreferrer" class="button-main-action">Learn More</a>The summit is centered around scheduled meetings between companies. These meetings are used to discuss partnerships, review performance, and plan future opportunities. The event also includes networking functions and informal gatherings where attendees connect with industry partners.  EDS is primarily attended by decision makers from electronic component manufacturers, distributors, and sales organizations. The event is structured around business discussions rather than a traditional exhibition format.  The summit serves as a yearly meeting point for companies working in electronic components and related technologies. Participants use the event to set goals, exchange ideas, and maintain industry relationships.  EDS takes place annually in Las Vegas and is considered a key business event for the electronic components ecosystem. The schedule typically includes several days of meetings and networking activities.  <h2 id="isPasted">Who attends EDS?</h2>Par­tic­i­pants in EDS are pri­mar­i­ly man­u­fac­tur­ers of elec­tron­ic com­po­nents, plus sup­pli­ers of goods and ser­vices used by dis­trib­u­tors and sale reps. Atten­dees at EDS are dis­trib­u­tors and sales reps. <h3>400 Man­u­fac­tur­ers who sell through elec­tron­ic Distributors</h3><ul><li>Pas­sive and electro­mechan­i­cal components</li><li>Instru­ments</li><li>Dat­a­com products</li><li>Acces­sories</li><li>Active com­po­nents</li></ul><h3>Sup­pli­ers who sell to elec­tron­ic Distributors</h3><ul><li>Third par­ty logistics</li><li>Val­ue added equipment</li><li>Data pro­cess­ing equip­ment and software</li><li>Office and ware­house equipment</li><li>Con­sult­ing services</li></ul>

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