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Announcing TechBlick's free-to-attend virtual conference and exhibition covering innovations in Wearable Sensors | E-Textiles | Printed Electronics & Beyond. It is a unique event with two-parallel live tracks, a live engaging exhibition floor, and 400+ attendees. See details & registration link here
Wearable electronic textiles are a demanding environment for reliable interconnects – the ability to function with movement and survive multiple cleanings and reuse. Good adhesion is particularly challenging in these wearable and conformable electronics applications. While solders provide the most conductive electrical connection, they are rigid and require not only the addition of an underfill adhesive but usually a post bond encapsulation. This Anisotropic Conductive Epoxy, provides reliable interconnections between electronic components and circuitry on textiles with excellent structural bonding, without encapsulation, even under repeated stretching and washings. This technology has been shown as a scalable assembly process for e-Textile manufacturing in an SMT line.