The HARTING har-flex® board Insulation Displacement Connectors (IDCs) are compact, low-profile cable-to-board interconnects designed for high-density PCB environments. The connectors enable one side of a ribbon cable to be permanently terminated to the PCB while the opposite end remains detachable, ensuring efficient assembly and reduced space usage. Supporting 1.27 mm pitch ribbon cables with 6 to 50 contacts, these IDCs facilitate modular device designs without excess pin allocation. Optional strain relief enhances mechanical stability under vibration or motion. 

The system supports manual (6–16 pins) or automated press-fit assembly, providing flexibility for different production volumes. Its flat, fixed connection geometry is ideal for compact electronic devices, control units, and industrial automation systems requiring minimal stack height and robust electrical integrity. Fully RoHS and ELV compliant, har-flex Board IDCs are used in robotics, frequency inverters, energy storage, and precision motor control applications where reliability and compact integration are critical.

Features of har-flex Board IDCs 

The har-flex Board IDCs feature a compact, low-profile design with fixed cable termination for space-efficient PCB integration. Optional strain relief enhances mechanical stability under vibration and motion-intensive industrial environments. Let’s go through their features in detail: 

Compact Cable-to-Board Design

The har-flex Board IDCs provide a space-efficient solution for fixed cable-to-board connections in compact electronic assemblies. They are designed for applications that do not require pluggable interfaces, with one side of the ribbon cable permanently terminated to the PCB. This permanent connection minimizes vertical height, allowing for denser layouts and efficient use of limited board space.

Electrical & Mechanical Configuration

These IDCs maintain 0.635 mm contact spacing and a 0.4 mm clearance distance, ensuring reliable electrical performance in high-density designs. Compatible with 1.27 mm pitch ribbon cables, they support even pin configurations from 6 to 50 contacts, as well as 60, 64, 68, 80, and 100 pins/contacts. Optional hold-downs and strain reliefs improve mechanical durability against vibration and movement, increasing long-term connection integrity.

Standards & Environmental Ratings

The connectors comply with UL 1977 and CSA 22.2 No. 182.3 standards, ensuring safe operation in regulated industrial environments. Their -55°C to +125°C operating temperature range enables reliable use in extreme thermal conditions commonly found in automation, energy, and motion-control applications.

Assembly and Integration

The har-flex Board IDCs support both manual and automated assembly. Configurations with 6–16 contacts can be connected using a handheld press tool, while higher pin counts are compatible with machine-assisted press-fitting. This flexibility accommodates low- and high-volume production lines. The fixed side can be permanently soldered or press-mounted to the PCB, providing a robust and vibration-tolerant joint.

Structural Design and Material Properties

The connectors feature a low-profile housing engineered for compact enclosures. Optional strain reliefs distribute mechanical stress evenly along the cable termination, preventing conductor fatigue during repetitive motion or thermal cycling. The materials comply with RoHS and ELV environmental directives, ensuring low halogen content and recyclability.

Applications

The har-flex Board IDCs are engineered for integration in industrial and electromechanical systems requiring compact, vibration-resistant interconnections. In robotic arms and industrial motors, they enable stable signal and power transmission under continuous movement and mechanical stress. Within high-torque machines and frequency inverters, the connectors maintain electrical integrity in high-current or high-vibration environments. In control units and dynamic energy-storing systems, their compact geometry supports dense PCB layouts and efficient space utilization. They are implemented in modular device panels, facilitating subassembly interconnection, reducing cable complexity, and supporting high reliability across distributed system architectures in automation and motion-control applications.