An air curtain shooting down from the brim of a hard hat can prevent 99.8% of aerosols from reaching a worker’s face. The technology, created by University of Michigan startup Taza Aya, potentially offers a new protection option for workers in industries where respiratory disease transmission is a concern.Independent, third-party testing of <a href="https://taza-aya.com/" target="_blank" rel="noreferrer noopener">Taza Aya</a>‘s device showed the effectiveness of the air curtain, curved to encircle the face, coming from nozzles at the hat’s brim. But for the air curtain to effectively protect against pathogens in the room, it must first be cleansed of pathogens itself. Previous research by the group of Taza Aya co-founder <a href="https://cee.engin.umich.edu/people/clack-herek-l/" target="_blank" rel="noreferrer noopener">Herek Clack</a>, U-M associate professor of civil and environmental engineering, showed that their method can remove and kill 99% of airborne viruses in farm and laboratory settings.&nbsp;<iframe width="640" height="360" src="https://www.youtube.com/embed/iGMXfB-g0bY?&amp;wmode=opaque&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"></iframe>“Our air curtain technology is precisely designed to protect wearers from airborne infectious pathogens, using treated air as a barrier in which any pathogens present have been inactivated so that they are no longer able to infect you if you breathe them in,” Clack said. “It’s virtually unheard of—our level of protection against airborne germs, especially when combined with the improved ergonomics it also provides.”Fire has been used throughout history for sterilization, and while we might not usually think of it this way, it’s what’s known as a thermal plasma. Nonthermal, or cold, plasmas are made of highly energetic, electrically charged molecules and molecular fragments that achieve a similar effect without the heat. Those ions and molecules stabilize quickly, becoming ordinary air before reaching the curtain nozzles.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1721001150167-Worker-protection3-1280x720.jpg" style="width: 100%px;" class="fr-fic fr-dib">Taza Aya’s Worker Wearable Protection device keeps airborne virus particles from reaching a workers mouth and nose with an air curtain. That air is pre-treated to kill any viruses. Photo: Jeremy Little, Michigan EngineeringTaza Aya’s prototype features a backpack, weighing roughly 10 pounds, that houses the nonthermal plasma module, air handler, electronics and the unit’s battery pack. The handler draws air into the module, where it’s treated before flowing to the air curtain’s nozzle array.Taza Aya’s progress comes in the wake of the COVID-19 pandemic and in the midst of a summer when the U.S. Centers for Disease Control and Prevention have reported four cases of humans testing positive for bird flu. During the pandemic, agriculture suffered disruptions in meat production due to shortages in labor, which had a direct impact on prices, the availability of some products and the extended supply chain.In recent months, Taza Aya has conducted user experience testing with workers at Michigan Turkey Producers in Wyoming, Michigan, a processing plant that practices the humane handling of birds. The plant is home to hundreds of workers, many of them coming into direct contact with turkeys during their work day.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1721001170226-Suiting-up.jpg" style="width: 100%px;" class="fr-fic fr-dib">Herek Clack, a U-M associate professor of civil and environmental engineering and co-founder of Taza Aya, helps Michigan Turkey Producers employee, Blanca Chaidez, adjust a helmet that will protect her from infectious aerosols with an air curtain rather than a face mask. Photo: Jeremy Little, Michigan EngineeringTo date, paper masks have been the main strategy for protecting employees in such large-scale agriculture productions. But on a noisy production line, where many workers speak English as a second language, masks further reduce the ability of workers to communicate by muffling voices and hiding facial clues.“During COVID, it was a problem for many plants—the masks were needed, but they prevented good communication with our associates,” said Tina Conklin, Michigan Turkey’s vice president of technical services. &nbsp;In addition, the effectiveness of masks is reliant on a tight seal over the mouth and noise to ensure proper filtration, which can change minute to minute during a workday. Masks can also fog up safety goggles, and they have to be removed for workers to eat. Taza Aya’s technology avoids all of those problems.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1721001188858-On-the-job.jpg" style="width: 100%px;" class="fr-fic fr-dib">Michigan Turkey Producers employee, Blanca Chaidez, wears Taza Aya’s Worker Wearable Protection equipment as she prepares for her work shift. Photo: Jeremy Little, Michigan EngineeringAs a researcher at U-M, Clack spent years exploring the use of&nbsp;<a href="https://news.engin.umich.edu/2020/03/non-thermal-plasma-can-inactivate-airborne-viral-threat-to-pigs/" target="_blank">nonthermal plasma to protect livestock</a>. With the arrival of COVID-19 in early 2020, he quickly pivoted to how the technology might be used for personal protection from airborne pathogens.In October of that year, Taza Aya was named an awardee in the Invisible Shield QuickFire Challenge—a competition created by Johnson &amp; Johnson Innovation in cooperation with the U.S. Department of Health and Human Services. The program sought to encourage the development of technologies that could protect people from airborne viruses while having a minimal impact on daily life.“We are pleased with the study results as we embark on this journey,” said Alberto Elli, Taza Aya’s CEO. “This real-world product and user testing experience will help us successfully launch the Worker Wearable in 2025.”Clack and the University of Michigan have a financial interest in Taza Aya.

Headworn tech from U-M startup could protect agricultural and industrial workers from airborne pathogens.

An invisible mask? Wearable air curtain, treated to kill viruses, blocks 99.8 percent of aerosols

As the summer heat intensifies, with temperatures sometimes soaring to triple digits, the question of which fabrics are best for staying cool becomes particularly relevant. <a href="https://mse.gatech.edu/people/sundaresan-jayaraman" target="_blank">Sundaresan Jayaraman</a>, a professor in Georgia Tech’s School of Materials Science and Engineering, offers insights into the properties of various fabrics and why some are more effective than others in hot, humid conditions.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1720078088786-Linen+properties+-+June+28%2C+2024.jpg" style="width: 100%px;" class="fr-fic fr-dib">Jayaraman, a renowned expert in fibers, polymers, and textiles, recognizes linen as the best fabric for hot and humid conditions. He explains that linen's effectiveness lies in its superior moisture management properties. The fiber structure of linen allows it to absorb moisture quickly and then transport it away from the body. This is due to linen's high moisture regain capacity, which means it can absorb a significant amount of moisture without feeling damp.“The moisture vapor transport rate for linen is much greater than that for cotton or polyester,” he explained. Additionally, linen's bending rigidity prevents it from clinging to the body, allowing for better air circulation.Cotton is another popular fabric for summer, known for its softness and breathability. However, Jayaraman points out that while cotton effectively absorbs moisture, it tends to retain it longer than linen, making it feel clammy in extreme heat. Cotton's moisture vapor transmission rate is lower than linen’s, meaning it doesn't dry as quickly.The structure of cotton fibers, which are ribbon-like and can trap more water, also affects cotton’s performance. While it’s more prone to sticking to the body due to its lower bending rigidity, cotton is generally comfortable for less humid conditions or for shorter durations in the heat.While polyester may not be the first fabric that comes to mind for summer, its performance can be significantly enhanced with chemical treatments. Dri-FIT technology, for instance, improves polyester’s moisture-wicking properties, making it a popular choice for athletic wear.“Regular polyester is terrible when it comes to moisture absorption,” admitted Jayaraman. “But Dri-FIT polyester doesn’t feel clammy and is very comfortable for being physically active in the summer months.”While functionality is crucial, aesthetics also play a role in fabric choice for the summer. Linen, despite its excellent cooling properties, is prone to wrinkling and may not drape as elegantly as cotton or treated polyester. Jayaraman notes that linen's natural stiffness, which contributes to its cooling benefits, also leads to its tendency to wrinkle. He says, “For a crisp appearance, linen garments often require ironing before wear.” For those prioritizing appearance, cotton offers a softer drape and a smoother look, albeit with slightly less cooling efficiency.

Smart textiles expert and Professor in the School of Materials Science and Engineering shares insight into the best fabrics to wear in the Summer

Stay Cool: Top Fabrics to Wear to Survive the Summer Heat

In the early days&nbsp;of&nbsp;the technology, wearables were mundane&nbsp;- a triumph of function over flair.&nbsp;We wore them to count our steps, not to make us look chic.&nbsp;Things have changed. Modern&nbsp;wearable&nbsp;consumer electronics&nbsp;devices&nbsp;increasingly&nbsp;combine&nbsp;convenience and&nbsp;purpose&nbsp;with&nbsp;more than a&nbsp;touch of&nbsp;classic&nbsp;style&nbsp;in order to&nbsp;grab a slice of a lucrative and growing market.&nbsp;<h2>The global&nbsp;appeal&nbsp;of wearable&nbsp;devices&nbsp;</h2>The wearable technology sector continues to boom. According to analyst Statista, shipments of hearables, smartwatches, smart rings, wristbands, and other wearables are forecast to reach around 560 million units in 2024[1]. That's up from the 336 million units that shipped five years earlier[2], an increase of more than 65 percent.&nbsp;&nbsp;For now, this market is largely dominated by the established smartwatch ranges of major brands like Apple, Garmin, Google Fitbit, and Samsung. These manufacturers attempt to differentiate their products by offering increasing battery life, improving usability, and added features geared towards health and fitness.&nbsp;<h2>Adding form to function&nbsp;&nbsp;</h2>But the next wave of wearable tech is set to impact the lucrative world of fashion. Clever designers and developers are meeting new consumer demand by prioritizing form alongside function. By merging advanced technology with a traditional timepiece, a wearable no longer needs to look like a wearable.&nbsp;One company pioneering this approach is French consumer electronics company, Withings. The firm recently launched its&nbsp;<a href="https://www.nordicsemi.com/Nordic-news/2024/03/Withings-ScanWatch-Nova-employs-Nordics-nRF52840-SoC" target="_blank">ScanWatch Nova</a>, an advanced, hybrid smartwatch designed to provide wearers with accurate, around-the-clock health metrics while offering an elegant ‘diver style’ stainless steel design.&nbsp;&nbsp;The compact smartwatch integrates temperature, accelerometer, altimeter, and multi-wavelength photoplethysmography (PPG) sensors—all supervised by Nordic Semiconductor’s&nbsp;<a href="https://www.nordicsemi.com/Products/nRF52840" target="_blank">nRF52840</a> multiprotocol&nbsp;<a href="https://www.nordicsemi.com/Products/Wireless/Bluetooth-Low-Energy" target="_blank">Bluetooth LE</a>&nbsp;SoC—to generate a wide range of health data including temperature tracking, on-demand electrocardiogram&nbsp;(ECG), and menstrual cycle tracking.<h2>Smartwatches aim for share of prestige market&nbsp;&nbsp;</h2>Global prestige watch brand, Festina, has also launched the latest in its connected watch range in a stylish, modern design. The nRF52840 SoC-powered&nbsp;<a href="https://www.nordicsemi.com/Nordic-news/2024/03/Festinas-Connected-D-employs-nRF52840-SoC" target="_blank">Festina Connected D</a>&nbsp;is simultaneously both a traditional watch and an activity tracker. The stainless steel timepiece features an authentic physical dial plate and watch hands with a cut-out for the OLED display.&nbsp;Meanwhile Dayton Industrial’s Nordic&nbsp;<a href="https://www.nordicsemi.com/Products/nRF52832" target="_blank">nRF52832</a> SoC-powered&nbsp;<a href="https://www.nordicsemi.com/Nordic-news/2022/10/Dayton-Industrials-Link2Care-Smartwatch-DA13700-uses-nRF52832-SoC-and-nRF9160-SiP" target="_blank">Link2Care Smartwatch DA13700</a>, promotes elegant design alongside a 3D motion sensor for activity records, inactivity alerts, sleep monitoring, and fall detection. The smartwatch also integrates Nordic's&nbsp;<a href="https://www.nordicsemi.com/Products/nRF9160" target="_blank">nRF9160</a>&nbsp;SiP providing LTE-M/NB-IoT&nbsp;<a href="https://www.nordicsemi.com/Products/Wireless/Low-power-cellular-IoT" target="_blank">cellular IoT</a>&nbsp;connectivity and GNSS, meaning the wearer’s location can be reported to nominated caregivers along with any SOS alert, while further information can be uploaded directly to the Cloud and customer service center via a cellular network.&nbsp;This movement towards prioritizing form alongside function is no accident. Luxury watch sales haven't been as affected by smartwatch sales as some might think. For example last year Swiss watch exports grew by 7.2 percent compared with the previous year with mechanical watches generating almost 80 percent of the growth&nbsp;[3]. If connected watches can deliver on both looks and functionality, all signs are that consumers will respond positively. &nbsp;&nbsp;<h2>The growing trend in&nbsp;fashionable&nbsp;smart jewelry&nbsp;</h2>Another burgeoning market is fashion-forward smart jewelry that simultaneously provides health data to wearers, sometimes in addition to built-in safety and security features such as location updates and SOS alert capabilities.&nbsp;Aesthetically pleasing smart rings, in particular, are challenging the dominance of smartwatches across the sector.&nbsp;Smart rings target two different markets - people who may not want to wear a watch, and those wanting or needing to collect health metrics.&nbsp;One Nordic-powered smart ring, the&nbsp;<a href="https://www.nordicsemi.com/Nordic-news/2023/09/The-Ultrahuman-Ring-Air-employs-nRF52840-SoC" target="_blank">Ultrahuman Ring Air</a>, can track and record a range of health parameters, and simultaneously offer the wearer activity or recovery recommendations. As well as looking the part, the device is designed to provide a range of metrics—including a movement index and a sleep index—that can help the user better understand and improve their fitness level and the factors that affect their metabolism.&nbsp;Although not a smart ring, the&nbsp;<a href="https://www.nordicsemi.com/Nordic-news/2022/07/The-WHOOP-4-uses-Nordics-nRF52840-SoC" target="_blank">WHOOP 4.0</a>, developed by U.S.-based human performance company, WHOOP, is a non-traditional smart wearable as it does not have a display and can be worn on one arm, allowing the user to also wear a classic watch on the opposite wrist.&nbsp;<h2>Watch this space&nbsp;–&nbsp;the future of wearable&nbsp;tech&nbsp;</h2>The integration of wearable tech into high fashion is no passing trend. In the not too distant future, the boundaries could be pushed even further through concepts like AI-powered clothing design and customization, or interactive fashion experiences that go beyond the physical garment.&nbsp;And when powered by the next generation of highly integrated wireless SoCs, such as Nordic Semiconductor’s revolutionary&nbsp;<a href="https://www.nordicsemi.com/Products/nRF54H20" target="_blank">nRF54H20</a>, tomorrow’s wearables will not only be more fashionable, but even smaller, lighter, and more functional.&nbsp;<hr><h3>References</h3>1. Wearable unit shipments worldwide from 2014 to 2028. Statista, April 2024.&nbsp; 2. 2019 Wearable Market Report. IDC, March 2020&nbsp; 3. Record value and a sharp rise in volumes. Federation of the Swiss Watch Industry, January 2024.

Modern wearable consumer electronics devices increasingly combine convenience and purpose with more than a touch of classic style in order to grab a slice of a lucrative and growing market. 

Wearables become high fashion

<div data-breakout="normal" id="isPasted">Author: <a target="_blank" href="https://www.linkedin.com/in/eric-m-hayden/" rel="noopener noreferrer" data-hook="WebLink">Eric Hayden,&nbsp;</a><a target="_blank" href="https://www.linkedin.com/in/eric-m-hayden/" rel="noopener noreferrer" data-hook="WebLink">Head of Marketing &amp; Business Development</a></div><div data-breakout="normal"><a target="_blank" href="https://www.techblick.com/blog/hashtags/InMoldElectronics" rel="noopener" data-hook="WebLink">#InMoldElectronics</a> <a target="_blank" href="https://www.techblick.com/blog/hashtags/WearableElectronics" rel="noopener" data-hook="WebLink">#WearableElectronics</a> <a target="_blank" href="https://www.techblick.com/blog/hashtags/TextileElectronics" rel="noopener" data-hook="WebLink">#TextileElectronics</a> <a target="_blank" href="https://www.techblick.com/blog/hashtags/StretchableElectronics" rel="noopener" data-hook="WebLink">#StretchableElectronics</a> <a target="_blank" href="https://www.techblick.com/blog/hashtags/MedicalElectronics" rel="noopener" data-hook="WebLink">#MedicalElectronics</a></div><div data-breakout="normal">Precision screen printing machines have emerged as the premier choice for manufacturing printed electronics due to their unparalleled accuracy, efficiency, and versatility. These machines are essential in producing high-quality electronic components on flexible substrates, which are increasingly in demand in various industries, from consumer electronics to medical devices.</div><div data-breakout="normal">One of the key advantages of precision screen printing is its ability to achieve fine-line patterns necessary for modern electronic devices. Automatic screen printing machines enable the precise application of conductive inks, solder pastes, and adhesives, which are critical for the functionality and reliability of printed electronics[<a target="_blank" href="https://www.linkedin.com/pulse/global-automatic-screen-printing-machines-electronics-anevf" rel="noopener noreferrer" data-hook="WebLink">2</a>]. This high precision minimizes errors and ensures consistent production quality, reducing waste and production time.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1716560025860-Screenshot+2024-05-24+143533.jpg" style="width: 100%px;" class="fr-fic fr-dib">Figure 1: ATMALINE RR5060/C - Automatic CCD registration corrects alignment of the coiled material substrate on each printing pass for unrivaled accuracy.<div type="empty-line" data-hook="rcv-block12"> </div><div data-breakout="normal">A prime example of innovation in this field is the ATMA CCD camera screen printing machine. These machines utilize advanced camera optics combined with servo-driven components to enhance precision and alignment, which is crucial for the intricate patterns required in flexible electronics. The ATMAOE model, for instance, eliminates the need for the I-cut process after digital printing, streamlining the manufacturing process and further enhancing efficiency[<a target="_blank" href="https://www.cubbison.com/blog/being-close-doesnt-cut-it-perfecting-precision-with-screen-printing-technology" rel="noopener" data-hook="WebLink">3</a>]</div><div type="paragraph" data-hook="rcv-block13"><iframe width="640" height="360" src="https://www.youtube.com/embed/zD4kthj_wtA?&amp;wmode=opaque&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"></iframe>Figure 2 - Suitable&nbsp;for high precision screen printing on the coiled flexible (or film) material, such as conductive films, biotech sensors, blood glucose testers, etc.</div><div type="empty-line" data-hook="rcv-block19"> </div><div data-breakout="normal">The versatility of precision screen printing machines is evident in their application across various substrates, including flexible printed circuits (FPCs) and ITO conductive films. These machines are designed to handle the unique challenges posed by flexible materials, ensuring that the electronic components maintain their integrity and performance even under bending and stretching conditions[<a target="_blank" href="https://rhsolutionsllc.com/ATMA_ATMALINE_RR5060_C.html" rel="noopener" data-hook="WebLink">1</a>].</div><div data-breakout="normal">In conclusion, precision screen printing machines, exemplified by ATMA's advanced models, are the optimal choice for manufacturing printed electronics. Their ability to deliver high-precision, consistent, and efficient production makes them indispensable in the rapidly evolving electronics industry.</div><div data-breakout="normal">Sources</div><div data-breakout="normal"><ol><li dir="auto"><a target="_blank" href="http://rhsolutionsllc.com/" rel="noopener" data-hook="WebLink">rhsolutionsllc.com</a><a target="_blank" href="https://rhsolutionsllc.com/ATMA_ATMALINE_RR5060_C.html" rel="noopener" data-hook="WebLink">&nbsp;– ATMALINE RR5060/C</a></li><li dir="auto"><a target="_blank" href="http://linkedin.com/" rel="noopener" data-hook="WebLink">linkedin.com</a><a target="_blank" href="https://www.linkedin.com/pulse/global-automatic-screen-printing-machines-electronics-anevf" rel="noopener" data-hook="WebLink">&nbsp;- Global Automatic Screen Printing Machines for Electronics</a></li><li dir="auto"><a target="_blank" href="http://cubbison.com/" rel="noopener" data-hook="WebLink">cubbison.com</a><a target="_blank" href="https://www.cubbison.com/blog/being-close-doesnt-cut-it-perfecting-precision-with-screen-printing-technology" rel="noopener" data-hook="WebLink">&nbsp;- Being Close Doesn't Cut It! Perfecting Precision with Screen Printing Technology</a></li></ol></div><div data-breakout="normal"><hr><h3 dir="auto"><a target="_blank" href="https://www.techblick.com/exhibitors-2024-boston" rel="noopener noreferrer" data-hook="WebLink">We are Exhibiting in Boston.</a></h3></div><div type="heading" data-hook="rcv-block27"> </div><div data-breakout="normal">Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, &nbsp;Wearable, Structural, and 3D.</div><div data-breakout="normal">Visit our&nbsp;booth at this long-awaited&nbsp;<a target="_blank" href="https://www.techblick.com/exhibitors-2024-boston" rel="noopener noreferrer" data-hook="WebLink">TechBlick US event on 12-13 June 2024 in Boston</a>. This is the most important industry and research meeting in our field in the US.</div><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1716560125787-RH+Solutions+-Booth+Slide.jpg" style="width: 100%px;" class="fr-fic fr-dib"> <div data-breakout="normal"><div dir="auto"> </div></div></div>

Precision screen printing machines have emerged as the premier choice for manufacturing printed electronics due to their unparalleled accuracy, efficiency, and versatility. 

The Future of Electronics: Precision Screen Printing Machines Leading the Way

Steve Paschky - Managing Director, Sales &amp; MarketingAmong the emerging areas for Printed Electronics (PE), wearables and automotive industries are rapidly adopting this technology on a commercial scale. These sectors are heavily investing in PE due to its several advantages mainly:<ul><li>PE supports invisible electronics</li><li>PE eliminates the complexities of bulky electronics integrations</li><li>PE allows direct printing on lightweight substrates, leading to substantial weight reduction</li></ul><h3> Stretchable electronics: A significant driver of Printed Electronics industry</h3> The transformative impact of PE is not only due to enabling experimentation with various ink materials and functionalities, but also encouraging the use of diverse substrate materials. More specifically in the wearables and automotive sectors, electronics printing on stretchable substrates is highly desirable;<ul><li>Stretchable electronics easily flex to fit complex car interior geometries</li><li>They offer excellent conformity to the human body ideal for health monitoring wearables and medical patches</li><li>Fully integrated PE on textiles offer comfort and movement flexibility in smart garments</li><li>They adopt easily to 3D shapes or thermoformed in the IME process perfect for automotive electronics</li></ul>To support these needs, Saralon GmbH has developed all the essentials for producing stretchable Printed Electronics. Stretchable Saral Inks© include Silver, Carbon-based and non-conductive inks for different stretchable and bendable substrates. On ink targets textile materials by containing larger silver particles to reduce unwanted permeation; the other is designed for printing on paper and thus doesn’t require high-temperature curing. Stretchable Saral Inks© are formulated to adhere to various substrates such as TPU, PC, PET, textile, paper, and other elastic or bendable materials.<h3> An inclusive system of compatible stretchable inks</h3> Stretchable Saral Inks© can be printed on top of each other, allowing for integrated printing in diverse combinations and stretchable overlays for healthcare and sport wearables, smart textiles, stretchable heaters, 3D smart objects, and high resistance stretchable Printed Electronics:<ul><li>Saral StretchSilver 800: for TPU and other plastics such as PC for thermoforming and IME</li><li>Saral StretchSilver 500: Solvent based stretchable conducting ink for textiles and other rough substrates</li><li>Saral StretchSilver H2O 600: for sustainable paper and other bendable application</li><li>Saral StretchCarbon 100 for low-conductive bendable electronics (e.g. heaters)</li><li>Saral StrecthDielectric 100 for encapsulation and protection of conductive layers</li><li>Stretchable EL ink set for <a href="https://www.youtube.com/watch?v=Sf3Pq-SlnHY" target="_blank" rel="noopener noreferrer">stretchable electroluminescent</a> on TPU (e.g. wearables, security or promotional textile applications)</li></ul> Full compatibility of Saral Inks© is guaranteed leading to significant time and cost reduction in RnD at PE developers end. All Saral Inks© are suitable for all types of screen printing and other printing processes, e.g., flexographic printing, pad printing, dispense and gravure printing. Ink adjustments based on request is also possible to meet the specific demands of innovative projects. Next, let’s move on to a brief overview of each ink, their properties and target applications. Saral StretchSilver 800:&nbsp; Solvent based stretchable conducting ink for direct printing on TPU and other plastic stretchable surfaces. When printed on TPU and dried at 120°C for 10 min, it shows a good initial sheet resistance of 30 mΩ/sq/25 μm and very good adhesion on the surface. Printed Saral StretchSilver 800 conductive ink on PC withstands high temperatures, pressure, and elongation during the thermoforming process. This simplifies the fabrication of highly customizable and conformal 3D electronics for HMI applications e.g., in automotive and white industries. As the demand for IME continues to grow, manufacturers are looking for innovative ways to create products that meet both functional and aesthetic requirements. Presenting stretchability and thermoformability properties, SaralStretch Silver 800 offers greater design flexibility, easier electronics integration in 3D shapes and complex geometries, and significant weight and cost reduction due to the elimination of bulky conventional wiring systems. Compatibility with our <a href="https://www.saralon.com/en/blog/product-updates-conductive-adhesive-inks-for-printed-electronics/" target="_blank" rel="noopener noreferrer">screen-printable conductive adhesive</a> – Saral SilverGlue Alpha 600 – makes it easy to apply SMD components on TPU/PC substrates and create stretchable/thermoformable hybrid electronics.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE2NDU5MTEwMDE4LUZpZ3VyZSAxLSBTYXJhbCBTdHJldGNoU2lsdmVyIDgwMCBwcmludGVkIG9uIFRQVS5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib">Figure 1- Saral StretchSilver 800 printed on TPU Saral StretchSilver 500: Solvent based stretchable conducting ink specifically designed for textiles and other rough surfaces. When printed on knitted fabric of PET/EL blend and dried at 120°C for 10 min, the initial sheet resistance is 25 mΩ/sq/25 μm. Bigger silver particle size in this ink prevents its penetration into the porous surface, resulting in good conductivity preservation upon stretch and after tension release. <a href="https://www.saralon.com/en/blog/product-updates-how-to-choose-the-right-stretchable-conductive-ink-for-wearables-and-smart-textiles/" target="_blank" rel="noopener noreferrer">Performance tests conducted by STFI</a> (Renown independent textile research institution in Saxony) benchmarking Saral StretchSilver 500 against an alternative stretchable ink available in the market indicated its superior properties in terms of stretchable conductivity, controllable printing thus process reliability and reproducibility. This ink is the optimised solution for smart textiles in sport, therapeutical, protective garments and other innovative applications.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1716459206169-Figure+2-+Saral+StretchSilver+500+printed+on+textile.jpg" style="width: 100%px;" class="fr-fic fr-dib">Figure 2- Saral StretchSilver 500 printed on textile Saral StretchSilver H2O 600: Water based stretchable conducting ink developed to withstand creasing lines in paper electronics thus doesn’t require high-temperature curing. Direct printed on paper and dried at 120°C for 2 minutes in oven, the ink shows a good sheet resistance of 40 mΩ/sq/25 μm. This ink is the specialty solution to the growing demand for more sustainable non-solvent and paper-based print applications. Due to its low temperature curing and bendability characteristics (creasing lines), Saral StretchSilver H2O 600 is ideal for paper-based and disposable electronics – smart labels for track-trace and logistics monitoring, medical applications e.g. lab-on-a-chip for diagnostics, diabetes sensors, etc.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1716459233227-Figure+3-+Saral+StretchSilver+H2O+600+printed+on+paper.jpg" style="width: 100%px;" class="fr-fic fr-dib">Figure 3- Saral StretchSilver H2O 600 printed on paper Saral StretchCarbon 100: Solvent-based stretchable carbon ink suitable for direct printing on different substrates such as TPU or bendable plastics. Characterized with high sheet resistance of 100 Ω/sq/25 μm (printed on PET and dried at 120°C for 5 minutes in oven), this ink is a promising candidate for stretchable electronic devices including resistors, sensors, or heating elements. Examples of such applications are wearables for sweat (moisture) sensing, heating bandages, and smart sportswear.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1716459264298-Figure+4-+Saral+StretchCarbon+100+printed+on+TPU.jpg" style="width: 100%px;" class="fr-fic fr-dib">Figure 4- Saral StretchCarbon 100 printed on TPU Saral StrecthDielectric 100: Solvent based stretchable insulating ink for protecting stretchable conductive layers. Saral StrecthDielectric 100 is fully compatible with all Saral Inks© therefore smoothly printable on top of and in combination with any of our silver- or carbon-based stretchable inks on paper, plastic, or textiles. After printing a transparent encapsulating layer is achieved that offers additional protection e.g. for electronic wearables. Recommended drying temperature is 120°C for 5 minutes.<h3> About Saralon</h3>Saralon GmbH is an industry leader in the development of functional and conductive inks and ready-to-use printed electronic boards for specific applications:<ul><li>Saral Inks©: A comprehensive range of individual conductive and functional inks that gives printed electronics developers the freedom to choose based on their desired functionality (e.g. stretchability, conductivity, adhesives, sensing, etc.) and end use.</li><li>Saral Inks© sets: Specifically designed and developed sets of compatible inks for effortless integrated printing of high value, high demand electronic applications such as <a href="https://www.saralon.com/en/saralink-printedbattery/" target="_blank" rel="noopener noreferrer">printable batterie</a>s, <a href="https://www.saralon.com/en/blog/product-updates-print-electroluminescent-displays-yourself" target="_blank" rel="noopener noreferrer">electroluminescent</a> &amp; <a href="https://www.saralon.com/en/blog/product-updates-print-electrochromic-flexible-displays-through-saral-inks/" target="_blank" rel="noopener noreferrer">electrochromic displays</a>, etc. With Saral Inks© sets, Saralon eliminates the need for investing extra time and cost finding compatible inks for various circuit parts.</li><li>InkTech: Know-how transfer including design files, printing guide and continuous professional support.</li><li><a href="https://www.saralon.com/en/applications/" target="_blank" rel="noopener noreferrer">Saral Electronics (Technology Platforms)</a>: Pre-printed functional boards produced by Saralon using Saral Inks©. With this portfolio of products and services, Saralon simplifies printed electronics, fuels innovation, and opens the doors to a sustainable future in the electronics industry.</li></ul><hr><h3 id="isPasted">We are Exhibiting in Boston.</h3>Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, &nbsp;Wearable, Structural, and 3D.Visit our booth at this long-awaited <a rel="noopener noreferrer" href="https://www.techblick.com/electronicsreshapedusa" target="_blank">TechBlick US event on 12-13 June 2024</a> in Boston. This is the most important industry and research meeting in our field in the US.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1716459441919-Saralon-Booth+Slide.jpg" style="width: 100%px;" class="fr-fic fr-dib">

An inclusive system of compatible stretchable inks

The right stretchable ink system compatible with many substrates is essential for many applications including in-mold electronics, wearable electronics, stretchable/conformable circuits, paper electronics, in-mold electronics, electronic textiles, and beyond, etc. 

Stretchable Saral Inks: All essentials for producing stretchable Printed Electronics

Wearable sensor patches offer novel opportunities for many healthcare and wellness applications. For optimal comfort and reliability, they should be flexible, soft, conformable, or even stretchable. Printed and hybrid electronics enable the use of almost any substrate and packaging materials, making it the perfect technology for next-generation wearables.Author: Antti Kemppainen , VTT,&nbsp;<a href="mailto:Antti.Kemppainen@vtt.fi" rel=" noopener" target="_blank" data-hook="WebLink">Antti.Kemppainen@vtt.fi</a><h3>Pilot Factory</h3>The production of printed and hybrid electronics requires several manufacturing processes and tools which might not be available by commercial manufacturing partners. VTT’s Printocent Pilot Factory bridges the gap towards full upscaled manufacturing by extremely versatile infra, including for example following capabilities:[1] Roll-to-roll printed electronics lines with:<ul><li>Interchangeable printing methods, high curing capacity and automated layer-to-layer registration.</li><li>Printing and coating processes are available for thin films (&lt;100 nm) up to thick films (tens of micrometers).</li><li>Highly experienced team and facilities for ink tailoring, process development and quality control.</li></ul>[2] Component assembly in a roll-to-roll format using:<ul><li>High throughput pick and place line for low-temperature soldering or adhesive bonding.</li><li>Flip-chip high-precision and bare-die assembly line</li></ul>[3] Extensive converting and post-processing capabilities including:<ul><li>A Versatile lamination and cutting converting line equipped with a cutting laser, robot arms, soldering and ultrasonic welding capabilities</li><li>Injection molding machine with a roll feeder for overmolded electronics</li></ul>[4] The roll-to-roll testing line for automated functionality testing and programming purposes.[5] Dedicated pilot line for silicone material processing in reduced pressure. Additionally, for early screening and testing, there are laboratory-scale capabilities available for all key processes used in Pilot Factory. For verification purposes, characterization capabilities range from material testing, profilometry to 3D X-ray imaging.<hr><h3 id="isPasted">We are Speaking in Boston</h3>Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, &nbsp;Wearable, Structural, and 3D.Join us at this long-awaited <a target="_blank" rel="noopener noreferrer" href="https://www.techblick.com/electronicsreshapedusa">TechBlick US event on 12-13 June 2024 in Boston</a>. This is the most important industry and research meeting in our field in the US.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE1NTk1MjU3NzUxLVdlIGFyZSBTcGVha2luZyAoQm9zdG9uIDIwMjQpLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib"><h3 id="isPasted">ECG Patch: Proof of Concept and Proof of Manufacturing</h3>At VTT, we have developed a smart patch proof-of-concept for a single-lead ECG (Electrocardiogram) wireless patch. This patch is printed and assembled onto a TPU (Thermoplastic Polyurethane) substrate.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE1NTk1MjgxODgwLUVsYXN0aWMgRUNHIHBhdGNoLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib"><figure id="isPasted"><figcaption>Elastic ECG patch printed and assembled directly onto TPU.&nbsp;</figcaption></figure>&nbsp;Manufacturing processes have been developed and piloted in a versatile environment with highly scalable technologies. In the video below, part of the converting and post-processing at VTT Printocent pilot factory for the ECG patch is shown. The demonstrated technology offers a versatile manufacturing platform for the development of elastic wearable skin contact patches.Smart patch manufacturing video <a rel="noopener noreferrer" href="https://www.youtube.com/watch?v=z96NH3xBoGw" target="_blank">https://www.youtube.com/watch?v=z96NH3xBoGw</a><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE1NTk1Mjk5ODQxLVIyUi1jb252ZXJ0aW5nLWxpbmUuanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib"><h3 id="isPasted">More sustainable future</h3>Printed electronics enable an unlimited selection of materials. For disposable smart patches reused, recycled, biobased or even biodegradable materials can be used. In a recent study, VTT has developed a new sustainable electrocardiogram patch that is fully recyclable and made of biomaterials. The device is modular, so electronic components can be easily removed from the disposable patch and used again. The patch itself is made of nanocellulose and printed with carbon conductors and sensing electrodes. The biodegradable patch is made of VTT’s new material <a rel="noopener noreferrer" href="https://www.youtube.com/watch?v=sDAL4gluGL8" target="_blank">cellulose e-skin</a>, which replaces traditional plastic in wearable skin applications.<h3>Why to use VTT and Pilot Factory</h3>Printocent pilot factory and VTT’s experienced crew offer a fast path from proof of product concept feasibility to scalable continuous web manufacturing. Alternatively, we can address specific technical challenges or process bottlenecks, complementing our customers’ existing competences or capabilities. This facilitates quicker market entry and enhances the precision of manufacturing investments for the future. The insights gained from pilot developments can be effectively leveraged for technology transfer to third parties or for establishing in-house production, with our experts’ support.&nbsp;Read more about:<a href="https://www.vttresearch.com/en/ourservices/printed-electronics" title="VTT Printed Electronics" target="_blank">VTT Printed Electronics</a><a href="http://www.printocent.net/" title="PrintoCent Ecosystem " target="_blank">PrintoCent Ecosystem&nbsp;</a><hr><h3>We are Exhibiting in Boston</h3>Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, &nbsp;Wearable, Structural, and 3D.&nbsp;Visit our booth at this long-awaited <a href="https://www.techblick.com/electronicsreshapedusa" target="_blank" rel="noopener noreferrer">TechBlick US event on 12-13 June 2024 in Boston</a>. This is the most important industry and research meeting in our field in the US.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE1NTk1MzY3MjEyLVZUVC1Cb290aCBTbGlkZS5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib"><a rel="noopener noreferrer" href="https://www.youtube.com/watch?v=raLk_bTMvv4" target="_blank">VTT’s age of wearables video</a><a rel="noopener noreferrer" href="https://www.vttresearch.com/en/ourservices/printed-electronics" target="_blank">https://www.vttresearch.com/en/ourservices/printed-electronics</a>Printocent Ecosystem for Printed Electronics

Wearable sensor patches offer many opportunities for healthcare and wellness applications. For comfort and reliability, they should be flexible, soft, conformable, or even stretchable. Printed and hybrid electronics enable the use of almost any substrate and packaging materials, making it essential.

Pilot Factory for roll-to-roll processing of next-generation smart wearable patches

<section id="isPasted">One concern about AI is that it can imitate voices, a practice called voice spoofing. Deepfakes are a prominent type of voice spoofing facilitated by deep learning, a process in which AI modeled after neural networks in the human brain analyzes data and draws connections. Criminals can use voice spoofing to impersonate someone’s family member and ask for money. Voice spoofing is also a concern in manufacturing settings where verbal commands are widely used to control machinery. Criminals can engineer voices to manipulate and disrupt the machinery or steal data.&nbsp;Machines and manufacturing personnel need a way to verify that verbal commands are legitimate. Such protections do exist but cannot stop skilled attacks like deepfakes, requiring additional safeguards.&nbsp;Dr. Nitesh Saxena, a professor in the Department of Computer Science and Engineering at Texas A&amp;M University, and Yingying (Jennifer) Chen, professor and department chair of Electrical and Computer Engineering at Rutgers University, are working to protect voice control technology against manipulation. Smartwatches may be part of their solution.</section><blockquote>Improving the security of voice authentication is critical in many applications, especially in manufacturing domains.<cite>Dr. Nitesh Saxena</cite></blockquote><section>Wearable devices like smartwatches are already equipped with microphones and accelerometers, which measure vibrations. Saxena and Chen plan to develop software that can be installed on smartwatches or other wearable devices to help authenticate commands in manufacturing settings.&nbsp;Voice control technologies are susceptible to attack because existing defenses only assess a voice sample’s acoustic properties. Saxena and Chen hope to enhance security by requiring verification of both the acoustic properties and the vibration signals of voice samples. They believe this will improve security because it will be harder for criminals to fake both measures simultaneously.&nbsp;“Improving the security of voice authentication is critical in many applications, especially in manufacturing domains. Thanks to the support from our sponsor, this project will allow us to explore this important line of research,” Saxena said. His&nbsp;<a href="https://spies.engr.tamu.edu/" rel="noopener" target="_blank">lab</a> has pioneered work in voice-based security.&nbsp;</section>

Dr. Nitesh Saxena is teaming up with the Texas A&M Engineering Experiment Station and Rutgers University to create software that could stop voice-control mischief in manufacturing settings.

Fighting Deepfakes with Smartwatches

As recently as&nbsp;2010, class-leading activity trackers generally recorded three parameters - how much you moved, and approximately how much sleep you got and how many calories you burned. Movement was measured by an embedded accelerometer, alongside a 25 MHz processor, 8 kB RAM and 128 kB Flash memory. Add in a rechargeable battery and that was about all the tech you needed to power a wearable in the early 2000s.&nbsp;&nbsp;In the intervening years&nbsp;as the technology has advanced,&nbsp;fitness trackers have not only become vastly more sophisticated in terms of what&nbsp;data they are able to&nbsp;record, the&nbsp;line between fitness, health and medical monitoring has become&nbsp;increasingly blurred.&nbsp;Today’s&nbsp;high-end&nbsp;wearables can support an impressive array of sensors&nbsp;to record, for example, the wearer’s V02&nbsp;max, blood oxygen saturation (Sp02), temperature, heart rate,&nbsp;and&nbsp;heart rate variability&nbsp;(HRV), as well&nbsp;as&nbsp;the&nbsp;sleep and activity data&nbsp;their&nbsp;early predecessors pioneered.&nbsp;&nbsp; <h2>Wearables&nbsp;crossover from fitness to health</h2>The heart monitoring capability&nbsp;of today’s wrist-worn devices has&nbsp;transformed the wearable from a&nbsp;fitness tracker to a powerful tool for managing an individual’s&nbsp;cardiovascular health.&nbsp;Heart rate and&nbsp;HRV, alongside skin temperature measurements,&nbsp;have also been shown to&nbsp;be valuable in predicting and detecting&nbsp;hypoglycemia[1], enabling&nbsp;next generation wearables to also provide insight on an individual’s&nbsp;blood glucose history and associated&nbsp;diabetic&nbsp;risk.&nbsp;Further,&nbsp;data from these same sensors can provide stress and heart rate data, that&nbsp;combined with&nbsp;sleep quality information, can&nbsp;provide&nbsp;valuable insight into&nbsp;an individual’s mental&nbsp;health,&nbsp;and&nbsp;assist&nbsp;in better managing stress and&nbsp;anxiety[2].&nbsp;<h2>Next gen SoCs optimized for sensor fusion and ML</h2>Demand for ever more sophisticated wearables is placing increasing demand on the wireless SoCs that power the devices. Supporting wireless connectivity and supervising a host of sensors that can generate millions of data points is one thing. But making sense of all that data in context and quickly enough to enable rapid and effective clinical intervention demands an SoC with serious processing heft, and the ability to perform machine learning (ML) and sensor fusion at the edge.&nbsp;ML algorithms bring the ability to deal with a large volume of data and extract clinically relevant information from large datasets. This makes ML useful, for example, in healthcare wearables designed for human activity recognition (HAR). HAR enables a wearable to determine both specific ambulation activities (whether the wearer walking or jogging, for example) and functional activities (have they brushed their teeth, washed their hands, prepared food?). Assessing such activities and making inferences can help discern an individual’s health and wellness[3].&nbsp;To get that complete picture requires combining different data streams from multiple sensors, and that requires an SoC capable of sensor fusion so it can filter information and determine which data points from all the different sensors correspond to the same activity or health concern, and which do not.&nbsp;<h2>Nordic nRF54 Series&nbsp;future ready&nbsp;for advanced wearables&nbsp;</h2>Nordic Semiconductor has always taken the “if you build it the developer will find innovative ways to use it” approach to SoC development. In other words, the applications that require the processing power or memory allocation its cutting-edge technology provides may not have been dreamed up yet - but put the chips in the hands of clever engineers and they soon will be.&nbsp;This has never been more true than with the launch of the company’s revolutionary&nbsp;<a href="https://www.nordicsemi.com/Products/nRF54H20" target="_blank">nRF54H20</a>&nbsp;and&nbsp;<a href="https://www.nordicsemi.com/Products/nRF54L15" target="_blank">nRF54L15</a>&nbsp;multiprotocol SoCs. While their immediate predecessor the&nbsp;<a href="https://www.nordicsemi.com/Products/nRF5340" target="_blank">nRF5340</a>&nbsp;was the world’s first wireless SoC to feature two Arm Cortex-M33 processors, the nRF54H20 now boasts multiple Arm Cortex-M33 processors and multiple RISC-V coprocessors. The processors are clocked at up to 320 MHz and are supported by 2 MB non-volatile memory and 1 MB of RAM. This processing power and amount of memory make the SoC perfect for running ML models and sensor fusion at the edge.&nbsp;<h2>State-of-the-art&nbsp;security to protect sensitive data&nbsp;</h2>The nRF54H20 is also one of the most secure low power, multiprotocol SoCs on the market, essential for healthcare applications that demand security of potentially sensitive personal data. Its state-of-the-art security is designed for Platform Security Architecture (PSA) Certified Level 3 IoT security standard. The SoC also supports security services such as Secure Boot, Secure Firmware Update, and Secure Storage, and has cryptographic accelerators that are hardened against side-channel attacks and tamper sensors that detect an attack in progress and take appropriate action.&nbsp;&nbsp;By replacing multiple components with a highly integrated SoC, and prolonging battery life with an ultra-low power radio and minimal sleep currents, tomorrow’s healthcare wearables powered by the nRF54H20 will continue to get smaller and become more efficient and functional, and in so doing will be able to capture various health metrics that are not possible to capture today. The rest will be down to the imagination of the developers.&nbsp;&nbsp;<hr><h3 id="isPasted">References</h3>1. The Potential of Current Noninvasive Wearable Technology for the Monitoring of Physiological Signals in the Management of Type 1 Diabetes: Literature Survey. National Institutes of Health, 2022. &nbsp;2. A Survey on Wearable Sensors for Mental Health Monitoring. National Institutes of Health, 2023.3. Wearable multi-sensor data fusion approach for human activity recognition using machine learning algorithms. B Vidya, Sasikumar P, 2022&nbsp;

Today’s high-end wearables can support an impressive array of sensors to record, for example, the wearer’s V02 max, blood oxygen saturation (Sp02), temperature, heart rate, and heart rate variability (HRV), as well as the sleep and activity data their early predecessors pioneered.

Sky's the limit for wearables thanks to next gen wireless SoCs

Authors:&nbsp;<a href="https://www.linkedin.com/in/daandekubber/" rel="noreferrer noopener" target="_blank" data-hook="WebLink">Daan de Kubber</a>, <a href="https://www.linkedin.com/in/jurgenwesterhoff/" rel="noreferrer noopener" target="_blank" data-hook="WebLink">Jurgen Westerhoff</a>, <a href="https://www.linkedin.com/in/ben-robesin-4a41096/" rel="noreferrer noopener" target="_blank" data-hook="WebLink">Ben Robesin</a>&nbsp; SPGPrints b.v., Raamstraat 1-3, 5831 AT, Boxmeer, the NetherlandsPrinted electronics have gained significant attention for their potential to revolutionize various industries through cost-effective and scalable manufacturing processes. However, a critical challenge within this domain lies in the transition from lab-scale and pilot equipment to industrial-scale production. We want to shed light on the implications of this transition, emphasizing its impact on cost reduction, repeatability, and time to market.The initial stages of printed electronics development predominantly occur on lab and pilot equipment, where researchers and innovators prototype new applications. As these applications progress towards commercialization, the shift to industrial-scale equipment becomes inevitable. Rotary screen printing emerges as a prominent technique, providing high-throughput capabilities essential for large-scale production.<hr>We are Speaking at the Free-To-Attend On-Line Innovations Festival on 25 April 2024.&nbsp;<a href="https://www.techblick.com/innovation-festival-april-2024" target="_blank" rel="noopener noreferrer">Register to hear our talk, and meet us during the virtual networking</a>. <img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712517684074-SPGPrints+%28Festival-APRIL-2024%29.jpg" style="width: 100%px;" class="fr-fic fr-dib"><hr>We have looked critically at this transition. Investments in Industrial-scale equipment, though substantial, ultimately leads to significant cost reductions in large-scale production. This is essential if manufacturers want to achieve sustainable, cost-effective printed electronics.Moreover, the transition to industrial-scale equipment like Rotary Screen Printing enhances repeatability and quality control. Lab-scale equipment often lacks the precision, required consistency and capacity for mass production. In contrast, industrial-scale tools offer robust control mechanisms, ensuring consistent output across large volumes. This shift results in higher product quality consistency, reducing defects and improving overall yield rates.A great example of a printed electronics application that is moving into high-volume industrialized scale are the printed e-paper displays by our partner Ynvisible. Their products are used on smart labels, IoT devices, retail signage and many more markets. Ynvisible even shares their know-how in scaling up printed electronics with other companies in the flexible solar and printable battery space.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712517725631-Img-1.jpg" style="width: 100%px;" class="fr-fic fr-dib">Printed ultra-low-power display for use in retailIf we take the e-paper example and run it through our break-even <a href="https://www.spgprints.com/printed-electronics-calculator?hsCtaTracking=35adfcbb-b27b-4123-9872-3bf81acad083%7Cda23b58a-7bd3-4c3a-99b7-2362dea12b57" rel="noreferrer noopener" target="_blank" data-hook="WebLink">calculator</a> you see that for a yearly production of 3.5 million screens the Rotary Screen Printing solution starts to become more profitable within 3 years of production. This shows that you need relatively high volumes to justify the investment in a full SPGPrints Rotary screen printing line, but it will pay off and will ensure steady profitable business in the long run. Of course SPGPrints also offers screen printing units that can be integrated into an existing or custom built line, changing the business case significantly. Next to owning the equipment SPGPrints (and our network of print service providers) offers Production-as-a-Service including application development consultancy.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712517753534-Img-2.jpg" style="width: 100%px;" class="fr-fic fr-dib">This is a calculation showing the cost per printed unit comparison between typical flat-bed screen printing and a full SPGPrints rotary screen printing line.It is imperative to acknowledge that transitioning equipment mid-development cycle extends the time to market. This delay arises from the need to recalibrate processes, optimize formulations, and adapt to the unique characteristics of industrial-scale equipment. This delay represents a critical trade-off, where time saved in large-scale production is weighed against the extended development phase.In conclusion, the transition from lab-scale and pilot equipment to industrial-scale production, like Rotary Screen Printing, plays a pivotal role in advancing printed electronics. While the cost reductions and enhanced repeatability are substantial benefits, it is important to recognize the inherent time-to-market trade-off associated with this transition. In this paper we will show some examples of how choosing for industrial-scale equipment at an early stage in development, saves time and money in the long run. Additionally, we will provide a calculation method to evaluate the most suitable production equipment for a specific application.Read more about our offerings online: <a href="https://www.spgprints.com/applications-printed-electronics" rel="noreferrer noopener" target="_blank" data-hook="WebLink">SPGPrints | Applications | Printed Electronics</a><hr><a href="https://www.techblick.com/exhibitors-2024-boston" rel="noreferrer noopener" target="_blank" data-hook="WebLink">We are exhibiting in Boston at the Future of Electronics RESHAPED</a>&nbsp;on 12-13 June 2024.&nbsp;<a href="https://www.techblick.com/electronicsreshapedusa" rel="noreferrer noopener" target="_blank" data-hook="WebLink">Register now and visit our booth</a>.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712517816523-SPG+Prints-Booth+Slide.jpg" style="width: 100%px;" class="fr-fic fr-dib">

Printed ultra low-power display for use in retail

Transitioning from Lab-scale in Printed Electronics: Going from lab and pilot equipment to rotary screen printing.  Learn about example applications in printed low-power displays for use in retail as well as cost-per unit calculation comparing flat-bed vs. rotary screen printing for mass production

Bridging the Divide: Transitioning from Lab-scale to Industrial-scale Equipment in Printed Electronics Development

Mike Simmons, Matthew Kleyn, Joseph Vlach, Liz Josephson; Intellivation LLCThe demand for high-performance devices with enhanced functionalities continues to grow. Materials, such as graphene and MoS2, exhibit unique electrical and mechanical properties making them ideal for flexible electronic applications. To meet the rising demand and requirements for flexible 2D microelectronics devices manufactured using Roll to Roll technology, we use innovative manufacturing techniques including vacuum coatings in combination with laser technology. Laser patterning of sputtered coatings provides the ability to achieve high-volume production with precision, functionality and efficiency for a wide range of flexible applications.Sputter deposition is a widely used technique for depositing thin films onto substrates. For flexible 2D microelectronics, sputtered coatings serve as the foundation for building functional devices. Sputtering involves bombarding a target material with ions to eject atoms or molecules, which then deposit onto a substrate to form a thin film. This process allows for precise control over the thickness and composition of the deposited film, making it a preferred method for creating uniform and reproducible coatings. &nbsp;Sputtered layers were deposited using Intellivation’s R2R Lab system. Sputtering provides an excellent method for depositing coatings uniformly over large areas, while laser patterning can create discrete devices, circuits, and other types of discontinuous features required for manufacturing. &nbsp;Using these two techniques in combination provides unique capabilities, particular during product development. &nbsp; Photolithography requires multiple steps and is time consuming, it also requires geometric commitment of features at early stage of design. &nbsp;Laser patterning offers a direct and efficient way to create and define patterns on sputtered coatings including changes in geometry while providing consistent feature size and edge quality.Laser patterning uses a laser beam to selectively remove or modify specific areas of deposited films enabling the generation of intricate patterns with submicron-level precision. &nbsp;Control and precision of the laser is critical and the non-contact nature of laser patterning reduces the risk of contamination and damage to the underlying substrate, ideal for delicate 2D materials. &nbsp;This technique provides the ability to develop and then validate a design and process in small volumes and then easily transfer to large area roll-to-roll production without changes to the laser processing equipment.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEyMTYwNzI0ODg3LVNjcmVlbnNob3QgMjAyNC0wNC0wMyAxNTQwMzkuanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712209387228-Boston-2024-email.jpg" style="width: 100%px;" class="fr-fic fr-dib">Join us and Intellivation at TechBlick's Future of Electronics RESHAPED conference and exhibition in Boston | June 2024 https://www.techblick.com/electronicsreshapedusaDeposition of the conductive material onto the substrate was done with Intellivation’s R2R thin film vacuum deposition Lab coater , it is then laser patterned or the laser is used to isolate regions to crystallize them for interfacing with subsequent layers. Once the substrate, layer stacks and laser variables are optimized, the next phase is to scale these devices to large area R2R processing. <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEyMTYxMDkyODYyLVNjcmVlbnNob3QgMjAyNC0wNC0wMyAxNTQzMzAuanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib">The combination of laser patterning and sputtered coatings has unlocked new possibilities in the high-volume production of flexible 2D microelectronics. This innovative approach addresses the demand for devices with enhanced performance, precision, and scalability. A roll-to-roll approach offers several significant advantages in terms of efficiency, cost and adaptability.&nbsp;<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712209445705-660d896c5506c37659840c4f.jpg" style="width: 768px;" class="fr-fic fr-dib">Intellivation will be exhibiting at TechBlick's Future of Electronics RESHAPED conference and exhibition in Boston | June 2024 https://www.techblick.com/electronicsreshapedusa

R2R Sputtering + Direct Laser Patterning is a great way to create large-area circuits on flexible circuits, even with materials such as graphene or MoS2.  The technology R2R produces high-quality uniform films on large substrates whilst the laser forms precision circuit patterns without photolith.

Flexible Microelectronic Devices produced with Sputtered Coatings and Laser Patterning

Multi-scale approach improves the fatigue threshold of particle-reinforced rubber

Rubber that doesn't grow cracks when stretched many times

TechBlick is proud to announce the conference and exhibition, "The Future of Electronics: RESHAPED," set against the cultural backdrop of Berlin. This expansive event serves as a canvas for printed, flexible, sustainable, R2R, additive, hybrid, 3D, structural, soft, InMold, textiles, stretchable, and wearable electronics. 17-18 October 2023 at the Estrel Congress Center (ECC), Berlin. The conference is housed within the modern architecture of Berlin's Estrel Hotel and Congress Centre (ECC). <a href="https://www.techblick.com/registration" target="_blank" rel="noopener noreferrer" class="button-main-action">Register for your slot here. </a> Pushing boundaries in electronics, TechBlick brings to the table categories like structural, soft, and InMold electronics which are fast making a niche for themselves. The intent is clear: to cohesively RESHAPE the electronics ecosystem to make it more inclusive, diverse, sustainable, and cutting-edge. Highlights of the Event:<ul data-stringify-type="unordered-list" data-indent="0" data-border="0"><li data-stringify-indent="0" data-stringify-border="0">78 Exhibitors, All Booths Sold Out! An exhibition increase of 50% since 2022 ensures attendees get a panoramic view of the current market landscape.</li><li data-stringify-indent="0" data-stringify-border="0">Unique Hybrid Package: Experience the Berlin event live, coupled with a year-long access to all virtual conferences and masterclasses from TechBlick. The future is hybrid, and so is our offering.</li><li data-stringify-indent="0" data-stringify-border="0">Masterclasses and Tours: Engage with industry leaders and take guided tours to witness the revolution in electronics.</li><li data-stringify-indent="0" data-stringify-border="0">Networking and Refreshments: All attendees can enjoy a grand buffet lunch and refreshments in the heart of the convention center, ensuring meaningful conversations happen over great food.</li></ul><h2>Who should be there?</h2>This is a must-attend event for innovators, tech enthusiasts, entrepreneurs, researchers, and anyone who believes in the potential of flexible and sustainable electronics. Registration Details: For those who have already secured their spot:<ul data-stringify-type="unordered-list" data-indent="0" data-border="0"><li data-stringify-indent="0" data-stringify-border="0">16 October: Registration desk opens from 7.30am</li><li data-stringify-indent="0" data-stringify-border="0">17 October: From 7.00am</li><li data-stringify-indent="0" data-stringify-border="0">18 October: From 8.00am</li></ul>Join the global community, witness transformative innovations, and be a part of the conversation that drives the next wave in electronics. The future is being reshaped in Berlin, and you're invited. <a href="https://www.techblick.com/registration" target="_blank" rel="noopener noreferrer" class="button-main-action">Register for this once-in-a-lifetime event on 17-18 October 2023. </a> <a href="https://www.techblick.com/electronicsreshaped22" target="_blank" rel="noopener noreferrer">Click here to learn more about the all-access package. </a> The next big leap in electronics awaits. Join us in Berlin!

Globally recognized event, on 17-18 October 2023, seeks to explore the forefront of electronic innovations, drawing a bridge between the traditional and the groundbreaking, and taking you on a journey through the very fabric of next-gen electronics.

The Future of Electronics: A New Dimension in Berlin

Andrew Stemmerman &amp; John Yundt SunRay Scientific Inc. Eatontown, NJ USA <a rel="noopener noreferrer" href="mailto:andrew@sunrayscientific.com" target="_blank">andrew@sunrayscientific.com</a> <a rel="noopener noreferrer" href="mailto:johny@sunrayscientific.com" target="_blank">johny@sunrayscientific.com</a>SunRay Scientific of Eatontown, NJ, USA has developed a new and innovative approach to electronic component assembly.&nbsp;This article will outline the developments of this technology and show examples of this magnetically aligned Anisotropic Conductive Epoxy packaging method used on various substrates. Progress will be shared for dense and fine pitch Land Grid Arrays (LGA) on a semi-rigid interposer.<h3>Introduction</h3>Flip-chip die and die-to-die bonding, from dense to fine pitch, typically require solder balls and underfills. Underfill and/or edge encapsulant is often utilized to provide additional mechanical strength and stress reduction. The result is a complex assembly process flow. Localized placement of Anisotropic Conductive Adhesive (ACA) or Anisotropic Conductive Film (ACF) for specific components typically involves the fine-pitchuse of thermocompression bonding, an additional process step that could also be damaging to thin silicon. Another drawback for traditional interconnect materials is relatively slow processes, limiting the utility of such technologies. Development towards a wafer scale compatible packaging method will be shared, using a pressure-less and low-temperature magnetically aligned Anisotropic Conductive Epoxy (ACE).<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNDM5ODc4LUZpZyAxLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 525px;" class="fr-fic fr-dib"><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted">Figure 1. Flip Chip assembly comparisons: traditional solder balls &amp; underfill attachment (Left); Die attach with z-axis magnetically aligned conductive epoxy (Right)</figcaption>A summary of the novel approach is shown above in Figure 1. First, ferro-magnetic particles dispersed within an epoxy are coated onto a substrate. The ferro-magnetic particles form z-axis magnetically aligned columns, fixed in place during the die-to-substrate cure process without any pressure applied. The formation of the columns during the curing process is illustrated in Figure 2. This technology simplifies the assembly process to a single adhesive application, which provides both electrical interconnection and mechanical reinforcement. No additional underfill material is needed. Fine patterning is not required as the entire area of the component target location is deposited with epoxy. The device alignment process is more.forgiving relative to solder ball-to-solder pad alignment. Z-axis columns align after component placement, magnetic pallet exposure and cure is achieved.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNDc0MDUyLUZpZyAyLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 378px;" class="fr-fic fr-dib"><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted">Figure 2. X-Ray photos of Z-axis magnetically aligned particles ferromagnetic in an Anisotropic Conductive Epoxy (ACE)</figcaption><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1699453964933-B-and-B-2024%28e-mail%29.jpg" style="width: 739px;" class="fr-fic fr-dib">Join us in Berlin and/or Boston and lets us RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D - techblick.comThermal or UV curing methods complete the component attachment without any thermocompression (cure method is epoxy formulation dependent). Thermal curing occurs within the 80°C to 160°C temperature range.This article outlines the developments of this technology and shows examples of this magnetically aligned Anisotropic Conductive Epoxy packaging method used on various substrates. Progress will be shared for dense and fine-pitch Land Grid Arrays (LGA) on a semi-rigid interposer. Additionally, advancements made for die-to-die bonding will be presented as well as updates towards achieving ≤ 60-micron pitch. Other proposed direct die-attach packaging concepts will be illustrated.Example #2 covers development work performed on attaching a 126-pin Land Grid Array (LGA) bare die to a polymer semi-rigid multi-layer substrate. The use of the substrate resulted in multiple challenges for bare die attach. The non-planarity of the conductive circuit pads was one issue. The electrical resistance variation between pads had to be minimized for optimum performance. The non-uniformity of the substrate’s conductor pads is evident in the photo on the left. The schematic on the right illustrates how the ACE material allows for “leveling” in connecting the bare die to the non-planar substrate.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNTE3Njg5LUZpZyAzLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 584px;" class="fr-fic fr-dib"><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted">Figure 3. 126-pad semi-rigid substrate (Left) and illustration of bond between die and substrate</figcaption>Additional learning during this work was in identifying trapped moisture within the polymer-based substrate as a cause for voids in the ACE during cure. These bubbles not only prevented connection in some cases but interfered with proper z-axis column formation. Prebake for the substrate was added as a step for this particular type of assembly.Two formulations were the focus of the work in Example #3. These were the Fine particles ACE and the Ultra Fine particles version. Stencil thicknesses of 0.001” to 0.005” were studied, as this tool has the most impact on establishing bond line thickness. The target for choosing the best formulation, tool and bond line thickness was lowest average resistance values with lowest deviation among the 126 pads. Iterative testing was done. “Heat maps” based on the 126 pad locations were created to visually observe resistance values within set target and acceptance ranges. The next two Figures show results from early work on process development with each epoxy formulation and stencil tools, to the progress made with the final choices on material and stencil thickness. Ultimately the Ultra Fine particles ACE with a 0.001” thick stencil was chosen for this LGA-to-substrate assembly application. Summary Table 1 shows the results of the chosen ACE and stencil, and Figure 6 is a cross-section from the development study.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNTQwNDg0LUZpZyA0LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 598px;" class="fr-fic fr-dib"><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted">Figure 4. Pad-by-pad resistance measurement studies, early iteration (Left: Ultrafine, Right: Fine)</figcaption><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNTcyMzk5LUZpZyA1LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 601px;" class="fr-fic fr-dib"><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted">Figure 5.&nbsp;Pad-by-pad resistance measurement studies, final iteration (Left: Ultrafine, Right: Fine)</figcaption>Table 1.&nbsp;Summary of performance metrics (continuity, resistance &amp; deviation, pad-to-pad)<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNjAwNzk0LVRhYmxlIDEucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 564px;" class="fr-fic fr-dib"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNjIyODMyLUZpZyA2LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 559px;" class="fr-fic fr-dib"><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted">Figure 6. Cross-section of component attached and electrically connected with the Z-axis ACE (Photo courtesy of Rochester Institute of Technology)</figcaption>Example #2 takes the LGA and Substrate subassembly to the next level, a large area 8” x 10” circuit board populated with four of the subassemblies plus components of various sizes and function. This larger assembly involves attaching all the multiple components and subassemblies in one ACE attachment process. Passives range in size from as small as 0201 up to 2220. Other devices are a 26-pin SMT connector and SoICs. This project is underway, and results will be shown by SunRay at TechBlick live in October.Fine-pitch die-to-die bonding with the ACE is the third example. The development methodology is like the other projects. An initial focus was on measuring continuity and resistance at pad sites as part of identifying the optimum process parameters and stencil tool for this application. The degree of difficulty is greater with finer pitch. Dense arrays of 60 microns pitch die, with 30 microns pads and 30 microns spacing, were used.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1699454054997-B-and-B-2024%28blog%29.jpg" style="width: 761px;" class="fr-fic fr-dib">Join us in Berlin and/or Boston and lets us RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D - techblick.comA Design of Experiments (DoE) was established for the stencil studies. Laser profilometry was used for 3D and 2D scans of the two surfaces to be bonded, as was employed for observing the non-planarity of the semi-rigid board in Example #1. All initial steps were done manually: hand stencil printing, die placement with die bonder, batch oven cure and electrical probing.Prior to using fully functional devices, Quartz substrates patterned with the top layer of each die in the bond pair, were procured and used in early studies. The purpose was to provide enhanced analysis of the bonded die pair before, during, and after bonding/curing has occurred. Bond parameters were observed at each step of the process: pre-bond, bond, and post alignment &amp; cure.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNjk2MDIyLUZpZyA3LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 624px;" class="fr-fic fr-dib"><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted">Figure 7. Left: Target overlay of quartz substrates; Middle: ACE deposit before bond; Right: Post-bond, before z-axis alignment and cure</figcaption>Due to the finer pitch requirements, the test vehicles have a nickel layer applied during wafer fabrication, at the bond pad locations. Past experimentation, as pictured in Figure 8, has shown nickel application may lower the resistance of the bonded circuit by directing column formation to the metallized bond pad boundary, the nickel pads, acting as localized magnets, attract column formation during exposure to the magnetic pallet. This only applies to the bond pads themselves, to concentrate the ferromagneticmetalized particles within the ACE more towards the connection points. This creates a higher density of columns within each pad.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk3MTAzNzcyMzM0LUZpZyA4LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 488px;" class="fr-fic fr-dib"><figcaption data-pm-slice='1 1 ["figureImage",null]' id="isPasted">Figure 8. Left: No nickel interlayer and ACE; Right: ACE after cure with Nickel interlayer layer in pads</figcaption><h3 data-pm-slice="1 1 []" id="isPasted">Conclusion</h3>Besides the addition of the nickel layer to the functional die, key parameter targets were updated for the project’s next phase. In the short-term alignment, fiducials on the quartz plates were updated to improve bonding in X, Y, and theta; and the size of test probe pads were increased to improve accuracy and reduce testing time.The development efforts for all three examples are still underway. The conclusions thus far are:<ul><li>Successful demonstrations of Heterogenous Packaging using z-axis magnetically aligned epoxy for structural &amp; electrical bonding.</li><li>Similar established process techniques and test methodologies are usable across applications, although each has unique requirements.</li><li>The Ultra Fine particles ACE formulation has the best performance for finer pitches and more challenging alignments.</li><li>Uniform bond lines between device pads are critical for optimum electrical performance.</li><li>Excellent performance results were obtained, even with manual assembly techniques. Performance will improve with automation.</li></ul>In concept this z-axis magnetically aligned conductive epoxy approach could integrate multiple silicon wafers on top of each other, creating the possibility for an exceptionally dense integrated System-In-a-Package (SIP). Processing temperatures can be as low as 80°C, opening room for alternate substrates and biocompatible assemblies. This anisotropic epoxy is not limited to specific device attachment; it can be used to bond multiple component sizes and styles across an entire substrate.<hr>Join us in Berlin and/or Boston and lets us RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D - techblick.com<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1699454093608-B-and-B-2024%28small-LinkedIn+for-email%29.jpg" style="width: 709px;" class="fr-fic fr-dib">

Fine-Pitch Direct Die Attach Without Thermal Compression, Alignment or Underfill

Fine-pitch dense die assembly process with only a single adhesive application without pressure, without underfill, without fine patterning, without complex alignment vs solder ball-to-solder pad, etc? Learn here how magnetically aligned Anisotropic Conductive Epoxy (ACE) enable this

<div data-draftjs-conductor-fragment='{"blocks":[{"key":"74cni","text":"Authors Wim Christiaens | Quand Industries | Wim.Christiaens@quad-ind.com ","type":"unstyled","depth":0,"inlineStyleRanges":[],"entityRanges":[],"data":{}}],"entityMap":{},"VERSION":"9.14.3"}' id="isPasted">Authors Wim Christiaens | Quand Industries | &nbsp;Wim.Christiaens@quad-ind.com&nbsp;</div>Textiles are tactile, sensorial and visual. Qualities can be modified or even expanded when technology is added, transforming passive textiles into active and interactive devices, monitoring and detecting bodily functions due to their constant contact with our skin.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk1MTM1MDU4ODI3LTMwNzQ1LmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 532px;" class="fr-fic fr-dib"><h3>Printed electronics technology: the superior choice for smart textiles</h3>Printed electronics technology opens up possibilities that the older wired technologies simply cannot match.&nbsp;<ul><li>Thanks to their flexibility, stretchability and lightweight, printed electronics allow for smart garments that function as a second skin with a great level of comfort for its wearer.&nbsp;</li><li>Printed electronics are also more durable than traditional electronics and can withstand multiple washing cycles, crinkling, friction and sweating.&nbsp;</li><li>The lower production costs and easy scalability of printed electronics also stimulate the development of new (IoT) applications and a larger adoption of e-garments and smart fabrics in general, which can promote a healthier lifestyle and reduce the risk of disease, accidents and injuries in many industries.&nbsp;</li><li>Their integration is straightforward. After printing the sensors on TPU they can be transferred onto the textile material via hot press lamination. Both are well-established techniques. &nbsp; &nbsp;&nbsp;</li></ul><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk1MTM1MjQ3NDc4LWltYWdlMDAxLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 553px;" class="fr-fic fr-dib"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1699455670417-B-and-B-2024%28blog%29.jpg" style="width: 756px;" class="fr-fic fr-dib">Join us in Berlin and/or Boston and lets us RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D - techblick.com<ul><li>Compared to traditional electronics manufacturing, printed electronics are easily scalable and low cost.&nbsp;</li><li>They are durable, precise, efficient and comfortable to wear.&nbsp;</li><li>They have excellent interconnectability. The PCB’s can be positioned in a remote spot, are small and don’t need much power to work. &nbsp; &nbsp; &nbsp;</li></ul><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk1MTk3OTk3Mjk4LVNjcmVlbnNob3QgMjAyMy0wOS0yMCAwOTE4MTcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 686px;" class="fr-fic fr-dib"><a href="https://www.techblick.com/post/smart-textiles-monitoring-sensing-and-heating-technology-integrated-in-fabrics#viewer-71qek" target="_blank" rel="noopener noreferrer">Click here to watch the video</a> demonstration <hr><h3>Applications that change our lifestyle</h3>Athletic monitoring: Train smarter, not harderA wide range of smart sportswear (e.g. shirts, insoles, sports bras) track vital signs (via printed ECG or EMG sensors), core temperature, and biomechanics both during training and in the recovery phase. It helps athletes to enhance performance, ensure a healthy athletic growth, help reduce stress and prevent different types of injuries. &nbsp; &nbsp;Alleviating the healthcare and medical sectorSmart textiles serve as a functional and comfortable ‘wearable computer’ that help health care professionals by monitoring and communicating a patient's condition by detecting, storing, analysing, and transmitting physiological signals.Automotive and aerospaceIn the aerospace industry and in vehicle engineering, current applications focus on smart sensors integrated in interior fabrics and biometric monitoring for safety purposes. Information can provide insight into the driver's physical condition and level of fatigue, triggering haptic feedback through the steering wheel or warning alerts in the car's cockpit.&nbsp;Active workwearThe monitoring of vital signs of workers in demanding environments and high-risk industries has been made easier. In regulated industries where safety rules restrict workers from wearing devices, smart workwear can give insightful information about the condition of workers or machine operators that can be used to optimize their well-being, performance and productivity. Thermal workwear to dynamically regulate body temperature of workers in cold climates is another huge application domain.Textile-integrated flexible heaters&nbsp;There is a steep rise of interest is heating technology for garments. Stretchable printed electronics heaters make it easy to incorporate heat into comfortable, elegant, flexible, lightweight clothing. The high precision that can be achieved with screen-printed circuitry also makes it simpler to provide warmth exactly where required and avoid areas of the body which don’t need any additional heat.<div data-draftjs-conductor-fragment="{&quot;blocks&quot;:[{&quot;key&quot;:&quot;17kt9&quot;,&quot;text&quot;:&quot;Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. For special discounts on attendee passes please contact Wim.Christiaens@quad-ind.com &quot;,&quot;type&quot;:&quot;unstyled&quot;,&quot;depth&quot;:0,&quot;inlineStyleRanges&quot;:[{&quot;offset&quot;:0,&quot;length&quot;:107,&quot;style&quot;:&quot;{\&quot;FG\&quot;:\&quot;#424242\&quot;}&quot;},{&quot;offset&quot;:0,&quot;length&quot;:53,&quot;style&quot;:&quot;UNDERLINE&quot;},{&quot;offset&quot;:107,&quot;length&quot;:37,&quot;style&quot;:&quot;UNDERLINE&quot;},{&quot;offset&quot;:146,&quot;length&quot;:86,&quot;style&quot;:&quot;BOLD&quot;},{&quot;offset&quot;:146,&quot;length&quot;:86,&quot;style&quot;:&quot;{\&quot;FG\&quot;:\&quot;#dc3134\&quot;}&quot;}],&quot;entityRanges&quot;:[{&quot;offset&quot;:0,&quot;length&quot;:53,&quot;key&quot;:0},{&quot;offset&quot;:107,&quot;length&quot;:37,&quot;key&quot;:1}],&quot;data&quot;:{}}],&quot;entityMap&quot;:{&quot;0&quot;:{&quot;type&quot;:&quot;LINK&quot;,&quot;mutability&quot;:&quot;MUTABLE&quot;,&quot;data&quot;:{&quot;url&quot;:&quot;https://www.techblick.com/electronicsreshaped&quot;,&quot;target&quot;:&quot;_blank&quot;,&quot;rel&quot;:&quot;&quot;}},&quot;1&quot;:{&quot;type&quot;:&quot;LINK&quot;,&quot;mutability&quot;:&quot;MUTABLE&quot;,&quot;data&quot;:{&quot;url&quot;:&quot;https://www.techblick.com/electronicsreshaped&quot;,&quot;target&quot;:&quot;_blank&quot;,&quot;rel&quot;:&quot;&quot;}}},&quot;VERSION&quot;:&quot;9.14.3&quot;}" id="isPasted"><a data-hook="linkViewer" href="https://www.techblick.com/electronicsreshaped" target="_blank" rel="noopener noreferrer">Join us in Berlin and/or Boston and lets us RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D - techblick.com</a></div><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1699455718770-B-and-B-2024%28small-LinkedIn+for-email%29.jpg" style="width: 766px;" class="fr-fic fr-dib">

Textiles are tactile, sensorial and visual. Qualities can be modified or even expanded when technology is added, transforming passive textiles into active and interactive devices, monitoring and detecting bodily functions due to their constant contact with our skin. 

Smart Textiles: monitoring, sensing and heating technology integrated in fabrics

Authors: Steliyan Vasilev1, Melanie Hoerr1, Michaela Kasdorf1, Sven Boehmer213E Smart Solutions, Krefeld, Germany2ZSK Stickmaschinen GmbH, Krefeld, GermanyThis article originally appeared <a href="https://www.techblick.com/post/optimizing-embroidered-conductive-traces-for-e-textiles" target="_blank" rel="noopener noreferrer">here.</a><h3>1. Introduction</h3>Embroidery was historically a means of adorning fabrics with intricate patterns, a testament to human skill. However, in the modern era, this ancient art form has significantly evolved. In recent years, embroidery has undergone a profound transformation, emerging as a pioneering technology at the intersection of artistry and functionality. This article delves into the possibilities which embroidery offers for the production of Smart and E-Textiles, exploring technical intricacies, advantages, and challenges related to embroidered conductive traces.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4Mjk4MjI0LVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzU1MjIucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 649px;" class="fr-fic fr-dib">Join us at TechBlick&#39;s Future of Electronics RESHAPED conference &amp; tradeshow in Berlin on 17-18 OCT 2023 - <a target="_blank" rel="noopener noreferrer" data-fr-linked="true" href="//www.techblick.com/electronicsreshaped" id="isPasted">www.techblick.com/electronicsreshaped</a><h3>2. Solutions for the E-Textiles Production Made Possible by Embroidery</h3>E-Textiles represent a fascinating synergy between traditional textiles and modern technology, serving diverse sectors like automotive, aerospace, sports and fitness, medical, home textiles, and wearable technology. Thanks to the exceptional precision and high degree of automation of embroidery technology, it is ideal for integrating functional elements into textiles, such as sensors, actuators, antennas, or electrodes.&nbsp;By use of conductive threads and specialized attachments for automated integration of electronic components, embroidery techniques, originally developed for aesthetic purposes, now enable reliable and scalable E-Textiles production. Embroidery makes possible the following innovative solutions, among all:<ul><li>Integrating and Interfacing Electrical Components and PCBs</li></ul><h4>Semi-Automated Integration</h4>In decorative embroidery, the Appliqu&eacute; technique is utilized to attach pre-made textile patches to the carrier fabric. This same method can be used for semi-automatic placement of printed circuit boards (PCBs). After the manual placement and adjustment of the PCB, the embroidery machine takes over, automatically fixing it to the fabric and establishing the electrical connections at the interface pads.&nbsp;<h4>Automated Integration</h4>Embroidery machines equipped with automated Sequin Placement Devices can be configured to incorporate functional sequins into textiles (Fig. 1a). Functional sequins can be equipped with SMD soldered components, such as LEDs or RFID chips. For larger circuit boards, whether rigid or flexible, embroidery machines fitted with automated PCB Placement Devices can precisely position and secure the PCBs to the textile (Fig. 1b), followed by embroidery of the electrical connections. Automated integration is especially valuable for achieving reliability and reproducibility in the production of E-Textiles on a large scale.<ul><li>&nbsp;Embroidery of Complete Electrical Circuits</li></ul>By embroidering conductive traces onto fabric, placed PCBs and peripheral components can be electrically connected to each other, as well as to power sources or external circuitry. This approach allows for the automated integration of complete electrical circuits into textiles during a single production step.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4MzM4OTEwLVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzA4NDAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 689px;" class="fr-fic fr-dib">Figure&nbsp;1&nbsp;Automated integration of functional LED sequins (a) and PCBs (b) by using automated Sequin Placement Device and PCB Placement Device from ZSK Stickmaschinen GmbH<ul id="isPasted"><li>&nbsp;Integration of Conductive Fibers and Wires</li></ul>Tailored Wire Placement (TWP) and Tailored Fiber Placement (TFP) techniques allow precise conductor placement for applications such as illumination, textile-based heating, RFID antennas, and more.<ul><li>&nbsp;Embroidery of Conductive Areas</li></ul>With conductive threads, conductive areas in various shapes and sizes can be embroidered. These areas can serve a multitude of functions, including wide conductive traces, sensors, electrodes, and antennas, expanding applications from automotive control elements to advanced medical devices.<h3>3. Advantages of Embroidered Conductive Traces</h3>Embroidery of conductive traces has opened up new horizons for Smart and E-Textiles, driven by several distinct advantages:<ul><li>&nbsp;Versatility in Design and High Precision</li></ul>Embroidery offers unparalleled versatility in design. Complex patterns and intricate geometries become feasible, catering to diverse application needs. The precision achieved in embroidery ensures that these designs are replicated accurately and consistently.<ul><li>&nbsp; Flexibility and Breathability</li></ul>One of the standout features of embroidered conductive traces is their inherent flexibility. They easily integrate with the carrier fabric, preserving its natural drape. Unlike printed circuits, embroidered traces allow textiles to breathe, enhancing wearability in clothing and comfort in various applications.<ul><li>&nbsp;Durability and Washability</li></ul>Embroidered conductive traces exhibit impressive durability. They withstand the rigors of daily use and multiple washing cycles, remaining fully functional over extended periods. This longevity contributes to the reliability and sustainability of embroidered E-Textiles products.<ul><li>&nbsp;Enabling Direct Connection to Electrical Components and PCBs</li></ul>Embroidery facilitates the direct integration of conductive traces with electrical components and printed circuit boards (PCBs). This approach eliminates the need for additional connectors or complex wiring, enhancing the product&rsquo;s reliability and comfort and reducing production costs.<h3>4. Challenges and State-of-the-Art Solutions for Embroidered Conductive Traces</h3>While there are clear advantages to using embroidered conductive traces, there are also associated challenges. In the following sections, we will outline the primary challenges and present state-of-the-art solutions to address them.&nbsp; &nbsp; &nbsp; &nbsp; a) &nbsp; Compensation for High Yarn ResistivityOne of the main challenges in utilizing conductive embroidery threads is their intrinsic high resistivity of up to a few hundred Ohms per meter. To address this challenge, several state-of-the-art solutions have emerged:<ul><li>&nbsp;Multiple Passes and Use of Conductive Bobbin Thread&nbsp;</li></ul>A method to compensate for the high resistivity of the conductive thread is to embroider multiple passes using the so-called running stitch. Each pass adds to the overall conductivity, effectively acting like parallel resistors (Fig. 2a). Additionally, incorporating a conductive bobbin thread enhances conductivity by further reinforcing the electrical path (Fig. 2b). As an additional benefit, multiple embroidered passes compensate for the inhomogeneity in resistance throughout yarn length due to local damages in a single yarn pass during use, increasing the reliability of the E-Textiles product.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4NDA1MDAxLVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzEwMTYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 723px;" class="fr-fic fr-dib">Figure 2&nbsp;Equivalent circuit of embroidered conductive trace with one, two, and three passes (a), and conductive embroidery (yellow) and bobbin (green) thread (b)<ul id="isPasted"><li>&nbsp;Conductive Traces Embroidered as Filled Areas</li></ul>An alternative approach for reducing resistivity is to embroider conductive traces as filled areas, using the fill stitch rather than the running stitch. The high density of stitches in the filled areas enhances the overall trace conductivity. To ensure sufficient electrical contact between the stitches along the stitch direction, an underlayer must be added beneath the fill stitch, angled to the primary stitch direction (Fig. 3) [1].<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4NDU1NTMxLVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzEwNTIucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 732px;" class="fr-fic fr-dib">Figure 3&nbsp;Embroidered area with fill stitch without (a) and with a grid underlayer (b)&nbsp; &nbsp; &nbsp; &nbsp; &nbsp;b) Avoiding Conductive Thread Damage during EmbroideryDuring embroidery, stitching directly into the conductive yarn can damage it, compromising electrical properties. Therefore, special attention must be given to the digitizing of the embroidery design to avoid placing stitches over previously embroidered threads as well as repetitive stitching in the same spot.To mitigate this while embroidering multiple running stitch passes, a swing factor can be introduced in the digitizing program, altering the stitching path slightly with each pass. This minimizes localized stress on the yarn, preserving its integrity and conductivity. Fig. 4 illustrates a conductive trace with four passes and an added swing factor, shown as a visualization in the embroidery machine&rsquo;s programming software (a) along with a photograph of the embroidered trace (b).<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4NDk4MjQ1LVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzExMjAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 731px;" class="fr-fic fr-dib">Figure 4&nbsp;Conductive trace with four passes for increased conductivity and added swing factor, shown in the digitizing software (a) and after embroidery (b).When adding a swing factor, corners pose a specific challenge, leading to repeated puncturing at the same location (Fig. 5a). Rounding corners in the embroidery design is essential, as it significantly reduces the risk of stitching into the yarn, maintaining its electrical properties (Fig. 5b) [1].<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4NjIyNTQ5LVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzEyMTQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 704px;" class="fr-fic fr-dib">Figure 5&nbsp;Running stitch with three passes and an added swing factor, with multiple punctures in sharp edges (a) and without multiple punctures in rounded corners (b)&nbsp; &nbsp; &nbsp; &nbsp; c) Enabling Crossing and Insulation of Conductive TracesComplex E-Textiles designs often require multiple closely adjacent or intersecting conductive traces. Without proper insulation, unwanted electrical connections can occur&nbsp;when these traces come into contact. Adding non-conductive bridges between traces prevents unintended short circuits and maintains the desired electrical paths. Insulating bridges can be created by embroidering multiple layers of satin stitch with non-conductive thread, as depicted in Fig. 6a. It is crucial to ensure that the stitch directions of the bridge layers are angled in relation to the intersecting conductive traces.Covering conductive traces with non-conductive thread can also be used for insulation towards the surrounding environment. Fig. 6b illustrates an example of covered conductive traces connected to moss-embroidered electrodes for body signal acquisition. The covering prevents direct contact with the skin outside the electrode areas. For applications requiring waterproofing of the conductive traces, seam sealer in the form of tape or liquid, or dispensed polymer coatings can be utilized.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4NjcxMzQwLVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzEyNDAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 702px;" class="fr-fic fr-dib">Figure 6&nbsp;Covering conductive traces with non-conductive thread to create insulating bridges between intersecting traces (a) and as a method of insulation towards the surrounding environment (b).<h3>&nbsp;5. Conclusion</h3>The integration of conductive traces into textiles through embroidery offers a promising avenue for the development of Smart and E-Textiles. While the advantages of embroidered conductive traces make them a compelling choice for a wide range of applications, there are technical hurdles. Fortunately, various state-of-the-art solutions have been developed to address these challenges, ensuring that embroidered conductive traces can meet the demands of diverse applications.&nbsp;As technology advances and the demand for Smart Textiles grows, continued research and innovation in the field of technical embroidery will be essential. With ongoing efforts to refine techniques and materials, we can expect to see even more sophisticated and reliable embroidered E-Textiles, opening up new possibilities in wearable technology, healthcare, fashion, and beyond.&nbsp;References[1] McCann, J., &amp; Bryson, D. (2023). Smart Clothes and Wearable Technology, Second Edition. Elsevier. <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0ODQ4NzExOTEwLVNjcmVlbnNob3QgMjAyMy0wOS0xNiAwNzU0NDgucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 671px;" class="fr-fic fr-dib">Join us at TechBlick&#39;s Future of Electronics RESHAPED conference &amp; tradeshow in Berlin on 17-18 OCT 2023 - <a target="_blank" rel="noopener noreferrer" data-fr-linked="true" href="//www.techblick.com/electronicsreshaped" id="isPasted">www.techblick.com/electronicsreshaped</a>

Embroidery was historically a means of adorning fabrics with intricate patterns,a testament to human skill.In the modern era, this ancient art form has significantly evolved, becoming a pioneering tech at the intersection of artistry & functionality. Learn here about Embroidered Electronics Textiles

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