Challenges & Events
Current and Upcoming
Learn how to reduce the risk and cost of late design, and manufacturing changes at the free Altair Virtual Global Event on May 16, 2024
Create sustainable and thriving communities that are well-equipped to face future challenges. Win up to $7,000+ in prizes!
Engineers, researchers, entrepreneurs, inventors, and end users are invited to join TechBlick Innovations Festival, exploring additive, printed, 3D, and wearable electronics on 25 April 2024 online.
Explore and address needs in assistive technology, creating meaningful solutions for individuals with disabilities. Win great prizes!
Past
One of the world's leading gatherings on the future of science & technology. Learn and be inspired by world leaders, thinkers and researchers. Tickets are on sale now. July 10–11, 2024.
Mohammed Dogar, Vice President, Head of Global Business Development & Ecosystem, and Jeff Sieracki, Director of AI COE, will sit with tech writer Samir Jaber to unpack the Reality AI Tools suite and discuss their impact on Edge AI applications.
Exploring the Trends, Challenges, and Innovations Shaping the Future of Engineering. Complete the survey to enter the prize draw!
Explore Particle's latest devices and software as well as the 2024 product roadmap.
Join the 3D Printing FGF Engineering Challenge and explore the possibilities of 3D Printing with granulates.
Accelerating Urban Efficiency through Technology. Explore How AI & IoT Drive the Future of Sustainable Urban Living
Globally recognized event, on 17-18 October 2023, seeks to explore the forefront of electronic innovations, drawing a bridge between the traditional and the groundbreaking, and taking you on a journey through the very fabric of next-gen electronics.
Identify gaps in current assistive technologies and design innovative solutions that cater to the unique needs of individuals with disabilities. Win great prizes.
The 2023 trade show brought together technological innovations, industry experts, and future talents in the field of automation.
