Tech Specs | Product Specification

Wolfspeed SpeedVal™ Kit Modular Evaluation Platforms

Modular Evaluation Platforms for Silicon Carbide Devices, Gate Drivers & Control Schemes

General

Product TypeEvaluation Platforms
ApplicationsPrototyping & Development, Automotive Systems, Power Management
Key FeaturesSilicon Carbide (SiC) MOSFETs, Half-Bridge, Buck/Boost, 3-Phase Inverter

Technical Specifications

Supported Device TechnologiesSilicon Carbide (SiC) MOSFETs
Power TopologiesHalf-Bridge, Buck/Boost, 3-Phase Inverter
Supported Device Voltage650V to 1200V Devices
Buck/Boost Power RangeUp to 15 kW
3 Phase Inverter Power RangeUp to 30 kW
Package TypesTOLL, TO-263-7, TO-247-3, TO-247-4, U2 top-side cooled
Measurement InterfaceBNC Connector for Low Voltage VDS Measurement,MMCX connectors for VGS and low-side IS
ApplicationsAutomotive, Renewable Energy, Power Supplies, Inverters, Industrial Power, Motor Drives

Overview

The Wolfspeed SpeedVal Kit Modular Evaluation Platforms provide a flexible architecture for in-circuit performance assessment of silicon carbide (SiC) devices, gate drivers, and control schemes. These platforms use a motherboard paired with power daughter cards, gate driver cards, and optional control boards or accessories, supporting multiple power topologies, package types, and voltages. 

This modularity enables rapid evaluation and optimization of SiC MOSFET high-speed dynamic switching with various gate driver options. High-power thermal testing is supported, evaluating operations at actual operating points. Integrated, modular SPICE models enable a comparative analysis of test data with simulations for system modelling.

The card-edge connection on the power daughter card enables quick modification of SiC devices while maintaining low DC bus inductance. This design accelerates testing workflows significantly. The 3-phase motherboard extends capabilities to 2kW to 30kW industrial motor drives, EV auxiliary motors, heat pumps, and air conditioners.

Features of SpeedVal Kit Modular Evaluation Platforms

Let’s explore some of the features, listed below: 

Modular System Architecture

Wolfspeed SpeedVal Kit Modular Evaluation Platforms use a set of interchangeable boards designed for in‑circuit system performance evaluation. The platforms are composed of a motherboard, power daughter card(s), gate driver card(s), an optional control card, and other optional accessories. This modular design facilitates the testing of SiC devices, gate drivers, and control schemes under actual operating conditions. The platforms support a range of power topologies, package types, and voltages, enabling broad application coverage.

Performance Evaluation and Optimization

The kits allow for the evaluation and optimization of the high-speed dynamic switching performance of silicon carbide MOSFETs when integrated with various gate driver options. High-power thermal testing is supported, enabling the assessment of operational characteristics at specified operating points. Each system block incorporates an accurate modular SPICE model, facilitating the comparison of empirical test data with simulation results and supporting the development of user-specific system models. The platforms include features such as a preassembled heatsink, BNC connectors for lower VDS measurement, and high-bandwidth MMCX test points for VGS and low-side IS from a high-bandwidth surface-mount shunt.

Quick Device Swapping and Connectivity

The system enables the quick swapping of SiC devices through a low-inductance card-edge connection, allowing engineers to test 650 V to 1200 V devices in minutes rather than weeks. This design supports packages from surface‑mount TOLL devices to TO‑247 types, maintaining reliable connections to the DC bus while reducing reconfiguration time significantly. 

Power Application Capabilities

The platforms support a range of power application capabilities. The buck/boost configuration can handle up to 15 kW of power. A three-phase motherboard combines the capabilities of a half-bridge board, facilitating the rapid testing of silicon carbide devices under real operating conditions across a range of 2 kW to 30 kW. This includes applications such as three-phase industrial motor drives, EV auxiliary motors, heat pumps, and air conditioners. The platforms are designed to test devices with voltage ratings from 650V to 1200V.

Applications

SpeedVal Kit Modular Evaluation Platforms find applications across various power electronics domains that require high-performance SiC solutions. In the automotive sector, these platforms facilitate the development and testing of onboard EV battery chargers and auxiliary motors, critical for efficient electric vehicle operation. Within renewable energy systems, they are utilized for the design and optimization of PV inverters. For general power supplies, the kits support the development of high-voltage DC/DC converters. Furthermore, in industrial power applications, the platforms are instrumental in evaluating and optimizing motor drives, ranging from 2kW to 30kW for three-phase industrial motor drives, EV auxiliary motors, heat pumps, and air conditioners.

References

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